应用多模式组合加工技术修正大口径非球面环带误差

为了满足大口径非球面光学元件加工的需求,提出了用多模式组合加工(MCM)技术修正大口径非球面反射镜环带误差的方法。本文讨论的MCM技术以经典加工工艺为基础,采用抛光盘的多工位加工和抛光模式的组合完成光学元件的抛光,实现对光学表面中低频段误差的有效控制。介绍了MCM技术的重要组成部分JP-01抛光机械手的工作原理,分析了MCM的工作模式。采用MCM技术对Φ1230mm的非球面反射镜进行环带误差的修正,给出了镜面面形检测结果。实验结果表明,MCM技术可以有效地控制光学表面的中低频误差,使光学表面误差得到有效收敛,从而显著提高抛光效率。目前,采用MCM技术加工1～2m口径的同轴非球面,其精度可以达到30nm(RMS)。     

Manufacture of SiC off-axis aspheric mirrors by double-swing method

研究了用双摆动技术抛光离轴非球面的工艺.介绍了用双摆动抛光加工离轴非球面的原理,分析了双摆动抛光过程中抛光盘与工件的相对运动特性及各个工艺参数对相对运动路径的影响.建立了双摆动抛光运动的数学模型,进行了计算机仿真,并对不同参数下的仿真结果进行了比较.给出了抛光模形状模型,实验验证了不同形状抛光模的材料去除特性.应用双摆动技术加工了一个224 mm× 108 mm离轴碳化硅反射镜,结果显示:应用该技术加工离轴非球面镜可以有效抑制光学表面中频误差,具有较高的材料去除效率,面形精度可以稳定达到λ/30(rms,@633 nm).因此,双摆动抛光技术的研究有助于推动离轴非球面制造技术的发展.     

应用双摆动技术加工离轴碳化硅反射镜

研究了用双摆动技术抛光离轴非球面的工艺。介绍了用双摆动抛光加工离轴非球面的原理,分析了双摆动抛光过程中抛光盘与工件的相对运动特性及各个工艺参数对相对运动路径的影响。建立了双摆动抛光运动的数学模型,进行了计算机仿真,并对不同参数下的仿真结果进行了比较。给出了抛光模形状模型,实验验证了不同形状抛光模的材料去除特性。应用双摆动技术加工了一个224mm×108mm离轴碳化硅反射镜,结果显示:应用该技术加工离轴非球面镜可以有效抑制光学表面中频误差,具有较高的材料去除效率,面形精度可以稳定达到λ/30(rms,@633nm)。因此,双摆动抛光技术的研究有助于推动离轴非球面制造技术的发展。     

多模式组合抛光技术在光学加工中的应用

介绍了将经典抛光方法与数控加工技术有机结合的多模式组合抛光技术.描述了多模式组合抛光的关键技术之一,材料去除率仿真模型的建立方法.通过设置抛光盘因子和元件因子,多模式组合抛光的材料去除模型不仅包含抛光模式、速度等加工参数,还将抛光模形状、边角效应、元件面形误差等因素对材料去除的影响一并考虑入内,可以根据抛光阶段的不同,...     

基于流变原理的柔性接触抛光材料去除模型综述

基于流变原理的柔性接触抛光是通过辅助场控制智能材料转变相态形成柔性抛光头进行加工的一类抛光,能够满足复杂形面零件所需的高形状精度和高表面完整性要求。材料去除函数能直观地反应抛光后工件表面轮廓,是实现工件材料确定性去除的关键。对当前具有代表性的柔性接触抛光方法如磁流变抛光、电流变抛光、磁射流抛光、剪切增稠抛光进行综述,阐述了基于不同理论建立的材料去除模型,分析了各个模型的主要影响参数,比较了各个模型的特点。对柔性接触抛光方法及其材料去除模型研究趋势进行预测。     

应用四轴联动磁流变机床加工曲面

以永磁型磁流变抛光机为基础,提出了在光栅式加工轨迹下结合四轴联动机床(不含抛光轮转动轴)和变去除函数实现磁流变抛光技术确定性加工曲面的方法。讨论了曲面上光栅式加工轨迹等面积规划原则和基于矩阵乘积运算的驻留时间求解算法。分析了磁流变四轴联动机床的机械补偿方式,同时以变去除函数模型为基础从算法上实现了机械的剩余补偿。应用以氧化铈为抛光粉的水基磁流液对口径为80mm、曲率半径为800mm的BK7材料凸球面进行了修形验证实验,一次加工(5.5min)后显示:面形误差分布峰谷值(PV)和均方根值(RMS)从117.47nm和22.78nm分别收敛到60.80nm和6.28nm。实验结果表明:结合四轴联动的低自由度机床和变去除函数算法补偿的磁流变加工工艺能够有效地实现球面及低陡度非球面等曲面的高效确定性加工,为磁流变抛光在光学制造中的应用提供了有力的支持。     

机器人气囊抛光位置误差建模及补偿

针对机器人气囊抛光中抛光压力波动的问题,分析影响抛光压力稳定的因素,提出误差补偿法来降低抛光压力波动对加工面形的影响。首先,分析气囊抛光的运动过程,根据Preston方程建立材料去除函数模型,使用MATLAB对去除函数进行仿真分析。然后针对由机器人末端位置波动引入的系统误差,提出网格式误差补偿法,根据误差数据模型对加工点位进行即时修正,从而降低由机器人引入的抛光压力波动误差。实验数据表明：补偿后机器人末端位置X,Y方向误差波动值分别下降了86.2%,67.6%,机器人末端位置精度明显提高,最终加工面形精度的RMS为0.118λ。证明了该方法能够有效的减小抛光压力的波动,改善加工面形质量。     

时变去除函数在气压砂轮抛光中的应用研究

针对气压砂轮抛光中通过驻留时间控制材料去除量需在模具表面多去除一层材料及抛光效率低等问题,提出了一种基于时变去除函数的抛光材料去除量控制方法。该方法以抛光工具所能达到的最大进给速度在模具表面进行抛光加工,无需多去除材料,通过实时改变抛光工具的去除能力以适应面形误差的变化,极大地缩短了抛光时间;开展了抛光材料去除过程研究,建立了气压砂轮抛光工具进给速度与面形数据和抛光去除函数之间的关系,提出了抛光过程时间的计算方法;针对时变去除能力超出抛光工具最大去除能力的问题,提出了在气压砂轮抛光中对需去除的材料进行分层抛光的思想。最后,通过抛光过程时间对材料去除量控制的两种方法进行了对比分析。研究结果表明,在气压砂轮抛光中采用时变去除函数来控制材料去除量能极大地提高抛光效率。     

气囊抛光过程的运动精度控制

针对用于球面、非球面光学元件超精密光学加工的气囊抛光技术,提出了一套控制抛光过程中气囊运动精度的方法。该方法通过控制加工单元的温度,保证抛光过程中设备运动精度达到50μm;使用坐标传递法,使检测数据二维方向对准不确定度达到0.30~0.70mm。另外,基于磨头去除量估计与反馈修正法,提高精抛过程面形误差收敛效率。最后,通过磨头探测校准法,将磨头与加工工件法向位置精度提高至10μm。实际抛光实验显示:使用运动精度控制法在280mm口径的平面精密抛光中获得的面形加工精度为0.8nm(RMS),在160mm口径的凹球面精密抛光中获得的面形加工结果为1.1nm(RMS),实现了超高精度面形修正的目的,为超高精度球面、非球面光学元件加工提供了一套行之有效的方法。该方法同样适用于其他接触式小磨头数控抛光方法。     

大曲率半径球面反射镜球面误差的改善

结合环形抛光工艺,提出了新的球面抛光方法,以满足环形激光器、同步辐射加速器、光学振荡器等对大曲率半径球面反射镜球面误差的特殊要求.基于Preston抛光方程,分析了传统工艺在抛光过程中球面区域沿径向不同点的相对运动轨迹,建立了抛光过程材料去除模型.运用所建立的数学模型对大曲率半径球面反射镜传统抛光过程进行计算机仿真,揭示了传统抛光方法产生球面误差的两个原因,即工件无法始终处于抛光盘工作区域内以及工件自转与抛光盘转速不一致.由此提出增大抛光盘面积和驱动工件同步转动两条措施来降低球面误差.应用提出的新工艺加工了半径为6 000 mm的大曲率半径球面反射镜,测试显示其球面误差△R/R＜0.02,粗糙度小于0.25 nm,表面疵病达到0级,满足设计要求.     

Configuration design and accuracy analysis of a novel magnetorheological finishing machine tool for concave surfaces with small radius of curvature

Magnetorheological finishing (MRF) is a computer-controlled deterministic polishing technique that is widely used in the production of high-quality optics. In order to overcome the defects of existing MRF processes that are unable to achieve concave surfaces with small radius of curvature, a configuration method of a novel structured MRF machine tool using small ball-end permanent-magnet polishing head is proposed in this paper. The preliminary design focuses on the structural configuration of the machine, which includes the machine body, motion units and accessory equipment, and so on. Structural deformation and fabrication accuracy of the machine are analyzed theoretically, in which the reasonable structure sizes, manufacturing errors and assembly errors of main structural components are given for configuration optimization. Based on the theoretical analysis, a four-axes linkage MRF machine tool is developed. Preliminary experiments of spot polishing are carried out and the results indicate that the proposed MRF process can achieve stable polishing area which meets requirement of deterministic polishing. A typical small-bore complex component is polished on the developed device and fine surface quality is obtained with sphericity of the finished spherical surfaces 1.3 µm and surface roughness Ra less than 0.018 µm.

     

机器人恒压球形公自转磨头抛光技术研究

采用工业机器人进行大口径光学元件的研抛过程中，机器人自身定位误差会导致研抛压力产生波动，进而影响去除函数稳定性，为此提出了一种机器人恒压球形公自转磨头抛光方法，并对其结构、工作原理、机器人定位特性以及研抛压力输出特性开展了研究。首先，基于Preston理论构建了材料去除模型，对去除函数形状进行了分析，对所设计抛光磨头的机械结构与工作原理进行了介绍。然后，对机器人定位误差以及磨头输出力响应性与稳定性进行了测量，验证了所提方法能够较好地适应机器人研抛压力波动而做出的力响应控制。最后，进行了定点抛光以及粗、精磨抛加工实验。实验结果表明：利用所提方法去除函数的稳定性强，通过10个周期的粗、精抛加工，面形收敛率分别为9095%、7261%，可获得较高的加工精度与面形质量。     

Material removal characteristics of full aperture optical polishing process

Precision surfaces of optical grade have been in great demand for various applications such as high-power laser systems, astronomical reflecting telescopes glass mirrors, folding mirrors of avionics displays, reflectors, guides for transmission of hot and cold neutron beams for neutron exploration setups, electronic substrate, display covers and substrates for biomedical imaging and sensing, etc. Generation of such surfaces has been a challenge; particularly the polishing operation of optical fabrication process is quite critical which determines the final surface quality. To achieve the required optical surface parameters, a good control and systematic understanding of polishing process and its parameters are required. However, the conventional or full aperture optical polishing process still depends on operator's skills to achieve the target surface quality. To exploit the process to the extent, it is must to have a scientific understanding of material removal behavior of the polishing process, which will lead to the process becoming deterministic. This article has attempted to address this issue. Authors have summarized different material removal theories and discussed various mathematical models as proposed by researchers so far. Attempt has been made to come up with knowledge gaps which are required to be bridged in future.     

Effect of the components of Magnetic Compound Fluid (MCF) slurry on polishing characteristics in aspheric-surface finishing with the doughnut-shaped MCF tool

For the aspheric optical surface finished with a doughnut-shaped MCF (magnetic compound fluid) polishing tool, the performance of the polishing tool depends mainly on the properties of the MCF slurry. Therefore, understanding the effect of each MCF slurry component on the polishing characteristics is crucial to developing novel polishing techniques. In this paper, the polishing principle was depicted and the corresponding polishing jig was constructed with a six-degree-of-freedom manipulator. The conical surfaces, which were considered as special aspheric surfaces, were experimentally polished under proper polishing conditions to examine the effects of the carbonyl iron particles (CIPs) concentration and the sizes of the abrasive particles (APs) on the polishing ability to remove material/tool marks and improve work surface qualities. Theoretical analyses were also performed to gain a more comprehensive understanding of the behaviors of CIPs and APs in the magnetic field. The results were shown as follows: (1) The CIPs concentration affected positively the magnetization of the MCF slurry, leading to better performance in the removal rate of material/tool marks when a higher CIPs concentration of was applied. The best surface quality was attained with a CIPs concentration of 45 wt%. (2) Larger APs were beneficial for obtaining higher removal rates of material/tool marks. The APs with 1 μm in diameter were preferred for achieving a better surface quality. (3) Ferric clusters were formed along the magnetic line of force and their orientations changed periodically to stir the APs with the magnet revolution. (4) The Aps, at a given working gap, can squeeze the work-surface. The squeezing action was much more intense when larger APs and the MCF slurry with a higher magnetization were employed. (5) The material removal model suggested that the material was removed due to the APs and the relative motion between the work-surface and APs.     

用于模具自由曲面的新型气囊抛光中磨粒场的分析

为提高模具自由曲面抛光的效率和品质,提出一种基于柔性抛光理念的新型气囊抛光技术。研究了气囊抛光接触区内磨粒的运动轨迹、压力分布和抛光力的分布情况,建立了气囊抛光接触区内磨粒的运动模型、压力模型,揭示了气囊抛光接触区内磨粒直径对抛光力和被加工工件内部剪切应力的影响规律,研究了抛光过程中工件内部的剪切应力分布,明确了材料疲劳去除机理。为气囊抛光的应用奠定了理论基础。     

一种基于非晶层粘性流动的机械化学抛光模型

通过分析单个微纳米磨粒滑动接触的分子动力学模拟的研究结果，提出了在典型的机械化学抛光（CMP）过程中芯片表面材料的去除应为表面非晶层物质粘性流动所致的新观点。基于这种机理，应用微观接触力学和磨粒粒度分布理论建立了一种新的表征CMP过程材料去除速率的数学模型。模型中引入了一个表征单个磨粒去除芯片表面非晶层能力的比例系数k，k综合反映了磨粒的机械作用、抛光液对芯片表面的化学作用和芯片的材料特性。通过实验验证发现该模型的理论预测值与实验测定值十分吻合。     

磨料液体射流抛光技术研究进展

论述了磨料液体射流抛光过程中的材料去除机理,介绍了磨料液体射流加工系统平台的国内外研究成果。从速度变化、材料去除、表面演化、表面粗糙度、数值模拟五个方面阐述了磨料液体射流数学模型的构建状况。系统分析了主要工艺参数如磨粒动能、射流压力、磨料、喷射角度、喷射距离、添加剂对加工结果的影响规律,并总结了磨料液体射流抛光技术发展历程。最后针对其将来的研究方向与内容给出了进一步的建议与展望。