激光剥离技术制备GaN/metal/Si的结构和光学特性研究

采用激光剥离技术结合金属熔融键合技术将生长在蓝宝石衬底上的GaN外延层转移到Si衬底上.GaN和Si表面分别用电子束蒸发Al/Ti/Au和Ti/Au/In后,在氮气环境下200℃加压实现GaN和Si的键合.采用脉冲宽度30 ns、波长248 nm的准分子脉冲激光透过蓝宝石衬底辐照GaN薄膜,在脉冲激光能量密度为380 mJ/cm2的条件下将蓝宝石衬底剥离下来,实现GaN薄膜向Si衬底的转移.样品截面显微镜和扫描电镜(SEM)照片说明经过键合工艺形成了致密的GaN/Al/Ti/Au/In/Au/Ti/Si结构.对转移衬底后的GaN薄膜进行原子力显微镜(AFM)和光致发光谱(PL)测试,结果表明金属熔融键合和激光剥离工艺没有对GaN薄膜的结构和光学特性带来明显的不利影响.     

GaN基半导体上BiFeO_3薄膜的生长与性能研究

采用脉冲激光沉积法在(0001)取向的GaN以及AlGaN/GaN调制掺杂结构上制备了(111)取向的BiFeO3(BFO)薄膜。首先在导电氧化物SrRuO3和TiO2缓冲层包覆的GaN上制备了BFO薄膜,分析了在GaN上生长的BFO薄膜的面外取向、外延关系、表面形貌以及电学性能等性质。然后,在AlGaN/GaN调制掺杂结构上采用TiO2缓冲层生长了BFO薄膜,并采用光刻工艺分别在AlGaN表面制备Ti/Al/Ti/Au欧姆电极和BFO表面制备Ni/Au肖特基电极以形成二极管结构。C-V测试表明,由于BFO铁电薄膜极化的作用,BFO/TiO2/AlGaN/GaN结构具有1 V左右的逆时针窗口。     

蓝宝石上GaN基多层膜结构椭偏研究

对InN/GaN/Al2O3和Ga2O3/GaN/Al2O3多层膜结构进行了椭圆偏振光谱研究。所有GaN样品均采用MOCVD工艺在蓝宝石(Al2O3)衬底上生长所得。应用多层介质膜模型,在300～800nm测试波长范围内拟合得到了样品各层厚度和折射率色散关系,并与GaN单层膜色散关系相比较,分析了各层膜之间对自身折射率的影响。研究结果表明,InN和Ga2O3表面均存在一个粗糙层,采用有效介质近似模型可使拟合结果更为准确;相对于GaN单层膜结构,InN薄膜使其下面的GaN层折射率明显增大,这应与界面层态密度有关;而在300～400nm测试范围内,Ga2O3折射率出现反常色散现象,InN消光系数亦产生了一个强的吸收峰,这则可能与GaN层在360nm左右存在的一个强吸收(Eg≈3.4eV)有关。     

纳秒脉冲激光对316L不锈钢微抛光效果的影响

激光微抛光过程中,激光的能量密度对微抛光效果的影响很大.采用纳秒紫外脉冲激光(波长为355 nm,脉冲宽度为35 ns)对316L不锈钢材料进行微抛光实验研究,分析了工件表面的形貌、扫描速度和离焦距离等因素对激光微抛光效果的影响.通过对4种不同表面形貌的抛光效果比较,发现不仅表面粗糙度会影响抛光质量,而且表面的形貌也对激光微抛光的效果有很大影响;激光微抛光时对确定的激光能量密度存在最佳微抛光效果的扫描速度和离焦距离.提出了355 nm紫外纳秒脉冲激光器对316L不锈钢微抛光效果的最佳工艺参数:激光能量密度为0.14 J/cm2,激光脉冲重复频率为20 Hz,扫描速度为18.6 mm/min,离焦距离为81.2μm.在此工艺参数下,316L不锈钢经过微抛光之后,表面粗糙度由123.23 nm降低至80.96 nm.     

MgO缓冲层对PZT/AlGaN/GaN异质结构电学性能的影响

采用脉冲激光沉积(PLD)技术,以MgO作为缓冲层,在AlGaN/GaN半导体异质结构上沉积了Pb(Zr0.52T0.48) O3 (PZT)铁电薄膜,从而形成金属-铁电-介质-半导体结构(MFIS).XRD扫描结果表明,通过MgO缓冲层对界面结构的优化,实现了PZT薄膜沿(111)面择优取向生长.电流-电压(I-V ...     

以TiO_2为缓冲层在GaN上外延生长PZT铁电薄膜

采用脉冲激光沉积技术在(0001)取向的GaN基片上以TiO2为缓冲层外延生长了PZT(111)单晶薄膜。X射线衍射分析表明PZT(111)衍射峰的摇摆曲线半高宽为0.4°,说明薄膜结晶性能良好。PZT薄膜疲劳特性测试结果表明,在经过107次翻转后PZT薄膜的剩余极化强度开始出现下降。P-E电滞回线和I-V测试表明PZT薄膜矫顽场(2Ec)为350 kV/cm,剩余极化(2Pr)约为96μC/cm2,在1 V电压下薄膜的漏电流密度为1.5×10-7A/cm2。以上性能测试结果表明,在半导体GaN上外延生长的PZT铁电薄膜性能基本满足铁电随机存储器的需要。     

纳秒激光辐照对类金刚石薄膜的损伤及改性

利用Nd:YAG纳秒激光(波长分别为355、532和1 064 nm)辐照由电子束蒸发技术制备的类金刚石(DLC)薄膜,通过光学显微镜、光学轮廓仪和拉曼光谱仪等分析了辐照后的薄膜样品,结果表明:不同波长的单脉冲激光辐照时,DLC膜的激光损伤阈值不同;同一波长的多脉冲激光辐照时,损伤阈值低于单脉冲辐照阈值;脉冲激光辐照对DLC膜具有改性作用,受辐照薄膜区域表层发生了石墨化、剥落和气化效应,致使DLC膜表面出现了隆起和弹坑,隆起高度和弹坑深度与激光能量密度大小和脉冲个数有关.     

硅基GaN外延层的SIMS及XPS研究

采用真空反应法在硅基上制备出了GaN外延层。利用二次离子质谱和X射线光电子能谱对GaN外延层进行了深度剖析和表面分析。结果表明 ,外延层中Ga和N分布均匀 ;在表面处Ga发生了偏聚 ;外延层中还存在Si,O等杂质 ,但这些并未影响到GaN外延层的物相及发光性能。实验还表明 ,在外延生长前采用原位清洗可去除Si衬底表面的氧     

Al_2O_3衬底上Pb(Zr,Ti)O_3铁电薄膜的外延生长与性能

以SrRuO3(SRO)作为缓冲层,利用脉冲激光沉积的方法,首次在蓝宝石(Al2O3)衬底上制备了PbZr0.52-Ti0.48O3(PZT)外延薄膜。利用X射线衍射分析得到了PZT薄膜与Al2O3衬底的外延关系,即(111)[110]PZT//(0001)[1010]Al2O3。所制备的PZT薄膜具有较强的铁电极化性能,饱和极化值达到138.3μC/cm2。同时,利用对电流-电压性质的测量研究了铁电极化的退反转现象。     

Spindt阴极制作中剥离层的研究

在Spindt场发射阴极制作工艺流程中,剥离层对于形成良好的发射尖锥形状至关重要,同时它也是实现阴极阵列中尖锥均匀性的关键因素.本文研究了几种常用的剥离层材料包括金属铜,Al2O3以及水溶性的NaCl和NA2CO3.实验表明NaCl和Na2CO3用作剥离层,可以被去离子水迅速、容易地去除,并同时实现很好的腐蚀选择性.但用这些水溶性材料得到的发射尖锥形状不很规则且表面粗糙,由此也会带来整个阴极阵列上尖锥的不均匀性.使用Al2O3作为剥离层则较为理想,可以得到光滑的栅极收口和很好的尖锥阵列.但传统用来腐蚀Al2O3的热H3PO4,对于加热制作的Al2O3剥离层腐蚀较为困难.尝试了使用基于NaOH的腐蚀液来剥离加热Al2O3层,通过严格的工艺参数控制,如腐蚀液浓度和刻蚀时间,可以制作出质量较好尖锥发射体阵列.     

GaN Electronics

An overview is presented of progress in GaN electronic devices for high‐power, high‐temperature applications. The wide bandgaps of the nitride materials, their excellent transport properties, and the availability of heterostructures (e.g., GaN/AlGaN) make them ideal candidates for these applications. In the past few years a wide range of devices have been reported, including heterostructure field effect transistors (HFETs), heterojunction bipolar transistors (HBTs), bipolar junction transistors (BJTs), Schottky and p–i–n rectifiers, and metal–oxide–semiconductor field effect transistors (MOSFETs). Some of the unexpected features of GaN‐based electronics include the ability to use piezoelectrically induced carriers for current transport in heterostructures and the sensitivity of the GaN surface to preferential loss of nitrogen during device processing.     

GaN的MOVPE生长和m－i－n型蓝光LED的试制

利用自行研制的常压ＭＯＶＰＥ设备和全部国产ＭＯ源，采用低温生长缓冲层技术，在蓝宝石（α－Ａｌ２Ｏ３）衬底上获得了高质量的ＧａＮ外延层。未掺杂的ＧａＮ外延层的室温电子迁移率已达１１４ｃｍ２／Ｖ．ｓ，载流于浓度为２×１０１８。７７Ｋ光致发光谱近带边发射峰波长为３６５ｎｍ，其线宽为４ＤｍｅＶ。Ｘ射线双晶衍射回摆曲线的线宽为３６０ａｒｃｓｅｃ。用Ｚｎ掺杂生长了绝缘的ｉ－ＧａＮ层。在此基础上研制了ｍ－ｉ－ｎ型ＧａＮ的ＬＥＤ，并在室温正向偏压下发出波长为４５５ｎｍ的蓝光。     

Preparation and optimization of freestanding GaN using low-temperature GaN layer

In this work, a method to acquire freestanding GaN by using low temperature (LT)-GaN layer was put forward. To obtain porous structure and increase the crystallinity, LT-GaN layers were annealed at high temperature. The morphology of LT-GaN layers with different thickness and annealing temperature before and after annealing was analyzed. Comparison of GaN films using different LT-GaN layers was made to acquire optimal LT-GaN process. According to HRXRD and Raman results, GaN grown on 800 nm LT-GaN layer which was annealed at 1090 °C has good crystal quality and small stress. The GaN film was successfully separated from the substrate after cooling down. The self-separation mechanism of this method was discussed. Cross-sectional EBSD mapping measurements were carried out to investigate the effect of LT-buffer layer on improvement of crystal quality and stress relief. The optical property of the obtained freestanding GaN film was also determined by PL measurement.     

NH3-MBE生长极化场二维电子气材料

介绍了用ＮＨ３－ＭＢＥ技术在蓝宝石Ｃ面上外延的高质量的ＧａＮ单层膜以及ＧＮ／ＡｌＮ／ＧａＮ极化感应二维电子气材料。外延膜都是Ｎ面材料。形成的二维电子气是“倒置二维电子气”。ＧａＮ单层膜的室温电子迁移率为３００ｃｍ＾２／Ｖｓ。二维电子气材料的迁移率为６８０ｃｍ＾２／Ｖｓ（ＲＴ）和１７００ｃｍ＾２／Ｖｓ（７７Ｋ）,相应的二维电子气的面密度为３．２＊１０＾１３ｃｍ＾－２（ＲＴ）和２．６ｘ１０＾１３ｃｍ＾     

Undoped High-Resistance GaN Buffer Layer for AlGaN/GaN High-Electron-Mobility Transistors

Technical Physics Letters - It is shown that intentionally undoped high-resistance GaN buffer layers in AlGaN/GaN heterostructures with high electron mobility for transistors can be formed by...     

Bulk large-area GaN layers

Mirror-smooth, transparent bulk GaN layers with an area of 2×3 cm² and a thickness of up to 1 mm were grown by hydrochloride vapor-phase epitaxy. Cracking of the material was eliminated by using a two-stage growth process; separation from a substrate was provided by a low-temperature buffer layer of preset thickness. For the best samples, FWHM of the X-ray rocking curve was ω_θ=3.5′ and the dislocation density amounted to 10⁷–10⁸ cm⁻².     

High quality GaN film overgrown on GaN nanorods array template by HVPE

The high density vertically aligned GaN nanorods array was fabricated by thermal evaporation of GaN powder with the assistance of HCl gas. The GaN nanorods array was used as template for GaN film growth by hydride vapor phase epitaxy (HVPE). The full width at half maximum values (FWHM) of high-resolution X-ray diffraction (HRXRD) rocking curves for the GaN film with GaN nanorods array template are 247 arc sec (002 reflection) and 308 arc sec (102 reflection), while those for the GaN film without GaN nanorods array template are 292 and 369 arc sec, respectively. This result indicates a significant reduction of dislocation density in the overgrown GaN film with GaN nanorods array template. Photoluminescence spectra measurements reveal the compressive strain relaxation and an improvement in the quality of the overgrown GaN film with GaN nanorods array template as compared to the regrown GaN film without GaN nanorods array template, which is consistent with the trend observed by HRXRD.     

Thermoelectric properties and thermoelectric devices of free-standing GaN and epitaxial GaN layer

We studied the thermoelectric properties of free-standing GaN (fr-GaN) and epitaxial GaN layer (epi-GaN), and furthermore, we have fabricated thermoelectric devices using these materials. For fr-GaN, the maximum power factor was 7.7 × 10^− 4 W/m K² at 373 K, and for epi-GaN layer, the maximum power factor was 9.4 × 10^− 4 W/m K² at 373 K. The devices fabricated are (a) fr-GaN and chromel of 4 pairs, and (b) epi-GaN and chromel of 3 pairs. The maximum output power and the open output voltage were (a) 3.35 × 10^− 6 W and 2.76 × 10^− 2 V at ΔT = 153 K, and (b) 1.21 × 10^− 7 W and 1.71 × 10^− 2 V at ΔT = 153 K, respectively.     

M-plane core-shell InGaN/GaN multiple-quantum-wells on GaN wires for electroluminescent devices

Nonpolar InGaN/GaN multiple quantum wells (MQWs) grown on the {11-00} sidewalls of c-axis GaN wires have been grown by organometallic vapor phase epitaxy on c-sapphire substrates. The structural properties of single wires are studied in detail by scanning transmission electron microscopy and in a more original way by secondary ion mass spectroscopy to quantify defects, thickness (1-8 nm) and In-composition in the wells (～16%). The core-shell MQW light emission characteristics (390-420 nm at 5 K) were investigated by cathodo- and photoluminescence demonstrating the absence of the quantum Stark effect as expected due to the nonpolar orientation. Finally, these radial nonpolar quantum wells were used in room-temperature single-wire electroluminescent devices emitting at 392 nm by exploiting sidewall emission.