利用湿法腐蚀提高红光LED外延片的发光效率

采用熔融态的KOH对AlGaInP基红光LED外延片进行了表面粗化处理。研究了粗化温度、粗化时间对LED外延片表面形貌的影响,并利用原子力显微镜(AFM)、半导体芯片自动测试系统对LED器件的相关性能(形貌、I-V特性曲线、亮度和主波长)进行了表征。比较了粗化前后的LED亮度和电流特性变化。测试结果表明:利用熔融态的KOH对AlGaInP基红光LED外延片进行表面粗化可以有效地抑制光在通过LED表面与空气接触界面时产生的全反射,得到性能更好的器件。实验结果显示,采用熔融态KOH,在粗化温度为200℃、粗化时间为8min时,能使制作的红光LED外延片发光效率提高30%。     

GaP表面粗化对AlGaInP发光二极管光电特性的影响

采用湿法溶液粗化AlGaInP基红光LED表面GaP层 ,并在粗化后的GaP表面沉积ITO,研究了粗化时间对GaP表面形貌的影响,并利用SEM、半导 体 芯片测试机、X射线衍射仪、X射线光电子能谱对LED器件表面形貌、光电特性曲 线、界面晶向、元素特性进行表征,比较了粗化前后的LED亮度和光电特性变 化。测试结果表明:采用HIO₄、I₂、HNO₃系列粗化液在室温、粗化时间为30 S 时,有效增加了光在通过GaP面与ITO界面时的出光角度,使AlGaInP发光二极管 的发光效率提高21.4%,同时引起界面处的缺陷密度升高,费米能级 远离价带,主波长蓝移0.36 nm,正向电压上升0.04 V。     

侧面粗化提高GaN基LED出光效率研究

通过对传统结构LED出光分析,提出采用侧面粗化来提高GaN基LED出光效率的方法,使用蒙特卡罗光子追踪方法对器件出光效率进行了模拟。结果表明:粗化侧面为三角状、底角为55°时出光效率最高,随机粗化可以获得比固定角度粗化更高的出光效率,同时降低材料的吸收系数可以提高LED的出光效率,在吸收系数为10/cm时,经过粗化后的LED出光效率可以达到46.1%。模拟结果证明侧面粗化可以较大地提高LED的出光效率。     

GaAs基AIGaInP LED的研究和进展

探讨了GaAs基AIGaInP LED的最新研究与进展,介绍了AlGaInP红光LED外延材料的能带结构和基本的外延层结构以及限制外量子效率的问题,探讨了几种高效率的LED器件结构设计.着重介绍了目前一些外量子效率比较高的LED器件的制作方法以及一些提高外量子效率的AlGaInP LED器件结构,最后探讨了AlGaInP LED在作为固体光源发展过程中仍然需要面对的挑战.     

表面粗化提高倒装AlGaInP发光二极管的光提取效率

对发光二极管进行表面粗化能够大幅度的提高其光提取效率。利用晶片键合技术并采用湿法刻蚀的办法粗化n面AlGaInP表面制作了一种带表面粗化的倒装薄膜发光二极管。刻蚀后的表面形貌呈现金字塔状。270μm x 270μm管芯裸装在TO-18金属管座上,在20mA的注入电流下,粗化了的LED-I光强达到了315mcd,输出光功率达到了4.622mW,比没有粗化的LED-II的光功率高1.7倍。光功率增加的原因在于粗化后形成的这种金字塔状表面,其不但减少了背部镜面系统和半导体-空气接触面的反射,而且能有效的将光从LED中散射出去。     

GaAs基AlGaInP LED的研究和进展

探讨了GaAs基AlGaInP LED的最新研究与进展,介绍了AlGaInP红光LED外延材料的能带结构和基本的外延层结构以及限制外量子效率的问题,探讨了几种高效率的LED器件结构设计。着重介绍了目前一些外量子效率比较高的LED器件的制作方法以及一些提高外量子效率的AlGaInP LED器件结构,最后探讨了AlGaInP LED在作为固体光源发展过程中仍然需要面对的挑战。     

倒装GaN基发光二极管阵列微透镜的粗化技术

通过模拟计算,分析了阵列微透镜粗化对倒装结构GaN基LED提取效率的影响.并采用感应耦合等离子(ICP)干法刻蚀技术在蓝宝石表面制备阵列微透镜,实现倒装结构GaN基LED出光面粗化.测试结果表明,相对于普通倒装结构,阵列微透镜表面粗化可以使LED提取效率提高约50%,测试结果与模拟计算值相符合.     

倒装GaN基发光二极管阵列微透镜的粗化技术

通过模拟计算,分析了阵列微透镜粗化对倒装结构GaN基LED提取效率的影响.并采用感应耦合等离子(ICP)干法刻蚀技术在蓝宝石表面制备阵列微透镜,实现倒装结构GaN基LED出光面粗化.测试结果表明,相对于普通倒装结构,阵列微透镜表面粗化可以使LED提取效率提高约50%,测试结果与模拟计算值相符合.     

表面粗化提高GaN基LED光提取效率的模拟

影响GaN基LED的外量子效率低下的主要因素是光子在半导体和空气界面处的全反射.根据实际芯片建立LED模型,利用蒙特卡罗方法进行光线追迹模拟,分析了光子的主要损耗对出光效率的影响.计算不同的表面粗化微元,微元尺寸及微元底角对LED光提取效率的影响;比较不同微元形成的光场分布.模拟显示:所设计最佳的表面粗化结构在理想状况下可以提高光提取效率3倍以上.     

湿法表面粗化提高倒装AlGaInP LED外量子效率

介绍了一种利用盐酸、磷酸混合液对不同Al组分(AlxGa1-x)0.5In0.5P的选择性腐蚀特性对倒装AlGaInP红光LED进行表面粗化的方法。通过向粗化层GaInP加入适量的Al,在Al组分为0.4时,利用体积比为1∶10的HCl∶H3PO4可以得到横向尺寸约为60nm,纵向尺寸约为150nm的最有利于出光的类三角圆锥型表面结构。器件测试结果表明,在20mA注入电流下,器件外量子效率比粗化前提高了80%。     

Improvement of AlGaInP light emitting diode by sulfide passivation

The brightness of AlGaInP light emitting diodes (LEDs) has been raised by a factor of 1.12 at 20 mA by sulfide passivation. Meanwhile, the sulfide also can decrease leakage current of AlGaInP LEDs at -2 V to nearly one thousandth of that in the as-fabricated device. The possible causes for the brightness increase of AlGaInP LEDs after sulfide treatment including surface roughness, reduction of Fresnel loss, and effective injection of carriers were demonstrated.     

Improved Extraction Efficiency of Light-Emitting Diodes by Modifying Surface Roughness With Anodic Aluminum Oxide Film

An anodic alumina oxide (AAO) film with nano-roughening is added on the top window layer of AlGaInP light-emitting diodes (LEDs) to improve the light extraction of the device. The AAO film has a natural porosity to provide light scattering centers at the surface, allowing an increase of light emission intensity with no loss of or damage to the semiconductor material. Further, the fabricated AAO film with a refractive index is about which is intermediate between those of air and the window layer of GaP. By inserting this layer between the ambient and GaP, it broadens the critical angle for light emission and reduces internal reflection. Experiments with laboratory-fabricated AlGaInP devices of conventional design demonstrated a 32% improvement in the luminous intensity at 20 mA for the device with the AAO layer. This letter shows by theory and experiment that AAO films can be used as a low-cost, easily implemented surface nano-roughening for improving extraction efficiency of AlGaInP LEDs.     

AlGaInP系LED的表面纳米级粗化以及光提取效率提高

分析了常规AlGaInP系发光二极管（LED）光提取效率低的主要原因,半导体的折射率与空气折射率相差很大,导致全反射使有源区产生的光子绝大部分不能通过出光面发射到体外。通过在LED出光层采用纳米压印技术引入表面纳米结构,以改变光子的传播路径,从而使得更多的光子能够发射到体外。理论分析与实验结果表明,与常规平面结构相比,...     

Extraction Efficiency Enhancement of GaN-Based Light-Emitting Diodes by Microhole Array and Roughened Surface Oxide

The light-output power of GaN-based light-emitting diodes (LEDs) was enhanced by microhole array pattern and roughened $hbox{GaO}_{x}$ film grown on the exposed surface. The $hbox{GaO}_{x}$ film was grown by photoelectrochemical (PEC) oxidation via $hbox{H}_{2}hbox{O}$ and formed a naturally rough oxide surface and $hbox{GaO}_{x}/hbox{GaN}$ interface. Compared with that of conventional broad-area LEDs, the output power of the microhole array LED and the surface-oxidized microhole array LED increased by 1.38 and 1.82 times at 20-mA forward current, respectively. The results show that the microhole array pattern with the roughened surface oxide method could significantly enhance light extraction efficiency and be a candidate for manufacturing high-efficient low-cost GaN-based LEDs.      

460-nm InGaN-Based LEDs Grown on Fully Inclined Hemisphere-Shape-Patterned Sapphire Substrate With Submicrometer Spacing

This letter investigates 460-nm InGaN-based light-emitting diodes (LEDs) grown on a hemisphere-shape- patterned sapphire substrate (HPSS) with submicrometer spacing. The full-width at half-maximum of the (102) plane rocking curves for GaN layer grown on a conventional sapphire substrate (CSS) and HPSS are 480 and 262 arcsec, respectively. Such improvement is due to the reduction of the pure edge threading dislocations. At the forward current of 20 mA, the light output power of the LEDs grown on CSS and HPSS were 4.05 and 5.86 mW, respectively. This improvement of 44% light-output power can be attributed to the improved quality of the material and the increase of the light extraction by the fully inclined facets of the HPSS.     

Fabrication process simulation and reliability improvement of high-brightness LEDs

To enhance the light extraction efficiency and thermal performance of AlGaInP light-emitting diodes (LEDs), the wafer bonding technique which can replace the GaAs substrate with other high thermal conductivity substrates was applied. However, this technique may make the film crack during either the removal etching process of the GaAs substrate or the annealing process after the GaAs removal. Therefore, this crack problem is an important issue in the reliability/yield of high-brightness LEDs. In this research, a detailed finite element model of the high-brightness AlGaInP LED, which is replaced by the GaAs substrate with high thermal conductivity substrate through the Au–In metal bonding technique, was developed and fabricated. In addition, the mechanical behavior of wafer-level metal bonding was also simulated by finite element analysis (FEA) and validated by experimental measurements. Hence, the above validated simulation technique combined with process modeling is used to understand the stress variation of the multilayer structure of AlGaInP LED during the fabrication process and to find the principal cause of the film crack.     

带有锥状反射结构的AlGaInP键合衬底LED

本研究通过光辅助化学腐蚀技术在衬底键合AlGaInP反极性发光二极管中制备出锥状反射镜结构提升器件的光提取效率。首先利用氢氟酸与双氧水在532nm激光的辐射下载GaP:Mg层制备出锥状腐蚀结构,然后将金属反射镜蒸镀在锥状结构之上制备锥状的反射镜结构。在完成全部芯片工艺后,测试结果表明锥状反射镜结构可以显著提升光提取效率,并在光通量测量中与表面粗化集成平板反射镜LED相比较,得到了18.55%的增强。     

High Light-Extraction GaN-Based Vertical LEDs With Double Diffuse Surfaces

High light-extraction (external quantum efficiency ~40%) 465-nm GaN-based vertical light-emitting diodes (LEDs) employing double diffuse surfaces were fabricated. This novel LED structure includes one top transmitted diffuse surface and another diffuse omnidirectional reflector (ODR) on the bottom of a LED chip. The diffusive ODR consists of a roughened p-type GaN layer, an indium-tin-oxide (ITO) low refractive index layer, and an Al layer. The surface of the p-type GaN-layer was naturally roughened while decreasing the growth temperature to 800 degC. After flip-bonding onto a Si substrate by AuSn eutectic metal and laser lift-off processes to remove the sapphire substrate, an anisotropic etching by dilute potassium hydroxide (KOH) was employed on the N-face n-GaN layer to obtain transmitted diffuse surfaces with hexagonal-cone morphology. The double diffused surfaces LEDs show an enhancement of 56% and 236% in light output power compared to single side diffused surface and conventional LEDs, respectively. The devices also show a low leakage current in the order of magnitude of 10 ^-8 A at -5 V and a calculated external quantum efficiency of about 40%. The high scattering efficiency of double diffused surfaces could be responsible for the enhancement in the device light output power     

复合布拉格反射镜高亮度AlGaInP发光二极管

采用光学薄膜理论中干涉矩阵模型计算了峰值波长为630nm的AlGaInP红光LED的Al0.6Ga0.4As/AlAs材料的常规DBR和复合DBR的反射谱特性,用LP-MOCVD方法生长了模拟设计的DBR结构,测量了其白光反射谱,实验与模拟结果基本符合.制备了采用Al0.6Ga0.4As/AlAs复合DBR的LED器件,未封装输出光功率为2.3mW,外量子效率为5.6%,发光效率可达12 lm/W,比常规DBR器件提高了35%.验证了复合DBR与常规DBR相比,可以大幅度提高AlGaInP红光LED的出光效率.     

GaN0.011P0.989-GaP double-heterostructure redlight-emitting diodes directly grown on GaP substrates

Novel red light-emitting diodes (LEDs) based on GaN_0.011P_0.989-GaP double-heterostructure (DH) directly grown on (100) GaP substrates have been fabricated for the first time. The samples were grown by gas-source molecular beam epitaxy with an RF nitrogen radical beam source to incorporate N in GaP. Compared to conventional GaAs-based AlGaInP red LEDs, this novel LED structure eliminates the complicated steps of etching the light-absorption GaAs substrate and wafer-bonding to a transparent GaP substrate. Based on the uncoated devices made with the heterojunction bipolar transistor masks, the emission efficiency of the DH LEDs is 20 times stronger than that of a GaNP pn homojunction diode