立方相GaN的持续光电导

研究了金属有机物化学气相外延 (MOVPE)方法生长的非故意掺杂的立方相 Ga N的持续光电导效应 .在六方相 Ga N中普遍认为持续光电导效应与黄光发射有关 ,而实验则显示在立方 Ga N中 ,持续光电导效应与其中的六方相 Ga N夹杂有关系 ,而与黄光发射没有关系 .文中提出 ,立方相 Ga N与其中的六方相 Ga N夹杂之间的势垒引起的空间载流子分离是导致持续光电导现象的物理原因 .通过建立势垒限制复合模型 ,解释了立方相 Ga N的持续光电导现象的物理过程 ,并对光电导衰减过程的动力学作了分析 .对实验数据拟合的结果证明以上的模型和推导是与实验相符的 .     

低真空退火对GaN MSM紫外探测器伏安特性的影响

利用金属有机化学气相沉积生长的非故意掺杂GaN单晶制备了金属一半导体一金属交叉指型肖特基紫外探测器。用肖特基势垒的热电子发射理论研究了低真空下不同热退火条件对器件伏安特性的影响。Au-GaN肖特基势垒由退火前的0．36eV升高到400℃0．5h的0．57eV,退火延长为1h势垒反而开始下降。分析结果表明：由工艺造成的填隙Au原子引入的缺陷是器件势垒偏低的主要原因,Au填充N空位形成了施主型杂质是退火后势垒升高的主要原因。     

GaN avalanche photodiodes operating in linear-gain mode and Geigermode

For solar-blind ultraviolet detection, AlGaN avalanche photodiodes (APDs) that operate in Geiger mode can outperform conventional AlGaN photodiodes in sensitivity and should compare favorably to photomultiplier tubes. Toward this goal, we report GaN APDs that operate in the linear-gain mode and in the Geiger mode. The APDs were fabricated from high-quality GaN epitaxial layers grown by hydride vapor phase epitaxy. The GaN layer structure consisted of a Zn-doped π layer, an unintentionally doped n layer, and a Si-doped n+ layer-all on top of a thick GaN unintentionally doped n layer on a sapphire substrate. Capacitance-voltage (C-V) measurements on photodiodes fabricated from some of these layers show that field strengths between 3 and 4 MV/cm are sustainable in the depletion region at voltages slightly below the observed breakdown of ~80 V. Both mesa-etched and planar devices exhibited avalanche gains of 10 in linear-gain mode and ~10⁶ in Geiger mode when top illuminated with a 325 nm HeCd laser. Raster measurements of the photoresponse show highly uniform response in gain mode that becomes slightly more inhomogeneous in Geiger mode     

Influence of Si-doping on the characteristics of InGaN-GaN multiplequantum-well blue light emitting diodes

A detailed study on the effects of Si-doping in the GaN barrier layers of InGaN-GaN multiquantum well (MQW) light-emitting diodes (LEDs) has been performed. Compared with unintentionally doped samples, X-ray diffraction results indicate that Si-doping in barrier layers can improve the crystal and interfacial qualities of the InGaN-GaN MQW LEDs. It was also found that the forward voltage is 3.5 and 4.52 V, the 20-mA luminous intensity is 36.1 and 25.1 mcd for LEDs with a Si-doped barrier and an unintentionally doped barrier, respectively. These results suggests that one can significantly improve the performance of InGaN-GaN MQW LEDs by introducing Si doping in the GaN barrier layers     

The Effect of an Fe-doped GaN Buffer on off-State Breakdown Characteristics in AlGaN/GaN HEMTs on Si Substrate

An Fe-doped GaN buffer layer was employed in the growth of AlGaN/GaN high-electron mobility transistors (HEMTs) on Si substrates. In order to investigate the effects of an Fe-doped GaN buffer on OFF-state breakdown characteristics, HEMT devices with an Fe-doped GaN buffer on Si substrates were fabricated along with conventional devices utilizing an unintentionally doped GaN buffer on Si substrates. The device characteristics were compared. While HEMT devices with the conventional structure showed an extremely unstable OFF-state breakdown behavior due to punchthrough to the Si substrate, it was demonstrated that an Fe-doped GaN buffer layer on a Si substrate successfully suppressed the premature failure caused by Si-induced breakdown. As a result, the AlGaN/GaN HEMTs with an Fe-doped GaN buffer on Si substrates exhibited much more consistent and enhanced breakdown voltages, when compared with the conventional devices. Consequently, it is highly desirable that AlGaN/GaN HEMTs on Si substrates have an Fe-doped GaN buffer layer in order to achieve stable and robust OFF-state breakdown characteristics     

生长压力对GaN材料光学与电学性能的影响

研究了采用MOCVD技术分别在100与500Torr反应室压力下生长的非故意掺杂GaN薄膜的光学与电学性能。研究表明,低压100Torr外延生长条件可以有效地降低Ga与NH3气相反应造成GaN薄膜的碳杂质沾污,从而抑制造成光致发光中黄光峰与蓝光峰的深受主的形成,所制备的材料表现出较好的光学性能。同时,不同生长压力下的GaN薄膜表现出相异的电学性能,即在500Torr下生长的样品通常表现出更高的载流子浓度（（4.6-6.4）×1016 cm-3）与更高的迁移率（446-561cm2/（V.s））,而100Torr下生长的样品通常表现为更低的载流子浓度（1.56-3.99）×1016 cm-3与更低迁移率（22.9-202cm2/（V.s））。     

Characteristics of the intrinsic defects in unintentionally doped 4H-SiC after thermal annealing

Thermal annealing effects on the characteristics of intrinsic defects in unintentionally doped 4H-SiC were investigated. The 4H-SiC samples were prepared by Low-Pressure Chemical Vapor Deposition (LPCVD) technique. Results show that there is only one Electron Spin Resonance (ESR) peak and a broad, from green to yellow, photoluminescence (PL) band were detected. These results are attributed to the native defects of carbon vacancy (V_C) and complex carbon compound vacancy. The concentration of the intrinsic defects increases and reaches its maximum annealing at 1573 K, then decreases with the anneal temperature. Both ESR and PL have significant changes when the samples were annealed for 60 min. The concentration variation in unintentionally doped 4H-SiC is process dependent and is related to the interaction among the various intrinsic defects during the annealing. The silicon capping layer may also play an important role for these defect interactions particularly when the annealing was lasted for 60 min.     

The effect of organometallic vapor phase epitaxial growth conditions on wurtzite GaN electron transport properties

The growth issues known to effect the quality of GaN organometallic vapor phase epitaxial films are reviewed and the best 300Kmobility vs electron concentration data are discussed. The data probably represent transport properties intrinsic to films grown on sapphire. From the results of Hall measurements, the unintentional donor in high quality GaN films cannot be Si since the donor ionization energy is much larger than that of films intentionally doped with Si (36 vs 26 meV). Electrical properties of a doped channel layer are shown not to be significantly different from those of thick films which implies a viable technology for conducting channel devices. It is argued that 77K Hall measurements are a useful indicator of GaN film quality and a compilation of unintentionally and Si doped data is presented. The 77K data imply that, at least over a limited range, Si-doping does not appreciably change the compensation of the GaN. The 77K data indicate that the low mobilities of films grown at low temperatures are probably not related to dopant impurities.     

GaN Power Schottky Diodes with Drift Layers Grown on Four Substrates

We have examined the performance of gallium nitride (GaN) high-power Schottky diodes fabricated on unintentionally doped (UID) metalorganic chemical vapor deposition (MOCVD) films grown simultaneously on four substrates ranging in threading dislocation density from 5 × 10³ cm ^{- 2} to 10¹⁰ cm ^{- 2}. The substrates were an intentionally doped and a UID freestanding hydride vapor phase epitaxy substrate, an MOCVD GaN template grown on a sapphire wafer, and a bulk GaN substrate grown via an ammonothermal method. Capacitance–voltage (C–V) results showed the carrier concentration was ～2 × 10¹⁶ cm^?3 for films grown on each of the four substrates. With that doping level, the theoretical breakdown voltage (V _b) is ～1600 V. However, measured V _b for the devices tested on each of the four substrates fell short of this value. Also, the breakdown voltages across each of the four substrates were not substantially different. This result was especially surprising for films grown on bulk GaN substrates, because of their superior crystal quality, as determined from their x-ray rocking curve widths. Simple probability calculations showed that most of the diodes tested on the bulk substrate did not cover a single threading dislocation. Although optimization of edge-termination schemes is likely to improve V _b, we believe that point defects, not threading dislocations, are the main reason for the reduced performance of these devices.     

Gallium nitride materials - progress, status, and potential roadblocks

Metal-organic vapor phase epitaxy (MOVPE) and molecular beam epitaxy (MBE) are the principal techniques for the growth and n-type (Si) and p-type (Mg) doping of III-nitride thin films on sapphire and silicon carbide substrates as well as previously grown GaN films. Lateral and pendeoepitaxy via MOVPE reduce significantly the dislocation density and residual strain in GaN and AlGaN films. However tilt and coalescence boundaries are produced in the laterally growing material. Very high electron mobilities in the nitrides have been realized in radio-frequency plasma-assisted MBE GaN films and in two-dimensional electron gases in the AlGaN/GaN system grown on MOVPE-derived GaN substrates at the crossover from the intermediate growth regime to the droplet regime. State-of-the-art Mg doping profiles and transport properties have been achieved in MBE-derived p-type GaN. The Mg-memory effect, and heterogeneous growth, substrate uniformity, and flux control are significant challenges for MOVPE and MBE, respectively. Photoluminescence (PL) of MOVPE-derived unintentionally doped (UID) heteroepitaxial GaN films show sharp lines near 3.478 eV due to recombination processes associated with the annihilation of free-excitons (FEs) and excitons bound to a neutral shallow donor (D/spl deg/X).     

Reactive ion etching damage in n-GaN and its recovery by post-etch treatment

Reactive ion etching (RIE) in unintentionally doped GaN and damage recovery by post-etch treatment (rapid thermal annealing followed by KOH treatment) were investigated. Induced surface damage by RIE etching degraded the rectifying I-V behaviour and increased the interface state density. Post-etch treatment on the RIE etched sample improved the rectifying characteristics and reduced the interface state density. Although the electrical properties did not restore to those of the as-grown sample, post-etch treatment is effective in removing surface damage by RIE etching in n-GaN.     

输出功率密度为2.23W/mm的X波段AlGaN/GaN功率HEMT器件

MOCVD技术在蓝宝石衬底上制备出具有高迁移率GaN沟道层的AlGaN/GaN HEMT材料.高迁移率GaN外延层的室温迁移率达741cm2/(V·s),相应背景电子浓度为1.52×1016cm-3;非有意掺杂高阻GaN缓冲层的室温电阻率超过108Ω·cm,相应的方块电阻超过1012Ω/□.50mm HEMT外延片平均方块电阻为440.9Ω/□,方块电阻均匀性优于96％.用此材料研制出了0.2μm栅长的X波段HEMT功率器件,40μm栅宽的器件跨导达到250mS/mm,特征频率fT为77GHz;0.8mm栅宽的器件电流密度达到1.07A/mm,8GHz时连续波输出功率为1.78W,相应功率密度为2.23W/mm,线性功率增益为13.3dB.     

Effect of H implantation on the structural properties of GaN

High-resolution X-ray diffraction and Raman scattering techniques have been used to analyse the impact of multiple energy hydrogen implantation with energy ranging from 40 to 120 keV on the structural properties of metal organic chemical vapour deposition grown unintentionally doped n-type Gallium Nitride (GaN) epitaxial layers. The full-width at half-maximum (FWHM) value of GaN rocking curves increases with ion dose indicating the damage in the crystal matrix due to hydrogen ion implantation. E₂ (high) and A₁(LO) Raman modes of GaN have been analysed. The behaviour of Raman shift, FWHM and area of GaN modes with H⁺ dose are explained on the basis of hydrogen substituting nitrogen atom, implantation-induced lattice damage and light attenuation by lattice damage in GaN layer. The influences of H⁺ implantation on the Raman mode parameters of sapphire substrate have also been analysed.     

Observation of compensation in GaN films grown by metalorganic chemical vapor deposition

Hall-effect measurements were conducted on an unintentionally doped n-type GaN films grown on (0 0 0 1) sapphire substrates in a low-pressure metalorganic chemical vapor deposition (LP-MOCVD) system. Variable temperature Hall-effect measurements reveal a different dependence of the electron concentration and the Hall mobility on temperature for the two samples. In the sample with a background concentration of 10¹⁸ cm⁻³, the electron concentration shows a non-monotonous relationship with increasing temperature from 90 to 400 K. However, in the normal sample with a background concentration of <10¹⁷ cm⁻³, the dependence of the electron concentration on temperature is monotonous between 90 and 400 K. The different behavior was also found in the dependence of the Hall mobility on temperature for the sample. The experimental data were analyzed by considering two donor levels and one acceptor level model. The good agreement between measured data and calculation demonstrates that the abnormal dependence is indicative of a compensation effect in GaN film grown by LP-MOCVD.     

GaN外延材料中持续光电导的光淬灭

研究了非故意掺杂和掺Si的n型GaN外延材料持续光电导的光淬灭。实验发现非故意掺杂GaN的持续光电导淬灭程度远大于掺Si的n型GaN;撤去淬灭光后前者的持续光电导几乎没有变化,后者的却有明显减小;稍后再次加淬灭光前者的持续光电导无变化,而后者的有明显增加。我们认为两者持续光电导的形成都与空穴陷阱有关,用空穴陷阱模型解释了非故意掺杂GaN持续光电导的形成以及淬灭;认为掺Si的n型GaN的持续光电导是电子陷阱(杂质能级)和空穴陷阱共同作用的结果,并且在持续光电导发生的不同阶段其中一种陷阱的作用占主要地位。     

The effect of substrate misorientation on the optical, structural, and electrical properties of GaN grown on sapphire by MOCVD

We report the growth and characterization of unintentionally doped GaN on both exact and vicinal (0001) sapphire substrates. The GaN heteroepitaxial layers are grown by metalorganic chemical vapor deposition on c-plane A1₂O₃ substrates either on-axis or intentionally misoriented 2° toward the a-plane (1120) or 5 or 9° toward the m-plane (10 10). The samples are characterized by 300K photoluminescence, cathodoluminescence, and Hall-effect measurements as well as by triple-axis x-ray diffractometry to determine the effect of the misorientation on the optical, electrical, and structural properties of heteroepitaxial undoped GaN. Ten different sample sets are studied. The data reveal enhanced photo-luminescence properties, increased electron mobility, a reduced n-type background carrier concentration, and a somewhat degraded surface morphology and crystalline quality for the misoriented samples compared to the on-axis samples.     

Nanopatterned Contacts to GaN

The effect of nanoscale patterning using a self-organized porous anodic alumina (PAA) mask on the electrical properties of ohmic and Schottky contacts to n-GaN was investigated with the aim of evaluating this approach as a method for reducing the specific contact resistance of ohmic contacts to GaN. The electrical characteristics of contacts to these nanopatterned GaN samples were compared with contacts to planar, chemically prepared (“as-grown”) GaN samples and reactive ion etched (RIE) GaN films without any patterning. The specific contact resistivities to unintentionally doped n-GaN using a Ti/Al bilayer metallization were determined to be 7.4 × 10⁻³ Ω cm² for the RIE sample and 7.0 × 10⁻⁴ Ω cm² for the PAA patterned sample. Schottky metal contacts with Pt and Ni were prepared on the three samples to validate the effects of RIE and nanopatterning on electrical behavior. The effective barrier height was decreased and the reverse current was increased significantly in the PAA patterned sample. The radius of curvature of the nanoscale corrugation in the patterned interface was smaller than the depletion width. The reduction of the depletion width at sharp corners enhanced the local tunneling current, reducing the specific contact resistivity and decreasing the effective barrier height. These results suggest that nanopatterning with PAA on GaN can significantly lower the contact resistance.     

非故意掺杂n型GaN的负持续光电导现象

研究了MOCVD方法制备的非故意掺杂n型GaN薄膜的持续光电导现象.实验发现样品的光电导与入射光强有密切的关系,当入射光强由弱到强变化时,样品会依次出现正常持续光电导(PPC)、负光电导(NPC)和负持续光电导(NPPC)现象.据知,这是首次在一个样品中仅仅通过改变入射光强就可以依次产生以上现象的实验报道.通过系统的实验分析和理论研究认为,该现象形成的主要原因是材料中深能级电子陷阱和空穴陷阱共同作用的结果.     

未掺杂GaN外延膜的结晶特性与蓝带发光关系的研究

采用卢瑟福背散射／沟道技术，X射线双晶衍射技术和光致发光技术对几个以MOCVD技术生长的蓝带发光差异明显的未掺杂GaN外延膜和GaN：Mg外延膜进行了测试。结果表明，未掺杂GaN薄膜中出现的2．9eV左右的蓝带发光与薄膜的结晶品质密切相关。随未掺杂GaN的蓝带强度与带边强度之比增大，GaN的卢瑟福背散射／沟道谱最低产额增大，X射线双晶衍射峰半高宽增大。未掺杂GaN薄膜的蓝带发光与薄膜中的某种本征缺陷有关。研究还表明，未掺杂GaN中出现的蓝带与GaN：Mg外延膜中出现的2．9eV左右的发光峰的发光机理不同。     

Impurity centers of rare-earth ions (Eu,Sm, Er) in GaN wurtzite crystals

Gallium nitride (GaN) was doped with Eu, Sm, and Er impurities using the diffusion method. The behavior of rare-earth impurities (the formation of donor or acceptor levels in the GaN band gap) correlates with the total concentration of defects, which is determined from optical measurements, and with the position of the Fermi level in starting and doped crystals. The intensity of emission lines, which are characteristic of the intracenter f-f transition of rare-earth ions, is controlled by the total defect concentration in the starting semiconductor matrix.