Laser ablation preparation and property of bismuth-layer-structured SrBi2Ta2Ta2O9 and Bi4Ti3O12 ferroelectric thin films

Abstract

Bismuth-layer-structured ferroelectric thin films, SrBi₂Ta₂O₉ and Bi₄Ti₃O₁₂, have been prepared by laser ablation method on both Pt sheets and Si wafers at low temperatures of 400 ～ 500°C. These thin films have been characterized by XRD, XPS, AFM, C-V, D-E hysteresis and J-V measurement. SrBi₂Ta₂O₉ thin films have a good (105) preferential orientation, and Bi₄Ti₃O₁₂ thin films have (117) and c-axis orientation on these substrates. Ferroelectric film-SiO₂-Si structures show good C-V hysteresis curve owing to Si surface potential controlled by the D-E hysteresis. D-E hysteresis is obtained in Bi₄Ti₃O₁₂ thin film prepared on Pt sheet, and the remnant polarization and the coercive force are 7.5 μC/cm² and 72 kV/cm, respectively.     

Epitaxial growth of multilayered (Bi,La)4Ti3O12/Pb(Zr,Ti)O3 ferroelectric thin films with different orientations

Epitaxial (Bi,La)₄Ti₃O₁₂ (BLT) thin films, epitaxial Pb(Zr,Ti)O₃ (PZT) thin films, and epitaxial multilayered BLT/PZT ferroelectric thin films with different orientations were prepared on SrTiO₃ (STO) single crystal substrates by pulsed laser deposition. From X-ray pole-figures and electron diffraction patterns, the epitaxial orientation relationships between BLT layers, PZT layers, and STO substrates were identified to be (1) BLT(001)//PZT(001)//STO(001), and BLT[110]//PZT[100]//STO[100] for the multilayered thin films on (001)-oriented STO substrates, and (2) BLT(118)//PZT(011)//STO(011), and $ {\text{BLT}}{\left[ {\overline{1} \overline{1} 0} \right]}//{\text{PZT}}{\left[ {100} \right]}//{\text{SrTiO}}_{3} {\left[ {100} \right]} $ for the multilayered films on (011)-oriented STO substrates. Tri-layered films of the same compositions showed well-defined hysteresis loops as well as a high fatigue resistance up to 1?×?10¹⁰ switching cycles.     

Inverse Capacitance-Voltage Characteristics of Bi3.25La0.75Ti3O12 Thin Film Pulsed Laser Deposited on Thermally Oxidized n-Type Si Substrates

Comparative studies on the electrical properties of a metal-ferroelectric-insulator-semiconductor field effect transistor were conducted using pulsed laser ablated ferroelectric Bi_3.25La_0.75Ti₃O₁₂ (BLT) thin films deposited on SiO₂/Si substrates with different SiO₂ thicknesses. The SiO₂ layer was prepared on n-type Si substrates by dry oxidation at a temperature of 800°C. Small angle x-ray reflectivity studies were used to measure the SiO₂ thickness. The capacitance-voltage (C-V) measurements revealed that the films showed good interfacial properties. Shifts in flatband voltages were observable, but were effectively reduced by deposition of the ferroelectric films. Au/BLT/SiO₂/Si diodes with 8 nm SiO₂ layer showed to be stable with relatively large memory window values of about 0.3 V, 2.5 V, 5.0 V, and 7.0 V, at increasing bias voltages of ±5 V, ±7 V, ±10 V, and ±12 V, respectively.     

Phase Formations and Electrical Properties of Various (Bi, La)4Ti3O12 Thin Films by Chemical Solution Deposition

The phase formation and electrical properties of (Bi, La)₄Ti₃O₁₂ (BLT) thin film and V-, Sm-doped BLT thin films prepared by the chemical solution deposition method on Pt/TiO₂/SiO₂/Si substrates have been investigated. It was observed that the microstructure and electrical properties of BLT thin films dramatically varied with V- and Sm-doping. The crystallinity and grain size of BLT thin films were definitely increased by V- and Sm-doping into BLT films, which resulted in the enhancement of remanent polarization in doped BLT films. The remanent polarization (Pr) of Sm-doped BLT films annealed for 3 min by an RTA system was about 9 C/cm². The V- and Sm-doped BLT films also exhibited good fatigue characteristics under bipolar stressing to 10¹⁰ cycles.     

Ferroelectric Properties of (Bi, Sm)4Ti3O12 (BST) Thin Films Fabricated by a Metalorganic Solution Deposition Method

Ferroelectric properties of samarium substituted Bi₄Ti₃O₁₂ films, Bi_3.15Sm_0.85Ti₃O₁₂ (BST), were evaluated for use as lead-free thin film ferroelectrics for FeRAM applications. The BST films were fabricated on the Pt/Ti/SiO₂/Si(100) substrates by a metalorganic solution deposition method. The measured XRD patterns revealed that the BST films showed only a Bi₄Ti₃O₁₂-type phase with a random orientation. The BST film capacitors showed excellent ferroelectric properties. For the film capacitor annealed at 700C, 2P_r of 64.2 C/cm² and 2E_c of 101.7 kV/cm at applied electric field of 150 kV/cm were observed. The capacitor did not show any significant fatigue up to 1.5 × 10⁸ read/write switching cycles at a frequency of 1 MHz, which suggests that the samarium should be considered for a promising lanthanide elements to make a good thin ferroelectric film for memory applications.     

Bilayered Pb(Zr,Ti)O3/(Bi,Nd)4Ti3O12 thin films

Bilayered ferroelectric thin films consisting of Pb(Zr_0.52Ti_0.48)O₃ (PZT) and (Bi_3.15Nd_0.85)Ti₃O₁₂ (BNT) have been successfully synthesized on Pt/Ti/SiO₂/Si substrates, via a combined sol–gel and rf-sputtering route. Their ferroelectric and dielectric properties are critically dependent on the phases present, film texture and in particular layer and film thicknesses. Due to the coupling of PZT and BNT bilayers, there requires an optimized thickness combination of the two ferroelectric layers, in order to give rise to the wanted ferroelectric and dielectric properties, while the phenomenon can not be accounted for by the simple series connection model.     

Formation of Silicate-Added (Bi,La)4Ti3O12 Films on LaAlO3/Si(100) Structures

We fabricated MFIS (metal-ferroelectric-insulator-semiconductor) diodes with ((Bi,La)₄Ti₃O₁₂: BLT) films and lanthanum silicate (La₂SiO₅: LSO)-added BLT films formed on LaAlO₃/Si(100) structures. LaAlO₃ films were prepared by an MBD (molecular beam deposition) method. After the film deposition, they were subjected to ex site N₂ annealing in a rapid thermal annealing (RTA) furnace at 800°C for 1 min. BLT films and LSO-added BLT films were deposited on these LaAlO₃/Si structures using a sol-gel technique. The memory windows of BLT and LSO-added BLT films were 3.0 V and 2.1 V, respectively. It was found from the current density-voltage (I-V) characteristics that the insulation property of the LSO-added BLT film was superior to that of the BLT film. We conclude from these results that LaAlO₃ is an excellent candidate of a buffer layer for forming ferroelectric-gate FETs and that the LSO-added BLT film is suitable for low voltage operation of the FETs.     

(Zr/Ti) ratio effect on RF magnetron sputtered lead titanate zirconate films

Abstract

Sputtered Pb(Zr_xTi_1?x)O₃ thin films with various (Zr/Ti) compositions ranging from 15/85 to 70/30 were grown and characterised in terms of structural and electrical properties. PZT thin films, with 0.7–0.8μm thickness, were deposited on Si/SiO₂/Ti/Pt by sputtering followed by conventional annealing. The sputtering conditions were the same for all the compositions. There were no apparent differences in crystallographic orientation as a function of Zr/Ti and the films a-lattice constant evolution is not exactly identical to the one of bulk ceramics. The permittivity increases when the Zr concentration increases and decreases just after the mor-photropic composition i.e. Zr-rich films. The ferroelectric properties are very sensitive to the Zr/Ti ratio. For example, the coercive field increases when the Ti concentration in the film increases.     

Preparation of Epitaxial Bi4Ti3O12 Thin Films on LaAlO3(012) Substrates by a Spin Coating-Pyrolysis Process

Bismuth titanate Bi₄Ti₃O₁₂ thin films were prepared on LaAlO₃(012) substrates by a spin coating-pyrolysis process using metal naphthenates as starting materials. The c-axis oriented Bi₄Ti₃O₁₂ thin films, which contained no second phases as –2 scans, were obtained by heat-treatment in air at temperatures of 600°C and above. X-ray diffraction pole-figure analysis showed that the Bi₄Ti₃O₁₂ thin film has an epitaxial relationship with the LaAlO₃ substrate.     

Preparation of Bi4Ti3O12 thin films by electron cyclotron resonance sputtering

Abstract

Ferroelectric Bi₄Ti₃O₁₂ thin films were deposited on Pt-coated oxidized Si substrate by electron cyclotron resonance (ECR) sputtering using ceramic targets. Crystal structure and dielectric properties of the films were investigated as functions of sputtering conditions such as substrate temperature and sputtering gas. Using a target with excess Bi content compared to stoichiometric composition was required to compensate Bi re-evaporation from the substrate and to obtain a perovskite single phase at 600°C. (117)-oriented films exhibited ferroelectric hysteresis loops. The remanent polarization and coercive field of the films were 9.8 μC/cm² and 180 kV/cm, respectively.     

MOCVD of Pb(Zr x Ti1-x )O3 thin films on MgTiO3/Si substrates and their electrical properties

Abstract

Pb(Zh _x , Ti_1-x )O₃(PZT) thin films were deposited on Si substrates using MgTiO₃ as the buffer layer and the electrical properties of those MFIS structures were investigated. PZT and MgTiO₃ films were made by MOCVD using ultrasonic spraying technique. Perovskite PZT films have been succesfully made at the substrate temperature of 550 to 600°C only when using MgTiO₃ buffer layer. AES depth profile analysis and RBS analysis revealed that there is no remarkable interdiffusion and no formation of reaction layer between PZT and MgTiO₃ and/or between MgTiO₃ and Si substrate. The capacitance-voltage (C-V) curves of the MFIS structure which were made with PZT and MgTiO₃buffer layer have shown the hysteresis resulted from the ferroelectric switching of the PZT films.     

Flux-mediated epitaxy for ferroelectric Bi4Ti3O12 single crystal film growth

We propose the “Flux-mediated epitaxy” as a novel concept for the growth of single crystalline films of incongruent, volatile, and high-temperature-melting compounds. In flux-mediated eptitaxy, by supplying materials precursors from the gas phase through the liquid flux films pre-deposited on the substrate, a quasi-thermodynamic equilibrium condition is obtained at the interface between the growing films and the flux films. This process has been demonstrated in this paper by fabricating ferroelectric Bi₄Ti₃O₁₂ films, which has volatile Bi oxide. The most important step in this process is the selection of the right flux material, which is hard to predict due to the lack of an appropriate phase diagram. In order to overcome this problem, we have selected the combinatorial approach. A series of ternary flux libraries composed of two self-fluxes (Bi₂O₃ and Bi₄Ti₃O₁₂) and a third impurity flux were fabricated on SrTiO₃ (001) substrates. After that, stoichiometric Bi₄Ti₃O₁₂ films were grown on each of these flux libraries at a temperature presumed to melt the flux. High-throughput characterization with the concurrent X-ray diffraction method resulted in the identification of CuO containing Bi₂O₃ as the flux material for the growth of single crystalline Bi₄Ti₃O₁₂ films. Stoichiometric Bi₄Ti₃O₁₂ films fabricated by using a novel CuO containing Bi₂O₃ are qualified to be single crystalline judging from their large grain size and the electrical properties equivalent to bulk single crystal’s.     

Excess Bismuth-Dependent Characteristics of Chemical Solution Deposited Bi3.15La0.85Ti3O12 Thin Films

The phase formation and electrical properties of (Bi_3.15La_0.85)Ti₃O₁₂ (BLT) thin films prepared by the chemical solution deposition method on Pt/Ti/SiO₂/Si substrates have been investigated. It was observed that the microstructure and electrical properties of BLT thin films dramatically varied with the excess Bi content. The crystallographic orientation of BLT films was varied with excess Bi content and the intermediate rapid thermal annealing (RTA) process. While BLT thin films prepared without intermediate RTA process have ?117? orientation irrespective of excess Bi content, BLT thin films with RTA process at 450°C have an orientation change with excess Bi content. The leakage current of BLT thin films slightly increased with increasing excess Bi content up to 6.5% and then considerably decreased in BLT film with 10% Bi, where was revealed to be almost stoichiometric composition.     

Synthesis and properties of ferroelectric Si-doped (Bi, Nd)4Ti3O12 thin films by chemical solution deposition

Ferroelectric Si-doped (Bi,Nd)₄Ti₃O₁₂ thin films have been prepared on Pt/TiO_x/SiO₂/Si substrates through metal-organic compounds by the chemical solution deposition. The Bi_3.25Nd_0.75Ti_2.9Si_0.1O₁₂ (BNTS) precursor films were found to crystallize into the Bi-layered perovskite Bi₄Ti₃O₁₂ single-phase above 600^∘C. The synthesized BNTS films revealed a random orientation having a strong 117 reflection. The BNTS thin films prepared between 600^∘C and 700^∘C showed well-saturated P-E hysteresis loops with P _r of 13–14 μ C/cm² and E _c of 100–110 kV/cm at an applied voltage of 5 V. The surface roughness of the BNTS thin films was improved by Si doping compared with that of undoped Bi_3.35Nd_0.75Ti₃O₁₂ films.     

Properties of Chemical Solution Deposited Polycrystalline Neodymium-Modified Bi4Ti3O12

Thin films of neodymium-modified bismuth titanate Bi_3.44Nd_0.56Ti₃O₁₂ (BNT) were grown on Pt/TiO₂/SiO₂/Si substrates using chemical solution deposition method. The capacitors made by applying top Au electrodes on BNT films showed significantly improved values of the remanent polarization as compared to that using bismuth titanate Bi₄Ti₃O₁₂ (BT) films. The 2P _r value for the BNT capacitors was determined to be equal to 38 C/cm² at an applied voltage of 24 V, whereas, for Bi₄Ti₃O₁₂ (BT) capacitors a value of 20 C/cm² was measured at the same applied voltage. The maximum piezoelectric and pyroelectric coefficients of 22 pm/V and 112 C/m² K respectively, were measured for the BNT thin films.     

Preparation of Textured Growth Pb(Zr,Ti)O3 Thin Films on Si Substrate Using SrTiO3 as Buffer Layers

PZT thin films are deposited on SiO₂/Si substrate by metallo-organic decomposition (MOD) process, using SrTiO₃ (STO) as buffer layer for textured growth. The STO layers deposited on SiO₂/Si substrate by pulsed laser deposition process show (100)/(200) preferred orientation, whereas the STO buffer layer deposited on silica substrate using spin-coating technique show random orientation behavior. The use of STO as buffer layers enhanced the crystallization and the preferred orientations of the PZT films. The PZT on STO buffered SiO₂/Si substrates thus obtained possess high refractive index, (n)_PZT/STO = 2.1159, and are of good enough quality for optical waveguide applications.     

Low Temperature Process for Synthesis of (100) Textured Pb(Zr0.48Ti0.52)O3 Thin Films on Si Substrate by Laser Lift-Off Transferring Technique

(100) textured Pb(Zr_0.48Ti_0.52)O₃ (PZT) films were prepared on silicon substrates by MOD process and laser lift-off technique. Textured PZT films were first grown on (001) Sapphire substrate, using Ba(Mg_1/3Ta_2/3)O₃ (BMT) materials as buffer layer. The (100) textured PZT/BMT/Sapphire films were attached to Si substrate using a transient-liquid-phase Pd-In bonding process, and then were separated from Sapphire substrates by a laser lift-off process, in which, a 38 ns pulse from excimer laser (248 nm) at 600 mJ/cm² fluence melted BMT buffer layer, expelling the Sapphire. The crystallinity of the surface of films was further improved by laser annealing. X-ray diffraction analysis of the PZT films showed that the crystallographic structure of films is maintained during laser lift-off process. Electrical testing of the films after laser lift-off process followed by laser annealing demonstrated that the ferroelectric properties are retained for the transferred films (P_r = 9μ C/cm² and E_c = 74 kV/cm).     

Characteristics of Bi4Ti3O12 thin films on ITO/glass and Pt/Si substrates prepared by R.F. sputtering and rapid thermal annealing

Bi₄Ti₃O₁₂ thin films are deposited on ITO/glass and Pt/Ti/Si(100) substrates by R.F. magnetron sputtering at room temperature. The films are then heated by a rapid thermal annealing (RTA) process conducted in oxygen atmosphere at temperatures ranging from 550–700^∘C. X-ray diffraction examination reveals that the crystalinity of the films grown on Pt/Ti/Si is better than that of the films grown on ITO/glass under the same fabrication conditions. SEM observation shows that the films grown on Pt/Ti/Si are denser than those grown on ITO/glass substrates. Interactive diffusion between the Bi₄Ti₃O₁₂ film and the ITO film increases with the increase of annealing temperature. The optical transmittance of the thin film annealed at 650^∘C is found to be almost 100% when the effect of the ITO film is excluded. The relative dielectric constants, leakage currents and polarization characteristics of the two films are compared and discussed.     

Retention Characteristics of (Bi,La)4Ti3O12 Films on Si(100) Substrates Using LaAlO3 Buffer Layers

We demonstrate the ferroelectric behavior of (Bi,La)₄Ti₃O₁₂ (BLT) films deposited on Si(100) substrates by using LaAlO₃ buffer layers. LaAlO₃ films were prepared by molecular beam deposition method. Then, they were subjected to ex situ dry N₂ annealing in a rapid thermal annealing furnace. From the capacitance-voltage measurement, the dielectric constant of LaAlO₃ was estimated to be 20 to 26. On these structures, BLT films were deposited by sol-gel method and they were characterized by X-ray diffraction analysis. It was found from capacitance-voltage measurements that the characteristics showed a hysteresis loop and the memory window was about 0.5 V for the voltage sweep of ±9 V. It was also found from the retention measurement that the higher and lower capacitance values in the hysterisis loop could be distinguished at least for 3 days. It is concluded from these results that the BLT/LaAlO₃/Si(100) structure is one of the most promising structures for realizing MFISFETs (metal-ferroelectric-insulator-semiconductor field effect transistors).     

Dielectric behavior of Bi2/3Cu3Ti4O12 ceramic and thick films

The paper reports on synthesis, sintering and microstructure of Bi_2/3Cu₃Ti₄O₁₂, a lead-free, high-permittivity material with internal barrier layer capacitor behavior. Complex impedance and capacitance of the ceramic and thick films were studied as a function of frequency (10 Hz–2 MHz) and temperature (−170 to 400°C). Dc electrical conductivity of the samples was measured in the temperature range 20–400°C. Broad and high maxima of dielectric permittivity versus temperature plots were observed reaching 60,000 for ceramic and 5,000 for thick films. The maxima decrease and shift to higher temperatures with increasing frequency. Two arcs ascribed to grains and grain boundaries were found in the plots of imaginary part versus real part of impedance. Analysis of the impedance spectra indicates that Bi_2/3Cu₃Ti₄O₁₂ ceramic could be regarded as electrically heterogeneous system composed of semiconducting grains and less conducting grain boundaries. The developed thick film capacitors with dielectric layers based on Bi_2/3Cu₃Ti₄O₁₂ exhibit dense microstructure, good cooperation with Ag electrodes, high permittivity up to 5,000 and relatively low temperature coefficient of capacitance in the temperature range 100–300°C. Broad maxima in the dielectric permittivity versus temperature curves may be attributed to Maxwell–Wagner relaxation.