Effects of oxygen flow rate on microstructure and properties of indium molybdenum oxide films by ion beam-assisted deposition

The purpose of the present work is to experimentally study the effect of oxygen flow rate on the microstructure and properties of indium molybdenum oxide (IMO) films deposited onto the polyethersulfone (PES) substrate by ion beam-assisted deposition (IBAD). Crystalline quality, surface morphology, and optoelectronic properties of the IMO films are examined. Experimental results show that the IMO films present a columnar feature as observed by using FE-SEM with the corresponding root mean square (RMS) roughness of 2 nm as measured by using AFM. An increased oxygen flow rate reduces resistivity of the IMO film. The lowest resistivity of 1.59×10⁻³ Ω cm, with carrier mobility of 16.31 cm²/V s, carrier concentration of 1.02×10²⁰ cm⁻³, and visible transmittance of 82% of the IMO film was achieved under an oxygen flow rate of 5 sccm at an ion beam discharge voltage of 150 V.     

Effect of the oxygen flow on the properties of ITO thin films deposited by ion beam assisted deposition (IBAD)

ITO films were deposited onto glass substrates by ion beam assisted deposition method. The oxygen ions were produced using a Kaufman ion source. The oxygen flow was varied from 20 until 60 sccm and the effect of the oxygen flow on properties of ITO films has been studied. The structural properties of the film were characterized by X-ray diffraction and atomic force microscopy. The optical properties were characterized by optical transmission measurements and the optical constants (refractive index n and extinction coefficient k) and film thickness have been obtained by fitting the transmittance using a semi-quantum model. The electrical properties were characterized by Hall effect measurements. It has been found that the ITO film with low electrical resistivity and high transmittance can be obtained with 40 sccm oxygen flow (the working pressure is about 2.3 × 10^− 2 Pa at this oxygen flow).     

Nematic liquid crystal alignment on the ion beam-exposed ZnO film

This paper investigates the nematic liquid crystal (NLC) alignment on ion beam-exposed zinc oxide (ZnO) films. The ZnO films are deposited by a radio frequency magnetron sputtering. During the deposition of ZnO film, we supplied sufficient oxygen gas for high resistivity and transmittance. The deposited films show a high transmittance of over 90% and high resistivity of over 10¹⁰ Ω cm. The ZnO films show a high deposition rate of 26.7 Å/min. Images obtained via scanning electron microscopy of the ZnO film surfaces, before and after the ion beam exposure, show that groove patterns are formed being to be parallel to the ion beam exposure direction. LC cells are fabricated with the ion beam-exposed ZnO films. The NLC molecules align parallel to the ion beam exposure direction. The electro-optic and response characteristics of fabricated cells show the possibility of application to liquid crystal displays.     

Ion beam energy effects on structure and properties of diamond like carbon films deposited by closed drift ion source

In the present study DLC films deposited from acetylene gas by a closed drift ion source were investigated. Ion beam energy effects on structure as well as optical and electrical properties of the synthesized films were studied. Non-monotonic dependence of structure of the DLC films on ion beam energy was observed. The highest sp³/sp² ratio as well as highest optical transparency was observed in the case of the films synthesized by 500 eV energy ion beam. However, the bandgap of the DLC films synthesized by 500 eV energy ion beam was the lowest between all investigated samples, while resistivity non-monotonically decreased with increase of the ion beam energy. These results were explained by changes of the sp³/sp² ratio, structure of sp² bonded clusters as well as hydrogen content in the film due to the competition between the increased (decreased) ion beam energy and decreased (increased) ion/neutral ratio.     

Properties of indium tin oxide films deposited on unheated polymer substrates by ion beam assisted deposition

The optical, electrical and mechanical properties of indium tin oxide (ITO) films prepared on polyethylene terephthalate (PET) substrates by ion beam assisted deposition at room temperature were investigated. The properties of ITO films can be improved by introducing a buffer layer of silicon dioxide (SiO₂) between the ITO film and the PET substrate. ITO films deposited on SiO₂-coated PET have better crystallinity, lower electrical resistivity, and improved resistance stability under bending than those deposited on bare PET. The average transmittance and the resistivity of ITO films deposited on SiO₂-coated PET are 85% and 0.90 × 10^− 3 Ω cm, respectively, and when the films are bent, the resistance remains almost constant until a bending radius of 1 cm and it increases slowly under a given bending radius with an increase of the bending cycles. The improved resistance stability of ITO films deposited on SiO₂-coated PET is mainly attributed to the perfect adhesion of ITO films induced by the SiO₂ buffer layer.     

Low temperature deposition of ITO on organic films by using negative ion assisted dual magnetron sputtering system

In a magnetron sputter type negative metal ion deposition, the influence of positive bias voltage (V_b) on the surface morphology, electrical resistivity, optical transmittance, and microhardness of ITO prepared on organic polycarbonate films has been investigated. In this study, the V_b increased from 0 to 250 V to attract secondary negative In and Sn metal ions, which were produced from ITO target by surface negative ionization with intense Cs ion bombardments. During deposition although reactive oxygen gas was not introduced into the chamber, by adjusting V_b at 100 V, ITO films on polycarbonate substrate with resistivity as low as 6.1×10⁻⁴ Ω cm and transmittance over 90% at 550 nm have been obtained without intentional substrate heating.AFM measurement also shows that surface roughness varied significantly with V_b. However, too intense ion bombardment originated by high V_b (>100 V) condition increased surface roughness and as a result deteriorated the electrical and optical property of ITO films.     

Optical properties of TiO2 thin films deposited on polycarbonate by ion beam assisted evaporation

TiO₂ thin films were deposited on polycarbonate (PC) substrate by ion beam assisted evaporation. The grain size increased with the ion anode voltage and film thickness. The TiO₂ thin films had an amorphous structure. Moiré deflectometry was used to measure the nonlinear refractive indices of TiO₂ thin films on PC substrates. The nonlinear refractive index was measured to be of the order of 10^− 8 cm² W^− 1 and a change in refractive index was of the order of 10^− 5. Dense TiO₂ films exhibited high linear refractive indices, red-shift of the optical absorbance, and absorbance in the near-IR region.     

Low energy O2 and N2O ion beam modification of polyimide for improving adhesive strength of Cu/PI in roll-to-roll process

To enhance the weak mechanical durability of directly deposited copper layers on polyimide (PI) film due to their poor adhesive strength, a continuous roll-to-roll process involving surface modification using a reactive ion beam irradiation and in-situ deposition process is studied. The polyimide film is modified by an ion source with a linear stationary plasma thruster (LSPT) in the vacuum roll-to-roll process. An O₂ ion beam, with beam energy of 214 eV and beam current density of 0.78 mA/cm², and N₂O ion beam, with 220 eV and 0.69 mA/cm², irradiate PI film in winding speed of 0.5 m/min. The surface energy increases from 38 mN/m for the pristine PI film to 80 mN/m after beam irradiation at an ion fluence of 3.5 × 10¹⁶ ions/s. After beam irradiation, a 10 nm thick tie layer and 200 nm thick copper layer are successively deposited by in-situ DC magnetron web coating. The peel strength of the copper layer on the PI film is enhanced from 0.4 kgf/cm without ion beam treatment to 0.71 kgf/cm after O₂ beam treatment and to 0.75 kgf/cm after N₂O beam treatment. This enhancement is closely related to the increase in the polar force originating from the formation of hydrophilic CO (carbonyl) groups on the modified PI surface.     

The effect of helium ion implantation on the relaxation of strained InGaAs thin films

Previous work on pseudomorphic SiGe on Si has shown that a significant reduction in the threading dislocation density can be achieved through appropriate ion beam processing. Helium ion implantation was used in an analogous study to induce strain relaxation within strained pseudomorphic InGaAs layers on GaAs through the intentional introduction of subsurface damage without the introduction of surface nucleated dislocations and their associated threading segments. Wafers of fully-strained 28 nm thick films of In_0.24Ga_0.76As were separately implanted with helium doses of 5 × 10¹⁴, 2 × 10¹⁵, and 1 × 10¹⁶ cm⁻² at 25 keV. These wafers became substrates for additional InGaAs film growth. The final InGaAs films always exhibited lower residual strain as compared to films grown directly on a control substrate of non-implanted GaAs. The broadening of the X-ray peaks indicates an increase in dislocation density within the InGaAs films and the strain relaxation was found to occur with a significant increase in surface roughness. This result stands in contrast to related work on SiGe films on Si where a reduction of the threading dislocation density within a SiGe film was observed. The reaction of the InGaAs/GaAs structure and materials to ion irradiation, with local disturbance to the stoichiometry, could preclude the use of ion beam techniques for realizing a reduction in threading dislocation density during strain relaxation.     

Ion beam deposition of α-Ta films by nitrogen addition and improvement of diffusion barrier property

Ta thin films were deposited on Si (100) substrates by an ion beam deposition method at various substrate bias voltages under Ar + N₂ atmosphere with different pressure ratios of Ar and N₂. The effects of nitrogen pressure in the plasma gas and the substrate bias voltage on the surface morphology, crystalline microstructure, electrical resistivity and diffusion barrier property were investigated. It was found that the fraction of a metastable β-phase in the Ta film deposited at the substrate bias voltage of − 50 V films decreased by adding nitrogen gas, while the α-Ta phase became dominant. As a result, the Ta films deposited at the substrate bias voltage of − 50 V under Ar (9 Pa) + N₂ (3 Pa) atmosphere showed a dominant α-phase with good surface morphology, low resistivity, and superior thermal stability as a diffusion barrier.     

Effects of substrate on the structural, electrical and optical properties of Al-doped ZnO films prepared by radio frequency magnetron sputtering

Transparent and conductive Al-doped ZnO (AZO) thin films were deposited on substrates including alkali-free glass, quartz glass, Si, and SiO₂ buffer layer on alkali-free glass by using radio frequency magnetron sputtering. The effects of different substrates on the structural, electrical and optical properties of the AZO films were investigated. It was found that the crystal structures were remarkably influenced by the type of the substrates due to their different thermal expansion coefficients, lattice mismatch and flatness. The AZO film (100 nm in thickness) deposited on the quartz glass exhibited the best crystallinity, followed sequentially by those deposited on the Si, the SiO₂ buffer layer, and the alkali-free glass. The film deposited on the quartz glass showed the lowest resistivity of 5.14 × 10^− 4 Ω cm among all the films, a carrier concentration of 1.97 × 10²¹ cm^− 3 and a Hall mobility of 6.14 cm²/v·s. The average transmittance of this film was above 90% in the visible light spectrum range. Investigation into the thickness-dependence of the AZO films revealed that the crystallinity was improved with increasing thickness and decreasing surface roughness, accompanied with a decrease in the film resistivity.     

Characterization of nanocrystalline indium tin oxide thin films prepared by ion beam sputter deposition method

Indium tin oxide (ITO) thin films were deposited on glass substrates by ion beam sputter deposition method in three different deposition conditions [(i) oxygen (O₂) flow rate varied from 0.05 to 0.20 sccm at a fixed argon (1.65 sccm) flow rate, (ii) Ar flow rate changed from 1.00 to 1.65 sccm at a fixed O₂ (0.05 sccm) flow rate, and (iii) the variable parameter was the deposition time at fixed Ar (1.65 sccm) and O₂ (0.05 sccm) flow rates]. (i) The X-ray diffraction (XRD) patterns show that the ITO films have a preferred orientation along (400) plane; the orientation of ITO film changes from (400) to (222) direction as the O₂ flow rate is increased from 0.05 to 0.20 sccm. The optical transmittance in the visible region increases with increasing O₂ flow rate. The sheet resistance (R_s) of ITO films also increases with increasing O₂ flow rate; it is attributed to the decrease of oxygen vacancies in the ITO film. (ii) The XRD patterns show that the ITO film has a strong preferred orientation along (222) direction. The optical transmittance in the visible spectral region increases with an increase in Ar flow rate. The R_s of ITO films increases with increasing Ar flow rate; it is attributed to the decrease of grain size in the films. (iii) A change in the preferred orientations of ITO films from (400) to (222) was observed with increasing film thickness from 314 to 661 nm. The optical transmittance in the visible spectral region increases after annealing at 200 °C. The R_s of ITO film decreases with the increase of film thickness.     

Properties of indium tin oxide films deposited using High Target Utilisation Sputtering

Indium tin oxide (ITO) films were deposited on soda lime glass and polyimide substrates using an innovative process known as High Target Utilisation Sputtering (HiTUS). The influence of the oxygen flow rate, substrate temperature and sputtering pressure, on the electrical, optical and thermal stability properties of the films was investigated. High substrate temperature, medium oxygen flow rate and moderate pressure gave the best compromise of low resistivity and high transmittance. The lowest resistivity was 1.6 × 10^− 4 Ω cm on glass while that on the polyimide was 1.9 × 10^− 4 Ω cm. Substrate temperatures above 100 °C were required to obtain visible light transmittance exceeding 85% for ITO films on glass. The thermal stability of the films was mainly influenced by the oxygen flow rate and thus the initial degree of oxidation. The film resistivity was either unaffected or reduced after heating in vacuum but generally increased for oxygen deficient films when heated in air. The greatest increase in transmittance of oxygen deficient films occurred for heat treatment in air while that of the highly oxidised films was largely unaffected by heating in both media. This study has demonstrated the potential of HiTUS as a favourable deposition method for high quality ITO suitable for use in thin film solar cells.     

Influence of 150 MeV Ni swift heavy ion irradiation on CuFe2O4 thin films prepared by radio frequency magnetron sputtering: Modification on structure and surface morphology

The bulk copper ferrite nanomaterials are synthesized by co-precipitation technique. The vibrating sample magnetometer measurement for bulk CuFe₂O₄ reveals its unsaturated superparamagnetic behavior. The crystallites of the synthesized nanomaterial are in cubic form having an average size of ~ 100 Å and are used as target to prepare thin films of various thicknesses (600, 900 and 1100 nm) by radio frequency magnetron sputtering technique. X-ray peaks arise only when films are annealed at 1200 °C and also they are found to be in tetragonal structure. The magnetic characteristics of 900 nm unirradiated CuFe₂O₄ thin film exhibit superparamagnetic behavior and have an unsaturated magnetic moment at high field. Magnetic force microscopy images of unirradiated CuFe₂O₄ thin films confirm the soft nature of the magnetic materials. The 150 MeV Ni¹¹⁺ swift heavy ion irradiation on these thin films at the fluence of 1 × 10¹⁴ ions/cm² modifies the polycrystalline nature due to electron-phonon coupling. Atomic force microscopy image shows that the swift heavy ion irradiation induces agglomeration of particles in 600 and 900 nm thin films and increases rms surface roughness from 33.43 to 39.65 and 69.7 to 102.46 nm respectively. However, in 1100 nm film, holes are created and channel-like structures are observed along with a decrease in the rms surface roughness from 75.12 to 24.46 nm. Magnetic force microscopy images of 900 nm irradiated thin film explain the formation of domains on irradiation and are also supported by the ferromagnetic hysteresis observed using vibrating sample magnetometer.     

Atmospheric pressure PECVD of SiO2 thin film at a low temperature using HMDS/O2/He/Ar

SiO₂-like thin films were deposited at a low temperature (< 50 °C) by a remote-type, atmospheric pressure plasma enhanced chemical vapor deposition (AP-PECVD) using a pin-to-plate-type, dielectric barrier discharge with gas mixtures containing hexamethyldisilazane (HMDS)/O₂/He/Ar. The film characteristics were investigated according to the HMDS and O₂ flow rates. To obtain a more SiO₂-like thin film, an adequate combination of HMDS and oxygen flow rates was required to remove the -(CH₃)_x bonding in the HMDS and to oxidize the Si in HMDS effectively. At the optimized flow rates, the surface roughness of the SiO₂-like thin film was also the lowest. By using HMDS (50 sccm) and O₂ (500 sccm) flow rates in the gas mixture of HMDS/O₂/He (2 slm)/Ar (600 sccm), SiO₂-like thin films with a low impurity (< 6.35% C) were obtained at a deposition rate of approximately 10.7 nm/min.     

X-ray photoelectron spectroscopy and conducting atomic force microscopy investigations on dual ion beam sputtered MgO ultrathin films

Ultrathin films of MgO (~ 6 nm) were deposited on Si(100) using dual ion beam sputtering in different partial pressures of oxygen. These thin films were characterized by X-ray photoelectron spectroscopy (XPS) for chemical state analysis and conducting atomic force microscopy for topography and local conductivity map. No trace of metal Mg was evidenced in these MgO films. The XPS analysis clearly brought out the formation of oxygen interstitials and Mg(OH)₂ primarily due to the presence of residual water vapors in the chamber. An optimum value of oxygen partial pressure of ~ 4.4 × 10^− 2 Pa is identified with regard to homogeneity of film and stoichiometry across the film thickness (O:Mg::0.93-0.97). The local conductivity mapping investigations also established the film homogeneity in respect of electrical resistivity. Non-linear local current-voltage curves revealed typical tunneling characteristics with barrier width of ~ 5.6 nm and barrier height of ~ 0.92 eV.     

Surface morphology analysis of natural single crystal diamond chips bombarded with Ar ion beam

We have studied the surface morphology of natural single crystal diamond chips machined by 0.5-3.0 keV Ar⁺ ion beam irradiation at ion incidence angles of 0°, 30°, 45°, 60°, and 80° with ion doses from 3.4 × 10¹⁸ ions/cm² to 6.8 × 10¹⁸ ions/cm². The surface of diamond chips machined with 0.5 and 1.0 keV Ar⁺ ion beam, at angles of ion incidence from 0° to 45° can be made smooth. Results show that the machined surface at ion dose of 6.8 × 10¹⁸ ions/cm² and beam energy of 0.5 and 1.0 keV become ultra-smooth (surface roughness SR = 0.1 nm rms) compared with unprocessed surface (SR = 0.15-2.1 nm rms). Results also confirm the ripple formation on diamond surface at ion incidence angles of 60°-80° by 0.5-3.0 keV Ar⁺ ion beam. Therefore, the technique of smoothing by choosing ion beam irradiation parameter can be applicable to nano-finishing of diamond tools without ripple formation. This technique can also be applicable in mass production if the diamond surface is mechanically pre-finished.     

Optical and electrical properties of p-type transparent conducting CuAlO2 thin film

P-type transparent conducting CuAlO₂ thin films were prepared by e-beam evaporation and wet-oxidation technique. CuAlO₂ film was preferentially (006) oriented after wet-oxidation. The transmittance varied from 20 to 85% and the resistivity varied from 5 × 10^− 3 to 4 Ω cm with wet-oxidation conditions. The nature of p-type films was confirmed by the positive hall coefficient. Optical band gap was estimated to be in the range of 3.96-4.20 eV. These behaviors were due to the decrease of oxygen deficient state in the film as oxidation progresses. Microstructural observations of films showed smooth morphology with 23.2-29.7 Å rms roughness.     

Temperature effect on structure and surface morphology of indium tin oxide films deposited by reactive ion-beam sputtering

Indium tin oxide (ITO) films were deposited by reactive ion-beam sputtering. The relationship among the surface morphology, the resistivity ρ of the films, the substrate temperature T_S and the film thickness t_F was investigated. The heat power from the ion source during the sputtering was 265 W. T_S increased from 30 to 145 °C with an increase of t_F. The films thinner than 187 nm at T_S lower than 120 °C were amorphous, the film surface was as smooth as the substrate. The films deposited at T_S in the range between 135 and 145 °C were polycrystalline. So, the films thicker than 375 nm were in a multilayer structure of a polycrystalline layer on an amorphous layer. The surface of the polycrystalline films became rough. ρ of the films suddenly decreased at t_F of 375 nm, where the structure of the films changed. Next, the amorphous films with t_F of 39 nm were annealed in the atmosphere. The film structure changed to a polycrystalline structure at annealing temperature T_A of 350 °C. However, the surface roughness of all the films was almost same. As a result, the substrate temperature during the sputtering was important for the deposition of the films with a very smooth surface.     

Ion bombardment-induced enhancement of the properties of indium tin oxide films prepared by plasma-assisted reactive magnetron sputtering

Research on tin doped indium oxide (ITO) has for many years been stimulated by the need to simultaneously optimize the electrical, optical and mechanical properties, and by new challenges related to the deposition of transparent conducting oxides on flexible plastic substrates. In the present work, we investigate the growth and optical, electrical, and mechanical (hardness, elastic modulus and stress) properties of ITO films deposited by plasma assisted reactive magnetron sputtering (PARMS) from an indium-tin alloy target. PARMS achieves an effective control of bombardment by reactive species (e.g., O₂⁺, O⁺) on the surface of the growing film by varying the bias voltage, V_B, induced by a radiofrequency power applied to the substrate. Stress-free films possessing high transparency (> 80% — film on glass) and low resistivity (4 × 10^− 4 Ω cm) can be deposited by PARMS under conditions of intense ion bombardment (≤ 600 eV).