New thermosets obtained from bisphenol A diglycidyl ether and hydroxyl‐ended hyperbranched polymers partially blocked with benzoyl and trimethylsilyl groups

New epoxy thermosets with improved flexibility were prepared by chemical modification of bisphenol A diglycidyl ether (DGEBA) with hyperbranched polymers (HBPs). Hydroxyl‐ended hyperbranched polyesters were modified by blocking part of the hydroxyl groups with trimethylsilyl or benzoyl groups. The curing of mixtures of DGEBA with various proportions of two modified HBPs using ytterbium triflate as cationic initiator was investigated using differential scanning calorimetry and thermomechanical analysis. The characterization of these materials was performed using several thermal analysis techniques and their morphology was investigated using electron microscopy. High proportions of HBPs reduced the glass transition temperature and the relaxed storage modulus but barely affected gelation. The overall curing shrinkage was controlled by the content of hydroxyl groups and by the changes of HBP molecular interactions during curing. The results indicated that the relative proportion and type of terminal groups play a role in the evolution of the curing and the properties of the thermosets. Hydroxyl groups promoted the covalent incorporation of the HBP to the network via hydroxyl‐induced chain‐transfer reactions, whereas benzoyl groups promoted phase separation. Formulations containing HBP blocked with benzoyl groups showed two phases connected through covalent linkages between the HBP‐rich phase and the epoxy matrix. Copyright © 2010 Society of Chemical Industry     

Crosslinking of mixtures of DGEBA with 1,6-dioxaspiro[4,4]nonan-2,7-dione initiated by tertiary amines. Part IV. Effect of hydroxyl groups on initiation and curing kinetics

The anionic homopolymerization of DGEBA epoxy resin and its anionic copolymerization with a bislactone was studied using two alternative tertiary amines, 1-methylimidazole (1MI) and dimethylaminopyridine (DMAP) as initiators. 1MI caused slower cure than DMAP in neat DGEBA and DGEBA-bislactone formulations. Studies of the influence of the hydroxyl concentration in the DGEBA oligomer on its homopolymerization explain descrepancies in the literature regarding the ability of these initiators to produce full cure of the epoxy groups. In contrast, in the copolymerization of DGEBA-bislactone formulations, full cure could be readily achieved with either 1MI or DMAP as initiators, irrespective of the hydroxyl content. FTIR and DSC experiments show that this behaviour is associated with the formation of the carboxylate anion which plays an important part on the curing kinetics and the completion of cure.     

Thermal scanning rheometric analysis of curing kinetic of an epoxy resin. I. An anhydride as curing agent

The curing reaction of the system diglycidyl ether of bisphenol A (DGEBA), an organic anhydride (HMTPA), as curing agent and a tertiary amine (DMP 30) as initiator has been studied by Thermal Scanning Rheometry (TSR) under isothermal conditions. The gel time, which is defined by several different criteria, has been found to be a good parameter to determine the activation energy of this curing process; on the other hand, the gel time depends on the concentration of the initiator. An empirical model has been used to predict the change in viscosity (η*) of the system with time until the gelation is reached; the first‐order kinetics, the apparent kinetic constant (k′), and the activation energy before gelation have been determined. Furthermore, these results are reported together with the reaction mechanism proposed by another authors. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 1239–1245, 1999     

Thermal degradation and flammability of P/Si polysilsesquioxane epoxy nanocomposites

A thermal stable epoxy nanocomposite prepared from the 4,4′‐diglycidylether bisphenol A (DGEBA) and the P/Si ladder‐like polysilsesquioxane (PSSQ). The activation energies of thermal degradation were calculated by Kissinger's and Ozawa's methods. The higher ladder‐like PSSQ content not only increase the oligomer content but also generate the steric hindrance. Which steric hindrance influence the epoxy/amine curing reaction of the modified epoxy system was more than the pristine DGEBA epoxy system. The P‐Si synergistic effect on the thermal stability of the nanocomposites was discussed. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Relationship between viscoelastic properties and gelation in the epoxy/phenol‐novolac blend system with N‐benzylpyrazinium salt as a latent thermal catalyst

A study of viscoelastic properties and gelation in epoxy/phenol‐novolac blend system initiated with 1 wt % of N‐benzylpyrazinium hexafluoroantimonate (BPH) as a latent cationic thermal initiator was performed by analysis of rheological properties using a rheometer. Latent behavior was investigated by measuring the conversion as a function of curing temperature using traditional curing agents, such as ethylene diamine (EDA) and nadic methyl anhydride (NMA) in comparison to BPH. In the relationship between viscoelastic properties and gelation of epoxy/phenol‐novolac blend system, the time of modulus crossover was dependent on high frequency and cure temperature. The activation energy (E_c) for crosslinking from rheometric analysis increased within the composition range of 20–40 wt % phenol‐novolac resin. The 40 wt % phenol‐novolac (N40) to epoxy resin showed the highest value in the blend system, due to the three‐dimensional crosslinking that can take place between hydroxyl groups within the phenol resin or epoxides within the epoxy resin involving polyaddition of the initiator with BPH. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 79: 2299–2308, 2001     

Curing of diglycidyl ether of bisphenol‐A epoxy resin using a poly(aryl ether ketone) bearing pendant carboxyl groups as macromolecular curing agent

BACKGROUND: Reactive thermoplastics have received increasing attention in the field of epoxy resin toughening. This paper presents the first report of using a novel polyaryletherketone bearing one pendant carboxyl group per repeat unit to cure the diglycidyl ether of bisphenol‐A epoxy resin (DGEBA). The curing reactions of DGEBA/PEK‐L mixtures of various molar ratios and with different catalysts were investigated by means of dynamic differential scanning calorimetry and Fourier transform infrared (FTIR) spectroscopy methods. RESULTS: FTIR results for the DGEBA/PEK‐L system before curing and after curing at 135 °C for different times demonstrated that the carboxyl groups of PEK‐L were indeed involved in the curing reaction to form a crosslinked network, as evidenced by the marked decreased peak intensities of the carboxyl group at 1705 cm^?1 and the epoxy group at 915 cm^?1 as well as the newly emerged strong absorptions of ester bonds at 1721 cm^?1 and hydroxyl groups at 3447 cm^?1. Curing kinetic analysis showed that the value of the activation energy (E_a) was the highest at the beginning of curing, followed by a decrease with increasing conversion (α), which was attributed to the autocatalytic effect of hydroxyls generated in the curing reaction. CONCLUSION: The pendant carboxyl groups in PEK‐L can react with epoxy groups of DGEBA during thermal curing, and covalently participate in the crosslinking network. PEK‐L is thus expected to significantly improve the fracture toughness of DGEBA epoxy resin. Copyright © 2009 Society of Chemical Industry     

Effect of curing order on the curing kinetics and morphology of bisGMA/DGEBA interpenetrating polymer networks

The curing kinetics and morphology of an interpenetrating polymer network (IPN) formed from an epoxy resin (DGEBA) cured by an imidazole (1‐MeI) and a dimethacrylate resin (bisGMA), cured by low‐ and high‐temperature peroxide initiators (TBPEH and DHPB, respectively) have been studied by temperature‐ramping DSC, isothermal near‐infrared (NIR), DMTA and small‐angle neutron scattering (SANS). bisGMA and DGEBA are polar and chemically similar thermosetting resins which should enhance the miscibility of their IPNs. The phase structure was controlled by varying the curing procedure: the order of gelation of the components is dependent on the choice of low‐ and high‐temperature initiators for bisGMA and this affects the morphology formation. In the cure of the bisGMA/TBPEH:DGEBA/1‐MeI system, the dimethacrylate cures first. For isothermal cure studies at 80 °C, the final conversion of the epoxy is reduced by high crosslinking of the methacrylate groups in the IPN causing vitrification before full cure. The dimethacrylate conversion is enhanced due to plasticisation with unreacted DGEBA, and its cure rate is increased due to accelerated decomposition of TBPEH initiator by 1‐MeI. SANS revealed that phase separation occurs in these IPNs with domains on the scale of 6–7 nm. In the cure of the bisGMA/DHBP:DGEBA/1‐MeI system, the epoxy cures at a similar rate to that of the methacrylate groups. For isothermal cure studies at 80 °C, similar final conversions of the epoxy have been observed except for the 75:25 IPN. The cure rate of the methacrylate groups in the IPN is increased also due to accelerated decomposition of DHBP initiator by 1‐MeI, and the extent of accelerated decomposition for DHBP is stronger than that in the TBPEH‐based systems. SANS studies revealed that this system is more homogeneous due to the rapid formation of the dimethacrylate gel in the presence of the preformed epoxy network which interlocks the networks at low degrees of methacrylate conversion. Copyright © 2006 Society of Chemical Industry     

Kinetic approach for epoxy resins cured with diaminodiphenyl sulfone under non‐isothermal conditions

The curing reactions of epoxy resin basing on diglycidyl ether bisphenol A (DGEBA) with 4,4′‐diaminodiphenyl sulfone (DDS) were investigated with a differential scanning calorimeter and gel permeation chromatography. Based on the generating function method and the Monte Carlo simulation procedure, kinetic models for both isothermal and nonisothermal curing conditions were proposed. The apparent activation energy of curing reactions was found to be 14.9 Kcal/mol by the thermal analysis. According to our kinetic models, gel points, the profiles of epoxy conversion, and the molecular weights of polymers were calculated. Good agreement is obtained between the model predictions and experimental data. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 721–728, 1999     

Structures and properties of polycarbonate‐modified epoxies from two different blending processes

It has been proved in our previous study that during the melt‐blending of an epoxy oligomer based on the diglycidyl ether of bisphenol‐A (DGEBA) with polycarbonate (PC) at 200°C, the secondary hydroxyl groups in the DGEBA react with the carbonate groups in PC through transesterification, resulting in degraded PC chains with phenolic end groups and also in PC/DGEBA copolymers. Yet, in the same study, it was found that the prereactions between DGEBA and PC can be minimized or eliminated if a solution‐blending process was used. Therefore, it was expected that, after being cured with a curing agent, different epoxy‐network structures should result as a consequence of the two different premixing processes of DGEBA and PC. In addition, we also expect that in the melt‐blending process, the fracture toughness of epoxies should be increased due to the incorporation of ductile PC chains into the epoxy network. In this study, therefore, we attempted to examine and compare the structures and properties of PC‐modified epoxies through these two different blending processes. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 2510–2521, 1999     

Processing and chemorheology of epoxy resins and their blends with dendritic hyperbranched polymers

Toughened epoxy systems have found increasing applications in automotive, aerospace, and electronic packaging industries. The present article reported work done for elucidation of gelation and vitrification for various epoxy systems and their blends with dendritic hyperbranched polymers (HBPs) having epoxy and hydroxyl functionality. Gel time was found to increase with increasing functionality from diglycidyl ether of bisphenol A (DGEBA) to tetraglycidyl diaminodiphenyl methane (TGDDM). The vitrification point was clearly identified from rheological experiments for triglycidyl p‐amino phenol (TGAP) and TGDDM. In the case of DGEBA a clear display of vitrification was not observed. TGDDM underwent vitrification sooner than did TGAP. Hydroxyl‐functionalized HBP reduced the gel time of the blends because of the accelerating effect of –OH groups to the epoxy curing reaction. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 1604–1610, 2004     

Effects of amino‐functionalized carbon nanotubes on the properties of amine‐terminated butadiene–acrylonitrile rubber‐toughened epoxy resins

Amino‐functionalized multiwalled carbon nanotubes (MWCNT‐NH₂s) as nanofillers were incorporated into diglycidyl ether of bisphenol A (DGEBA) toughened with amine‐terminated butadiene–acrylonitrile (ATBN). The curing kinetics, glass‐transition temperature (T_g), thermal stability, mechanical properties, and morphology of DGEBA/ATBN/MWCNT‐NH₂ nanocomposites were investigated by differential scanning calorimetry (DSC), thermogravimetric analysis, a universal test machine, and scanning electron microscopy. DSC dynamic kinetic studies showed that the addition of MWCNT‐NH₂s accelerated the curing reaction of the ATBN‐toughened epoxy resin. DSC results revealed that the T_g of the rubber‐toughened epoxy nanocomposites decreased nearly 10°C with 2 wt % MWCNT‐NH₂s. The thermogravimetric results show that the addition of MWCNT‐NH₂s enhanced the thermal stability of the ATBN‐toughened epoxy resin. The tensile strength, flexural strength, and flexural modulus of the DGEBA/ATBN/MWCNT‐NH₂ nanocomposites increased increasing MWCNT‐NH₂ contents, whereas the addition of the MWCNT‐NH₂s slightly decreased the elongation at break of the rubber‐toughened epoxy. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40472.     

Kinetic of epoxy resin formation by high‐performance liquid chromatography

This article is focused on the following of the cure of an epoxy resin by high‐performance liquid chromatography (HPLC) and the comparison of the data obtained with those obtained by differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) techniques usually employed for characterize curing processes. A reversed‐phase HPLC method with UV detection is developed to study the kinetic of the curing reaction of diglycidyl ether of bisphenol A (DGEBA) with 1,3‐cyclohexanebismethylamine (1,3‐BAC) at 60, 70, and 80°C, before and after gelation. The limits of quantification obtained permit the application of the proposed method until the last steps of the formation kinetic. HPLC and DSC analysis show a good correlation. The gel conversions obtained by HPLC and DMA agree well. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 497–504, 2003     

Rheological,mechanical, and morphological studies of epoxy/poly(methyl methacrylate) semi‐interpenetrating polymer networks

Semi‐interpenetrating polymer networks (semi‐IPNs) of epoxy resin and poly(methyl methacrylate) (PMMA) were synthesized. Methyl methacrylate (MMA) was polymerized by free radical mechanism with azo‐bis‐isobutyronitrile in the presence of oligomeric epoxy resin (DGEBA), and hexahydrophthalic anhydride as crosslinking agent. The gelation and vitrification transitions during cure/polymerization processes have been examined using parallel‐plates rheological technique. From differential scanning calorimetry and rheological techniques, it was suggested that both curing and polymerization processes occur simultaneously. However, the gelation time was longer for the semi‐IPN than those observed for the cure of pure DGEBA or polymerization of MMA. The gelation time increased significantly when 5% of MMA was employed, suggesting a diluent effect of the monomer. Higher amount of MMA resulted in a decrease of gel time, probably because of the simultaneous polymerization of MMA during the curing process. Structural examination of the semi‐IPNs, using scanning electron microscopy, revealed phase separation in nanoscale size for semi‐IPNs containing PMMA at concentrations up to 15%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Hydroxyl terminated poly(ether ether ketone) with pendant methyl group‐toughened epoxy clay ternary nanocomposites: Preparation,morphology, and thermomechanical properties

Hydroxyl terminated poly(ether ether ketone) oligomer with pendant methyl group (PEEKMOH) was prepared. Ternary nanocomposites were processed by blending PEEKMOH oligomer with diglycidyl ether of bisphenol‐A (DGEBA) epoxy resin along with organically modified montmorillonite (Cloisite 25A) followed by curing with 4,4'‐diamino diphenyl sulfone. Tensile moduli and flexural moduli were increased, while the tensile strength and Izod impact strength were decreased with increase in clay content. Similarly, storage moduli and loss moduli were increased and glass transition temperature was decreased as the percentage of clay increased. X‐ray diffractograms showed exfoliated morphology even with higher concentration of clay content (8 phr). Scanning electron microscopy of fractured surfaces and tensile failed specimens revealed slow crack propagation and increase in river markings with nanoclay incorporation confirming the improvement in toughness. The domain size of PEEKMOH was decreased with the incorporation of nanoclay into the epoxy matrix, indicating the restriction of growth mechanism by nucleation during phase separation. With increase in clay content, phase separation disappeared indicating gelation occurs before phase separation. Fracture toughness was increased with the addition of PEEKMOH and clay in epoxy resin. Coefficient of thermal expansion of nanocomposites decreases up to 3 phr clay concentrations thereafter it increases. A marginal increase in thermal stability was observed with increase in clay content. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Synthesis,characterization, and curing of {2,6–bis‐[2‐(bis‐oxiranylmethyl‐amino)‐methylbenzyl]‐phenyl}‐bis‐oxiranylmethylamine (BPBOMA)

The curing behavior of epoxy resin prepared by reacting epichlorohydrin with amine functional aniline acetaldehyde condensate (AFAAC) was investigated using AFAAC as a curing agent. The epoxy resin, {2,6‐bis‐[2‐(bis‐oxiranylmethyl‐amino)‐methylbenzyl]‐phenyl}‐bis‐oxiranylmethylamine (BPBOMA), was characterized by FTIR and ¹H‐NMR spectroscopy, viscosity measurement, and determination of epoxy content. Analysis of the curing reaction was followed by differential scanning calorimetry (DSC) analysis. To investigate the curing kinetic with AFAAC, dynamic DSC scans were made at heating rates of 5, 10, 15, and 20°C/min. The activation energy and frequency factor of the AFAAC formulation were evaluated. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3168–3174, 2006     

Curing of DGEBA epoxy resin by low generation amino‐group‐terminated dendrimers

Low generation amino‐group‐terminated poly(ester‐amine) dendrimers PEA1.0 (NH₂)₃ and PEA1.5 (NH₂)₈, and poly(amido‐amine) dendrimer PAMAM1.0 (NH₂)₄ were used as diglycidyl ether of bisphenol A (DGEBA) epoxy resin hardeners. Thermal behavior and curing kinetics of dendrimer/DGEBA systems were investigated by means of differential scanning calorimetry (DSC). Compared with ethylene diamine (EDA)/DGEBA system, the dendrimer/DGEBA systems gradually liberated heat in two stages during the curing process, and the total heat liberated was less. Apparent activation energy and curing reaction rate constants for dendrimer and EDA/DGEBA systems were estimated. Thermal stabilities and mechanical properties of cured thermosetting systems were examined as well. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3902–3906, 2006     

Cure kinetics and thermal stability of micro and nanostructured thermosetting blends of epoxy resin and epoxidized styrene‐block‐butadiene‐block‐styrene triblock copolymer systems

The compatibility of styrene‐block‐butadiene‐block‐styrene (SBS) triblockcopolymer in epoxy resin is increased by the epoxidation of butadiene segment, using hydrogen peroxide in the presence of an in situ prepared catalyst in water/dichloroethane biphasic system. Highly epoxidized SBS (epoxy content SBS >26 mol%) give rise to nanostructured blends with epoxy resin. The cure kinetics of micro and nanostructured blends of epoxy resin [diglycidyl ether of bisphenol A; (DGEBA)]/amine curing agent [4,4′‐diaminodiphenylmethane (DDM)] with epoxidized styrene‐block‐butadiene‐block‐styrene (eSBS 47 mol%) triblock copolymer has been studied for the first time using differential scanning calorimetry under isothermal conditions to determine the reaction kinetic parameters such as kinetic constants and activation energy. The cure reaction rate is decreased with increasing the concentration of eSBS in the blends and also with the lowering of cure temperature. The compatibility of eSBS in epoxy resin is investigated in detailed by Fourier transform infrared spectroscopy, optical and transmition electron microscopic analysis. The experimental data of the cure behavior for the systems, epoxy/DDM and epoxy/eSBS(47 mol%)/DDM show an autocatalytic behavior regardless of the presence of eSBS in agreement with Kamal's model. The thermal stability of cured resins is also evaluated using thermogravimetry in nitrogen atmosphere. POLYM. ENG. SCI., 2012. © 2012 Society of Plastics Engineers     

Post‐Crosslinkable Blends: Reactions Between a Linear Poly(hydroxyl‐amino ether) and a Diepoxy

Summary: A thermoplastic poly(hydroxyl‐amino ether) polymer (BLOX) was blended with a diglycidyl ether of bisphenol A monomer (DGEBA). This system may be used as a crosslinkable thermoplastic. It means that it may be processed in an extruder like a classic thermoplastic, and cured by etherification reactions initiated by tertiary amine groups of the BLOX in a second step, to produce a material with good mechanical properties. In order to understand and quantify the etherification reactions occurring at high temperature (135 °C), between epoxy groups of the diepoxy and hydroxyl groups of the thermoplastic, a model system was studied based on DGEBA in excess and ethanolamine. In the model system the rate of the etherification reaction was well described by a second‐order kinetic equation. The specific rate constants and the epoxy conversion at the gel were related to the polarity of the reactive medium. The polyetherification occurring in the DGEBA‐BLOX system could also be fitted with a second‐order kinetics. A significant increase in the reaction rate was observed when using high BLOX concentrations.

     

Cure kinetics of a high epoxide/hydroxyl group-ratio bisphenol a epoxy resin—anhydride system by infrared absorption spectroscopy

An infrared absorption spectroscopy study of the curing (gelation and postcure) kinetics of a high (4.7) epoxide/hydroxyl group-ratio diglycidyl ether of bisphenol A (DGEBA)–mixed anhydride epoxy resin system is reported. Peak assignments to molecular vibrational modes are given for the range 400–4000 cm^?1, and the optical density behavior of all peaks during reaction is discussed in detail. Chemical reaction was found to follow consecutive-step addition esterification and simultaneous addition etherification. Epoxide hydroxyl-group and carboxylic acid dimer hydrogen bonding was found to occur. The gelation phase of reaction is complex, exhibiting rapid initial hydroxyl–anhydride reactions followed by S-shaped kinetics approaching an incompletely reacted limit. Postcure exhibits functional group kinetic behavior similar to that occurring in low epoxide/hydroxyl group-ratio bisphenol A epoxy resin–phthalic anhydride systems and produces similar final chemical structures. The reaction behavior of low and high epoxide/hydroxyl group-ratio bisphenol A epoxy resin–anhydride systems arises from an hydroxyl group-limited inhomogeneous reaction mechanism involving bisphenol A epoxy resin molecular aggregates. The importance of free hydroxyl group content is discussed.     

Time‐of‐flight secondary ion mass spectrometry investigation of epoxy resin curing behavior in real time

Time‐of‐flight secondary ion mass spectrometry and principal components analysis were used in real time to monitor the progress of curing reactions on the surface of a diglycidyl ether of bisphenol A (DGEBA) and diglycidyl ether of bisphenol F (DGEBF) epoxy resin blend reacted with the diamine hardener isophorone diamine at different time intervals. Molecular ions in the mass spectra that characterized the curing reactions steps, including blocking, coupling, branching, and crosslinking, were identified. The aliphatic hydrocarbon ions were correlated to the curing reaction rate, and this indicated that coupling and branching occurred much faster than the blocking and crosslinking curing reactions steps. The total conversion of the coupling and branching reaction steps were followed on the basis of changes with time in the relative ion intensity of molecular ions assigned to the DGEBA/DGEBF, aliphatic hydrocarbon, epoxide, and aromatic ring structures. Indicative measures of crosslinking density were monitored through the observation of changes in the ratio of the relative intensities of the aliphatic hydrocarbon and hydroxyl molecular ions over time. The curing reaction conversion was established by the observation of the changes in the relative ion intensity of the molecular ions that were related to the DGEBA/DGEBF molecules. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009