Reduced delay sensitivity to process induced variability in current sensing interconnects

The effect of process induced variability in long global on-chip interconnects caused by critical dimension control and intrinsic fluctuation of transistor threshold voltage is analysed for current and voltage mode signalling. Projections in scaled CMOS technologies show that current sensing interconnects exhibit smaller mean delay and sensitivity to parameter fluctuations. The standard deviation of delay exhibits an increasing dependency on process variations at the low and high extremes of receiver to driver circuit resistance ratios. An experimental on-chip bus demonstrates the reduced delay variability in current sensing schemes.     

Wireless inter-chip interconnects

Inter-chip wireless interconnect technologies such as inductive coupling and electromagnetic wave propagation have been developed for future high performance system in package at low cost. Inductive coupling is used for near field transmission whose distance is shorter than 100 μm as local wireless interconnects. Antennas are used for far field transmission between chips whose distance is longer than 1 cm as global wireless interconnects. A single-chip Gaussian monocycle pulse (GMP) transmitter using complementary metal oxide semiconductor (CMOS) technology with an on-chip integrated antenna was developed for inter-chip ultra wideband (UWB) communication.     

Pulsed current-mode signaling for nearly speed-of-light intrachip communication

In this paper, we describe the design of on-chip repeater-less interconnects with nearly speed-of-light latency. Sharp current-pulse data transmission is used to modulate transmitter energy to higher frequencies, where the effect of wire inductance is maximized, allowing the on-chip wires to function as transmission lines with considerably reduced dispersion. A prototype 8-Gb/s serial link employing this pulsed current-mode signaling in a 0.18-/spl mu/m CMOS process is described and measured.     

Supply and threshold voltage scaling for low power CMOS

This paper investigates the effect of lowering the supply and threshold voltages on the energy efficiency of CMOS circuits. Using a first-order model of the energy and delay of a CMOS circuit, we show that lowering the supply and threshold voltage is generally advantageous, especially when the transistors are velocity saturated and the nodes have a high activity factor, In fact, for modern submicron technologies, this simple analysis suggests optimal energy efficiency at supply voltages under 0.5 V. Other process and circuit parameters have almost no effect on this optimal operating point. If there is some uncertainty in the value of the threshold or supply voltage, however, the power advantage of this very low voltage operation diminishes. Therefore, unless active feedback is used to control the uncertainty, in the future the supply and threshold voltage will not decrease drastically, but rather will continue to scale down to maintain constant electric fields     

A 0.5-V power-supply scheme for low-power system LSIs using multi-V/sub th/ SOI CMOS technology

This paper proposes a novel power-supply scheme suitable for 0.5-V operating silicon-on-insulator (SOI) CMOS circuits. The system contains an on-chip buck DC-DC converter with over 90% efficiency, 0.5-V operating logic circuits, 100-MHz operating flip-flops at 0.5-V power supply, and level converters for the interface between the 0.5-V operating circuit and on-chip digital-to-analog (D/A) converters or external equipment. Based on the theory, the values of on-resistance and threshold voltage of SOI transistors are clarified for the 0.5-V/10-mW output DC-DC converter, which satisfies both high efficiency and low standby power. The proposed flip-flop can hold the data during the sleep with the use of the external power supply, while maintaining high performance during the active. The level converter comprises dual-rail charge transfer gates and a CMOS buffer with a cross-coupled nMOS amplifier to operate with high speed even in a conversion gain of higher than 6, where the conversion gain is defined as the ratio of the output and input signal swings. The test chip was fabricated for the 0.5-V power supply scheme by using multi-V/sub th/ SOI CMOS technology. The experimental results showed that the buck DC-DC converter achieved a conversion efficiency of 91% at 0.5-V/10-mW output with stable recovery characteristics from the sleep, and that the dual-rail level converter operated with a maximum data rate of 300 Mb/s with the input signal swing of 0.5 V.     

Rationale and challenges for optical interconnects to electronicchips

The various arguments for introducing optical interconnections to silicon CMOS chips are summarized, and the challenges for optical, optoelectronic, and integration technologies are discussed. Optics could solve many physical problems of interconnects, including precise clock distribution, system synchronization (allowing larger synchronous zones, both on-chip and between chips), bandwidth and density of long interconnections, and reduction of power dissipation. Optics may relieve a broad range of design problems, such as crosstalk, voltage isolation, wave reflection, impedence matching, and pin inductance. It may allow continued scaling of existing architectures and enable novel highly interconnected or high-bandwidth architectures. No physical breakthrough is required to implement dense optical interconnects to silicon chips, though substantial technological work remains. Cost is a significant barrier to practical introduction, though revolutionary approaches exist that might achieve economies of scale. An Appendix analyzes scaling of on-chop global electrical interconnects, including line inductance and the skin effect, both of which impose significant additional constraints on future interconnects     

Effects of temperature in deep-submicron global interconnect optimization in future technology nodes

The resistance of on-chip interconnects and the current drive of transistors are strongly temperature-dependent. As a result, the interconnect performance in Deep-Submicron technologies is affected by temperature in a substantial proportion. In this paper we evaluate thermal effects in global RLC interconnects and quantify their impact in a standard optimization procedure based on repeaters insertion. By evaluating the difference between a simple RC and an accurate RLC model, we show how the temperature induced increase of resistance may reduce the impact of inductance. We also project the evolution of such effects in future CMOS technologies, according to the semiconductor roadmap.     

Designing fast on-chip interconnects for deep submicrometer technologies

This paper proposes a solution to the problem of improving the speed of on-chip interconnects, or wire delay, for deep submicron technologies where coupling capacitance dominates the total line capacitance. Simultaneous redundant switching is proposed to reduce interconnect delays. It is shown to reduce delay more than 25% for a 10-mm long interconnect in a 0.12-/spl mu/m CMOS process compared to using shielding and increased spacing. The paper also proposes possible design approaches to reduce the delay in local interconnects.     

Wafer-level package interconnect options

As integrated circuit technology enters the nanometer era, global interconnects are becoming a bottleneck for overall chip performance. In this paper, we show that wafer-level package interconnects are an effective alternative to conventional on-chip global wires. These interconnects behave as LC transmission lines and can be exploited for their near speed of light transmission and low attenuation characteristics. We compare performance measures such as bandwidth, bandwidth density, latency, and power consumption of the package-level transmission lines with conventional on-chip global interconnects for different International Technology Roadmap for Semiconductors (ITRS) technology nodes. Based on these results, we show that package-level interconnects are well suited for power demanding low-latency applications. We also analyze different interconnect options such as memory buses, long inter tile interconnects, clock, and power distribution.     

A design-oriented methodology for accurate modeling of on-chip interconnects

An accurate modeling methodology for typical on-chip interconnects used in the design of high frequency digital, analog, and mixed signal systems is presented. The methodology includes the parameter extraction procedure, the equivalent circuit model selection, and mainly the determination of the minimum number of sections required in the equivalent circuit for accurate representing interconnects of certain lengths within specific frequency ranges while considering the frequency-dependent nature of the associated parameters. The modeling procedure is applied to interconnection lines up to 35 GHz obtaining good simulation-experiment correlations. In order to verify the accuracy of the obtained models in the design of integrated circuits (IC), several ring oscillators using interconnection lines with different lengths are designed and fabricated in Austriamicrosystems 0.35 μm CMOS process. The average error between the experimental and simulated operating frequency of the ring oscillators is reduced up to 2% when the interconnections are represented by the equivalent circuit model obtained by applying the proposed methodology.     

CMOS掉电保护电路

介绍了一种提高单片机运行可靠性的片内掉电保护电路，该电路可以检测电源电压的降低状况，并按规定的要求在电源电压降至下限阈值时启动内部复位产生器，从而复位ＣＰＵ并保证使其处于复位状态直至电源电压恢复正常。该ＣＭＯＳ掉电保护电路由取样电阻、１．２Ｖ参考电压源和ＣＭＯＳ电压比较器组成，并结合片内复位逻辑完成掉电保护功能。     

Moment computation of lumped and distributed coupled RC trees withapplication to delay and crosstalk estimation

In today's deep submicrometer technology the coupling capacitances among individual on-chip RC trees have an essential effect on the signal delay and crosstalk, and the interconnects should be modeled as coupled RC trees. In this paper we provide simple exact explicit formulas for the Elmore delay and higher order voltage moments and a linear order recursive algorithm for the voltage moment computation for lumped and distributed coupled RC trees. By using the formulas and algorithms, the moment-matching method can be efficiently implemented to deal with delay and crosstalk estimation, model order reduction, and optimal design of interconnects. As an application of the algorithm, we provide a new efficient and accurate model for crosstalk estimation in coupled RC trees. Simulation results show it works better than existing methods     

Current-Sensing and Repeater Hybrid Circuit Technique for On-Chip Interconnects

In this paper, hybrids based on current-sensing and repeaters are proposed for on-chip interconnects in an effort to overcome the limitations of these techniques. A novel receiver for current-sensing results in static power savings and allows an easier transition from current-sensing to traditional full rail voltage signals. Measurements of hybrids on a 0.18-m CMOS technology show significant gains over repeater insertion in delay across wire lengths. Hybrids can also be used in placement constrained and low-noise scenarios to achieve delay and power benefits.     

Voltage-Mode Driver Preemphasis Technique For On-Chip Global Buses

This paper demonstrates that driver preemphasis technique can be used for on-chip global buses to increase signal channel bandwidth. Compared to conventional repeater insertion techniques, driver preemphasis saves repeater layout complexity and reduces power consumption by 12%-39% for data activity factors above 0.1. A driver circuit architecture using voltage-mode preemphasis technique was tested in 0.18-mum CMOS technology for 10-mm long interconnects at 2 Gb/s     

Polylithic Integration of Electrical and Optical Interconnect Technologies for Gigascale Fiber-to-the-Chip Communication

Polylithic integration of electrical and optical interconnect technologies is presented as a solution for merging silicon CMOS and compound semiconductor optoelectronics. In contrast to monolithic and hybrid integration technologies, polylithic integration allows for the elimination of optoelectronic and integrated optic device-related processing from silicon CMOS manufacturing. Printed wiring board-level and compound semiconductor chip-level waveguides terminated with volume grating couplers facilitate bidirectional optical communication, where fiber-to-board and board-to-chip optical coupling occurs through a two-grating (or grating-to-grating) coupling path. A 27% increase in the electrical signal I/O projected by and 33% increase in the number of substrate-level electrical signal interconnect layers implied by the International Technology Roadmap for Semiconductors (ITRS) projections for the 32-nm technology generation are required to facilitate 10 Tb/s aggregate bidirectional fiber-to-the-chip communication. Buried air-gap channels provide for the routing of chip or board-level encapsulated air-clad waveguides for minimum crosstalk and maximum interconnect density. Optical signals routed on-board communicate with on-chip volume grating couplers embedded as part of a wafer-level batch package technology exhibiting compatible electrical and optical input/output interconnects. Measurements of grating-to-grating coupling reveal 31% coupling efficiency between two slab, nonoptimized, nonfocusing volume grating couplers.     

Loop-based inductance extraction and modeling for multiconductor on-chip interconnects

An efficient extraction and modeling methodology for self and mutual inductances within multiconductors for on-chip interconnects is investigated. The method is based on physical layout considerations and current distribution on multiple return paths, leading to loop inductance and resistance. It provides a lumped circuit model suitable for timing analysis in any circuit simulator, which can represent frequency-dependent characteristics. This novel modeling methodology accurately provides the mutual inductance and resistance as well as self terms within a wide frequency range without using any fitting algorithm. Measurement results for single and coupled wires within a multiconductor system, fabricated using 0.13 and 0.18 /spl mu/m CMOS technologies, confirm the validity of the proposed method. Our methodology can be applicable to high-speed global interconnects for post-layout as well as prelayout extraction and modeling.     

A low-voltage low-power threshold voltage monitor for CMOS process sensing

In this paper a low-voltage low-power threshold voltage monitor for CMOS process sensing is presented. This circuit works in weak inversion and it can be used as an elementary circuit block for on-chip compensation of the intra-die or inter-die threshold voltage variations in low-power analog and mixed-signal SoC, since it is robust to temperature and power supply voltage variations (similar to the bandgap voltage reference). The proposed threshold voltage monitor has been successfully verified in a standard 0.35-μm n-well CMOS TSMC process. Experimental results have confirmed that the circuit generates an average reference voltage of 758 mV (very close to the typical threshold voltage when extrapolated to absolute zero) for a 950 mV power supply voltage, with a variation of 39 ppm/°C for the −20 to 80°C temperature range.     

Predictions of CMOS compatible on-chip optical interconnect

Interconnect has become a primary bottleneck in the integrated circuit design process. As CMOS technology is scaled, the design requirements of delay, power, bandwidth, and noise due to the on-chip interconnects have become more stringent. New design challenges are continuously emerging, such as delay uncertainty induced by process and environmental variations. It has become increasingly difficult for conventional copper interconnect to satisfy these design requirements. On-chip optical interconnect has been considered as a potential substitute for electrical interconnect. In this paper, predictions of the performance of CMOS compatible optical devices are made based on current state-of-the-art optical technologies. Electrical and optical interconnects are compared for various design criteria based on these predictions. The critical dimensions beyond which optical interconnect becomes advantageous over electrical interconnect are shown to be approximately one-tenth of the chip edge length at the 22 nm technology node.     

A 16 Gb/s adaptive bandwidth on-chip bus based on hybrid current/voltage mode signaling

This paper describes an adaptive bandwidth bus (ABB) architecture based on hybrid current/voltage mode repeaters for long global RC interconnect static busses that achieves high-data rates while minimizing the static power dissipation associated with current-mode signaling. Attaining a maximum aggregate bandwidth of 16 Gb/s (i.e., 1 Gb/s per line) across lossy on-chip interconnects spanning 1.75 cm in length, the bus core fabricated in 0.35 /spl mu/m CMOS technology dissipates approximately 93 mW with a supply of 2.5 V and signal activity of 0.5, equivalent to 5.71 pJ/bit. Experimental results using a 16-bit reference bus design that can be externally programmed to operate in voltage, current or adaptive modes indicate a 50% reduction in power dissipation over current-mode (CM) sensing, and an improvement in interconnection delay and signaling bandwidth of 35%-70% and 66% over voltage-mode (VM) sensing, respectively.     

Enhanced transmission characteristics of on-chip interconnects withorthogonal gridded shield

On-chip interconnects over an orthogonal grid of grounded shielding lines on the silicon substrate are characterized by full-wave electromagnetic simulation. The analysis is based on a unit cell of the periodic shielded interconnect structure. It is demonstrated that the shielding structure may help to significantly enhance the transmission characteristics of on-chip interconnects particularly in analog and mixed-signal integrated circuits with bulk substrate resistivity on the order of 10 Ω-cm. Simulation results for the extracted R, L, G, C transmission line parameters show a significant decrease in the frequency-dependence of the distributed shunt capacitance as well as decrease in shunt conductance with the shielding structure present, while the series inductance and series resistance parameters are nearly unaffected. An extension of the equivalent circuit model for the shunt admittance of unshielded on-chip interconnects to include the effects of shielding is also presented