以磷化铁为添加剂沿(111)面生长磷掺杂金刚石大单晶

掺杂是调控金刚石性能的一种重要手段。本文采用温度梯度法,在5.6 GPa、1 312 ℃的条件下,选用Fe₃P作为磷源进行磷掺杂金刚石大单晶的合成。金刚石样品的显微光学照片表明,随着Fe₃P添加比例的增加,金刚石晶体的颜色逐渐变深,包裹体数量逐渐增加,晶形由板状转变为塔状直至骸晶。金刚石晶形的变化表明Fe₃P的添加使生长金刚石的V形区向右偏移,这是Fe₃P改变触媒特性的缘故。红外光谱分析表明,Fe₃P的添加使金刚石晶体中氮含量上升,这说明磷的进入诱使氮原子更容易进入金刚石晶格中。激光拉曼光谱测试表明,随着Fe₃P添加比例的增加,所合成的掺磷金刚石的拉曼峰位变化不大,其半峰全宽(FWHM)值变大,这说明磷的进入使得金刚石晶格畸变增加。XPS测试结果显示,随着Fe₃P添加比例的增加,金刚石晶体中磷相对碳的原子百分含量也会增加,这意味着添加Fe₃P所合成的金刚石晶体中有磷存在。     

用于小角散射原位加载测试的单晶金刚石窗口制备工艺研究

根据小角散射原位加载测试的应用需求,采用自行研制的2.45 GHz/6 kW穹顶式微波等离子体化学气相沉积(MPCVD)装置进行高质量单晶金刚石窗口的制备,对晶托结构进行改进,并系统研究了沉积温度对单晶金刚石生长速率、表面形貌、结晶质量、X射线透过率的影响.实验结果表明,新型晶托结构使籽晶表面温度分布均匀,有利于提升单晶金刚石结晶质量;沉积温度1000℃下制备单晶金刚石样品表面形貌、拉曼曲线半峰宽、摇摆曲线半峰宽、X射线透过率均优于其它温度的样品,并最终在该温度下制备出Φ7 ×0.5 mm2的单晶金刚石窗口.经测试,样品生长速率可达11.6 μm/h,厚度偏差小于±2;,其Raman半峰宽为2.08 cm-1,XRD摇摆曲线半峰宽为28arcsec,PL谱中未出现与氮相关的杂质峰,X射线透过率超过80;且窗口耐压达到27 MPa,所有性能均满足小角散射原位加载测试的应用需求.     

高质量硼掺杂单晶金刚石同质外延及电学性质研究

突破高质量、高效金刚石掺杂技术是实现高性能金刚石功率电子器件的前提。本文利用微波等离子体化学气相沉积(MPCVD)法,以三甲基硼为掺杂源,制备出表面粗糙度0.35 nm,XRD(004)摇摆曲线半峰全宽28.4 arcsec,拉曼光谱半峰全宽3.05 cm^-1的高质量硼掺杂单晶金刚石。通过改变气体组分中硼元素的含量,实现了10¹⁶~10²⁰ cm^-3的p型金刚石可控掺杂工艺。随后,研究了硼碳比、生长温度、甲烷浓度等工艺条件对p型金刚石电学特性的影响,结果表明:在硼碳比20×10^-6、生长温度1 100 ℃、甲烷浓度8%、腔压160 mbar(1 mbar=100 Pa)时p型金刚石迁移率达到207 cm²/(V·s)。通过加氧生长可以提升硼掺杂金刚石结晶质量,降低杂质散射。当氧气浓度为0.8%时,样品空穴迁移率提升至 614 cm²/(V·s)。     

Ar对微波等离子体CVD单晶金刚石生长的影响

采用自主研发的5 kW不锈钢谐振腔式MPCVD设备,在Ar/H2/CH4气氛下,保持总气压与CH4气流量不变,研究了不同Ar/H2比例对单晶金刚石生长速度和晶体质量的影响.通过拉曼光谱与高分辨率XRD摇摆曲线,从生长速度与生长质量两点对所得样品进行分析.结果表明,适量Ar的存在能够显著提高单晶金刚石的生长速度,并且不损害金刚石的晶体质量.当Ar/H2=30;时,生长速度最高,为35 μm/h.随着Ar/H2比例的进一步增加,单晶金刚石的结晶质量会有所下降,Ar/H2比例过高则会严重破坏单晶金刚石的生长.     

单晶金刚石p型和n型掺杂的研究

超宽禁带半导体材料金刚石在热导率、载流子迁移率和击穿场强等方面表现出优异的性质,在功率电子学领域具有广阔的应用前景。实现p型和n型导电是制备金刚石半导体器件的基础要求,其中p型金刚石的发展较为成熟,主流的掺杂元素是硼,但在高掺杂时存在空穴迁移率迅速下降的问题;n型金刚石目前主流的掺杂元素是磷,还存在杂质能级深、电离能较大的问题,以及掺杂之后金刚石晶体中的缺陷造成载流子浓度和迁移率都比较低,电阻率难以达到器件的要求。因此制备高质量的p型和n型金刚石成为研究者关注的焦点。本文主要介绍金刚石独特的物理性质,概述化学气相沉积法和离子注入法实现金刚石掺杂的基本原理和参数指标,进而回顾两种方法进行单晶金刚石薄膜p型和n型掺杂的研究进展,系统总结了其面临的问题并对未来方向进行了展望。     

探测器级单晶金刚石材料的生长

采用高质量高温高压单晶金刚石衬底,通过等离子体环境净化的方法获得高纯、低缺陷密度金刚石材料,有望应用于医疗、核、宇宙射线等辐射探测器.采用微波化学气相沉积方法成功外延生长出了8 mm×8 mm的高质量单晶金刚石材料.晶体内无明显的应力集中区,X射线摇摆曲线(004)峰半高宽0.008°,PL光谱中未见与氮相关杂质,基于电子顺磁共振测试孤氮杂质含量为23ppb.     

Cs3Bi2I9晶体的生长及辐射探测性能

采用布里奇曼法成功制备出大尺寸(φ15 mm×50 mm)、高质量的全无机金属卤化物类钙钛矿Cs₃Bi₂I₉单晶。室温下,该晶体属于六方晶系,空间群为P6₃/mmc,密度为5.07 g/cm³,晶胞参数为a=b=0.840 nm,c=2.107 nm,熔点为632 ℃。采用粉末X射线衍射谱、紫外-可见-近红外漫反射光谱、I-V测试等表征该晶体的性质。制备Au/Cs₃Bi₂I₉/Au三明治型器件结构,采用飞行时间技术测试Cs₃Bi₂I₉晶体的载流子迁移率,得到Cs₃Bi₂I₉晶体的电子迁移率为4.33 cm²·V^-1·s^-1。根据Hecht单载流子方程拟合得到Cs₃Bi₂I₉晶体的载流子迁移率寿命积(μτ)为8.21×10^-5 cm²·V^-1,并且在500 V偏压下对α粒子的能量分辨率达到39%。     

硼含量对含硼金刚石单晶电学性能的影响

采用碳化硼添加量不同的铁基触媒,在高温高压下合成含硼金刚石单晶.用数字电桥和自制的电阻测量夹具测量了含硼金刚石单晶的电阻;用阴极射线发光光谱测量了金刚石单晶的光子频数;用XRD检测了不同硼含量掺杂的金刚石单晶的晶体结构.结果表明:随着触媒中碳化硼添加量的增加,含硼金刚石单晶的电阻率降低,可呈现半导体电阻特性.其原因是硼元素的掺入促进了金刚石单晶的(111)晶面生长,使受主能级提高,晶体的带隙变窄,载流子浓度提高.     

二氧化碳对同质外延生长单晶金刚石内应力的影响

本文研究了在反应气体中引入不同浓度的CO₂对微波等离子体化学气相沉积(MPCVD)法同质外延生长单晶金刚石内应力的影响，并对其作用机理进行了分析。研究发现，随着CO₂浓度增加，单晶金刚石内应力逐渐减小，这是由于添加的CO₂提供了含氧基团，可以有效刻蚀金刚石生长过程中的非金刚石碳，并能够降低金刚石中杂质的含量，从而避免晶格畸变，减少生长缺陷，并最终表现为单晶金刚石内应力的减小，其中金刚石内应力以压应力的形式呈现。此外反应气体中加入CO₂可以降低单晶金刚石的生长速率和沉积温度，且在合适的碳氢氧原子比(5∶112∶4)下能够得到杂质少、结晶度高的单晶金刚石。     

直喷式直流电弧等离子化学气相沉积法金刚石单晶外延层制备研究

采用非循环直流喷射(直喷式)直流电弧等离子化学气相沉积法,在Ar/H2/CH4气氛下,成功制备了金刚石单晶外延层.试验采用的是3 mm×3 mm×1.2 mm的高温高压Ib型金刚石单晶衬底.研究了不同衬底温度和甲烷浓度对金刚石单晶外延层的形貌,速率和晶体质量的影响.采用光学显微镜,激光共聚焦表征了样品的形貌,利用千分尺测量其生长速率,利用Raman表征其晶体质量,采用OES诊断Ar/H2/CH4等离子气氛下C2、CH与Hβ的相对浓度.研究表明,温度和甲烷浓度对单晶刚石形貌和质量产生了明显的影响.在衬底为温度980℃,甲烷浓度在1.5;的条件下,生长速率达到了36 μm/h,并且晶体质量较好(半高宽仅为1.88 cm-1).同时发现生长参数对金刚石单晶外延层的生长模式有着显著地影响.     

InAlAs/InGaAs/InP sub-micron HEMTs grown by CBE

The InAlAs/InGaAs/InP high electron mobility transistor (HEMT) lattice matched to InP offers excellent high frequency, low noise operation for MMICs and low-noise amplifiers. The InP channel in the InP/InAlAs HEMT offers the advantages of improved high field velocity and higher breakdown voltages (the potential for higher power applications) over InGaAs channel HEMTs. InAlAs has been grown for the first time by CBE using TMAA producing InGaAs/InAlAs and InP/InAlAs HEMTs. Sub-micron InGaAs/InAlAs HEMTs with planar Si doping have been fabricated with f_t values of 150 GHz and f_max values of 160 GHz. This device showed excellent pinch-off charateristics, with a maximum transconductance of 890 mS/mm. The planar doped InGaAs channel HEMT had a higher f_t than a similar uniformly doped device. However, the non-optimized structure of the planar doped device resulted in a large output conductance of 120 mS/mm, limiting f_max for that device. A sub-micron InP channel device was grown with a quantum well channel and double-sided planar Si doping. A sheet charge density of 4.4×10¹² cm^-2 and associated room temperature mobility of 2800 cm²/V·s were achieved; however, the saturation current was low. The most likely causes for this are diffusion of the planar doping beneath the channel and the poor quality of the InP on InAlAs interface at the bottom of the quantum well channel.     

Demonstration of the N2 carrier process for LP-MOVPE of III/V''s

The suitability of an N₂ carrier in LP-MOVPE of GaInAs/InP device structures and for the growth of (Al)GaInP is investigated for the first time. Al-free GaInAs/InP HEMTs and MSM photodetectors exhibit cutoff frequencies of f_t = 135 GHz and f_max = 200 GHz and a bandwidth of 16 GHz and responsivity of 0.27 A/W, respectively. AlGaInP and GaInP layers deposited using the optimized growth conditions showed excellent structural, optical and homogeneity properties. For example X-ray diffractograms with FWHMs as low as 15–16 arcsec for 1 μm thick layers and 300 K photoluminescence mappings over full 2 inch wafers with standard deviations of ±0.23 and ±0.26 nm were obtained for both materials.     

化学计量比对镓酸镁尖晶石陶瓷微波介电性能的影响

尖晶石型微波介质陶瓷因高品质因数和可调的谐振频率温度系数在无线通信等领域应用广泛。本文通过无压烧结制备了MgO·nGa₂O₃(n=0.975、1.00、1.08和1.17)尖晶石陶瓷,采用XRD Rietveld全谱拟合研究了化学计量比对晶体结构的影响,并结合键价理论模型探究了微波介电性能与晶体结构的关系。结果表明:MgO·nGa₂O₃陶瓷相对介电常数(ε_r)的变化与晶格常数和离子极化率有关;品质因数(Q×f)受键强和阳离子有序度的共同影响,随n值增大从165 590 GHz下降至109 413 GHz;而谐振频率温度系数(τ_f)与晶体热膨胀系数相关。制备的MgO·0.975Ga₂O₃陶瓷具有优异的微波介电性能:ε_r=9.69、Q×f=165 590 GHz(频率14 GHz下)和τ_f=-7.12×10^-6/℃。     

砷锗镉晶体的生长和变温霍尔效应研究

采用温度振荡法和改进的布里奇曼法进行了CdGeAs₂多晶合成与单晶生长,生长出ϕ28 mm×65 mm完整无开裂的CdGeAs₂单晶体。用金刚石外圆切割机切割出CdGeAs₂晶片,采用X射线衍射(XRD)和X射线能量色散谱仪(EDS)对合成的多晶粉末和切割出的晶片进行表征。结果表明,合成产物为单相四方黄铜矿结构的CdGeAs₂多晶,晶片的原子百分比接近于理想化学计量比。经傅里叶变换红外分光光度计测试发现,初生长的CdGeAs₂晶体在11.3 μm处的吸收系数为0.117 cm^-1,经过拟合计算得出禁带宽度为0.52 eV。通过变温(110~300 K)霍尔效应测试表明,CdGeAs₂晶体在110~300 K温度范围内都为p型导电,载流子浓度p_H和霍尔系数R_H随温度的升高分别升高和下降,而霍尔迁移率μ_H几乎不变。拟合计算出晶体中受主电离能E_A=0.305 eV,并进一步分析了生长晶体中可能存在的受主缺陷。     

GaAs---InP heteroepitaxy and GaAs---InP MESFET fabrication by MOVPE

Lattice-mismatched heteroepitaxy has attracted considerable attention in recent years. A great interest of these systems is the possibility of integrating devices from different materials on a single substrate. 1.3 and 1.5 μm InGaAs(P)/InP laser diodes are essential for optical communication, whereas InP field effect transistor technology is less developed than that of GaAs MESFET. The performances of laser diodes are much more sensitive to a high density of disclocations, so it would be interesting to grow GaAs MESFET on InP for integration with 1.3 and 1.5 μm lasers. Due to the large difference of the thermal expansion coefficient and lattice parameter between GaAs and InP, it is very difficult to grow GaAs epilayers of high quality on it is very difficult to grow of GaAs epilayer high quality on InP substrates due to the large difference of the thermal expansion coefficient and lattice parameter between GaAs and InP. A new method, metalorganic source modulation epitaxy (MOSME), which improves the crystal quality of GaAs epilayers on InP substrates by MOVPE, has been adopted in our laboratory. The lowest full width at half maximum (FWHM) of the double crystal X-ray (DCX) diffraction spectra reaches as low as 120 arcsec for a 5 μm thick layer. Structural properties (misorientation, lattice parameters and crystal quality) of 1.0–5.0 μm thick GaAs layers grown on InP have been measured by DCX diffraction. On GaAs MESFETs grown on InP, we have measured g_m = 100 ms/mm. For these transitions, the current gain cut-off frequency (F_t) is around 12 GHz and the maximum frequency of oscillation (F_max) is higher than 30 GHz.     

Li0.5Bi0.5MoO4对Li2Zn2(MoO4)3陶瓷的微波介电性能影响

采用传统固相反应法制备了xLi_0.5Bi_0.5MoO₄-(1-x)Li₂Zn₂(MoO₄)₃ [xLBM-(1-x)LZM]复合陶瓷,研究添加不同质量分数(x=25%,30%,35%,40%和45%)的LBM对LZM陶瓷的烧结特性、物相组成、微观结构以及微波介电性能的影响。结果表明:添加一定量的LBM不仅能将LZM的谐振频率温度系数(τ_f)调节近零,还能降低LZM的烧结致密化温度;LBM可与LZM共存,且不发生化学反应生成其他新相。随着LBM添加量增加,复合陶瓷的烧结致密化温度逐渐降低、体积密度先增大后减小、介电常数(ε_r)与τ_f逐渐增大而品质因数(Q×f)逐渐减小。当LBM添加量为40%时,LZM-LBM复合陶瓷在600 ℃烧结2 h获得最大体积密度为4.41 g/cm³,以及优异的微波介电性能:ε_r为13.8,Q×f为28 581 GHz,τ_f为-4×10^-6/℃。     

碳酸钙掺杂对Ⅰb型金刚石沿不同晶面生长行为的影响

作为天然金刚石生长环境的碳酸盐,研究其掺杂对人造金刚石晶体生长行为的影响具有重要的学术价值。本文运用高温高压下的温度梯度法,将碳酸钙(CaCO₃)按照不同比例掺杂到金刚石合成腔体内的碳源中,用以研究其掺杂对金刚石分别沿(100)或(111)晶面生长行为的影响。利用光学显微成像对掺杂合成金刚石晶体形貌的表征表明:随着碳酸钙掺量的增加,沿(100)面生长的金刚石晶形由塔状变为板状且出现了裂晶、连晶现象,晶体颜色先变浅再变黑,内部出现了包裹体;同样,沿(111)面生长的金刚石晶形由板状逐渐变为塔状且出现了裂晶、孪晶现象,晶体颜色逐渐变黑,内部包裹体增多。用激光拉曼光谱对掺杂金刚石晶体质量的表征表明:随着碳酸钙掺量的增加,沿(100)或(111)面生长的掺杂金刚石的拉曼峰位偏移量均增大,半峰全宽均变大。这说明碳酸钙掺杂使得金刚石晶格畸变增加、内应力变大。本文对碳酸钙掺杂影响沿两不同面生长金刚石的晶形、颜色、内部质量等行为的成因进行了分析,为本课题后续研究奠定了基础。     

A comparison of commercial sources of epitaxial material for GaN HFETs fabrication

This paper describes a comparison of material and device results obtained from AlGaN/GaN epitaxial HFET wafers from three commercial sources. Although all three sources supplied material to the same nominal specification, X-ray diffraction, Hall effect and C–V profiling revealed significant differences between them. Wafers from two of the suppliers showed poor inter-device isolation characteristics, indicative of a conducting buffer layer. Wafers from the third supplier showed excellent inter-device isolation, but C–V measurements showed that the AlGaN was about twice as thick as specified, resulting in devices with high pinch-off voltages (−16 V). For the wafers with poor buffer isolation, RF measurements on 1.2 μm gate length devices gave values of f_T 5.0 GHz and values of f_max from 8.0 to 11.7 GHz (exact values depending on DC bias conditions), while for the wafer with over-thick AlGaN the corresponding values were 8.0 and 20.0 GHz.