电镀镍磷合金老化镀液资源化利用的研究

电镀老化液中含有重金属,属于危险废液。文章提出了一种处理电镀镍磷合金老化镀液的新方法,该方法可将电镀老化液转化为可用的化学镀液。研究了转化镀液的镍离子浓度对沉积速度及稳定性的影响,确定了转化镀液的优化配比,测试了镀层的结合力及镀层断面不同测点的显微硬度,观察了镀层表面及断面的微观形貌。结果表明,镀层具有合格的结合强度和中等的硬度,致密平滑,磷含量稳定。     

Reclaim nickel and remove organics from the spent electroless nickel-plating bath by electrolysis

Electroless plating is a growing segment of metalfinishing, especially in the electronics industry. Inelectroless plating, metals are deposited onto the sur-face of a part without the use of electricity as a sourceof electrons. Instead, the bath solution supplies the e-lectrons for the deposition reaction. These baths are ex-tremely complex using a variety of chelating and/orcomplexing agents that hold the metals in the solution.Common chelating agents include ethylenediaminetet-raacetic acid …     

硫酸镉在化学镀镍磷工艺中的应用研究

合理选择化学Ni-P合金配方和工艺条件，采用对比试验比较了几种稳定剂对化学镀Ni-P合金性能的影响，综合各类稳定剂对镀液及镀层性能的影响，选取影响工艺性能的3个工艺参数，采取正交试验方案，研究了硫酸镉与其它稳定剂复配时的性能变化规律，得出了较理想的稳定剂用量范围。     

镁合金无铬前处理工艺及化学镀镍

以马日夫盐为主盐,乙醇为溶剂,在AZ91D镁合金上获得一层不完全的转化膜,避免了铬酸刻蚀和HF酸活化.然后以硫酸镍作为化学镀镍磷合金镀液的主盐,选择合适的络合剂,实现了在AZ91D镁合金的表面直接化学镀Ni-P合金,得到的镀层均匀致密,无明显缺陷.对镁合金化学镀镍基合金的无铬前处理工艺参数进行了探讨,并对前处理膜层和后...     

Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath

Eleetroless Ni-Cu-P deposits were deposited on the Si substrate in a basic hypophosphite-type plating bath.The effects ofpH value and the metal source composition, Ni and Cu, in the plating bath on the kinetics of the Ni-Cu-P deposition were studied.The electroless Ni-Cu-P deposits were characterized by a scanning electron microscope, a transmission electron microscope, an en-ergy dispersive X-ray spectroscope, and an X-ray diffractometer.The results showed that the pH value of the plating bath had no ob- vious effect on the morphology and composition of electroless Ni-Cu-P deposits.However, the composition of the metal source, Ni and Cu, in the plating bath had great effect on the kinetics of electroless Ni-Cu-P deposition.     

酸性光亮电镀锡铈合金工艺的研究

采用赫尔槽试验研究了镀液中各种成分的作用及工艺条件,用扫描电镜(SEM)观察了镀层形貌。研究发现,在酸性光亮镀锡镀液中添加铈盐和自制的光亮剂,可获得一种铈含量达0.5%的锡铈合金镀层,该镀层外观光亮、平整。通过镀层性能测试,并与纯锡镀层性能进行比较,发现:当镀层厚度大于5μm时,锡铈合金镀层表面致密均匀,结晶细致光亮;其抗氧化性、耐蚀性、防变色性能及可焊性明显优于纯锡镀层,解决了纯锡镀层在焊锡时易发生变色,提高了焊接温度。     

Effect of attapulgite added in plating bath on the properties of Ni/TiC nano-composite coatings

Pure copper plates were coated by Ni-TiC dipulse current plating method. The effects of adding different concentration(ranging from 0.5 g/L to 3.0 g/L) of attapulgite nano particles to the plating bath on the surface morphology, wear resistance, and oxidation resistance of Ni/TiC/Attapulgite nano-composite coatings were investigated. The experimental results show that the composite coating is flat and compact with adding 3.0 g/L in the bath, and the coating preferred orientation is changed from the planes (111) to (200). The coefficient of the composite coatings decreases from 0.68 to 0.18 with increasing content of attapulgite in the bath, a mixed mode of adhesive-abrasive wear occurs for all coatings, and the wear mechanism shows a transition from adhesive-abrasive to predominantly abrasive wear mechanism when the concentration of attapulgite is beyond 1.5 g/L in electrolyte. The oxidation resistance of composite coatings is the best prepared when adding attapulgite particles at 0.5 g/L in the bath, the oxide mainly consists of a NiO phase by X-ray analysis.     

The linear regression method for improving magnetic parameter of the electroless CoFeB films

The kinetics equation of deposition rate was implemented to help explain some of the mechanisms responsible for structures observed during the deposition of CoFeB films on poly-ester plastic. The plating rate of electroless CoFeB films is a function of concentration of sodium tetrahydroborate, pH of the plating bath, plating temperature and the metallic ratio. The estimated regression coefficient, confidence interval, residual error and confidence interval were confirmed by computer program. The optimal composition of the plating bath was obtained and the dynamic electromagnetic parameters of films were measured in the 2-10 GHz range. At 2 GHz, the permeability, magnetic loss of the electroless CoFeB films were 304,76.6 respectively as the concentration of reducer is 1 g·L^-1.     

Electroless copper plating process of N, N, N, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high plating rate

Electroless copper plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl)ethylenediamine(THPED) chelating agent was researched comprehensively. The results indicate that plating rate decreases with the 3H2O has a bad effect on deposits quality, but 2, 2′-dipyridyl and PEG make deposits quality improve greatly. Low concentration of 2-mercaptobenzothiozole (2-MBT) increases plating rate and improves deposits quality, but decreases plating rate and worsens deposits quality when 2-MBT reaches 5 mg/L. The optimal conditions of this electroless MBT are 16.8 g/L, 16.0 mL/L, 13.3 g/L, 0.5 g/L, 5.0 mg/L and 2.0 mg/L, respectively, pH value is 12.75,bath temperature is 30 ℃. Plating rate reaches 9.54 μm/h plating for 30 min in the bath. The SEM images demonstrate that the surface of copper film is smooth and the crystal is fine.     

电镀镍磷合金研究现状及前景

对电镀镍磷合金的镀液成份及镀覆条件、电沉积机理和非晶态形成条件、镀层的物相结构及测定方法、镀层性能和耐蚀机理等方面的研究现状进行了综述,并概要介绍了其应用前景。     

无电解镀老化液的再生方法

为了再生以次亚磷酸盐为还原剂的无电解镀老化液,把硫酸钙加入含有EP络合剂的已失效的镀液中,以亚磷酸钙从溶液中析出沉淀。作者研究了影响老化液再生的一些因素,在最佳条件下,溶液中亚磷酸根离子的除去率高于93.5%,根据本法,还设计出用于无电解镀工业老化液再生的工艺流程。     

Removal of nickel from spent electroless nickel-plating bath with nickel foam cathode

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激光电镀的实验研究及机理探讨

本文报告了激光电镀的实验研究结果及其理论解释。将激光束聚焦后照射在位于电解液内的电极上时,观察到了激光感应的电镀增强效应,其电镀速率比常规电镀速率高1000倍。     

电渗析法除氯离子制高纯碳酸钙的研究

本文研究了用电渗析法除碳酸钙中的氯离子，测定了电渗析时间，电位梯度、投料量、换电极室溶液等因素对氯离子脱除率的影响。实验结果表明：氯离子脱除率随电渗析的时间延长，电位梯度的增加而增大，随中室碳酸钙投料量的增加而减小。电极室加入强电解质化合物，或定时更换阳极液均可有效提高氟离子脱除率。     

提高煤矿机件抗蚀耐磨性的盐浴复合处理工艺的研究

本文通过磨损实验、腐蚀实验以及小能量冲击剥落试验，证实了经盐浴复合处理的工件抗蚀耐磨性及抗冲击剥落能力均高于镀硬铬及镀锌磷化涂二硫化铂。同时，盐浴复合处理的总费用较低，在煤矿机件上具有广泛的应用前景。     

Ni-P-Al_2O_3化学镀工艺研究

通过正交实验对施镀工艺参数进行了优化 ,并确定了镀层的合理化热处理温度 ,研究了镀液成分及工艺参数对镀层厚度、镀层耐磨性及镀层中Al2 O3颗粒分布的影响 .实验结果表明 ,Ni -P -Al2 O3复合化学镀层硬度可达HV0 .1 14 0 0左右 ,耐磨性比化学镀Ni -P大大提高 .     

Electroless copper plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high plating rate

Electroless copper plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl) ethylenediamine (THPED) chelating agent was researched comprehensively. The results indicate that plating rate decreases with the increase of concentration for THPED, CuSO₄ · 5H₂O and HCHO, pH value and bath temperature. The additive of K₄[Fe(CN)₆] · 3H₂O, 2, 2′-dipyridyl and polyethylene glycol(PEG) decrease plating rate and K₄[Fe(CN)₆] · 3H₂O has a bad effect on deposits quality, but 2, 2′-dipyridyl and PEG make deposits quality improve greatly. Low concentration of 2-mercaptobenzothiozole (2-MBT) increases plating rate and improves deposits quality, but decreases plating rate and worsens deposits quality when 2-MBT reaches 5 mg/L. The optimal conditions of this electroless copper plating process are that the concentration of THPED, HCHO, CuSO₄ · 5H₂O, PEG, 2, 2′-dipyridyl and 2-MBT are 16.8 g/L, 16.0 mL/L, 13.3 g/L, 0.5 g/L, 5.0 mg/L and 2.0 mg/L, respectively, pH value is 12.75, bath temperature is 30 °C. Plating rate reaches 9.54 μm/h plating for 30 min in the bath. The SEM images demonstrate that the surface of copper film is smooth and the crystal is fine. Foundation item: Project supported by Hubei Daye Nonferrous Metal Corporation of China     

Study on concentration of β-Naphthalenesulfonic acid by electrodialysis

Anion-exchange membranes 3362W and AM-203 were evaluated for facilitating the concentration of β-Naphthalenesulfonie acid by electrodialysis. The effect of concentration, temperature, electric current and time on the electrodialysis process were studied. Experimental results indicated that electrodialysis was an effective method for concentratingβ-Naphthalenesulfonic acid at 25℃. Higher efficiencies were not obtained at high temperature. The overall current efficiency was 80%～95%.     

基于纳滤-反向电渗析法脱硝废液发电试验研究

反向电渗析发电是一种零排放的、可持续的新型技术。在探究以电厂脱硝废液进行盐差能发电的基础上,采用纳滤-反向电渗析法耦合技术,研究了耦合发电系统在不同试验条件和不同运行参数下发电输出情况。分别研究了离子交换膜种类、膜堆电极材料、浓淡室进料浓度差、温度差对膜堆输出功率密度的影响。结果表明,以脱硝废液为膜堆进料溶液,膜堆使用阴离子交换膜,使用钌铱-钛网电极,以[Fe （CN）₆]^4-/[Fe （CN）₆]^3-为氧化还原对的电极溶液,提高淡室进料溶液温度等,均能够提高膜堆输出电化学性能。     

The effect and mechanism of Nano-Cu lubricating additives on the electroless deposited Ni-W-P coating

The coating and deposition process with excellent anti wear and suitable for industrial application were developed, and the optimum bath composition and process were obtained by studying the influence of the bath composition, temperature and pH value on the deposition rate and the plating solution stability. Moreover, the tribological properties of nano-Cu lubricating additives and electroless deposited Ni-W-P coating as well as their synergistic effect are researched using ring-block abrasion testing machine and energy dispersive spectrometer. Research results show that Ni-W-P alloy coating and nano-Cu lubricating additive have excellent synergistic effect, e g, the wear resistance of Ni-W-P alloy coating (with heat treatment and the oil with nano-Cu additives) has increased hundreds times than 45 steel as the metal substrate with the basic oil, and zero wear is achieved, which breaks through the bottleneck of previous separate research of the above-mentioned two aspects.