新发明

单组分、不流淌的韧性环氧胶粘剂公开号 CN 1046546A 本发明提供一种单组分、不流淌的韧性环氧胶粘剂,其特点是具有很高的胶接强度     

单组分环氧胶粘剂的研究现状

综述了单组分环氧树脂胶粘剂的研究现状,并对单组分环氧胶发展趋势进行了展望。     

单组分环氧树脂胶粘剂的研究现状

综述了单组分环氧树脂胶粘剂的发展现状,介绍了湿气固化型、微胶囊包覆型、潜伏性固化剂型以及阳离子光固化等类型的单组分环氧胶的研究进展,重点讨论了潜伏性固化剂型环氧胶的改性方法及效果。     

水基环氧树脂乳液及其胶粘剂

概述了环氧树脂乳液的发展及制造方法;介绍了以环氧树脂乳液为基础的胶粘剂配方及基本性能;重点讨论了单组分环氧乳液作为胶粘剂在建筑领域的应用。     

中国胶粘剂2002年1～5期目录索引

第一期1　ＳＹ - 2 4中温固化胶接体系6　互穿网络法增韧环氧树脂胶粘剂的研究9　废聚酯在聚酰胺热熔粘合剂合成中的应用1 2　油气管道接口热收缩带用固定片的研制1 5　木材加工用单组分室温湿气固化异氰酸酯树脂的研制1 9　微泡型单组分聚氨酯胶粘剂的研制2 2　聚醋酸乙烯酯乳液胶粘剂的改性研究2 5　ＳＡ/ＳＢＲ/ＰＶＡｃ三元地毯胶的研制2 8　带有压敏性的环氧胶带的研制31　聚氨酯锚固胶的研制34　聚醋酸乙烯酯乳液粘合剂生产新方法36　氯化乙丙胶的合成及其改性ＰＶＣ胶粘剂的配制39　国产ＣＲ - 2 4 4粘结型氯丁橡胶的性能及加工应用4…     

糊状结构胶粘剂KH-9420胶

KHm－9420胶是单组分环氧结构胶粘剂，糊状，有触变性，可用泵施胶，室温储存期长，能在高温迅速固化，能粘接金属等材料，粘接面无需除油处理，固化后粘接强度大，韧性优良。可在汽车制造中应用。     

单组分快固环氧胶开发成功

三友（天津）高分子技术有限公司以E-51环氧树脂、潜伏性固化剂、固化促进刹、填充剂等开发成功热固化单组分快田环氧胶粘剂，具有无溶剂、低气味、不污染、粘接强度高、电性能优、防腐性好、储存稳定等优点，已在汽车、电子、机械等行业获得应用，特别适用于自动生产线使用。制备单组分快固环氧胶的关键组分是潜伏性固化剂，要求室温下（〈40℃=稳定，几乎不与环氧树脂反应，     

环氧建筑结构胶耐疲劳性能试验研究

环氧建筑结构胶是一种重要的化学建材,作为一种新型胶粘剂,日益获得发展.本文对该胶耐疲劳性能进行了研究,对建筑结构胶实际应用,具有重要意义.     

双组分环氧胶粘剂在我厂的应用

简单介绍了双组分环氧胶粘剂的特点、组成及固化反应机理 ,并且详细叙述了我厂双组分环氧胶粘剂的组分、配制工艺和灌胶工艺以及讨论了双组分环氧胶粘剂在我厂的应用情况 ,为我厂的军品及民用电器产品的灌封胶接提供了广泛的前景     

聚氨酯胶粘剂讲座(连载五)

第五章单组分聚氨酯胶粘剂前言单组分聚氨酯胶粘剂是聚氨酯胶粘剂的一大胶种,与双组分胶粘剂相比,具有不需调配、从容器中倒出即可使用、操作简便等优点。     

J系列胶黏剂在我公司飞机制造中的应用概况

简述了我公司使用的部分J系列胶黏剂的组成、使用工艺、用途、主要性能指标和使用评价。主要胶种包括J-29和J-118发泡胶、J-70和J-122耐腐蚀底胶、J-71和J-123芯条胶、J-116胶膜、J-160单组份改性环氧胶黏剂、J-168耐高温胶黏剂、J-185室温固化氟橡胶胶液、J-189聚氨酯胶、J-190聚合物补偿填充料、J-191环氧胶、J-192胶。该系列胶总体性能稳定,可满足我公司飞机制造要求。     

Epoxy-based composite adhesives with improved lap shear strengths at high temperatures for steel-steel bonded joints

High-performance room temperature-cure epoxy structural adhesives utilizing simplified formulation are developed. The developed structural adhesive consists of diglycidyl ether of bisphenol A (DGEBA) and novolac epoxy blend as a base resin, micrometer-sized silica particles as a reinforcing filler, and triethylenetetramine as a curing agent. The developed ambient temperature-cure epoxy structural adhesive with optimized formulation exhibits outstanding properties including high glass transition temperature of 95°C, high thermal stability with degradation temperature at 5% weight loss of 364°C, exceptionally high rubbery plateau modulus of 320 MPa, good flame-retardant characteristics with limiting oxygen index of 40, and high single lap shear strength for single lap steel-steel bonded joint of 548 MPa at the temperature of 80°C. The silica-filled DGEBA/novolac epoxy composite adhesive is a potential candidate for applying as a structural adhesive for construction with long-term durability.     

Accelerated-curing epoxy structural film adhesive for bonding lightweight honeycomb sandwich structures

Accelerating the curing of epoxy/aromatic amine adhesives and improving their toughness are challenges in heat-resistant epoxy structural adhesives. Herein, we report an epoxy/aromatic amine adhesive accelerated curing system with an oxo-centered trinuclear (chromium III) complex, which is toughened using a thermoplastic block copolymer (TPBC). The reaction characteristics, heat resistance, microstructure, and bonding properties of the accelerated epoxy adhesives were analyzed. The reaction peak temperature of the epoxy with 3% catalyst was 113.1°C, which was 113.6°C lower than that of epoxy without catalyst, and the modified epoxy resin demonstrated a potential for rapid curing at medium temperature. The glass transition temperature of the TPBC-toughened epoxy adhesive was 125°C after curing, indicating excellent thermal stability after medium temperature curing. The introduction of the TPBC increased the single-lap shear strength of the epoxy adhesive without reducing its heat resistance. The shear strength at room temperature and 120°C of the modified epoxy adhesive with 50 phr of TPBC was 25.2 and 10.9 MPa, respectively. Moreover, the epoxy film adhesive exhibited outstanding bonding properties when used in the bonding of lightweight honeycomb sandwich structures.     

Experimental study of the effect of microspheres and milled glass in the adhesive on the mechanical adhesion of single lap joints

This article describes several experiments conducted on single lap joints (SLJ) subjected to tensile mechanical loads. Two epoxy adhesives, with slow and fast curing, were used, with a weight of 0%, 3%, and 10% of glass microspheres and milled glass particles, respectively. The adherends used in the construction of the specimens were fiber-reinforced polymers. The types of failures produced in the SLJ specimens were classified according to ASTM standards. The results of the experimental tests on the SLJ with fast-curing epoxy adhesive showed that the use of milled glass and glass microspheres improved the strength of the joint compared with the neat fast-curing epoxy adhesive. As for the experimental test on the joint with slow-curing epoxy adhesive, the results showed that the use of milled glass and glass microspheres decreased its strength when using different additive concentrations compared with the neat slow-curing epoxy adhesive.     

聚乙烯醇缩醛—环氧结构胶粘剂

介绍了一种新型结构胶——聚乙烯醇缩醛——环氧胶粘剂,它是由聚乙烯醇缩醛、环氧树脂、固化剂、混合溶剂及其他配合剂制成。在飞机及宇航工业中,可广泛用于金属蜂窝结构件的制造。     

Benchmark tests on adhesive strengths in butt, single and double lap joints and double-cantilever beams

The RC99 committee of the Japan Society for Mechanical Engineers conducted the benchmark tests on strengths of adhesive joints using different testing methods. The effects of joint configuration, loading mode, adherend yield strength and so on, on the strength and data scatter were investigated using two typical epoxy adhesives. The strengths obtained by various tests were compared with each other. The relationships among strengths of butt, single lap and double lap joints and fracture toughness were given. Thirteen member institutes of the committee participated in this project. The benchmark results allow us to recognize that the joint strengths are strongly affected by the curing process. The key to obtaining the appropriate joint strength, is precise temperature control inside the adhesive layer for curing. Toughened adhesives do not always give higher joint strengths than untoughened adhesives. The yield strength of adherends much affects the observed lap joint strength of adhesives.     

Ultraviolet/heat dual‐curable film adhesives with pendant‐acryloyl‐functional‐group‐modified epoxy resin

To facilitate the fabrication of a reliable semiconductor package, the UV/heat dual curing of film adhesives was investigated. The curing system of the epoxy resin affected the film adhesive properties. As the UV/heat dual‐curable epoxy resin, a modified o‐cresol novolak epoxy resin, in which half of the glycidyl groups were substituted by acryloyl groups (OCN‐AE), was applied to the film adhesive. The formulated film adhesive contained acrylic copolymer, OCN‐AE, phenolic aralkyl resin as a heat‐curing agent of the glycidyl groups, and 1‐hydroxycyclohexyl phenyl ketone as a photoinitiator of the acryloyl groups. The formulated reference film adhesive contained unmodified o‐cresol novolak epoxy resin (OCN‐E) in place of OCN‐AE. Formulated film adhesives containing a mixture of OCN‐E and o‐cresol novolak epoxy acrylate were also used as references. The morphology and the film adhesive properties were investigated. In these investigations, the film adhesive of OCN‐AE showed better adhesive properties, lower modulus, and a better stress‐relaxation ability than the referenced adhesives. As a result, a reliable film adhesive for semiconductor packages was successfully developed. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Methodology for optimization of the curing cycle of paste adhesives

This contribution, carried out in the frame of the European Joint Technology Initiative ‘Clean Sky’, presents the results of a research program investigating the influence of fast curing on the quality of epoxy based paste adhesives. Today, the curing of paste adhesives is typically carried out following the supplier's recommendations. In order to reduce cycle time, save costs and energy resources, paste adhesives could be cured at higher temperature. To ensure a bonded joint quality with maximum mechanical performance, the limitation of this temperature increase is studied. This study shows the effects of the use of high temperatures in the curing process, which can lead to a degradation of the adhesive system due to the increase of void content, decreasing the mechanical performance in the paste adhesive as well as in the bonded joint. The goal of this research is to find fast and robust processing of paste adhesives and to develop a methodology to determine the maximum curing temperature possible. Different properties of the adhesive are investigated, including different thermal analysis techniques, optical and mechanical testing of the pure adhesive. Additionally, state of the art qualification of paste adhesives, single lap shear testing, is considered. In this study, a novel method to control the quality of the cured paste adhesives is defined based on the analysis of the pure cured paste adhesive, not influenced by the adherent quality, by measuring the void content and its effects on the bonded joint.     

室温固化耐热环氧胶粘剂的研究进展与发展趋势

综述了室温固化耐热环氧树脂(EP)胶粘剂的研究进展与发展趋势,介绍了近年来国内外部分性能优异的室温固化耐热EP胶粘剂,指出室温固化耐热EP胶粘剂的发展趋势是耐高温、高强度、高耐久性及快速固化。