铜基钎料真空钎焊金刚石

采用铜基合金钎料,适当控制钎焊工艺,实现了金刚石与钢基体的高强度连接.借助扫描电镜(SEM)、X射线能谱(EDS)、X射线衍射(XRD)分析了真空加热条件下,对铜基合金钎料与金刚石之间的界面反应,钎焊面进行了表面形貌和结构分析.探讨了钎料与金刚右界面处碳化物的形成机理.阐明了在钎焊过程中Ti元素在金刚石界面形成富Ti层并与金刚石表面的C元素反应生成TiC、SnTi C是实现合金层与金刚石有较高结合强度的主要因素.钎料与钢基体在钎焊温度下发生组元间相互扩散,形成了固溶体及其化合物,从而实现钎料与钢基体的高强度结合,并对一系列铜基钎料进行了测试.     

Ag-Cu-Ti钎料钎焊金刚石的界面微观组织分析

在真空炉中采用Ag-Cu-Ti钎料对金刚石磨粒进行了真空钎焊试验,实现了金刚石与钢基体的高强度连接.采用SEM对金刚石与钎料界面、金刚石表面碳化物形貌进行了观察分析,采用EDS分析了金刚石与钎料界面的成分变化,采用Raman对焊后的金刚石结构进行了分析.结果表明,Ag-Cu-Ti钎料中的Ti元素在界面处发生偏析,并在金刚石表面生成尺寸小于1 μm块状TiC,金刚石在焊接过程的高温中没有发生石墨化,最后在界面上形成了金刚石/TiC/钎料/钢基体的梯度结合层.     

Ni-Cr合金钎料激光钎焊金刚石磨粒界面显微结构及形成机理（英文）

采用Ni-Cr合金钎料,在Ar气保护条件下,对金刚石磨粒进行了激光钎焊研究。采用扫描电镜(SEM)和能谱仪(EDS)及X射线衍射仪(XRD)分析金刚石磨粒与Ni-Cr钎料结合界面的组织结构与物相组成,并研究了钎料与金刚石界面处碳化物的形成机理。结果表明,激光钎焊过程中,在金刚石表面形成的富Cr层与金刚石表面的C元素反应生成碳化物Cr_3C_2。通过反应热力学与动力学分析显示,界面反应产物可以依靠置换反应形成,使金刚石磨粒与钎料实现了牢固结合。     

Ni-Cr合金钎料激光钎焊金刚石磨粒界面显微结构及形成机理

本文采用Ni-Cr合金钎料,在Ar气保护条件下,对金刚石磨粒进行了激光钎焊试验研究。采用扫描电镜(SEM)和能谱仪(EDS)及X射线衍射仪(XRD)分析金刚石磨粒与Ni-Cr钎料结合界面的组织结构与物相组成,并研究了钎料与金刚石界面处碳化物的形成机理。测试结果表明,激光钎焊过程中在金刚石表面附近形成的富Cr层与金刚石表面的C元素反应生成碳化物Cr3C2,通过反应热力学与动力学分析显示界面反应产物可以依靠置换反应形成,使金刚石磨粒与钎料实现了牢固结合。     

Ag-Cu-Ti钎焊金刚石的界面结构及热应力分析

采用Ag-Cu-Ti钎料对金刚石进行真空钎焊实验,实现了金刚石与钢基体的高强度连接.采用SEM对金刚石与钎料界面、金刚石表面碳化物形貌进行观察分析,采用EDS分析金刚石表面碳化物的成分,利用XRD对焊后金刚石磨料的进行物相分析,采用Raman光谱对焊后的金刚石是否石墨化、残余应力进行分析.结果表明:Ag-Cu-Ti钎料中的Ti元素在界面处发生偏析,并在金刚石表面生成尺寸小于1μm的块状TiC.金刚石在焊接过程的高温下没有发生石墨化.金刚石中的最大拉应力位于磨粒顶部,为60 MPa,最大压应力在底部,为120 MPa.最后在界面上形成了金刚石/TiC/钎料/钢基体的梯度结合层.     

激光钎焊多层金刚石磨粒与镍铬合金的微观结合形态

在45钢基体上进行了镍铬合金钎料与金刚石磨粒的多层钎焊加工,借助光学显微镜、扫描电镜、能谱分析等研究了钎料与金刚石磨粒的结合形态、钎料层组织结构及其变化规律、金刚石表面损伤形态、金刚石与钎料结合处以及钎焊层的元素分布规律.结果表明:从与基体结合处到钎焊层表面分别形成了平面晶、胞状晶、树枝晶、柱状晶以及等轴晶的显微组织形态.输入的线能量影响钎料与金刚石的浸润结合、及钎焊层晶粒大小.逐道搭接钎焊时的热积累改变了搭接线附近的晶粒生长方向和大小,在逐层堆叠时的层与层结合线附近存在粗化晶粒区.金刚石磨粒的存在促使其周边形成等轴晶和垂直其界面生长的柱状晶和树枝晶.钎焊层内C元素含量在靠近上表面附近较高.钎焊层内部金刚石与钎料之间存在一元素过渡区域,Cr和Si元素在过渡区存在聚集现象,有利于形成Cr和Si的碳化物,促进金刚石与钎料间的冶金结合.钎焊层内的金刚石磨粒出现不同程度损伤及石墨化形态.     

Ni-Cr合金钎焊镀钛金刚石的研究

本文利用真空炉中钎焊的方法,采用Ni-Cr合金钎料,适当控制钎焊温度,保温时间和冷却速度,实现了镀钛金刚石与钢基体的高强度连接.并用深腐蚀处理钎焊后的试样,使金刚石脱离基体,用扫描电镜,X-射线能谱,对金刚石表面的碳化物进行了分析,剖析了Ni-Cr合金与镀钛金刚石的接口微区结构.结果表明:在钎焊过程中,钎料在金刚石表面形成富铬层并与金刚石表面的C元素反应生成Cr7C,和Cr3C2,其中Cr7C3呈笋状生长,Cr3C2呈片状生长,而Ti却并没有在表面形成碳化物.这主要是因为Ti元素与Ni的结合力大于Ti与C的结合力,因此,实现Ni-Cr合金与镀钛金刚石高强度冶金结合的,是活性钎料中的Cr元素.     

铜基钎料焊接金刚石的界面结构与强度

选用Cu-Sn-Ti活性钎料在钢基体上焊接金刚石磨粒,研究钎料合金与金刚石焊接界面的组织形貌与物相组成,分析不同钎焊温度对焊接界面结构及结合强度的影响.结果表明,钎料合金元素与金刚石在钎焊过程中发生化学反应,生成化合物TiC,CuTi和CuSn等,实现了铜基钎料、金刚石颗粒与钢基体之间的化学冶金结合.当钎焊温度为880～930℃时,均可获得连接良好的钎焊接头;钎焊温度900℃时,焊接界面形成的化合物层均匀连续且界面致密,此时在相同磨削条件下,钎焊金刚石试件的磨损失重很小,达到了焊接界面的强力结合.     

银基钎料钎焊金刚石的界面结构及TiC生长机制

在合适的工艺下,采用Ag-Cu-Ti钎料实现了金刚石与钢基体的高强度连接,并剖析了Ag-Cu-Ti钎料与金刚石的界面微区结构.通过对界面处的成分分布和深腐蚀后碳化物TiC形貌的观察,分析了Ti的作用机理、新生化合物TiC的形貌及生长规律.结果表明:在一定的条件下,Ti元素与组成金刚石的碳元素发生反应形成TiC层;碳化物层使钎料与金刚石之间产生冶金结合,并在其界面上形成了金刚石/TiC/钎料/钢基体的梯度结合层.     

活性钎料真空单层钎焊金刚石

应用真空钎焊技术，分别采用含有强碳化物形成元素Cr，Ti的BNi2，CuSnNiTi活性钎料进行金刚石的单层钎焊，通过微分扫描式热分析(DSC)及界面能谱分析(EDS)表明，在一定的钎焊温度、时间及真空度下，金刚石与钎料及基体之间均可形成化学冶金结合，但结合的状况及锯切性能随钎料的不同而改变。磨削试验表明CuSnNiTi钎料制成的磨轮具有较高的锋利度和工作寿命。     

Cr、Ti金属粉改善Ag-Cu-Zn合金对金刚石的钎焊性能研究

本文通过在Ag-Cu-Zn钎料合金与金刚石之间添加Cr、Ti金属粉,改善Ag-Cu-Zn合金对金刚石的钎焊性能,并在不同的保护条件下(真空、Ar气体、无机盐覆盖、C粉覆盖)钎焊金刚石磨粒;采用扫描电镜和光学显微镜对钎焊金刚石表面形貌以及金刚石一钎料合金-钢基体之间界面的微观结构进行了观察;结果表明添加Cr粉可以在空气中对金刚石实现良好的钎焊,添加Ti粉则需要在真空中或者覆盖C粉才能保证钎焊效果较好;在金刚石与钎料合金的界面处发现Cr和Ti元素的富集,这提高了Ag-Cu-Zn合金对金刚石的润湿性.     

Study on the use of CuSnTi brazing alloy for induction brazing of diamond grits surface-treated by direct current plasma chemical vapor deposition

Induction brazing of diamond grits surface-treated by direct current plasma chemical vapor deposition (DC-PCVD) on a steel substrate was carried out in an argon atmosphere. A CuSnTi brazing alloy (with an approximate melting temperature of 900 °C) was used for this purpose. The diamond edges were exposed out of the brazing alloy to retain their sharpness. Relatively fine titanium–carbon compounds were formed with uniform interspaces on the brazed diamond surface when immersed in the brazing alloy. The liquid brazing alloy filled the interspaces, leading to increased bonding strength between the brazing alloy and diamond grits. Boring tests on diamond core drills brazed with the treated diamond grits and untreated diamond grits showed that the percentages of whole grain fracture and of pullout from the matrix of the brazed treated-diamond grits became lower.     

Brazing diamond grits onto a steel substrate using copper alloys as the filler metals

Surface-set diamond tools were fabricated by an active metal brazing process, using bronze (Cu-8.9Sn) powder and 316L stainless steel powder mixed to various ratios as the braze filler metals. The diamond grits were brazed onto a steel substrate at 1050 °C for 30 min in a dry hydrogen atmosphere. After brazing practice, an intermediate layer rich in chromium formed between the braze filler metal and diamond. A braze filler metal composed of 70 wt % bronze powder and 30 wt % stainless steel powder was found to be optimum in that the diamond grits were strongly impregnated in the filler metal by both mechanical and chemical types of holding. The diamond tools thus fabricated performed better than conventional nickel-plated diamond tools. In service, the braze filler metal wore at almost the same rate as the diamond grits, and no pullout of diamond grits or peeling of the filler metal layer took place.     

高温钎焊立方氮化硼界面微结构

以Ag-Cu-Ti合金为钎料采用真空钎焊的方法在优化的钎焊温度和时间下，实现了立方氮化硼(CBN)与砂轮基体的牢固连接。运用扫描电镜(SEM)、X射线能谱仪(EDS)及X射线粉末衍射仪(XRD)对连接界面的微观组织以及CBN表面生成物的三维形貌、化学成分、物相结构进行了综合分析。结果表明，钎料中的元素Ti向CBN表面扩散富集，生成了针状TiB2和TiN，在磨粒与钎料界面形成化学冶金结合，这是CBN与Ag-Cu-Ti钎料间有良好浸润性和高结合强度的主要原因。磨削对比试验表明钎焊CBN砂轮比电镀CBN砂轮具有更高的磨粒把持强度。     

钎焊法制造单层金刚石取孔钻及其界面微观结构

使用钎焊法制造了单层金刚石取孔钻,并与电镀单层金刚石取孔钻的加工性能进行了比较.发现由于具有高的金刚石出刃和结合强度,钎焊取孔钻的锋利度和寿命都优于电镀取孔钻.通过光学显微镜、扫描电子显微镜(SEM)、能谱分析(EDX)和X射线衍射等对钢基体-钎料合金-金刚石的界面微观结构和成分进行了观察和分析,发现钎料合金中的Ni,Cr元素向钢基体中有一定的扩散;而在钎料合金和金刚石上分别存在反应层.钎料合金反应层主要是金刚石表面的C原子扩散进入液相后与Cr反应生成的Cr3C2和Cr7C3,而金刚石反应层是石墨化金刚石表面的位错通道与Cr反应形成Cr3C2并渗透到一定的深度形成的.     

Microstructural characterization of diamond/CBN grains steel braze joint interface using Cu–Sn–Ti active filler alloy

In order to develop the new generation superhard abrasive tools of diamond and cubic boron nitride (CBN), the brazing joint experiments of diamond/CBN crystals and AISI 1045 steel matrix using Cu–Sn–Ti active filler powder alloy were investigated in vacuum furnace. The brazing temperature was 930 °C and the dwelling time was 20 min. Interfacial characteristics of the brazing joint among the diamond/CBN grains, the active filler layer and the steel substrate were analyzed using scanning electron microscopy, energy dispersive spectroscopy and X-ray diffraction techniques. The results indicated that Ti element in the Cu–Sn–Ti alloys diffused preferentially to the surface of diamond/CBN grits to form a Ti-rich reaction layer in the brazed joints by microanalyses. Moreover, the TiC, TiN and TiB₂ phases in diamond/CBN interface and Cu–Ti phase in steel interface were confirmed by X-ray diffraction phase analysis. The wetting and bonding reactions on diamond/CBN by melting Cu–Sn–Ti alloy were realized through the interfacial reaction products like TiC, TiN and TiB₂ compounds during the brazing process. The adhesive strength experiments of the joint interfaces revealed that the grains were not pulled out from the bond interface. The reliable bonding strength of brazed diamond/CBN grains to the steel substrate can meet the application requirements of high efficiency machining in the industrial field.     

Interfacial characteristics of titanium coated micro-powder diamond abrasive tools fabricated by electroforming-brazing composite process

In this study, abrasive tools were fabricated by an electroforming-brazing composite process. The abrasive tools were prepared using micro-powder diamond (MPD) grits with and without titanium (Ti) coatings. The interface characteristics of the MPD diamond grits and filler alloy were investigated. The results show that the diamond grits are uniformly dispersed on the surface of the steel substrate without visible agglomeration, and the NiCr filler alloy has good wetting toward diamond grits. Compared to the uncoated diamond grits, the abrasive grains with a Ti coating have an ideal grain distribution and brazed joints, and no aggregation of Si element observed at its edge. There is a more stable carbide TiC that formed on its surface in addition to the chromium carbide. Furthermore, the coated diamond grits are not graphitized and show a better residual stress state. In the abrasive tools with Ti-coated diamond, numerous intermetallic compounds (IMCs) are formed in the brazing layer, but the formation of theγ-Ni-based solid solution is relatively slight. The IMCs increase the microhardness of the filler alloy and help improve the wear resistance of the solder layer.     

钎焊单层金刚石砂轮的现存问题及其对策

概述了用活性钎料将金刚石磨料钎焊到钢基体表面制作单层金刚石砂轮 ,比传统的单层电镀金刚石砂轮具有明显的工艺优势。分析指出了钎焊工艺的现存问题 ,即如何实现金刚石磨料与合金钎料层高的结合强度、钎料层厚度的均匀性和金刚石磨料的有序排布。给出了可行的解决方案 ,即利用Ag -Cu -Cr或Ni-Cr等活性钎料与金刚石界面化学反应生成的Cr7C3 和Cr2 3 C7实现钎料层与金刚石间的高强度结合 ;通过砂轮地貌优化 ,优化出磨粒排布方式 ,然后按优化的结果排布磨料。研制出了具有磨料出露高度高、有序排布、钎料层厚度一致性、高结合强度、高锋利度的单层钎焊金刚石砂轮。     

钎焊金刚石耐磨涂层制备及其磨损性能

为提高农机刃具类零件的抗磨粒磨损性能,提出一种钎焊金刚石耐磨涂层制备方法,在Q235钢基体上制备了不同粒径及镀覆状态的金刚石耐磨涂层,并与65Mn钢的摩擦磨损和抗磨粒磨损性能进行对比。采用扫描电镜(SEM)对涂层表面、涂层与钢基体界面、涂层磨损后的表面微观形貌进行表征,并分析涂层的磨损规律及机理。结果表明:钎焊金刚石涂层与钢基体结合良好,金刚石在涂层中均匀分布,涂层厚度约370 μm。钎焊金刚石涂层的耐磨性优于65Mn钢的,且随着金刚石粒径减小钎焊金刚石涂层的摩擦系数降低,涂层的耐磨性增大;钎焊镀钨金刚石涂层的抗摩擦磨损和磨粒磨损性能均高于钎焊未镀覆金刚石涂层的。      

银基钎料钎焊单层金刚石砂轮的研究

概述了单层高温钎焊超硬磨料砂轮的优点。这种新型超硬磨料砂轮以其卓越的磨削性能在今后将逐步替代传统电镀砂轮。鉴于它极其广阔的应用前景,国内也必将大力开发此种单层钎焊超硬磨料砂轮。本文利用高频感应钎焊的方法,用Ag-Cu合金和Cr粉共同作中间层材料,在一定的钎焊温度和时间下,实现了金刚石与钢基体间的牢固结合。经扫描电镜分析发现Cr与金刚石之间形成CrC,与钢基体之间形成（FexCry)C,这是实现合金层与金刚石及钢基体之间都有较高结合强度的主要因素。最后通过磨削实验证实了金刚石确实有较高的把持强度。