Ionic liquid modified lignin-phenol-glyoxal resin: a green alternative resin for production of particleboards

The aim of this research was to evaluate the properties of particleboard panels bonded with ionic liquid treated lignin- phenol- glyoxal (LPG) resin. For this purpose, soda bagasse lignin was modified by 1-ethyl-3-methylimidazolium acetate ([Emim][OAc]) ionic liquid and then various contents of virgin and modified lignin (20, 30 and 40 wt% based on weight of phenol), phenol and glyoxal were used for synthesis of LPG resins. After resin synthesis, thermal and physicochemical properties of the synthesized resins such as curing behavior, gelation time, viscosity, solid content and density were measured. Finally, the resins so prepared were used for laboratory particleboard manufacturing. The panels physical (water absorption, thickness swelling) as well as mechanical (MOE, MOR and internal bond strength) properties were measured according to standard methods. The resins tests indicated that modification of lignin with ionic liquid not only can accelerate the gelation time and increase viscosity, density and solid content of LPG resins but also decrease the temperature required for curing the LPG resins. Based on the results of this work, the mechanical strength and dimensional stability of the particleboards bonded with a LPG resin can be improved by using modified lignin. The particleboards prepared with the LPG resin, using either modified or virgin lignin, presented higher water absorption as well as weaker mechanical strength than those prepared with the control PF resin. However, there does not appear to be any statistically significant difference between the some properties of the panels bonded with the control PF resin and those bonded with the LPG resin containing modified lignin.     

Effect of resin type and content on properties of composite particleboard made of a mixture of wood and rice husk

This study investigated the effect of resin type and content on the dimensional stability and mechanical properties of single-layer composite particleboards made of a mixture of wood particles (70 wt%) and rice husk particles (30 wt%). Two types of resin, urea–formaldehyde (UF) resin and phenol–formaldehyde (PF) resin, were used in the experiments at three different contents which were 8, 10, or 12 wt%. The dimensional stability of the samples was significantly improved by increasing the resin content. When the contents of the UF and PF resins increased from 8 to 12 wt%, the WA values of the samples decreased to18% and 33%, respectively. Similar results were also observed for the TS values. The UF resin bonded samples swelled two times more than the PF resin bonded particleboard. The mechanical properties of the PF resin bonded samples were better than the UF resin bonded samples. When the contents of the UF and PF resins increased from 8% to 12 wt%, the internal bond strength values of the samples increased to 21% and 41%, respectively. The bending strength and modulus of elasticity of the samples were not significantly increased by increasing contents of the UF and PF resins, except for the 12 wt% content.     

Properties of plywood panels bonded with ionic liquid-modified lignin–phenol–formaldehyde resin

The aim of this research was to investigate the physical and mechanical properties of plywood panels bonded with ionic liquid-modified lignin–phenol–formaldehyde (LPF) resin. For this purpose, soda bagasse lignin was modified by 1-ethyl-3-methylimidazolium acetate ([Emim][OAc]) ionic liquid, and then, various contents of modified lignins (10, 15, and 20 wt%) were added as a substitute of phenol in phenol–formaldehyde (PF) resin synthesis. The properties of the synthesized resin were compared with those of a control PF resin. The changes in curing behavior of the resins prepared were analyzed by differential scanning calorimetry (DSC). The physical properties of the resins prepared, as well as the water absorption, thickness swelling, shear strength, and formaldehyde emission of the plywood panels bonded with these adhesives, were measured according to standard methods. DSC analysis indicated that in comparison with PF resins, curing of the LPF resin occurred at lower temperatures. The physical properties of the synthesized resins indicated that viscosity and solid content increased, while gel time and density decreased by addition of treated lignin to the PF resin. Although the panels containing resins with modified lignin yielded low formaldehyde emission, their dimensional stability was worse than those bonded with a commercial PF adhesive. The plywood prepared using IL-treated lignin PF resins has shear strength, which satisfy the requirements of the relevant standards specifications and significantly better than that of panels prepared with the control PF resin. The mechanical properties of the panels could be significantly enhanced with increased percentage of treated lignin content from 0 to 20 wt%.     

Use of organosolv lignin in phenol-formaldehyde resins for particleboard production: II. Particleboard production and properties

The objective of this work was to demonstrate the utility of lignin-based resins designed for application as an adhesive in the production of particleboard. Bond qualities of lignin-phenol-formaldehyde resins, phenolated-lignin-formaldehyde resins and commercial phenol-formaldehyde (PF-com) resin were assessed by using an automatic bonding evaluation system, prior to production of particleboards. In order to evaluate the quality of lignin-based resins, particleboards were produced and physical and mechanical properties were investigated. These physical properties included internal bond, modules of rupture and modulus of elasticity. Thickness swell and water absorption properties of particleboards bonded with lignin-based resins were also determined. The lignin-based resins have been reported previously in Part I of this study. The results showed that particleboards bonded with phenolated-lignin formaldehyde resins (up to 30% lignin content) exhibited similar physical and mechanical properties when compared to particleboards bonded with PF-com. The work has indicated that phenolated-lignin formaldehyde resins (up to 30% substitution level) can be used successfully as a wood adhesive for constructing particleboard. The performance of these panels is comparable to those of boards made using PF-com resin.     

Relationship between curing activation energy and free formaldehyde content in urea-formaldehyde resins

This study investigated the effect on the curing behavior, activation energy (E _a) of the curing reaction, crystalline structure, crosslinking, and free formaldehyde content of the addition of the following scavengers in urea-formaldehyde (UF) resins: medium density fiber board flour, rice husk flour, silica powder, and tannin powder. The scavenger content was 3 and 7?wt% of the UF resin solid content. The curing behavior of UF resins was monitored by differential scanning calorimetry, thermogravimetric analysis, and X-ray crystallography. The curing E _a was correlated to the free formaldehyde content of the scavenger containing UF resins. The thermal stability of the UF resins increased but the curing E _a decreased with increasing scavenger content. After curing, the crystallinity of the UF resins decreased in the presence of scavengers. The unreacted free formaldehyde content was reduced in the tannin powder containing UF resins. The degree of crosslinking affects the formaldehyde emission from wood panels bonded with UF resin. This is especially true for wood panels in service for long periods of time and exposed to high humidity conditions. Once the free formaldehyde which influences considerably the emission has disappeared, the presence of the –CH₂– groups then becomes important. Hence, an increased resin crosslinking indicates a higher concentration of –CH₂– groups present, which may hydrolyze and emit formaldehyde slowly over time.     

Renewable polyol‐based polycarbamates and polycarbamate–formaldehyde thermosetting resins

Several polycarbamates and polycarbamate–formaldehyde (CF) resins were synthesized, and their properties were investigated aiming at developing of useful thermosetting polymer materials from simple polyols including those derived from renewable resources. Polycarbamates synthesized from polyols using two‐step laboratory routes showed good storage stabilities making them suitable as large volume industrial chemicals. Furthermore, syntheses and ¹³C‐NMR studies of CF resins showed the formation of oligomeric resins having hydroxymethyl and methylene groups with thermosetting curing properties that are similar to those of current urea–formaldehyde (UF) resins. Dynamic mechanical analysis studies showed somewhat slower curing rates for CF resins compared to UF resins. Bonding of particleboard and internal bond and free formaldehyde content measurements indicated high‐bond strength values and very low‐formaldehyde emission potentials for CF resins. The higher functionalities of CF resins appear to be the basis of good performances. Further investigations on scalable synthesis methods for polycarbamates and on the expansion of CF resins' bonding capabilities would need to be investigated in the future. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea–formaldehyde resin and properties of particleboard

As a part of abating the formaldehyde emission (FE) of urea–formaldehyde (UF) resin, this study was conducted to investigate the effects of formaldehyde to urea (F/U) mole ratio on thermal curing behavior of UF resins and properties of PB bonded with them. UF resins synthesized at different F/U mole ratios (i.e., 1.6, 1.4, 1.2, and 1.0) were used for the manufacture of PB. Thermal curing behavior of these UF resins was characterized using differential scanning calorimetry (DSC). As the F/U mole ratio decreases, the gel time, onset and peak temperatures, and heat of reaction (ΔH) increased, while the activation energy (E_a) and rate constant (k) were decreased. The amount of free formaldehyde of UF resin and FE of PB prepared decreased in parallel with decreasing the F/U mole ratio. The internal bond strength, thickness swelling, and water absorption of PB was slightly deteriorated with decreasing the F/U mole ratio of UF resins used. These results indicated that as the F/U mole ratio decreased, the FE of PB was greatly reduced at the expense of the reactivity of UF resin and slight deterioration of performance of PB prepared. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 1787–1792, 2006     

Improving the properties of ionic liquid-treated lignin-urea-formaldehyde resins by a small addition of isocyanate for wood adhesive

The aim of this research was to investigate the effect of polymeric 4, 4 diphenyl methane diisocyanate (pMDI) on the physical and mechanical properties of plywood panels bonded with an ionic liquid (IL)-treated lignin-urea-formaldehyde resin. Soda lignin modified by 1-ethyl-3-methylimidazolium acetate ([Emim][OAc]) IL was added to a urea formaldehyde (UF) resin during resin synthesis to prepare a lignin-urea-formaldehyde (LUF) resin. pMDI at various contents (2, 4, and 6% on resin solids) was then added to prepare a LUF resin. The thermal and physicochemical properties of the resins prepared as well as the water absorption, shear strength, and formaldehyde emission of the plywood panels bonded with them were measured according to standard methods. DSC analysis indicated that the addition of pMDI decreases the gel onset and curing temperatures of the LUF resin. According to the results obtained, the addition of pMDI significantly increased the viscosity and solid content and accelerated the gelation time of LUF resins. Based on the findings of this research, the addition of pMDI dramatically improves the performance of LUF resins as a new adhesive for wood-based panels. The LUF resins with isocyanate added yielded panels presenting lower formaldehyde emission and lower water absorption content when compared to those bonded with the control LUF resins. Greater dry and wet shear strength can be obtained by a small addition of pMDI to LUF resins.     

Medium‐density particleboards from rice husks and soybean protein concentrate

Rice husks are a valuable agricultural residue produced worldwide with potential applications as a wood substitute in particleboard manufacturing. In this work, the feasibility of producing medium‐density particleboards based on waste rice husks bonded with environmentally friendly adhesives from soybean protein concentrate was analyzed. The mechanical properties, internal bond strength, and water resistance of the obtained panels bonded with the homemade soybean protein concentrate adhesives were compared to those of boards glued with commercial adhesives such as phenol–formaldehyde and urea–formaldehyde resins. An alkaline treatment improved the gluing ability of the soybean protein concentrate. The mechanical properties of the alkali‐treated soybean protein concentrate were comparable to those determined for panels with urea–formaldehyde. The lower water resistance of the alkali‐treated soybean protein concentrate particleboards, compared with that of the formaldehyde‐based resins, was counterbalanced by the advantage of being more environmentally sound, which makes them suitable for applications for which the requirements for water resistance are not stringent. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

A comparison between lignin modified by ionic liquids and glyoxalated lignin as modifiers of urea-formaldehyde resin

The aim of this research was to compare the influence of modified lignin by ionic liquid (IL) on the physical and mechanical properties of wood-based panels bonded with urea-formaldehyde (UF) resin with the effect of glyoxalated lignin (GL) on UF properties. For this purpose, soda bagasse lignin was respectively modified by 1-ethyl-3-methylimidazolium acetate ([Emim][OAc]) IL and glyoxal and then the various content of modified lignins (10, 15, and 20%) were added at pH=7 during the UF resin synthesis instead of the second urea . The changes in the structure and thermal properties of lignin, after and before modification with glyoxal and IL, were analyzed by Fourier transform infrared spectrometry (FTIR) and differential scanning calorimetry (DSC). The physicochemical properties of the prepared resins as well as the water absorption, shear strength, and formaldehyde emission of the plywood panels made with these adhesives were measured according to standard methods. According to the FTIR spectra, the content of C=O bond increased in GL while in the IL-treated lignin the content of C–N bond markedly increased. DSC analysis indicated that lignin modified by IL had lower glass transition temperature (T_g) value compared to those modified with glyoxal and unmodified lignin, respectively. The UF resins containing IL-treated lignin exhibit a faster gel time compared to those prepared with GL. Equally, the plywood panels prepared with an IL had lower formaldehyde emission and higher mechanical strength compared to those made from UF resin containing GL. There were no significant differences in dimensional stability of the panels bonded with UFs modified with GL and those with IL-modified lignin.     

Evaluation of melamine‐modified urea‐formaldehyde resins as particleboard binders

Particleboards bonded with 6 and 12% melamine‐modified urea‐formaldehyde (UMF) resins were manufactured using two different press temperatures and press times and the mechanical properties, water resistance, and formaldehyde emission (FE) values of boards were measured in comparison to a typical urea‐formaldehyde (UF) resin as control. The formaldehyde/(urea + melamine) (F/(U + M)) mole ratio of UMF resins and F/U mole ratio of UF resins were 1.05, 1.15, and 1.25 that encompass the current industrial values near 1.15. UMF resins exhibited better physical properties, higher water resistance, and lower FE values of boards than UF resin control for all F/(U + M) mole ratios tested. Therefore, addition of melamine at these levels can provide lower FE and maintain the physical properties of boards. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Reduction of formaldehyde emission from plywood

The aim of this work is to evaluate performances of tannin-based resins designed as adhesive in the plywood production. For this purpose, a part of phenol formaldehyde (PF) and melamine formaldehyde (MF) in the classic adhesive formulation was replaced by tannin. The physical properties of the formulated resins (rheological characterization, etc.) were measured. In order to analyze the mechanical performance of tannin-based resins, plywood panels were produced and the mechanical properties including tensile strength wood failure and three-point bending strength were investigated. The performance of these panels is comparable to those of plywood panels made by commercial PF and MF. The results showed that the plywood panels bonded with tannin–PF (PFT) and tannin–MF (MFT) resins exhibited better mechanical properties in comparison to the plywood panels made of commercials PF and MF. The introduction of small properties of tannin in PF and MF resins contribute to the improvement of the water performance of these adhesives. The formaldehyde emission levels obtained from panels bonded with tannin-based resins were lower than those obtained from panels bonded with control PF and MF. Although there are no actual reaction at all between PF, MF, and tannin, addition of tannin significantly improves the water resistance of PF and MF resins. This is a novel finding that manifests the possibility of replacing a convention PF and MF resins by tannin. Modified adhesive is one of the goals in the plywood production without changing any of their production conditions with improvement to their overall properties.     

Hydrolytic stability of cured urea‐formaldehyde resins modified by additives

Urea‐formaldehyde (UF) resins are prone to hydrolysis that results in low‐moisture resistance and subsequent formaldehyde emission from UF resin‐bonded wood panels. This study was conducted to investigate hydrolytic stability of modified UF resins as a way of lowering the formaldehyde emission of cured UF resin. Neat UF resins with three different formaldehyde/urea (F/U) mole ratios (1.4, 1.2, and 1.0) were modified, after resin synthesis, by adding four additives such as sodium hydrosulfite, sodium bisulfite, acrylamide, and polymeric 4,4′‐diphenylmethane diisocyanate (pMDI). All additives were added to UF resins with three different F/U mole ratios before curing the resin. The hydrolytic stability of UF resins was determined by measuring the mass loss and liberated formaldehyde concentration of cured and modified UF resins after acid hydrolysis. Modified UF resins of lower F/U mole ratios of 1.0 and 1.2 showed better hydrolytic stability than the one of higher F/U mole ratio of 1.4, except the modified UF resins with pMDI. The hydrolytic stability of modified UF resins by sulfur compounds (sodium bisulfate and sodium hydrosulfite) decreased with an increase in their level. However, both acrylamide and pMDI were much more effective than two sulfur compounds in terms of hydrolytic stability of modified UF resins. These results indicated that modified UF resin of the F/U mole ratio of 1.2 by adding acrylamide was the most effective in improving the hydrolytic stability of UF resin. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Decreasing the formaldehyde emission in urea‐formaldehyde using modified starch by strongly acid process

The incorporation of the modified starch (MS) in urea‐formaldehyde resins at different stage of the synthesis was studied in this article. The synthesized resins were characterized by Fourier transform infrared spectroscopy, indicating that the ester bond can be introduced into the UF structure after the addition of MS. The curing reactions were examined with differential scanning calorimetry and it reveals that curing temperature of UF resin are slightly shifted to higher temperatures. To study the bonding strength and formaldehyde emission of the bonded plywood, the addition method and amount of MS are systematically investigated. The performance of the UF resins is remarkably improved by the addition of MS around 15% (weight percentage of the total resin) in the second stage. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40202.     

Differential scanning calorimetry of urea–formaldehyde adhesive resins,synthesized under different pH conditions

The purpose of this study was to investigate the effects of reaction pH conditions on thermal behavior of urea–formaldehyde (UF) resins, for the possible reduction of formaldehyde emission of particleboard bonded with them. Thermal curing properties of UF resins, synthesized at three different reaction pH conditions, such as alkaline (pH 7.5), weak acid (pH 4.5), and strong acid (pH 1.0), were characterized with multiheating rate method of differential scanning calorimetry. As heating rate increased, the onset and peak temperatures increased for all three UF resins. By contrast, the heat of reaction (ΔH) was not much changed with increasing heating rates. The activation energy (E_a) increased as the reaction pH decreased from alkaline to strong acid condition. The formaldehyde emission of particleboard was the lowest for the UF resins prepared under strong acid, whereas it showed the poorest bond strength. These results indicated that thermal curing behavior was related to chemical species, affecting the formaldehyde emission, while the poor bond strength was believed to be related to the molecular mobility of the resin used. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 422–427, 2006     

The effect of soda bagasse lignin modified by ionic liquids on properties of the urea–formaldehyde resin as a wood adhesive

The aim of this research was to investigate the influence of lignin modified by ionic liquids on physical and mechanical properties of plywood panels bonded with the urea–formaldehyde (UF) resin. For this purpose, soda bagasse lignin was modified by the 1-ethyl-3-methylimidazolium acetate ([Emim][OAc]) ionic liquid and then the various contents of unmodified and modified lignins (10, 15, and 20%) were added at pH=7 instead of second urea during the UF resin synthesis. The physicochemical properties of the prepared resins as well as the water absorption, shear strength, and formaldehyde emission of the plywood panels made with these adhesives were measured according to standard methods. According to Fourier Transform Infrared (FTIR) Spectrometry, by treatment of lignin, the C=O, C–C, and C–H bonds decrease while the content of the C–N bond dramatically increases. Based on the finding of this research, the performance of soda bagasse lignin in UF resins dramatically improves by modification by ILs; as the resins with modified lignin yielded lower formaldehyde emission and water absorption when compared to those made from unmodified lignin and commercial UF adhesives, respectively. The shear strength as well as wood failure percentages are lower for the panels produced with modified lignin than for the panels produced with UF resins alone.     

低甲醛释放量人造板用改性脲醛树脂制备及应用研究

为了降低脲醛树脂的游离甲醛含量及其胶接制品的甲醛释放量,本研究在脲醛树脂合成过程中加入改性剂代替部分甲醛,通过尿素-甲醛-改性剂发生共缩聚反应,合成了改性脲醛树脂。研究了改性剂取代甲醛的摩尔比对改性脲醛树脂固化速度、游离甲醛含量的影响,以及在不同的热压条件下,对胶接胶合板的胶合强度和甲醛释放量的影响。研究结果表明,改性剂的加入不仅能有效降低改性脲醛树脂的游离甲醛含量及其胶合板的甲醛释放量,还能提高胶合板的胶合强度和耐水性。     

脲醛树脂化学构造与胶接性能、甲醛释放量及固化特性关系的研究

采用3种典型的脲醛(UF)树脂合成方法合成UF树脂,并对合成UF树脂的性能、化学构造、胶接性能、甲醛释放量及其固化历程进行了研究。揭示了UF树脂化学构造与合成方法、胶接性能、固化特性及甲醛释放量之间的相关关系,证明UF树脂的胶接性能、固化历程、甲醛释放量与UF树脂的化学构造直接相关,尤其是树脂中羟甲基含量与结合方式、亚甲基的构造对树脂性能影响最大。     

Influence of the synthesis conditions on the curing behavior of phenol–urea–formaldehyde resol resins

The curing behavior of synthesized phenol–urea–formaldehyde (PUF) resol resins with various formaldehyde/urea/phenol ratios was studied with differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). The results indicated that the synthesis parameters, including the urea content, formaldehyde/phenol ratio, and pH value, had a combined effect on the curing behavior. The pH value played an important role in affecting the shape of the DSC curing curves, the activation energy, and the reaction rate constant. Depending on the pH value, one or two peaks could appear in the DSC curve. The activation energy was lower when pH was below 11. The reaction rate constant increased with an increase in the pH value at both low and high temperatures. The urea content and formaldehyde/phenol ratio had no significant influence on the activation energy and rate constant. DMA showed that both the gel point and tan δ peak temperature (T_tanδ) had the lowest values in the mid‐pH range for the PUF resins. A different trend was observed for the phenol–formaldehyde resin without the urea component. Instead, the gel point and T_tanδ decreased monotonically with an increase in the pH value. For the PUF resins, a high urea content or a low formaldehyde/phenol ratio resulted in a high gel point. The effect of the urea content on T_tanδ was bigger than that on the gel point because of the reversible reaction associated with the urea component. Too much formaldehyde could lead to more reversible reactions and a higher T_tanδ value. The effects of the synthesis conditions on the rigidity of the cured network were complex for the PUF resins. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 95: 1368–1375, 2005     

Curing of low level melamine‐modified urea‐formaldehyde particleboard binder resins studied with dynamic mechanical analysis (DMA)

Effects of resin formulation, catalyst, and curing temperature were studied for particleboard binder‐type urea‐formaldehyde (UF) and 6 ～ 12% melamine‐modified urea‐melamine‐formaldehyde (UMF) resins using the dynamic mechanical analysis method at 125 ～ 160°C. In general, the UF and UMF resins gelled and, after a relatively long low modulus period, rapidly vitrified. The gel times shortened as the catalyst level and resin mix time increased. The cure slope of the vitrification stage decreased as the catalyst mix time increased, perhaps because of the deleterious effects of polymer advancements incurred before curing. For UMF resins, the higher extent of polymerization effected for UF base resin in resin synthesis increased the cure slope of vitrification. The cure times taken to reach the vitrification were longer for UMF resins than UF resins and increased with increased melamine levels. The thermal stability and rigidity of cured UMF resins were higher than those of UF resins and also higher for resins with higher melamine levels, to indicate the possibility of bonding particleboard with improved bond strength and lower formaldehyde emission. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 377–389, 2005