Performance optimizing on multi-function MMIC design

Integration of GaAs BiFET (bipolar-FET) devices to obtain the optimum performance for multiple functions of MMIC design has been achieved. In this study, heterojunction bipolar transistors (HBTs), enhancement mode pseudomorphic HEMTs (E-pHEMTs), and depletion mode pHEMTs are developed for potential applications, including the integration of HBT power amplifier circuitry with pHEMT-based bias control, logic, RF switch, and low-noise amplifier circuitries. Critical processes including gate photolithography and gate recess control are presented and discussed in detail. The enhancement-depletion modes of pHEMT, HBT electrical performance, and uniformity are investigated comprehensively. In addition, power amplifiers and high power switches based on BiFET technology are investigated.     

A comparison of linear handset power amplifiers in different bipolar technologies

This work evaluates four linear power amplifiers for wireless handset applications that were fabricated (or simulated) in four different bipolar technologies. The four bipolar technologies are currently competing to become, or remain as, the preferred bipolar technology for the commercial development of power amplifier modules. The four technologies are GaAs HBT, Si BJT, SiGe HBT, and InP HBT. The purpose of this work is to evaluate the performance of power amplifiers in each of these competing technologies in terms of typical linear handset PA requirements (i.e., P/sub OUT/, ACPR, PAE, P/sub GAIN/, and ruggedness).     

低偏置电压工作的自对准InGaP/GaAs功率异质结双极晶体管

介绍L波段、低偏置电压下工作的自对准InGaP/GaAs功率异质结双极晶体管的研制.在晶体管制作过程中采用了发射极-基极金属自对准、空气桥以及减薄等工艺改善其功率特性.功率测试结果显示:当器件工作在AB类,工作频率为2GHz,集电极偏置电压仅为3V时,尺寸为2×(3μm×15μm)×12的功率管获得了最大输出功率为23dBm,最大功率附加效率为45%,线性增益为10dB的良好性能.     

Performance capabilities of HBT devices and circuits for satellitecommunication

The heterojunction bipolar transistor (HBT) performance is studied, with emphasis on its possible utilization in satellite power amplifiers. After a review of the requirements of satellite power amplifiers, the suitability of HBTs is discussed in depth, including the output power capabilities, the realizable power-added efficiency and linearity, reliability considerations, and circuit aspects. Models and simulation tools for HBTs in power amplifiers are discussed, and the results obtained so far are given. A comparison of realized HBTs and various FET devices and circuits demonstrates that the HBT is a promising device for applications in satellite power amplifiers. The HBT will be a preferable device for microwave power amplification if the problems concerning the reliability can be solved, and further investigations will be performed to obtain larger devices with higher rated output power     

Use of active loads with MSM photodetectors in digital GaAs MESFETphotoreceivers

Illuminated metal-semiconductor-metal (MSM) photodetectors display a current-voltage characteristic that saturates with increasing bias voltage and resembles the output characteristics of a field-effect transistor (FET). It is shown that operating an MSM photodetector with a GaAs FET active load can produce output voltage signal swings of over 80% of the power supply voltage from less than a 1 decade change in the MSM photocurrent, which may in turn be produced by only a 0.1 mW change in the input optical power. This swing allows the circuit to be used as an extremely compact optical input to high-speed digital gate circuits without the need for any intervening amplifiers. For fully monolithic prototype optical input circuits, less than -6 dBm of peak optical input power provided noise-free switching of a standard buffered FET logic (BFL) inverter from DC up to 25 MHz     

Low-voltage operation GaAs spike-gate power FET with highpower-added efficiency

A GaAs power FET with a spike-gate has been developed for high-efficiency operation under extremely low supply voltage less than 1.5 V. The spike-gate provides both low on-resistance of 2.2 Ω/mm and high transconductance of 180 mS/mm without reducing the output impedance or increasing the gate resistance. The implemented device achieved an output power of 31.5 dBm with 70% power-added efficiency at a frequency of 900 MHz. It should be noted that the present device kept PAE of 60% even at a bias of 0.5 V, which is the lowest voltage ever attained     

Low-Noise, Low Power Dissipation GaAs Monolithic Broad-Band Amplifiers

Low-noise, low dc power dissipation GaAs monolithic amplifiers have been developed for use in VHF-UHF mobile radio systems. The developed amplifiers have two-stage constuction, where gate width for the first stage is 1000 µm, and for the second stage is 500 pm. Using this circuit configuration, both noise figure and bandwidth have been improved. To maintain the uniformity for the ion-implanted active layers and to reduce gate-source resistance R/sub S/ and gate-drain resistance R/sub D/, the "closely spaced electrode FET" was adopted. The FET enables low drain voltage operation, resulting in low dc power dissipation. The developed amplifier for the FET threshold voltage VT= --0.6 V provides a 3-dB noise figure, less than 170-mW dc power dissipation, 9-MHz-3.9-GHz bandwidth with 16-dB gain. It can operate under a unipolar power source. When external choke inductors were introduced for the amplifier, 120-mW dc power dissipation has been achieved. It has also been demonstrated that the amplifier for V/sub T/= --0.6V, which is inferior to the amplifier for VT= -2.7V regarding gain-bandwidth product and power efficiency under the same dc power dissipation, however, has an acceptable performance for use in the mobile radio systems.     

Application of enhancement mode FET technology for wirelesssubscriber transmit/receive circuits

Single-supply power amplifiers have become the new paradigm in portable phone handsets due to the recent availability of heterojunction bipolar transistor (HBT) and pseudo enhancement mode PHEMT technology. We have developed a true enhancement mode heterostructure insulated-gate FET device (HIGFET) which is suitable for use in both saturated and linear power amplifiers. A three-stage power amplifier designed for 1900-MHz NADC application delivered +30-dBm output power and 41.7% power-added efficiency with an adjacent channel power of -29.8 dBc and alternate adjacent channel power of -48.4 dBc. In addition to this, we have demonstrated excellent noise figure and linearity performance for small-signal applications. At 900 MHz and bias conditions V_DS=1.0 V and I_DSQ=1 mA, a single-stage amplifier achieved a noise figure of 1.17 dB with an associated gain of 18.5 dB. These results make the technology an ideal candidate for application in both transmitter and receiver circuits     

A functional GaAs FET noise model

It is the purpose of this paper to develop a theory upon which the design of low noise FET amplifiers can be based. This is not a fundamenta model of the noise mechanisms in GaAs FET's, but rather, an endeavor to relate physically measurable device capacitances and resistances to the device noise figure and optimum noise source impedance. I will be shown that the noise performance of an FET can be adequately described by two uncorrelated noise sources. One, at the input of the FET, is the thermal noise generated in the various resis, tances in the gate-source loop. This noise source is frequency dependent and it can be calculated from the equivalent circuit of the FET. The second noise source, in the Output of the FET, is frequency independent, and not recognizably related to any measured parameters. This output nise is a function of drain current and voltage. The decomposition of the FET noise into two uncorrelated sources simplifies the design of broad-band low noise amplifiers. Once the equivalent circuit of a device and its noise figure at one frequency are known, the optimum noise source impedance and noise figure over a broad range of frequencies may be calculated. For the device designer this model also may be helpful in balancing input-output noise tradeoffs.     

Design and Performance of X-Band Oscillators with GaAs Schottky-Gate Field-Effect Transistors

The circuit construction and design of an X-band oscillator with a GaAs Schottky-gate FET have been studied. The oscillation characteristics including stability and noise performance have been examined in order to clarify the position of a GaAs FET as a microwave solid-state oscillator device. The experiments have revealed that 1) the GaAs FET simultaneously possesses the most desirable features of both Gunn and IMPATT oscillators, i.e., low bias voltage operation and fairly high efficiency, and 2) it is situated between Gunn and GaAs IMPATT oscillators with respect to noise properties. The results indicate that the GaAs FET oscillator will soon be joining the family of microwave solid-state oscillators as a promising new member.     

AlGaAs/GaAs heterojunction bipolar transistors for power applications: issues of thermal effect and reliability

AlGaAs/GaAs heterojunction bipolar transistor (HBT) has the advantages of superior switching speed, wide linearity, and high current handling capability. As a result, the device has gained popularity in designing power amplifiers for RF and microwave applications. However, the high power in the HBT, together with the poor thermal conductivity of GaAs, gives rise to significant thermal effect and reduced reliability in such a device. This paper presents an overview on the simulation, modeling, and reliability of AlGaAs/GaAs HBTs. Emphasis will be placed on the effects of thermal–electrical interacting behavior on the dc and ac performance of the HBT. The thermal-induced degradation process in the HBT will also be addressed and analyzed.     

AlGaAs/GaAs HBT linearity characteristics

Communication systems require linear power amplifiers with high efficiency and very low intermodulation distortion. AlGaAs/GaAs heterojunction bipolar transistors (HBT's) were found to have very low intermodulation distortion in power operation. Two-tone tests were carried out on both common-emitter (CE) and common-base (CB) power HBT's. At 7 GHz, the CE HBT showed -20 dBc IM₃ (third-order intermodulation ratio) and 12% power added efficiency (PAE) per tone at the 1 dB gain compression point; IM₃ dropped to -30 dBc at 1.5 dB output power backoff. The CE HBT has lower intermodulation distortion than CB HBT. Load pull data were collected to aid the understanding of the intermodulation. Parameters of the Gummel-Poon model (as used in SPICE) were derived for HBT's based on dc data and small-signal S parameters at various bias points. The accuracy and validity of the model were confirmed by comparison to experimental two-tone results. SPICE predicts that the emitter and base resistances linearize the HBT and reduce the third-order intermodulation distortion. The excellent third-order intermodulation performance of the CE HBT makes it a very attractive choice for linear power amplifiers     

具有在片稳定网络的GaAs HBT微波功率管

采用GaAs标准MMIC工艺制作了具有片上RC并联稳定网络的InGaP/GaAs HBT微波功率管单胞.依据K稳定因子,RC网络使功率管在较宽的频带内具有绝对稳定特性.Load-pull测试表明RC网络没有严重影响功率管的大信号特性,在5.4GHz饱和输出功率为30dBm,在11GHz 1dB压缩点输出功率大于21.6dBm.功率合成电路验证了该功率管具有高稳定性,非常适合制作微波大功率HBT放大器.     

具有在片稳定网络的GaAs HBT微波功率管

采用GaAs标准MMIC工艺制作了具有片上RC并联稳定网络的InGaP/GaAs HBT微波功率管单胞.依据K稳定因子,RC网络使功率管在较宽的频带内具有绝对稳定特性.Load-pull测试表明RC网络没有严重影响功率管的大信号特性,在5.4GHz饱和输出功率为30dBm,在11GHz 1dB压缩点输出功率大于21.6dBm.功率合成电路验证了该功率管具有高稳定性,非常适合制作微波大功率HBT放大器.     

一种自适应线性化偏置的单片集成功率放大器

提出一种自适应线性化偏置的电路结构,通过调节控制电压改变偏置管的工作状态,提高功率放大电路的线性度,降低偏置电流对参考电压和环境温度的敏感度.利用双反馈环结构抑制输入阻抗随频率的变化,实现了宽带匹配,拓展了放大器的带宽.采用微波电路仿真软件AWR进行仿真,验证了带宽范围内的相位偏离度在2°以内.基于2μm InGaP/GaAs HBT工艺,设计了集成电路版图并成功流片.测试结果表明:在3.5V电压供电下,该放大器在1～2.5 GHz频带范围内,输入反射系数均在-10 dB以下,功率增益为23 dB,输出功率大于30 dBm,误差向量幅度在2.412 GHz时为.2.7％@24 dBm,最大功率附加效率达40％.     

Performance comparison of state-of-the-art heterojunction bipolar devices (HBT) based on AlGaAs/GaAs, Si/SiGe and InGaAs/InP

This paper presents a comprehensive comparison of three state-of-the-art heterojunction bipolar transistors (HBTs); the AlGaAs/GaAs HBT, the Si/SiGe HBT and the InGaAs/InP HBT. Our aim in this paper is to find the potentials and limitations of these devices and analyze them under common Figure of Merit (FOM) definitions as well as to make a meaningful comparison which is necessary for a technology choice especially in RF-circuit and system level applications such as power amplifier, low noise amplifier circuits and transceiver/receiver systems. Simulation of an HBT device with an HBT model instead of traditional BJT models is also presented for the AlGaAs/GaAs HBT. To the best of our knowledge, this work covers the most extensive FOM analysis for these devices such as I-V behavior, stability, power gain analysis, characteristic frequencies and minimum noise figure. DC and bias point simulations of the devices are performed using Agilent's ADS design tool and a comparison is given for a wide range of FOM specifications. Based on our literature survey and simulation results, we have concluded that GaAs based HBTs are suitable for high-power applications due to their high-breakdown voltages, SiGe based HBTs are promising for low noise applications due to their low noise figures and InP will be the choice if very high-data rates is of primary importance since InP based HBT transistors have superior material properties leading to Terahertz frequency operation.     

GaAs-based materials for heterojunction bipolar transistor's: reliability results and MMIC applications

This paper reports the present status of GaAs based-heterojunction bipolar transistor (HBT) under development at Thales. We have developed a complete GaInP/GaAs-based technological process from material studies to discrete devices and microwave monolithic integrated circuits (MMIC) realisations. This know-how has been transferred recently to Thales/United monolithic semi-conductors. Discrete devices with output power over 1 W and power added efficiency (PAE) over 50% have been obtained at 10 GHz in CW. 8 W MMIC amplifiers have been fabricated using the same unit cells. The first reliability results are promising: more than 6000 h without failure for devices stressed up to 210°C and 40 kA cm⁻². However, it seems that these results can still be improved. Some physical properties of the GaInP/GaAs HBT structures are suspected to have a major impact on the device reliability. The role of key parameters such as hydrogen incorporation in the GaAs base layer or residual strain in the GaInP/GaAs HBT structure has been investigated and its effects on the device characteristics identified. However, the major reliability improvement came from a novel way to passivate the extrinsic base surface. A comparison of the obtained results (device performance and reliability) with some of the best reported values in the literature (HP, TI, Daimler-Benz, etc.) is presented.     

Simple precision bias circuit for medium-power amplifiers

Describes a new bias current regulation circuit for single-stage bipolar and FET amplifiers which achieves high precision and simplicity through a combination of feedback error amplifier with bandgap reference. The internally generated reference voltage can be preset between 100-200 mV. The approach is ideal for applications where the overhead voltage must be minimized to reduce power dissipation, and typically offers <0.5% regulation and ⩽40 ppm/°C temperature coefficient. The authors present three common applications which demonstrate the unique advantages of the new topology     

具有AlGaAs缓变结构的InGaP/GaAs HBT性能改进分析

对改进型结构具有零导带势垒尖峰的缓变InGaP/AlGaAs/GaAs HBT器件的直流和高频特性进行了理论探讨,并同传统突变结构的InGaP/GaAs HBT的相应性能作了比较。结果表明:在低于30 nm的一定范围内的缓变层厚度下,与突变的InGaP/GaAs HBT相比,改进型结构的InGaP/AlGaAs/GaAs HBT具有更低的offset和开启电压、更强的电流驱动能力、更好的伏-安输出特性和高频特性。     

Current-voltage characteristics, small-signal parameters, and switching times of GaAs FET's

A new two-dimensional model of a GaAs FET is proposed. The model takes into account diffusion processes and Gunn-domain formation under the gate but it requires a very small computer time. The electric-field profiles under the gate, current-voltage characteristics, the dependences of the transconductance and gate-to-source capacitance on the drain voltage, and the dependences of a characteristic switching time and power-delay product on the device thickness are calculated. The results of the calculation agree well with the experimental data found earlier by other authors. The proposed model can be used for a computer-aided design of GaAs FET amplifiers and logic elements and also for a comparative study of GaAs and InP MESFET's.