Al-N共掺P型Zn0.95Mg0.05O薄膜的性能

利用直流反应磁控溅射法,以N2O为N掺杂源,用Al-N共掺技术制备了p型Zn0.95Mg0.05O薄膜.用X射线衍射分析(XRD)、Hall测试仪和紫外可见(UV)透射谱等研究方法对其晶体结构、电学性能和禁带宽度进行分析.XRD分析结果表明,Zn0.95Mg0.05O薄膜具有良好的晶格取向,Hall测试的结果所得p型Zn0.95Mg0.05O薄膜最低电阻率为58.5Ω·cm,载流子浓度为1.95×1017 cm-3,迁移率为0.546cm2/(V·s),UV透射谱所推出的薄膜禁带宽度中,纯ZnO,p型Zn0.95Mg0.05O和p型Zn0.9Mg0.1O分别为3.34,3.39和3.46eV,可以看出Mg在ZnO禁带宽度中起了调节作用.     

Al-N共掺p型Zn0.95Mg0.05O薄膜的性能

利用直流反应磁控溅射法,以N2O为N掺杂源,用Al-N共掺技术制备了p型Zn0.95Mg0.05O薄膜.用X射线衍射分析(XRD)、Hall测试仪和紫外可见(UV)透射谱等研究方法对其晶体结构、电学性能和禁带宽度进行分析.XRD分析结果表明,Zn0.95Mg0.05O薄膜具有良好的晶格取向,Hall测试的结果所得p型Zn0.95Mg0.05O薄膜最低电阻率为58.5Ω·cm,载流子浓度为1.95×1017 cm-3,迁移率为0.546cm2/(V·s),UV透射谱所推出的薄膜禁带宽度中,纯ZnO,p型Zn0.95Mg0.05O和p型Zn0.9Mg0.1O分别为3.34,3.39和3.46eV,可以看出Mg在ZnO禁带宽度中起了调节作用.     

有机衬底SnO2∶Sb透明导电膜的研究

采用射频磁控溅射法在有机薄膜衬底上制备出SnO2∶Sb透明导电膜,并对薄膜的结构和光电特性以及制备参数对薄膜性能的影响进行了研究.制备的样品为多晶薄膜,并且保持了纯二氧化锡的金红石结构.SnO2∶Sb薄膜中Sb2O3的最佳掺杂比例为6%.适当调节制备参数,可以获得在可见光范围内平均透过率大于85%的有机衬底SnO2∶Sb透明导电薄膜,其电阻率～3.7×10-3Ω·cm,载流子浓度～1.55×1020cm-3,霍耳迁移率～13cm2·V-1·s-1.     

用超声喷雾热分解法制备p型Zn1-xMgxO薄膜

利用超声喷雾热分解(USP)技术,采用N-Al共掺法,在eagle2000衬底上制备出了电学特性较好的p型Zn0.93Mg0.07O薄膜:电阻率为18.43Ω.cm、迁移率是0.362 cm2/(V.s)、载流子浓度为1.24×1018cm-3。系统分析了前驱溶液中Al掺杂量或Mg掺杂量变化时对p型Zn1-xMgxO薄膜电学特性和结构特性的影响。紫外可见光透射测试表明:Zn1-xMgxO薄膜在紫外-可见光范围内的透过率达到了80%。     

用PLD方法制备Li掺杂的p型ZnMgO

在玻璃衬底上用PLD方法成功制备出具有高度(0002)取向性的、晶体质量较好的Li掺杂为0.4%的p型 Zn0.8Mg0.2O薄膜.衬底温度对薄膜的电学性能及结晶质量有重要影响,实验表明:在500℃时薄膜的电学性能最好,其载流子浓度为5.1×1018cm-3,电阻率为6.58Ω·cm,霍尔迁移率为0.189cm2/(V·s),且制备出的薄膜在可见光区具有90%的高透射率及在室温下光学禁带宽度3.625eV.     

用PLD方法制备Li掺杂的p型ZnMgO

在玻璃衬底上用PLD方法成功制备出具有高度(0002)取向性的、晶体质量较好的Li掺杂为0.4%的p型 Zn0.8Mg0.2O薄膜.衬底温度对薄膜的电学性能及结晶质量有重要影响,实验表明:在500℃时薄膜的电学性能最好,其载流子浓度为5.1×1018cm-3,电阻率为6.58Ω·cm,霍尔迁移率为0.189cm2/(V·s),且制备出的薄膜在可见光区具有90%的高透射率及在室温下光学禁带宽度3.625eV.     

N掺杂p型MgZnO薄膜的制备与性能研究

利用磁控溅射设备,Mg0.04Zn0.96O陶瓷靶材,以高纯的氮气与氩气混合气体作为溅射气体,在石英衬底上沉积获得了N掺杂p型Mg0.07Zn0.93O薄膜,薄膜的电阻率为21.47Ω·cm,载流子浓度为8.38×1016 cm-3,迁移率为3.45cm2/(V·s)。研究了该薄膜的结构与光学性能。实验结果显示,其拉曼光谱中出现了位于272和642cm-1左右与NO相关的振动模。低温光致发光光谱中,可以观察到位于3.201,3.384和3.469eV的3个发光峰,其中位于3.384eV的发光峰归因为导带电子到缺陷能级的复合发光,而位于3.469eV的发光峰归因为受主束缚激子(A0X)的辐射复合,这说明该N掺杂MgZnO薄膜的空穴载流子主要来自NO受主的贡献。     

PLD法制备锑掺杂p型ZnO薄膜

采用脉冲激光沉积方法在石英衬底上生长了掺锑(Sb)的p型ZnO薄膜.X射线衍射测试表明薄膜具有c轴择优取向的结构特性,霍尔测试表明ZnO薄膜呈p型导电特性,XPS分析表明Sb掺入了ZnO薄膜,且Sb掺人ZnO中是占据Zn的位置,而不是O的晶格位置.通过优化温度获得了电学性能优良的p型ZnO薄膜,其电阻率为2.21Ω·cm,迁移率为1.23cm2/(V·s),空穴浓度为2.30×1018cm-3.     

PLD法制备锑掺杂p型ZnO薄膜

采用脉冲激光沉积方法在石英衬底上生长了掺锑(Sb)的p型ZnO薄膜.X射线衍射测试表明薄膜具有c轴择优取向的结构特性,霍尔测试表明ZnO薄膜呈p型导电特性,XPS分析表明Sb掺入了ZnO薄膜,且Sb掺人ZnO中是占据Zn的位置,而不是O的晶格位置.通过优化温度获得了电学性能优良的p型ZnO薄膜,其电阻率为2.21Ω·cm,迁移率为1.23cm2/(V·s),空穴浓度为2.30×1018cm-3.     

基于生长方向的P型ZnO薄膜特性的研究

利用超声雾化热分解法(USP),通过N-Al共掺的方法,制备出p型ZnO薄膜.利用霍尔测试、X射线衍射(XRD)和扫描电子显微镜分析了不同生长时间ZnO薄膜样品的电学特性、结构和表面形貌的变化.结果表明:其它条件固定时,只有在合适的生长时间条件下,才能得到电学性能较好的N-Al共掺p型ZnO薄膜(电阻率为46.8 Ω·cm、迁移率为0.05 cm2·V-1·s-1、载流子浓度是2.86×1018 cm-3.     

High quality SiO2/Si interfaces of poly-crystallinesilicon thin film transistors by annealing in wet atmosphere

A new post-metallization annealing technique was developed to improve the quality of metal-oxide-semiconductor (MOS) devices using SiO ₂ films formed by a parallel-plate remote plasma chemical vapor deposition as gate insulators. The quality of the interface between SiO₂ and crystalline Si was investigated by capacitance-voltage (C-V) measurements. An H₂O vapor annealing at 270°C for 30 min efficiently decreased the interface trap density to 2.0×10¹⁰ cm^-2 eV^-1, and the effective oxide charge density from 1×10 ¹² to 5×10⁹ cm^-2. This annealing process was also applied to the fabrication of Al-gate polycrystalline silicon thin film transistors (poly-Si TFT's) at 270°C. In p-channel poly-Si TFT's, the carrier mobility increased from 60-400 cm² V^-1 s^-1 and the threshold voltage decreased from -5.5 to -1.7 V     

Optoelectronic properties of n-type CdZnTe 2-DEGsingle-quantum-well heterostructures

Optoelectronic properties of asymmetrically strained II-VI CdZnTe single-quantum-well structures grown by molecular-beam epitaxy are reported. Indium doping CdZnTe n-type using a two-dimensional electron gas heterostructure achieved a carrier mobility of 5000 cm²·V^-1 s^-1 at 40 K. A shallow donor ionization energy of 14.5 meV was determined from Hall effect measurements. Fabrication of a large-area-mesa heterostructure device allowed us to investigate exciton absorption of the mixed type-I and type-II single quantum well. Control of the electron concentration in the quantum well allows optical absorption modulation using both the quantum-confined Stark effect (QCSE) and phase-space absorption quenching. Separation of electron and hole photocurrents in different layers is demonstrated and results in photogain. A heavy-hole red-shift of 9.9 meV/V due to the reverse QCSE is reported     

Heterostructure devices using self-aligned p-type diffused ohmiccontacts

Describes the use of a p-type refractory ohmic contact in ohmic self-aligned devices. The contacts are based on self-aligned diffusion of zinc-doped tungsten film. The diffusion is nearly isotropic in the vicinity of silicon nitride sidewalls, allowing self-alignment of ohmic contacts with emitters and gates. Low-resistance contacts (<10^-6 Ω·cm²) are formed both to GaAs and GaAlAs, and the lifetime of the diffused region is superior to that obtained from implantation. Heterostructure bipolar transistors (HBTs) showing high current gains (⩾50 at 2×10³ A·cm^-2 and ⩾200 at 1×10⁵ A·cm^-2 with micrometer-sized emitter widths) and p-channel GaAs gate heterostructure field-effect transistors (HFETs) showing high transconductances (78 mS/mm at 2.2-μm gate length) have been fabricated using this contact     

Emission cross sections and spectroscopy of Ho3+ laserchannels in KGd(WO4)2 single crystal

The spectroscopic properties of Ho³⁺ laser channels in KGd(WO₄)₂ crystals have been investigated using optical absorption, photoluminescence, and lifetime measurements. The radiative lifetimes of Ho³⁺ have been calculated through a Judd-Ofelt (JO) formalism using 300-K optical absorption results. The JO parameters obtained were Ω₂=15.35×10^-20 cm², Ω ₄=3.79×10^-20 cm², Ω₆ =1.69×10^-20 cm². The 7-300-K lifetimes obtained in diluted (8·10¹⁸ cm^-3) KGW:0.1% Ho samples are: τ(⁵F₃)≈0.9 μs, τ( ⁵S₂)=19-3.6 μs, and τ(⁵F₅ )≈1.1 μs. For Ho concentrations below 1.5×10²⁰ cm^-3, multiphonon emission is the main source of non radiative losses, and the temperature independent multiphonon probability in KGW is found to follow the energy gap law τ_ph ^-1(0)=βexp(-αΔE), where β=1.4×10^-7 s^-1, and α=1.4×10³ cm. Above this holmium concentration, energy transfer between Ho impurities also contributes to the losses. The spectral distributions of the Ho³⁺ emission cross section σ_EM for several laser channels are calculated in σ- and π-polarized configurations. The peak a σ_EM values achieved for transitions to the ⁵I₈ level are ≈2×10^-20 cm² in the σ-polarized configuration, and three main lasing peaks at 2.02, 2.05, and 2.07 μm are envisaged inside the ⁵I₇→⁵I₈ channel     

高性能钆铝锌氧薄膜晶体管的制备

本文研究并制备了钆铝锌氧薄膜和以钆铝锌氧为有源层的薄膜晶体管。钆铝锌氧薄膜材料的光致发光光谱和透过率说明钆铝锌氧薄膜在透明显示方向的应用潜力。透射电子显微镜揭示了钆铝锌氧薄膜的非晶态微观结构。钆铝锌氧薄膜晶体管显示了良好的转移特性和输出特性。器件开关比大于10~5、饱和迁移率约为10cm~2·V~(-1)·s~(-1)。实验结果表明,钆铝锌氧薄膜可用作氧化物薄膜晶体管的有源层材料;钆铝锌氧薄膜晶体管可作为像素电路的驱动器件。     

Low-resistance bandgap-engineeredW/Si1-xGex/Si contacts

Bandgap-engineered W/Si_1-xGe_x/Si junctions (p⁺ and n⁺) with ultra-low contact resistivity and low leakage have been fabricated and characterized. The junctions are formed via outdiffusion from a selectively deposited Si_0.7Ge _0.3 layer which is implanted and annealed using RTA. The Si _1-xGe_x layer can then be selectively thinned using NH₄OH/H₂O₂/H₂O at 75°C with little change in characteristics or left as-deposited. Leakage currents were better than 1.6×10^-9 A/cm² (areal), 7.45×10^-12 A/cm (peripheral) for p⁺/n and 3.5×10^-10 A/cm² (peripheral) for n⁺/p. W contacts were formed using selective LPCVD on Si_1-xGe_x. A specific contact resistivity of better than 3.2×10^-8 Ω cm² for p ⁺/n and 2.2×10^-8 Ω cm² for n⁺/p is demonstrated-an order of magnitude n⁺ better than current TiSi₂ technology. W/Si_1-xGe _x/Si junctions show great potential for ULSI applications     

High average and high peak brightness slab laser

A high average and high peak brightness Nd:YAG MOPA laser system composed of a laser-diode-pumped Nd:YAG master oscillator, flash-lamp-pumped slab power amplifiers and a phase conjugated mirror was developed. The system demonstrates an average output power of 235 W at a repetition rate of 320 Hz and a peak power of 30 MW at a pulse duration of 24 ns with M²=1.5. Both an average brightness of 7×10⁹ W/cm²·sr and a peak brightness of 1×10¹⁵ W/cm2·sr are achieved simultaneously. The system design rules that we confirmed suggest that by replacing lamp pumping in the amplifier with laser-diode pumping, an average output power of ~1 kW can be obtained at ~1 kHz with a higher average brightness of ~3×10¹⁰ W/cm²·sr and a higher peak brightness of ~3×10¹⁵ W/cm²·sr     

Experimental determination of electron drift velocity in 4H-SiC p+-n-n+ avalanche diodes

4H-SiC p⁺-n-n⁺ diodes of low series resistivity (<1×10^-4 Ω·cm²) were fabricated and packaged. The diodes exhibited homogeneous avalanche breakdown at voltages U_b=250-270 V according to the doping level of the n layer. The temperature coefficient of the breakdown voltage was measured to be 2.6×10^-4 k^-1 in the temperature range 300 to 573 K. These diodes were capable of dissipating a pulsed power density of 3.7 MW/cm² under avalanche current conditions. The transient thermal resistance of the diode was measured to be 0.6 K/W for a 100-ns pulse width, An experimental determination of the electron saturated drift velocity along the c-axis in 4H-SIC was performed for the first time, It was estimated to be 0.8×10⁷ cm/s at room temperature and 0.75×10⁷ cm/s at approximately 360 K     

Properties of ion-implanted junctions in mercury—cadmium—telluride

The formation of n-p junctions by ion-implantation in Hg0.71Cd0.29Te is shown to be a result of implantation damage. n-p photodiodes have been made by implantation of Ar, B, Al, and P in a p-type substrate with acceptor concentration of 4 × 10¹⁶cm^-3. The implanted n-type layer is characterized by sheet electron concentration of 10¹⁴to 10¹⁵cm^-2and electron mobility higher than 10³cm². V^-1. s^-1, for ion doses in the range 10¹³-5 × 10¹⁴cm^-2. The photodiodes have a spectral cutoff of 5.2 µm, quantum efficiency higher than 80 percent, and differential resistance by area product above 2000 Ω . cm²at 77 K. The temperature dependence of the differential resistance is discussed. The junction capacitance dependence on reverse voltage fits a linearly graded junction model. Reverse current characteristics at 77 K have been investigated using gate-controlled diodes. The results suggest that reverse breakdown is dominated by interband tunneling in field-induced junctions at the surface, for both polarities of surface potential.     

High peak tunnel current densityGa0.47In0.53As Esaki diodes

High peak current density Ga_0.47In_0.53As interband tunnel diodes were fabricated by metal organic molecular beam epitaxy. A room temperature peak-to-valley current ratio of 16 and a peak tunnel current density of 9.2 kA/cm² were obtained in diodes doped to ~3×10¹⁹cm³ on both n-type and p-type sides. A peak-to-valley current ratio of 3.8, and a peak tunnel current density of 93.2 kA/cm² were obtained in diodes doped to ~10²⁰ cm^-3 on both n-type and p-type sides