成果转化

铝电解电容器用电极箔腐蚀工艺中高压铝电解电容器用阳极箔(化成箔)是生产铝电解电容器的关键原材料,而腐蚀是阳极箔制造的前道工序,是腐蚀箔比容的基础和关键,因而腐蚀工艺技术是化成箔制造的关键核心技术之一。     

前处理工艺条件对铝电解电容器阳极箔比容的影响

为获得铝电解电容器阳极箔的最优前处理工艺,探索了前处理溶液中Zn2＋的浓度、处理温度和处理时间三因素对铝电解电容器阳极箔比容的影响。研究结果表明,在后续工艺一定的条件下,采用在65℃Zn^2＋质量浓度为2×10^-5g/L的前处理溶液中浸泡120 s的前处理工艺,可使腐蚀箔的比容达到最大值。     

赋能腐蚀铝箔

综述了电解电容器的结构。简介了原箔的腐蚀和赋能特性。电解电容器的比容主要由阳极箔的比容决定的，提高总比容的重点在阳极箔。高压阳极箔比容与原箔组织结构有明显依赖关系，提高原箔立方织构含量是获得高比容的基本条件，立方织构含量大体上由化学成分和加工工艺决定，应达到９０％左右。     

广东东阳光铝业股份有限公司

广东东阳光铝业股份有限公司(股票代码:600673)是集精铝冶炼、高精铝板带箔加工、铝电解电容器用电极箔生产、铝电解电容器制造,涵盖磁性材料,氯碱化工等产品的科研开发、生产、销售为一体的高科技民营股份制企业。公司拥有全球范围内高精铝冶炼→铝板带箔加工→铝电解电容器用电极箔生产→铝电解电容器制造的完整性、整体水平高的铝及铝合金压延加工及材料制备产业链,是国内大型的电子光箔、化成箔、亲水箔、以及Φ16以上的大电容生产基地,是国内行业的领军企业,占据行业的主导地位。     

广东东阳光科技控股股份有限公司

正广东东阳光科技控股股份有限公司(股票代码:600673)是集精铝冶炼、高精铝板带箔加工、铝电解电容器用电极箔生产、铝电解电容器制造,涵盖磁性材料、氯碱化工等产品的科研开发、生产、销售为一体的高科技民营股份制企业。公司拥有全球范围内高精铝冶炼→铝板带箔加工→铝电解电容器用电极箔生产→铝电解电容器制造的完整性,整体水平高的铝及铝台金压延加工及材料制备产业链,是国内大型的电子光箔,化成箔、亲水箔、以及Φ16以上的大电容生产基地,是国内行业的领     

广东东阳光科技控股股份有限公司

<正>广东东阳光科技控股股份有限公司(股票代码:600673)是集精铝冶炼、高精铝板带箔加工、铝电解电容器用电极箔生产、铝电解电容器制造、涵盖磁性材料、氯碱化工等产品的科研开发、生产、销售为一体的高科技民营股份制企业。公司拥有全球范围内高精铝冶炼→铝板带箔加工→铝电解电容器用电极箔生产→铝电解电容器制造的完整性、整体水平高的铝及铝合金压延加工及材料制备产业链,是国内大型的电子光箔、化成箔、亲水箔、以及Φ16以上的大电容生产基地,是国内行业的领军企业,占据行业的主导地位。     

铝电解电容器用阴极铝箔

铝电解电容器用阴极箔的制造相对于阳极箔较简单，但在电容器中的作用却日益受到人们的重视，本文叙述了阴极铝箔的结构、作用、化学成分、腐蚀机理以及工艺过程。     

不同前处理对低压铝箔容量的影响

铝电极箔比容的高低是影响铝电解电容器质量及大小的关键因素之一。本实验通过采用不同前处理的腐蚀工艺,探索影响铝电极箔比容的因素。     

超高压铝电解电容器用阳极箔腐蚀工艺研究

采用正交法和单因素实验法,研究了发孔温度、电流密度、时间、Al3+浓度,扩孔温度、电流密度、时间对超高压铝电解电容器用阳极箔比容的影响。结果表明,发孔温度对超高压阳极箔比容的影响最大,Al3+浓度的影响最小。Vfe=700 V阳极箔的腐蚀工艺优化参数:在[Cl-]、[SO2-4]和Al3+浓度依次为1 mol/L、3 mol/L和0.2 mol/L,温度为75℃,0.40 A/cm2电流密度条件下发孔120 s,之后再在1 mol/L的HNO3溶液中,75℃,0.1 A/cm2条件下扩孔500 s,所得腐蚀箔经700 V二级化成,耐压值为663.7 V,比容值达到0.48μF/cm2。     

测量电极箔比容时双片法和单片法误差分析

本文对铝电解电容器用电极箔比容的标准测试方法中的两种方法,即单片法和双片法,由方法的不同而造成的误差进行了分析。     

Solid electrolytic capacitors using an aluminum alloy electrode and conducting polymers

Solid electrolytic capacitors, in which an aluminum–zirconium (Al–Zr) alloy foil is used as an electrode and a composite conducting polymer layer as a counter-electrode, were prepared and investigated. Soluble polyaniline (PAn) doped with carboxylic acid was used as a conductive precoating layer; using the precoating layer as an anode a polypyrrole layer was formed by electrochemical polymerization to form a composite conducting polymer layer. This method was successfully used in forming the counter-electrode of new alloy electrode capacitors. The capacitors show high capacitance per unit area and excellent high-frequency performance.     

咪唑啉缓蚀剂对电解电容器用铝箔直流扩面增容的作用

合成了油酸咪唑啉和丙烯酸咪唑啉化合物,通过红外谱对其进行了结构表征;用Tafle曲线和交流阻抗等方法研究了其对铝箔的缓蚀作用,并研究了其对铝箔直流扩面增容的影响。结果表明,在2.0 mol/L的HCl溶液中两种化合物对铝箔均有缓蚀作用,为阴极型缓蚀剂,腐蚀液中添加两种化合物后,铝箔直流扩面的蚀孔密度增加、分布均匀、使铝箔的比电容提高约25%。     

电解工艺条件对铝箔腐蚀形貌与比电容的影响

利用扫面电镜(SEM)、数字电桥研究了铝电解电容器用高压电子铝箔在硫酸+盐酸体系中进行电化学腐蚀扩面时,工艺条件对铝箔腐蚀形貌与比电容的影响规律:电解腐蚀时间对铝箔腐蚀后形貌与比电容影响较大,发孔时间延长、扩孔时间缩短,隧道孔密度增加、孔直径减小;发孔电流密度对铝箔腐蚀形貌与比电容影响较小,只要高于点蚀电流密度,小电流长时间发孔与大电流短时间发孔都可以在铝箔表面形成足够密度的蚀孔结构;电解液温度对铝箔腐蚀形貌和比电容影响较大,随着发孔液温度的提高,蚀孔密度增加、蚀孔孔径减小,隧道孔长度减小.     

Effects of polymer corrosion inhibitor on widening etch tunnels of aluminum foil for capacitor

We investigated the effects of polymeric corrosion inhibitor polystyrene sulfonic acid (PSSA) additive to 3% HNO₃ solution on widening tunnels of pre-etched aluminum foil by electrochemical DC etching for aluminum electrolytic capacitors, using scanning electron microscopy and polarization curves. With trace PSSA, the dissolution of exterior surface of etch tunnels of Al foil is suppressed and the dissolution of interior surface of etch tunnels of Al foil is facilitated, respectively. The tunnels transform from circular cone to circular column in shape and pits-merging on the surface is weakened, leading to significant increase in the surface area and specific capacitance of the Al foil. The amounts of reduced thickness and weight of Al foil during the widening process of etch tunnels can be decreased if PSSA is employed.     

Elektrolytische Tunnelätzung von Aluminiumfolie

Electrolytic tunnel etching of aluminium foil The most effective method of etching aluminum foil for high voltage electrolytic capacitors is the electrolytic tunnel etching with direct current in an aqueous solution of chloride salts. Surprisingly the classical electrochemical method for determining the potentiostatic current-time curves of annealed high purity aluminum foil delivers a pure tunnel etching in a narrow range around the pitting potential. The potentiostatic current-time curves show the dynamic of the very fast and on an already etched aluminum foil not repeatable process of forming the tunnels (tunnel diameter ca. 0.2 μm; tunnel length 10–100 μm) and immediate after tunnel formation the about 1000 times slower and controllable process of widening these tunnels in the region of passivation current density.     

电脉冲对金属铝箔的作用

通过对金属铝箔施加高密度脉冲电流的方法 ,从实验和理论上研究了电脉冲对金属铝箔的作用机制。实验结果表明 ,电脉冲对铝箔能够产生收缩作用 ,铝箔的收缩率与电脉冲充电电压和充电电容以及放电次数有关 ,充电电压越高 ,充电电容越高 ,放电次数越多 ,铝箔的收缩率就越大。分析认为 ,脉冲电流在铝箔中产生的电磁力是导致铝箔收缩的主要原因 ,而脉冲电流产生的焦耳热则不会导致铝箔熔化收缩。     

Effect of trace Sn on corrosion behaviors of high voltage anode aluminum foil

The cube texture and the surface corrosion structure of aluminum anode foil for high voltage electrolytic capacitor containing trace Sn were investigated based on quantitative texture analysis and microstructure observation under SEM. High volume fraction of cube texture over 95% and obviously higher specific capacity are obtained in the foils with less than 0.002% Sn. It is indicated that the corrosion behavior of trace Sn on aluminum surface is similar with that of Pb. Higher content of Sn over 0.002% reduces the cube texture component and therefore the specific capacity. Sn, as an eco-ffiendly microelement, can be applied to replace Pb in improving the homogenous pitting behaviors of high voltage aluminum foils.     

An investigation of electrolytic coloring process of anodized aluminum coatings

In this paper specimens of pure aluminum, AA 5083 and AA 6111 anodized under standard conditions were electrolytically colored from acidic tin sulphate solutions at different rms voltages in order to further gain insight to the ac electrolytic coloring process. Electrochemical methods, SEM/EDS, RBS and XRF techniques were used in this study. The tin deposition efficiency increases with the increase of applied rms electrolytic coloring voltage and the purity of aluminum. The classical linear porosity of the film formed on high purity aluminum favors the tin deposition, while the heavily modified film morphology on AA 6111, impedes it. In the case of reanodizing the anodic-cathodic peak currents quickly reach maximum values and they are influenced by the applied rms voltage and the material types. Their ratio approaches unity indicating symmetry and cooperative movement of the ions through the oxide film. The corresponding ratio of faradaic charges is about 0.6, thus the anodic reactions occur in an extent of about 60% of the cathodic ones. However as the electrolytic coloring is going on and the currents decrease reaching a limited value, then these ratios change slightly not only with respect to the time of coloring but also to the material types. Regardless of the reanodizing or dissolution process being operative during the anodic half cycle, the tin deposition proceeds, when formation of new oxide and redistribution of pores take place. In the case of thinning of barrier layer more time is necessary in order to reach the peak currents their maximum values. The symmetry of these currents is considerably disturbed in the case of alloys but not of pure aluminum, while the ratio of faradaic charges is slightly modified. Thus the capacitance of the oxide films of alloys seems to be considerably altered during the barrier layer dissolution process.     

Effect of microstructure on specific capacitance of AA3003 aluminum alloy foils

1　INTRODUCTIONInrecent years ,highspecificcapacitancehascometobepursuedforsmallelectrolyticcapacitors .Themicrostructuresofthealuminumfoilwillinflu encethespecificcapacitanceofthecapacitorsserious ly .AA30 0 3aluminiumalloyisoftenusedforthecathodeofthecapacitors[17] ,containingMn ,Cu ,Mg ,SiandFe ,andshowinganexcellentcorrosionresistance .ThesolubilityofMninAlmatrixisverylowatroomtemperature ,andMnisoftenprecipitat edintheformofMnAl6 .ThesolubleironinAlma trixisverylimited ,oftenpre…     

中间层对高体积分数SiCp/Al复合材料真空钎焊的影响

采用铜箔、Al-Si-Mg及Al-Si-Mg/Cu/Al-Si-Mg(简称ACA)3种不同中间层对高体积分数45%SiC_p/Al复合材料进行真空钎焊连接研究.通过SEM,EDS及XRD等方法对钎缝的微观结构及界面组织进行了分析,研究了中间层种类对钎焊接头微观结构、界面组织以及连接强度的影响,阐明了不同中间层钎焊连接45%SiC_p/Al复合材料的界面形成过程及接头断裂机制.结果表明,ACA中间层兼具了铜和Al-Si-Mg钎料的优点,可降低钎料的液相线,增加其流动性,通过Cu原子优先在铝合金基体与其氧化膜的界面处扩散发生共晶反应,增强钎料的去膜作用,从而实现高体积分数45%SiC_p/Al复合材料的高质量连接.