Microstructure and electrical properties of Pb(Zr0.52Ti0.48)O3 ferroelectric films on different bottom electrodes

The crystalline quality, dielectric and ferroelectricity of the Pb(Zr_0.52Ti_0.48)O₃ (PZT) films deposited on the LaNiO₃ (LNO), LNO/Pt and Pt bottom electrodes were comparatively analyzed to investigate the possibility for their application. LNO thin films were successfully prepared on Si (100) and Pt(111)/Ti/SiO₂/Si substrates by modified metallorganic decomposition (MOD). The PZT thin films were spin-coated onto the LNO, LNO/Pt and Pt bottom electrodes by sol–gel method. The crystallographic orientation and the microstructure of the resulting LNO films and PZT thin films on the different bottom electrodes were characterized by X-ray diffraction analysis. The dielectric and ferroelectric properties of PZT films on the different bottom electrodes are discussed. The PZT films deposited onto Pt/Ti/SiO₂/Si and LNO/Si substrates show strong (110) and (100) preferred orientation, respectively, while the films deposited onto LNO/Pt/Ti/SiO₂/Si substrates show the peaks of mixed orientations. PZT films on LNO and LNO/Pt bottom electrodes have larger dielectric constant and remnant polarizations compared with those grown on the Pt electrode.     

Direct current electric field adjustable phase transformation behavior in (Pb,La)(Zr,Ti)O3 antiferroelectric thick films

(Pb,La)(Zr,Ti)O₃ antiferroelectric 1.4 μm-thick films have been prepared on Pt (111)/Ti/SiO₂/Si(100) substrates by sol–gel process. The structures and dielectric properties of the antiferroelectric thick films were investigated. The films displayed pure perovskite structure with (100)-preferred orientation. The surface of the films was smooth, compact and uniform. The antiferroelectric (AFE) characterization have been demonstrated by P (polarization)-E (electric field) and C(capacitance)-V (DC bias) curves. The AFE–ferroelectric (FE) and FE-to-paraelectric (PE) phase transition were also investigated as coupling functions of temperature and direct current electric field. With the applied field increased, the temperature of AFE-to-FE phase transition decreased and the FE-to-PE phase shifted to high temperature. The AFE-to-FE phase transition was adjustable by direct current electric field. (Pb,La) (Zr,Ti) O₃ antiferroelectric films have broad application prospects in microelectromechanical systems because of the phase transition.     

A comprehensive review on the progress of lead zirconate-based antiferroelectric materials

Lead zirconate (PbZrO₃ or PZ)-based antiferroelectric (AFE) materials, as a group of important electronic materials, have attracted increasing attention for their potential applications in high energy storage capacitors, micro-actuators, pyroelectric security sensors, cooling devices, and pulsed power generators and so on, because of their novel external electric field-induced phase switching behavior between AFE state and ferroelectric (FE) state. The performances of AFE materials are strongly dependent on the phase transformation process, which are mainly determined by the constitutions and the external field. For AFE thin/thick films, the electrical properties are also strongly dependent on their thickness, crystal orientation and the characteristics of electrode materials. Accordingly, various strategies have been employed to tailor the phase transformation behavior of AFE materials in order to improve their performances. Due to their relatively poor electrical strength (low breakdown fields), most PZ-based orthorhombic AFE ceramics are broken down before a critical switching field can be applied. As a consequence, the electric-field-induced transition between AFE and FE phase of only those AFE bulk ceramics, with compositions within tetragonal region near the AFE/FE morphotropic phase boundary (MPB), can be realized experimentally at room temperature. AFE materials with such compositions include (Pb,A)ZrO₃ (A = Ba, Sr), (Pb_1−3/2xLa_x)(Zr_1−yTi_y)O₃ (PLZT x/(1−y)/y), (Pb_0.97La_0.02)(Zr,Sn,Ti)O₃ (PLZST) and Pb_0.99(Zr,Sn,Ti)_0.98Nb_0.02O₃ (PNZST). As compared to bulk ceramics, AFE thin and thick films always display better electric-field endurance ability. Consequently, room temperature electric-field-induced AFE–FE phase transition could be observed in the AFE thin/thick films with orthorhombic structures. Moreover, AFE films are more easily integrated with silicon technologies. Therefore, AFE thin/thick films have been a subject of numerous researches. This review serves to summarize the recent progress of PZ-based AFE materials, focusing on the external field (electric field, hydrostatic pressure and temperature) dependences of the AFE–FE phase transition, with a specific attention to the performances of AFE films for various potential applications, such as high energy storage, electric field induced strains, pyroelectric effect and electrocaloric effect.     

Improved dielectric properties of chemical solution derived Pb0.5Sr0.5TiO3 thin films by a layer-by-layer annealing method

Pb_0.5Sr_0.5TiO₃ thin films were prepared on Pt/TiO₂/SiO₂/Si and LaNiO₃ (LNO)/Si substrates by using chemical solution deposition technique, and a layer-by-layer annealing method was used in an attempt to improve the dielectric properties of the thin films. The structure, dielectric, and ferroelectric properties of the thin films were investigated. Improved dielectric properties of the thin films were clearly confirmed: the dielectric constant and dielectric loss for the films on Pt/TiO₂/SiO₂/Si substrates annealed at 650 °C were 1064 and 0.027, respectively, at 1 kHz, with a dielectric tunability of more than 50%; similarly, the films prepared on LNO/Si substrates, showed a high dielectric constant of 1280 and a low dielectric loss of 0.023, at 1 kHz. P-E hysteresis loop measurements indicated that the remanent polarization and coercive field for the films on Pt/TiO₂/SiO₂/Si substrates annealed at 650 °C were 15.7 μC/cm² and 51 kV/cm, respectively.     

Characterization of Sn-doped BST thin films on LaNiO<Subscript>3</Subscript>–coated Si substrate

Sn-doped (Ba,Sr)TiO₃(BSTS) thin films have been deposited on highly (200) oriented LaNiO₃(LNO) thin films by sol-gel method. The atomic force microscope (AFM) images exhibited that the dopant Sn did not decrease the crystalline grain size of BST thin films. The structure of the BST film, determined by X-ray diffraction (XRD), presented the higher intensity (110) and (200) peaks, while the latter was distinctly induced by LNO layer. Evidently, Sn-doped BST thin films on LNO/Si substrate were found to decrease the dielectric constant and the dielectric loss, which is favourable to potentially improve the figures of merits (F _D ) of pyroelectric materials. The BSTS thin films on LNO layer also displayed an excellent leakage current property comparing with the BST thin film on Pt/Ti/SiO₂/Si and LNO/Si substrates.     

电极对PZT铁电薄膜的微观结构和电性能的影响

采用溶胶—凝胶(sol—gel)工艺分别在Pt／Ti／SiO2／Si和LNO／Si电极上制备Pb(Zr0．53，Ti0．47)O3(PZT)铁电薄膜。研究了不同电极材料对PZT铁电薄膜的微结构及电性能的影响。(100)择优取向的PZT／LNO薄膜的介电性能和铁电性能较(111)／(100)取向的PZT／Pt薄膜略有下降，但在抗疲劳特性和漏电流特性方面都有了很大提高。PZT／LNO薄膜10m次极化反转后剩余极化几乎保持未变，直至10^12次反转后，剩余极化仅下降了17％。     

Studies of BaTiO3 thin films on different bottom electrode

BaTiO₃ (BT) thin films were prepared on Pt/Ti/SiO₂/Si and Ru/Ti/SiO₂/Si substrates by a modified sol-gel technique. The microstructure of the films was characterized by atomic force microscopy (AFM), X-ray diffraction (XRD) and Raman spectroscopy. The results showed that BT thin films crystallized with perovskite structure. Compared to BT film on Pt/Ti/SiO₂/Si substrate, BT thin film deposited on Ru electrode has similar dielectric constant, while it has higher dielectric loss. C–E curve for BT film on Pt/Ti/SiO₂/Si was more symmetrical around zero-bias field than C–E curve for BT film on Ru/Ti/SiO₂/Si substrate. The tunability was 52.02% for BT film on Pt electrode, which was 33.42% on Ru electrode, at 275 kV/cm and room temperature. The leakage current density of BT on Pt electrode was about an order of magnitude lower than BT film on Ru electrode at the applied electrical field below 150 kV/cm. The leakage conduction mechanism was investigated.     

Dielectric properties of (Ba,Ca)(Zr,Ti)O3/CaRuO3 heterostructure thin films prepared by pulsed laser deposition

(Ba_0.90Ca_0.10)(Zr_0.25Ti_0.75)O₃ (BCZT) thin films were grown on Pt/Ti/SiO₂/Si substrates without and with a CaRuO₃ (CRO) buffer layer using pulsed laser deposition (PLD). The structure and surface morphology of the films have been characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). At room temperature and 1 MHz, the dependence of dielectric constant and tunability of the films with electric field were investigated; the dielectric constant and tunability are 725 and 47.0%, 877 and 50.4%, respectively, for the BCZT film on Pt/Ti/SiO₂/Si substrates without and with the CRO buffer layer at 400 kV/cm. The tunability of the BCZT/CRO heterostructure thin films on Pt/Ti/SiO₂/Si substrates was higher than that of the BCZT thin films on Pt/Ti/SiO₂/Si substrates. The high constant likely results from the oxide electrode (CRO).     

Structure of post-annealed ferroelectric PbZrxTi1-xO3 and SrBi2Ta2O9 thin films

In order to fabricate good quality ferroelectric thin films, PbZr_xTi_(1-x)O₃ (PZT) and SrBi₂Ta₂O₉ (SBT) films were fabricated on SiO₂/Si(100) substrates and on Pt/Ti/ SiO₂/Si(100) substrates by pulsed laser excimer deposition (PLD). X-ray diffraction, Rutherford backscattering analysis, and atomic force microscopy were used to characterize the structural properties of the samples, which were post-annealed at different temperatures. The results showed that the PZT and SBT films fabricated on Pt/Ti/SiO₂/Si(100) substrates and annealed at 700 °C exhibited optimum properties.     

Fabrication of antiferroelectric PLZT films on metal foils

Fabrication of high-dielectric-strength antiferroelectric (AFE) films on metallic foils is technically important for advanced power electronics. To that end, we have deposited crack-free Pb_0.92La_0.08Zr_0.95Ti_0.05O₃ (PLZT 8/95/5) films on nickel foils by chemical solution deposition. To eliminate the parasitic effect caused by the formation of a low-permittivity interfacial oxide, a conductive buffer layer of lanthanum nickel oxide (LNO) was coated by chemical solution deposition on the nickel foil before the deposition of PLZT. Use of the LNO buffer allowed high-quality film-on-foil capacitors to be processed in air. With the PLZT 8/95/5 deposited on LNO-buffered Ni foils, we observed field- and thermal-induced phase transformations of AFE to ferroelectric (FE). The AFE-to-FE phase transition field, E_AF = 225 kV/cm, and the reverse phase transition field, E_FA = 190 kV/cm, were measured at room temperature on a ≈1.15 μm-thick PLZT 8/95/5 film grown on LNO-buffered Ni foils. The relative permittivities of the AFE and FE states were ≈600 and ≈730, respectively, with dielectric loss ≈0.04 at room temperature. The Curie temperature was ≈210 °C. The thermal-induced transition of AFE-to-FE phase occurred at ≈175 °C. Breakdown field strength of 1.2 MV/cm was measured at room temperature.     

Effect of heat-treatment on LaNiO3 film electrode of PZT thin films derived by a sol–gel method

Lanthanum nickel oxide (LaNiO₃ or LNO) conducting thin films that could be used as electrodes for improving fatigue and aging properties of ferroelectric thin films were investigated. In this paper, LNO films were directly spin-coated onto SiO₂/Si(1 0 0) substrates followed by thermal treatment in air and in oxygen. It was found that crack-free dense and uniform films with good crystallinity and medium grains were obtained, preferentially (1 0 0)-oriented LNO thin films could be formed at a lower annealing temperature of 550 °C and that with the increase in thermal annealing temperature the LNO thin film possessed better electrical properties especially at 750 °C. However, the LNO film displayed a structure transformation above 850 °C. A phenomenon was found that the first heat-treatment temperature and time played a key role to determine the crystallite size of LNO films. A subsequent deposition of a sol–gel derived Pb(Zr_0.53Ti_0.47)O₃ (PZT53/47) thin film on the LNO-coated SiO₂/Si(1 0 0) substrates was also found to have a (1 0 0)-oriented texture. Moreover, the Au/PZT/LNO capacitor was found to significantly improve the fatigue and the effects of the LNO electrodes to the fatigue were discussed.     

Effect of heat-treatment on LaNiO3 film electrode of PZT thin films derived by a sol–gel method

Lanthanum nickel oxide (LaNiO₃ or LNO) conducting thin films that could be used as electrodes for improving fatigue and aging properties of ferroelectric thin films were investigated. In this paper, LNO films were directly spin-coated onto SiO₂/Si(1 0 0) substrates followed by thermal treatment in air and in oxygen. It was found that crack-free dense and uniform films with good crystallinity and medium grains were obtained, preferentially (1 0 0)-oriented LNO thin films could be formed at a lower annealing temperature of 550 °C and that with the increase in thermal annealing temperature the LNO thin film possessed better electrical properties especially at 750 °C. However, the LNO film displayed a structure transformation above 850 °C. A phenomenon was found that the first heat-treatment temperature and time played a key role to determine the crystallite size of LNO films. A subsequent deposition of a sol–gel derived Pb(Zr_0.53Ti_0.47)O₃ (PZT53/47) thin film on the LNO-coated SiO₂/Si(1 0 0) substrates was also found to have a (1 0 0)-oriented texture. Moreover, the Au/PZT/LNO capacitor was found to significantly improve the fatigue and the effects of the LNO electrodes to the fatigue were discussed.     

Electrical properties of Pb0.97La0.02(Zr0.95Ti0.05)O3 antiferroelectric thin films on TiO2 buffer layer

Pb_0.97La_0.02(Zr_0.95Ti_0.05)O₃ antiferroelectric thin films with thickness of 500 nm were successfully deposited on TiO₂ buffered Pt(1 1 1)/Ti/SiO₂/Si(1 0 0) and Pt(1 1 1)/Ti/SiO₂/Si(1 0 0) substrates via sol-gel process. Microstructure of Pb_0.97La_0.02(Zr_0.95Ti_0.05)O₃ thin films was studied by X-ray diffraction analyses. The antiferroelectric nature of the Pb_0.97La_0.02(Zr_0.95Ti_0.05)O₃ thin films was confirmed by the double hysteresis behaviors of polarization and double buffer fly response of dielectric constant versus applied voltage at room temperature. The capacitance-voltage behaviors of the Pb_0.97La_0.02(Zr_0.95Ti_0.05)O₃ films with and without TiO₂ buffer layer were studied, as a function of temperature. The temperature dependence of dielectric constant displayed a similar behavior and the Curie temperature (T_c) was 193 °C for films on both substrates. The current caused by the polarization and depolarization of polar in the Pb_0.97La_0.02(Zr_0.95Ti_0.05)O₃ films was detected by current density-electric field measurement.     

Deflection of wafers and cantilevers with Pt/LNO/PZT/LNO/Pt/Ti/SiO2 multilayered structure

The present paper describes a Pt/LNO/PZT/LNO/Pt/Ti/SiO₂ multilayers deposited on 4-inch Si wafers. We have evaluated the variation of the deflection of the Si wafers with deposition of each of the thin films. The deposition of the multilayers has resulted in downward deflection (center is higher than edge) of the Si wafers. The multilayers have been also deposited onto SOI wafers and fabricated into piezoelectric micro cantilevers through MEMS bulk micromachining. The micro cantilevers have shown the upward deflection. We have characterized the ferroelectric and piezoelectric properties of the PZT thin films through electrical tests of the micro cantilevers. The dielectric constant, saturation polarization, remanent polarization and coercive field were measured to be 1050, 31.3 μC/cm², 9.1 μC/cm² and 21 kV/cm, respectively. The transverse piezoelectric constant, d₃₁, was measured to be − 110 pm/V from the DC response of the micro cantilevers.     

The effects of oxygen partial pressure on BST thin films deposited on multilayered bottom electrodes

Ba_0.5Sr_0.5TiO₃ (BST) thin films have been deposited by r.f. magnetron sputtering on silicon and platinum-coated silicon substrates with different buffer and barrier layers. BST films deposited on Si/SiO₂/SiN/Pt and Si/SiO₂/Ti/TiN/Pt multilayer bottom electrode have been used for the fabrication of capacitors. XRD and SEM studies were carried out for the films. It was found that the crystallinity of the BST thin film was dependent upon oxygen partial pressure in the sputtering gas. The role of multilayered bottom electrode on the electrical properties of Ba_0.5Sr_0.5TiO₃ films has been also investigated. The dielectric properties of BST films were measured. The results show that the films exhibit pure perovskite phase and their grain sizes are about 80–90 nm. The dielectric properties of the BST thin film on Si/SiO₂/Ti/TiN/Pt electrode was superior to that of the film grown on Si/SiO₂/SiN/Pt electrode.     

Phase formation and characteristics of r.f.-sputtered barium-strontium titanate thin films on various bottom layers

(Ba_0.7Sr_0.3)TiO₃ thin films were deposited by r.f.-magnetron sputtering on Pt/Ti/Si, Pt/TiSi₂/Si and Pt/Ti/SiO₂/Si substrates, respectively, and annealed at 650 C for 30s by Rapid Thermal Annealing (RTA). XRD (X-ray diffraction) patterns revealed that the BST films had perovskite structure without preferred orientation. Auger depth profiles of barium-strontium titanate (BST) films on various substrates were performed. In the Pt/Ti/Si and Pt/TiSi₂/Si structures, Si diffused into the BST film, but in the Pt/Ti/SiO₂/Si structure, the diffusion of Si into the BST film was prevented and the interface between the BST film and the electrode was stable. The dielectric constants were about 310–260 (100 kHz–1 MHz).     

Bottom electrodes dependence of microstructures and dielectric properties of compositionally graded (Ba1−xSrx)TiO3 thin films

Compositionally graded (Ba_1−xSr_x)TiO₃ (BST) thin films, with x decreasing from 0.3 to 0, were deposited on Pt/Ti/SiO₂/Si and Ru/SiO₂/Si substrates by radio frequency magnetron sputtering technology. The microstructure and dielectric properties of the graded BST thin films were investigated. It was found that the films on Ru electrode have better crystallization, and that RuO₂ is present between the Ru bottom electrode and the graded BST thin films by X-ray diffraction and SEM analysis. Dielectric measurement reveals that the graded BST thin films deposited on Ru bottom electrode have higher dielectric constant and tunability. The enhanced dielectric behavior is attributed to better crystallization as well as smaller space charge capacitance width and the formation of RuO₂ that is more compatible with the BST films. The graded BST films on Ru electrode show higher leakage current due to lower barrier height and rougher surface of bottom electrode.     

Ferroelectricity of ultrathin ferroelectric Langmuir-Blodgett polymer films on conductive LaNiO3 electrodes

LaNiO₃ (LNO) films with a surface roughness rms of 0.384 nm and a sheet resistance of about 200 Ω were prepared on SrTiO₃ and Si/SiO₂ substrates respectively by rf magnetron sputtering technique. The surface of LNO on Si/SiO₂ substrate is smoother than that on SrTiO₃ substrate. A nominal 2-monolayer (ML) poly(vinylidenefluoride-trifluoroethylene) film with a thickness of about 3 nm was deposited on LNO coated Si/SiO₂ substrate by Langmuir-Blodgett (LB) technology. Piezoresponse force microscopy (PFM) measurements show that the LB films demonstrate an obvious feature of polarization switching and good voltage durability. The results suggest that the ultrathin polymer films may be utilized to explore ferroelectric tunnel junctions.     

Comparative analysis for the crystalline and ferroelectric properties of Pb(Zr,Ti)O3 thin films deposited on metallic LaNiO3 and Pt electrodes

The crystalline quality and ferroelectricity of the Pb(Zr,Ti)O₃ (PZT) films deposited on the metallic LaNiO₃ (LNO) and Pt electrodes were comparatively analyzed to investigate the possibility for their application to non-volatile memory devices. LNO thin films were successfully deposited on various substrates by using r.f. magnetron sputtering even at a low temperature ranging from 250 to 500 °C, and the ferroelectric PZT thin films were spin-coated onto the LNO and Pt bottom electrodes. Metallic LNO thin films exhibited [100] orientation irrespective of the substrate species and PZT films coated onto LNO films had highly a- and c-axis orientations, while those with Pt bottom electrode were polycrystalline. PZT films with LNO bottom electrode had smaller grain size and larger dielectric constant compared to those grown on the Pt electrode. The ferroelectric thin films fabricated on LNO bottom electrode displayed an asymmetric D–E hysteresis loop, which was explained by the defect effects formed at the interface. Especially, the LNO/PZT/LNO capacitor was found to significantly improve the polarization fatigue and the effects of the LNO electrodes to the fatigue were discussed.     

Ferroelectric and piezoelectric properties of bismuth titanate thin films grown on different bottom electrodes by soft chemical solution and microwave annealing

Bismuth titanate (Bi₄Ti₃O₁₂, BIT) films were evaluated for use as lead-free piezoelectric thin films in micro-electromechanical systems. The films were grown by the polymeric precursor method on LaNiO₃/SiO₂/Si (1 0 0) (LNO), RuO₂/SiO₂/Si (1 0 0) (RuO₂) and Pt/Ti/SiO₂/Si (1 0 0) (Pt) bottom electrodes in a microwave furnace at 700 °C for 10 min. The domain structure was investigated by piezoresponse force microscopy (PFM). Although the converse piezoelectric coefficient, d₃₃, regardless of bottom electrode is around (∼40 pm/V), those over RuO₂ and LNO exhibit better ferroelectric properties, higher remanent polarization (15 and 10 μC/cm²), lower drive voltages (2.6 and 1.3 V) and are fatigue-free. The experimental results demonstrated that the combination of the polymeric precursor method assisted with a microwave furnace is a promising technique to obtain films with good qualities for applications in ferroelectric and piezoelectric devices.