A 44-/spl mu/W 4.3-GHz injection-locked frequency divider with 2.3-GHz locking range

A microwatt frequency divider for the 2.5-GHz ISM band is proposed. This divider directly modulates the output in a ring oscillator by means of a switch and realizes low power consumption with low supply voltage and a wide locking range. It is fabricated using a five-layer-metal and 0.2-/spl mu/m-gate length CMOS process. The core size is 10.8/spl times/10.5 /spl mu/m/sup 2/, which is much smaller than that of a typical inductor-enhanced frequency divider. This divider operates with a supply voltage in the range from 1.8 to 0.7V, and attains minimum power consumption of 44 /spl mu/W, in which case the supply voltage is 0.7 V, the maximum operating frequency is 4.3 GHz, and the locking range is 2.3 GHz. A derivation of the frequency locking range of the divider is provided in the Appendix.     

V-band harmonic injection-locked frequency divider using cross-coupled FETs

A V-band 1/2 frequency divider is developed using harmonic injection-locked oscillator. The cross-coupled field effect transistors (FETs) and low quality-factor microstrip resonator are employed as a wide-band oscillator to extend the locking bandwidth. The second harmonic of free-running oscillation signal is injected to the gates of cross-coupled FETs for high-sensitivity superharmonic injection locking. The fabricated microwave monolithic integrated circuit frequency divider using 0.15-/spl mu/m GaAs pHEMT process showed a maximum locking range of 7.4 GHz (from 65.1 to 72.5 GHz) under a low power dissipation of 100 mW. The maximum single-ended output power was as high as -3 dBm.     

A wide locking range and low Voltage CMOS direct injection-locked frequency divider

A low voltage and wide locking range injection-locked frequency divider using a standard 0.18-/spl mu/m complementary metal oxide semiconductor (CMOS) process is presented. The wide locking range and the low-voltage operation are performed by adding an injection nMOS between the differential outputs of the divider that contains on-chip transformers which result in positive feedback loops to swing the output signals above the supply and below the ground potential. This dual-swing capability maximizes the carrier power and achieves low-voltage performance. The measurement results show that at the supply voltage of 0.75-V, the divider free-running frequency is 2.02 GHz, and at the incident power of 0 dBm the locking range is about 1.49 GHz (36.88%), from the incident frequency 3.27 to 4.64GHz.     

A 15-GHz broad-band /spl divide/2 frequency divider in 0.13-/spl mu/m CMOS for quadrature generation

This letter presents a 0.13-/spl mu/m CMOS frequency divider realized with an injection-locking ring oscillator. This topology can achieve a larger input frequency range and better phase accuracy with respect to injection-locking LC oscillators, because of the smoother slope of the loop gain phase-frequency plot. Post layout simulations show that the circuit is able to divide an input signal spanning from 7 to 19GHz, although the available tuning range of the signal source limited the experimental verification to the interval 11-15GHz, featuring a 31% locking range. The divider dissipates 3mA from a 1.2-V power supply.     

A 1.5-V 45-mW direct-conversion WCDMA receiver IC in 0.13-/spl mu/m CMOS

A 2-GHz direct-conversion receiver for wide-band code division multiple access (WCDMA) is presented. It includes two low-noise amplifiers (LNAs), an I/Q demodulator, and two sixth-order baseband channel select filters with programmable gain. Quadrature local oscillator (LO) signals are generated on chip in a frequency divider flip-flop. An external interstage filter between the LNAs rejects transmitter leakage to relax demodulator linearity requirements. A low-voltage demodulator topology improves linearity as well as demodulator output pole accuracy. The active-RC baseband filter uses a programmable servo loop for offset compensation and provides an adjacent channel rejection of 39 dB. Programmable gain over 71-dB range in 1-dB steps is merged with the filter to maximize dynamic range. An automatic on-chip frequency calibration scheme provides better than 1.5% corner frequency accuracy. The receiver is integrated in a 0.13-/spl mu/m CMOS process with metal-insulator-metal (MIM) capacitors. Measured receiver performance includes a 6.5-dB noise figure, IIP2 of +27 dBm, and IIP3 of -8.6 dBm. Power consumption is 45 mW.     

Low phase noise IP VCO for multistandard communication using a 0.35-/spl mu/m BiCMOS SiGe technology

In this letter, we report that a commonly used 0.35-/spl mu/m, 60-GHz-F/sub MAX/ BiCMOS SiGe monolithic microwave integrated circuit (MMIC) technology is able to provide very low phase noise signal generation in the X-band frequency range. This statement has been demonstrated using a differential LC voltage-controlled oscillator (VCO) in which varactors are realized with metal-oxide semiconductor (MOS) transistors and inductors with a patterned ground shield technology. This VCO features an output power signal in the range of -5 dBm and exhibits a phase noise of -96 dBc/Hz at a frequency offset of 100kHz from carrier and -120 dBc/Hz at a frequency offset of 1 MHz. The VCO features a tuning range of 430 MHz or 4.3% of its operating frequency. Its power consumption is in the range of 70 mW (200 mW with buffers circuits) for a chip size of 800/spl times/1000 /spl mu/m/sup 2/ (including RF probe pads).     

A low-power CMOS Bluetooth RF transceiver with a digital offset canceling DLL-based GFSK demodulator

This paper presents a fully integrated 0.18-/spl mu/m CMOS Bluetooth transceiver. The chip consumes 33 mA in receive mode and 25 mA in transmit mode from a 3-V system supply. The receiver uses a low-IF (3-MHz) architecture, and the transmitter uses a direct modulation with ROM-based Gaussian low-pass filter and I/Q direct digital frequency synthesizer for high level of integration and low power consumption. A new frequency shift keying demodulator based on a delay-locked loop with a digital frequency offset canceller is proposed. The demodulator operates without harmonic distortion, handles up to /spl plusmn/160-kHz frequency offset, and consumes only 2 mA from a 1.8-V supply. The receiver dynamic range is from -78 dBm to -16 dBm at 0.1% bit-error rate, and the transmitter delivers a maximum of 0 dBm with 20-dB digital power control capability.     

A multimode 0.3-200-kb/s transceiver for the 433/868/915-MHz bands in 0.25-/spl mu/m CMOS

A fully integrated transceiver suitable for low-data-rate wireless telemetry and sensor networks operating in the license-free ISM frequency bands at 433, 868, or 915 MHz implemented in 0.25-/spl mu/m CMOS is presented. G/FSK, ASK, and OOK modulation formats are supported at data rates from 0.3 to 200 kb/s. The transceiver's analog building blocks include a low-noise amplifier, mixer, channel filter, received signal-strength indication, frequency synthesizer, voltage-controlled oscillator, and power amplifier. FSK demodulation is implemented using a novel digital complex-frequency correlator that operates over a wide modulation-index range and approximates matched filter detection performance. Automatic gain control, automatic frequency control, and symbol timing recovery loops are included on chip. Operating in the 915-MHz band in FSK mode at 9.6 kb/s, the receiver consumes 19.7 mA from a 3-V supply and achieves a sensitivity of -112.8dBm at 0.1% BER. The transmitter consumes 28.5 mA for an output power of 10 dBm and delivers up to 14 dBm.     

1-GHz, 200/spl deg/C, SiC MESFET Clapp oscillator

A SiC Clapp oscillator fabricated on an alumina substrate with chip capacitors and spiral inductors is designed for high-temperature operation at 1GHz. The oscillator operated from 30/spl deg/C to 200/spl deg/C with an output power of 21.8dBm at 1GHz and 200/spl deg/C. The efficiency at 200/spl deg/ C is 15%. The frequency variation over the temperature range is less than 0.5%.     

A 5-GHz programmable frequency divider in 0.18-μM CMOS technology

A 5-GHz CMOS programmable frequency divider whose modulus can be varied from 2403 to 2480 for 2.4-GHz ZigBee applications is presented.The divider based on a dual-modulus prescaler (DMP) and pulse-swallow counter is designed to reduce power consumption and chip area.Implemented in the 0.18-μm mixed-signal CMOS process,the divider operates over a wide range of 1-7.4 GHz with an input signal of 7.5 dBm; the programmable divider output phase noise is -125.3 dBc/Hz at an offset of 100 kHz.The core circuit without test buffer consumes 4.3 mA current from a 1.8 V power supply and occupies a chip area of approximately 0.015 mm2.The experimental results indicate that the programmable divider works well for its application in frequency synthesizers.     

LC-Tank Colpitts Injection-Locked Frequency Divider With Even and Odd Modulo

A new injection-locked frequency divider (ILFD) using a standard 0.18 $mu$m CMOS process is presented. The ILFD is based on a differential Colpitts voltage controlled oscillator (VCO) with a direct injection MOSFET for coupling an external signal to the resonators. The VCO is composed of two single-ended VCOs coupled with two transformers. Measurement results show that at the supply voltage of 1.4 V the divider's free-running frequency is tunable from 4.77 to 5.08 GHz, and the proposed circuit can function as a first harmonic injection-locked oscillator, divide-by-2, -3, and -4 frequency divider. At the incident power of 0 dBm the divide-by-2 operation range is from the incident frequency 7.7 to 11.5 GHz and the divide-by-4 operation range is from the incident frequency 18.9 to 20.2 GHz.      

A miniaturized Wilkinson power divider with CMOS active inductors

A miniaturized Wilkinson power divider implemented in a standard 0.18-/spl mu/m CMOS process is presented in this letter. By using active inductors for the circuit implementation, a significant area reduction can be achieved due to the absence of distributed components and spiral inductors. The power divider is designed at a center frequency of 4.5GHz for equal power dividing with all ports matched to 50/spl Omega/. Drawing a dc current of 9.3mA from a 1.8-V supply voltage, the fabricated circuit exhibits an insertion loss less than 0.16dB and a return loss better than 30dB at the center frequency while maintaining good isolation between the output ports. The active area of the miniaturized Wilkinson power divider is 150/spl times/100/spl mu/m/sup 2/, which is suitable for system integration in monolithic microwave integrated circuit (MMIC) applications.     

应用于26 GHz-41 GHz频率综合器的高速可编程分频器的设计

毫米波频率综合器中的重要模块之一高速可编程多模分频器,它主要用于对VCO的输出信号进行分频从而获得稳定的本振信号,它的性能影响整个毫米波频率综合器性能。本文设计的一种高速、低功耗、分频比可变的分频器具有非常重要的意义[1]。根据26 GHz-41 GHz硅基锁相环频率综合器的系统指标,本文基于TSMC 45nm CMOS工艺,设计实现了一种高速可编程分频器。本文采用注入锁定结构分频结构实现高速预分频,该结构可以实现在0 d Bm的输入功率下实现25 GHz-48 GHz的分频范围、最低功耗为:2.6 m W。基于脉冲吞咽计数器的可编程分频器由8/9双模分频器和可编程脉冲吞咽计数器组成。其中8/9双模分频器由同步4/5分频器和异步二分频构成,工作频率范围10 GHz-27 GHz,最低输入幅度为:300 m V,最低功耗为:1.6 m V。可编程吞咽计数器采用改进型带置数功能的TSPC D触发器,该可编程分频器的最大工作范围:25 GHz;最小功耗为:363μW。本文设计的高速可编程多模分频器,可以实现32-2 062的分频比;当工作于28 GHz时,相位噪声小于-159 dBc/Hz。动态功耗为5.2 m W。     

A single-chip dual-band direct-conversion IEEE 802.11a/b/g WLAN transceiver in 0.18-/spl mu/m CMOS

This paper presents a single-chip dual-band CMOS direct-conversion transceiver fully compliant with the IEEE 802.11a/b/g standards. Operating in the frequency ranges of 2.412-2.484 GHz and 4.92-5.805 GHz (including the Japanese band), the fractional-N PLL based frequency synthesizer achieves an integrated (10 kHz-10 MHz) phase noise of 0.54/spl deg//1.1/spl deg/ for 2/5-GHz band. The transmitter error vector magnitude (EVM) is -36/-33 dB with an output power level higher than -3/-5dBm and the receiver sensitivity is -75/-74 dBm for 2/5-GHz band for 64QAM at 54 Mb/s.     

Fully integrated CMOS fractional-N frequency divider for wide-band mobile applications with spurs reduction

A spurs reduction fractional-N frequency divider with a frequency range which is 3.5 times larger than that of a conventional fractional-N divider is presented in this paper. A 1.2-GHz quadrature voltage-controlled oscillator (VCO) is designed as the input source of the frequency divider. The circuit was fabricated using the 0.25-/spl mu/m CMOS technology. The power consumption of the frequency divider and the quadrature VCO are 3 and 6 mW, respectively, at a 2-V supply.     

A low-voltage 40-GHz complementary VCO with 15% frequency tuning range in SOI CMOS technology

The design of a low-voltage 40-GHz complementary voltage-controlled oscillator (VCO) with 15% frequency tuning range fabricated in 0.13-/spl mu/m partially depleted silicon-on-insulator (SOI) CMOS technology is reported. Technological advantages of SOI over bulk CMOS are demonstrated, and the accumulation MOS (AMOS) varactor limitations on frequency tuning range are addressed. At 1.5-V supply, the VCO core and each output buffer consumes 11.25 mW and 3 mW of power, respectively. The measured phase noise at 40-GHz is -109.73 dBc/Hz at 4-MHz offset from the carrier, and the output power is -8 dBm. VCO performance using high resistivity substrate (/spl sim/300-/spl Omega//spl middot/cm) has the same frequency tuning range but 2 dB better phase noise compared with using low resistivity substrate (10 /spl Omega//spl middot/cm). The VCO occupies a chip area of only 100 /spl mu/m by 100 /spl mu/m (excluding pads).     

96-GHz static frequency divider in SiGe bipolar technology

A static frequency divider designed in a 210-GHz f/sub T/, 0.13-/spl mu/m SiGe bipolar technology is reported. At a -5.5-V power supply, the circuit consumes 44 mA per latch (140 mA total for the chip, with input-output stages). With single-ended sine wave clock input, the divider is operational from 7.5 to 91.6 GHz. Differential clocking under the same conditions extends the frequency range to 96.6 GHz. At -5.0 V and 100 mA total current (28 mA per latch), the divider operates from 2 to 85.2 GHz (single-ended sine wave input).     

Design of a low power wide-band high resolution programmable frequency divider

The design of a high-speed wide-band high resolution programmable frequency divider is investigated. A new reloadable D flip-flop for the high speed programmable frequency divider is proposed. It is optimized in terms of propagation delay and power consumption as compared with the existing designs. Measurement results show that an all-stage programmable counter implemented with this D flip-flop using the Chartered 0.18 /spl mu/m CMOS process is capable of operating up to 1.8 GHz for a 1.8 V supply voltage and a 5.8-mW power consumption. By using this counter, an ultra-wide range high resolution frequency divider is achieved with low power consumption for 5-6-GHz wireless LAN applications.     

A 1-V 2.5-mW 5.2-GHz frequency divider in a 0.35-/spl mu/m CMOS process

A 1-V low-power high-speed dynamic-loading frequency divider is proposed using novel D flip-flops with a common-gate topology and with a single clock phase. A simple and accurate small-signal analysis model is provided to estimate the operating frequencies of the divider. Implemented in a standard digital 0.35-/spl mu/m CMOS process and at 1-V supply, the proposed frequency divider measures a maximum operating frequency up to 5.2 GHz with a power consumption of 2.5 mW.     

A 0.35-/spl mu/m CMOS 2-GHz VCO in wafer-level package

This letter presents a complementary metal oxide semiconductor (CMOS) voltage-controlled oscillator (VCO) with a high-Q inductor in a wafer-level package for the LC-resonator. The on-chip inductor is implemented using the redistribution metal layer of the wafer-level package (WLP), and therefore it is called a WLP inductor. Using the thick passivation and copper metallization, the WLP inductor has high quality-factor (Q-factor). A 2-nH inductor exhibits a Q-factor of 8 at 2 GHz. The center frequency of the VCO is 2.16 GHz with a tuning range of 385 MHz (18%). The minimum phase noise is measured to be -120.2 dBc/Hz at an offset frequency of 600 kHz. The dc power consumed by the VCO-core is 1.87 mW with a supply voltage of 1.7 V and a current of 1.1 mA. The output power with a 50-/spl Omega/ load is -12.5/spl plusmn/1.3 dBm throughout the whole tuning range. From the best of our knowledge, compared with recently published 2-GHz-band 0.35 /spl mu/m CMOS VCOs in the literature, the VCO in this work shows the lowest power consumption and the best figure-of-merit.