硅基隧穿二极管

隧穿二极管是一种很有前途的基于带隙工程的异质结构量子器件,其电流电压(I-V)曲线中所呈现的微分负阻特性能够用于开发多种不同的电路功能。在最近的研究中,空穴型双势垒单势阱共振隧穿二极管得到了实现,为Si1-xGex/Si异质结隧穿二极管器件的改进和电路应用打下了良好的基础。     

室温下Si/Si1-xGex共振隧穿二极管的数值模拟

采用量子水动力学(QHD)模型模拟了35nm Si/Si1-xGex空穴型共振隧穿二极管(RTD)在室温下的I-V特性.模拟过程中,引入second upwind,Schafetter-Gummel(SG)和二阶中心差分法相结合的离散方法对方程组进行离散,保证了结果的收敛性.还模拟了不同的器件结构,对结果的分析表明器件的势垒厚度和载流子有效质量都会对RTD的负阻效应产生影响.在室温下(T=293K),当x=0.23时,模拟结果的峰谷电流比为1.14,与实验结果相吻合.     

室温下Si/Si1-xGex共振隧穿二极管的数值模拟

采用量子水动力学(QHD)模型模拟了35nm Si/Si1-xGex空穴型共振隧穿二极管(RTD)在室温下的I-V特性.模拟过程中,引入second upwind,Schafetter-Gummel(SG)和二阶中心差分法相结合的离散方法对方程组进行离散,保证了结果的收敛性.还模拟了不同的器件结构,对结果的分析表明器件的势垒厚度和载流子有效质量都会对RTD的负阻效应产生影响.在室温下(T=293K),当x=0.23时,模拟结果的峰谷电流比为1.14,与实验结果相吻合.     

共振隧穿二极管型光探测器和光调制器

将共振隧穿二极管(RTD)的核心结构——双势垒系统与光探测器和调制器的原理相结合可构成共振隧穿光探测器和共振隧穿光调制器。这些器件既保持了RTD高频、高速的特点,同时又具备了光探测器和光调制器原有的功能,可用于光电集成电路。介绍了这种具有代表性的RTD型光电器件的工作原理、器件结构、制造工艺、器件参数测试等,为此类器件在国内的设计和研制奠定基础。     

基于共振隧穿二极管的蔡氏电路设计研究

首次提出一种基于共振隧穿二极管的蔡氏电路.利用共振隧穿二极管(RTD)的负微分电阻特性,采用驱动点特性合成的方法,实现了蔡氏电路中的分段线性电阻,通过一组参数的选取,进而实现了蔡氏电路,并用PSpice模拟软件进行了仿真验证.相对于用传统方法实现的蔡氏电路,基于RTD的蔡氏电路具有电路结构更加简洁、便于集成的特点.     

共振隧穿二极管中的电荷积累效应——共振隧穿器件讲座(4)

介绍了共振隧穿二极管(RTD)中电荷积累效应,利用顺序隧穿模型分析了RTD中有电荷积累时器件各部分电压的再分布;并结合电压降局限于双势垒区和遍及整个RTD的两种情况,建立了电荷和电流方程;最后利用电荷积累效应解释了负阻区本征双稳态特性。     

一种新材料结构的RTD器件的设计及实现

设计了一种带有Al0.22Ga0.78As/In0.15Ga0.85As/GaAs发射极空间层和GaAs/In0.15Ga0.85As/GaAs量子阱的共振隧穿二极管(RTD)材料结构,并且成功地制作了相应的RTD器件.在室温下,测试了RTD器件的直流特性,计算了RTD器件的峰谷电流比和可资电流密度.在分析器件特性的基础上,指出调整材料结构和优化工艺参数将进一步提高RTD器件的性能.     

基于共振隧穿二极管的应力检测方法

共振隧穿二极管(RTD)具有微分负阻效应,且其共振隧穿的I-V特性随着廊力的变化而变化,这就是RTD的压阻效应.与半导体材料压阻效应的应用类似,RTD也可用于应力检测.文中研究了两种基于RTD的应力检测方法.在讨论频率-应力检测法的基础上提出了一种新颖的应力检测方法--惠斯通RTD电桥检测法.测试结果表明,基于惠斯通RTD电桥检测法得到的压阻灵敏度随偏置电压可调,町调范围达到三个数量级.     

基于共振隧穿二极管的应力检测方法

共振隧穿二极管(RTD)具有微分负阻效应,且其共振隧穿的I-V特性随着廊力的变化而变化,这就是RTD的压阻效应.与半导体材料压阻效应的应用类似,RTD也可用于应力检测.文中研究了两种基于RTD的应力检测方法.在讨论频率-应力检测法的基础上提出了一种新颖的应力检测方法--惠斯通RTD电桥检测法.测试结果表明,基于惠斯通RTD电桥检测法得到的压阻灵敏度随偏置电压可调,町调范围达到三个数量级.     

RTD在压力下的弛豫振荡特性

报道了共振隧穿二极管(RTD)在压力下的弛豫振荡特性.采用Pspice 8.0软件仿真并设计了振荡电路,测得其振荡频率达200kHz.在(100)半绝缘(SI)GaAs衬底上利用分子束外延(MBE)技术生长了AlAs/InxGa1-xAs/GaAs双势垒共振隧穿结构(DBRTS),并采用Au/Ge/Ni/Au金属化和空气桥结构成功加工出了RTD.由于RTD的压阻效应,采用显微喇曼光谱仪标定所加应力大小,对RTD在加压条件下的振荡特性进行了研究,结果表明其弛豫振荡频率大致有-17.9kHz/MPa的改变量.     

Doping and processing epitaxial GexSi1−x films on Si(100) by ion implantation for Si-based heterojunction devices applications

The question of whether one can effectively dope or process epitaxial Si(100)/GeSi heterostructures by ion implantation for the fabrication of Si-based heterojunction devices is experimentally investigated. Results that cover several differention species (B, C, Si, P, Ge, As, BF₂, and Sb), doses (10¹³ to 10¹⁶/cm²), implantation temperatures (room temperature to 150°C), as well as annealing techniques (steady-state and rapid thermal annealing) are included in this minireview, and the data are compared with those available in the literature whenever possible. Implantation-induced damage and strain and their annealing behavior for both strained and relaxed GeSi are measured and contrasted with those in Si and Ge. The damage and strain generated in pseudomorphic GeSi by room-temperature implantation are considerably higher than the values interpolated from those of Si and Ge. Implantation at slightly elevated substrate temperatures (e.g., 100°C) can very effectively suppress the implantation-induced damage and strain in GeSi. The fractions of electrically active dopants in both Si and GeSi are measured and compared for several doses and under various annealing conditions. Solid-phase epitaxial regrowth of GeSi amorphized by implantation has also been studied and compared with regrowth in Si and Ge. For the case of metastable epi-GeSi amorphized by implantation, the pseudomorphic strain in the regrown GeSi is always lost and the layer contains a high density of defects, which is very different from the clean regrowth of Si(100). Solid-phase epitaxy, however, facilitates the activation of dopants in both GeSi and Si, irrespective of the annealing techniques used. For metastable GeSi films that are not amorphized by implantation, rapid thermal annealing is shown to outperform steady-state annealing for the preservation of pseudomorphic strain and the activation of dopants. In general, defects generated by ion implantation can enhance the strain relaxation process of strained GeSi during post-implantation annealing. The processing window that is optimized for ion-implanted Si, therefore, has to be modified considerably for ion-implanted GeSi. However, with these modifications, the mature ion implantation technology can be used to effectively dope and process Si/GeSi heterostructures for device applications. Possible impacts of implantation-induced damage on the reliability of Si/GeSi heterojunction devices are briefly discussed.     

Design and Manufacture of GeSi/Si Superlattice Nanocrystalline Photodetector

According to Maxwell＇s theory, the optical transmission characteristics in GeSi/Si superlattice nanocrystalline layer have been analyzed and calculated. The calculated result shows that when the total thickness L is 340 nm, the single mode lightwave can be transmitted only at periodic number M≥15.5. In addition, at the direction of transmission, when the transmission distance is larger than 500 μm, the lightwave intensity is decreased greatly. Based on the above parameters, the design and manufacture of GeSi/Si superlattice nanocrystalline photodetector are carried out.     

带间共振隧穿二极管(RITD)

带间共振隧穿二极管(RITD)是导带与价带间发生共振隧穿的两端器件,其特点是启始电压VT和峰值电压Vp较低,电流峰谷比PVCR较大。在导出RITD物理模型和其电流密度方程的基础上重点介绍了InAs/AlSb/GaSbⅡ类异质结RITD、n+InAlAs/InGaAs/InAlAs/In-GaAs/p+InAlAsp-n结双势阱Ⅰ类RITD以及δ掺杂RITD三种RITD的器件结构、材料结构、工作原理、器件特性和参数等,并对这三种RITD的特点进行了比较和讨论。     

Si/SiGe Resonant Interband Tunneling Diodes Incorporating $delta$-Doping Layers Grown by Chemical Vapor Deposition

This is the first report of a Si/SiGe resonant interband tunneling diodes (RITDs) on silicon substrates grown by the chemical vapor deposition process. The nominal RITD structure forms two quantum wells created by sharp $delta$-doping planes which provide for a resonant tunneling condition through the intrinsic spacer. The vapor phase doping technique was used to achieve abrupt degenerate doping profiles at higher substrate temperatures than previous reports using low-temperature molecular beam epitaxy, and postgrowth annealing experiments are suggestive that fewer point defects are incorporated, as a result. The as-grown RITD samples without postgrowth thermal annealing show negative differential resistance with a recorded peak-to-valley current ratio up to 1.85 with a corresponding peak current density of 0.1 $hbox{kA/cm}^{2}$ at room temperature.      

Resonant Tunneling through Monolayer Si Colloidal Quantum Dots and Ge Nanocrystals

Resonant tunneling through a 4 nm nanocrystal Ge (nc‐Ge) layer and a 2.4 nm monolayer of Si colloidal quantum dots (QD) is achieved with 0.7 nm amorphous Al₂O₃ (a‐Al₂O₃) barriers. The nc‐Ge resonant tunneling diode (RTD) demonstrates a peak‐to‐valley current ratio (PVCR) of 8 and a full width at half maximum (FWHM) of 30 mV at 300 K, the best performance among RTDs based on annealed nanocrystals. The Si QD RTD is first achieved with PVCRs up to 47 and FWHMs as small as 10 mV at room temperature, confirming theoretically expected excellences of 3D carrier confinements. The high performances are partially due to the smooth profile of nc‐Ge layer and the uniform distribution of Si QDs, which reduce the adverse influences of many‐body effects. More importantly, carrier decoherence is avoided in the 0.7 nm a‐Al₂O₃ barriers thinner than the phase coherence length (≈1.5 nm). Ultrathin a‐Al₂O₃ also passivates well materials and suppresses leakage currents. Additionally, the interfacial bandgap of ultrathin a‐Al₂O₃ is found to be similar to the bulk, forming deep potential wells to sharpen transmission curves. This work can be easily extended to other materials, which may enable resonant tunneling in various nanosystems for diverse purposes.     

模拟集成电路的发展动态

本文介绍了Ａ／Ｄ与Ｄ／Ａ转换器、超高速ＳＯＩ器件及电路、超高速双极电路、ＧｅＳｉ／Ｓｉ异质结器件和电路、智能功率等模拟集成电路的发展概况。     

Investigation of the local density of states in self-assembled GeSi/Si(001) nanoislands by combined scanning tunneling and atomic-force microscopy

The local density of states in self-assembled GeSi/Si(001) nanoislands is investigated for the first time by combined tunneling and atomic-force scanning microscopy. Current images and tunneling spectra of individual GeSi/Si(001) islands are obtained. These measurements yield the spatial and energy distributions of the local density of states in GeSi islands, respectively. The tunneling spectroscopy data demonstrate that uncapped Ge_0.3Si_0.7/Si(001) islands behave as type-I heterostructures.     

Nine-state resonant tunneling diode memory

The authors demonstrate an epitaxial series combination of eight pseudomorphic AlAs/In_0.53Ga_0.47As/InAs resonant tunneling diodes (RTDs) grown by molecular beam epitaxy on InP. This series RTD produces an eight-peak multiple negative differential resistance characteristic with a peak-to-valley current ratio (PVR) exceeding 2 per peak at a peak current density of approximately 6 kA/cm ². Hysteresis in the current-voltage characteristic is reduced by uniformly Si doping the double-barrier resonant tunneling region at a density of 5×10¹⁶ cm^-3. Using this multiple-peak RTD in series with a field-effect transistor load, a nine-state multivalued memory circuit is demonstrated     

GeSi-PMODMOS器件研究

在分析PMODMOS结构以及器件物理基础上,重点研究了GeSi沟道中Ge含量分布、超薄栅介质层SiO2和Si帽层厚度等对GeSi－PMODMOS特性的影响。介绍了与GeSi-PMODMOS结构器件相关的超薄栅介质层（PESiO2,LPSiO2）、超浅结工艺和超浅结金属化等重要工艺技术。