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1.
以甲基硅油为基础油、无水乙醇为分散剂、BN(氮化硼)或CNTs(多壁碳纳米管)/BN混杂物为导热填料,制备BN导热硅脂和CNTs/BN复合导热硅脂。研究结果表明:当w(BN)=50%和w(CNTs)=2%(相对于BN导热硅脂总质量而言)时,复合导热硅脂的热导率[为0.699 4 W/(m·K)]比BN导热硅脂提高了14.3%,体积电阻率为5.11×1011Ω·cm、接触电阻为88.6μΩ,说明CNTs/BN的协同作用,使复合导热硅脂既具有良好的导热性能,又具有优良的绝缘性能;采用修正的Burggeman非对称模型对复合导热硅脂的上述性能进行预测,所得实测值与理论值基本相符。  相似文献   

2.
研究聚丙烯(PP)/碳纤维(CF)/氮化硼(BN)复合材料的导热绝缘性能。结果表明,CF的含量达15%时,PP/CF复合材料的体积电阻率大幅度下降,出现逾渗现象;基于PP/CF(15%)填加不同含量的BN,当BN的含量达到20%。PP/CF/BN复合材料的热导率达0.939 5 W/(m·K),比纯PP提高近4倍,其体积电阻率为1.3×1014Ω·cm。  相似文献   

3.
为了提升换热器表面耐腐蚀性且不影响换热器的换热效果,以石墨烯,石墨粉末,环氧树脂等为原料,制备应用于换热器表面的耐腐蚀高导热石墨烯复合涂层。经硫酸腐蚀实验、导热实验、结合强度实验的测试,结果表明:涂层的耐腐蚀性能随石墨烯含量的增加而提升,当石墨烯质量分数达到0.06%时,涂层的腐蚀速率达到最低值0.2338mg/(cm2·h),其耐腐蚀性能远强于304不锈钢的1.5 mg/(cm2·h);涂层的导热性能随石墨粉含量的增加而提升,且当石墨质量分数为8%时达到最大值35.848 W/(m·K);涂层的结合强度达到ASTM等级:5B。  相似文献   

4.
环氧树脂/改性AIN导热绝缘复合材料的制备与性能研究   总被引:6,自引:1,他引:5  
将改性后的高导热的AIN与环氧树脂(EP)进行复合制备了Ep/改性AIN导热绝缘复合材料.研究了改性AIN的含量对EP/改性AIN复合材料的导热性能、电绝缘性能、粘接性能、热稳定性能及微观结构的影响.结果表明,当AlN体积分数为30%时,EP/改性AIN复合材料的热导率达到O.75 W (m·K),约为EP的4倍;线胀系数为6.3×10-5 K-1,仅为EP的50%左右;体积电阻率为1×1013Ω·cm,具有电绝缘性能.EP/改性AIN复合材料具有优于EP的粘接能力.  相似文献   

5.
高导热高绝缘FEP/AIN复合材料的研究   总被引:1,自引:0,他引:1  
采用聚全氟乙丙烯(FEP)为基体,偶联处理的氮化铝(AIN)为填料,通过共混、模压等方法制备了高导热、高绝缘的FEP/AIN复合材料。结合材料导热计算模型,分析了AIN用量对材料热导率、体积电阻率、力学以及流变性能的影响。结果表明:随AIN填充量的增加,复合材料的热导率呈近线性增加,当AIN的质量分数为30%时,材料的热导率可达2.22W/m·K),体积电阻率可达1.5×10^15Ω·cm,并具有较好的力学性能和流变性能。  相似文献   

6.
采用新的铝掺杂方法,降低了氧化锌晶须的本体电阻率;研究了铝掺杂对氧化锌晶须电阻率的影响。含20%掺量的氧化铝使氧化锌晶须的表面电阻率从107~108Ω降低到1·6×106Ω,体积电阻率从108~109Ω·cm降低到7·1×105Ω·cm;研究了铝掺杂氧化锌晶须对环氧树脂抗静电性能的影响,铝掺杂氧化锌晶须的添加量为8%,使涂层的表面电阻降低到7·2×1010Ω。  相似文献   

7.
朱毅 《特种橡胶制品》2006,27(6):23-24,34
介绍了两种国际上最新型的软质热接口材料的研制过程,对其中的配方、工艺等内容进行了讨论。研究出的材料经过欧洲实验室对主要性能的测试表明:两种材料系列的导热系数分别为2.25~3.99W/(m·K)和5.65~7.41W/(m·K),绝缘强度达到5000~6000VAc/mm,达到设计要求。  相似文献   

8.
双酚A苯并恶嗪一环氧树脂基印制电路基板的研究   总被引:4,自引:0,他引:4  
采用双酚A苯并恶嗪与环氧树脂共混改性制得胶液,经浸渍玻璃布、烘焙、压制得到了一系列玻璃布覆铜板基板其中含溴型基板的玻璃化转变温度为145.2℃,加强耐热性在300s以上,常温下表面电阻率和体积电阻率分别为1.51×1014Ω、5 75×1014Ω@m,无溴型基板玻璃化转变温度为160.3 ℃,加强耐热性在300 s以上.常温下表面电阻率和体积电阻率分别为1.91×1013Ω、5.01×1013Ω@m,覆铜板的耐浸焊性能优异,达到60s以上  相似文献   

9.
钢管用新型耐烧蚀涂层研究   总被引:1,自引:0,他引:1  
介绍了一种钢管用新型耐烧蚀涂层的研究情况。在对涂层材料基本性能研究的基础上,采用带有涂层的 钢管和无涂层钢管的对比实验对所研制涂层材料的实用性进行了研究。实验结果表明:涂层材料的拉伸强度达到 7 MPa;伸长率为1.04%;附着力为2.25 kg/cm2;导热系数为0.334 W/(m·K);比热容为4.669×103J/(kg·K);密 度为0.83 g/cm3;氧-乙炔烧蚀的线烧蚀率为:0.204 mm/s,质量烧蚀率为:0.0873 g/s;热分解温度在330-600℃;涂 层使钢管的熔速大幅度下降。  相似文献   

10.
环氧树脂/氧化锌晶须/氮化硼导热绝缘复合材料的研究   总被引:6,自引:0,他引:6  
以环氧树(脂EP)为基体,分别以氧化锌晶(须ZnOw)和ZnOw/氮化硼(BN)混合物为导热填料,制备了EP导热绝缘复合材料。研究了填料含量对复合材料导热性能、电绝缘性能及力学性能的影响,并利用扫描电镜对复合材料的断面形貌进行了观察。结果表明:随着导热填料含量的增大,复合材料的导热系数和介电常数增大,体积电阻率下降,而拉伸强度呈先增大后减小的趋势;在填料含量相同的情况下,EP/ZnOw/BN复合材料比EP/ZnOw复合材料具有更好的导热性能;当填料体积分数为15%时,EP/ZnOw/BN复合材料的热导率为1.06W/(mK)而,EP/ZnOw复合材料的热导率仅为0.98W/(mK)。  相似文献   

11.
The electrical and thermal properties of SiC ceramics containing 1 vol% nitrides (BN, AlN or TiN) were investigated with 2 vol% Y2O3 addition as a sintering additive. The AlN‐added SiC specimen exhibited an electrical resistivity (3.8 × 101 Ω·cm) that is larger by a factor of ~102 compared to that (1.3 × 10?1 Ω·cm) of a baseline specimen sintered with Y2O3 only. On the other hand, BN‐ or TiN‐added SiC specimens exhibited resistivity that is lower than that of the baseline specimen by a factor of 10?1. The addition of 1 vol% BN or AlN led to a decrease in the thermal conductivity of SiC from 178 W/m·K (baseline) to 99 W/m·K or 133 W/m·K, respectively. The electrical resistivity and thermal conductivity of the TiN‐added SiC specimen were 1.6 × 10?2 Ω·cm and 211 W/m·K at room temperature, respectively. The present results suggest that the electrical and thermal properties of SiC ceramics are controllable by adding a small amount of nitrides.  相似文献   

12.
《Ceramics International》2022,48(24):36287-36296
Multifunctional aerogels with high porosity and good thermal insulation have attracted much attention in the field of energy and aerospace engineering. In this work, a three-dimensional BN fiber aerogel with hierarchically porous structure was prepared through a freeze-drying combined with in-situ carbothermal reduction nitridation route. The synthesized BN fiber aerogel exhibits a specific surface area of 154.3 m2/g, a high porosity of 96.8% and hydrophobicity. Moreover, the BN fiber aerogel shows a low thermal conductivity of 0.051 W/(m·K) and excellent thermal insulation properties owing to its hierarchical porous structure. Particularly, the BN fiber aerogel still maintains its low thermal conductivity and a rather high mechanical strength after re-heated at 1473 K for 3 h in Ar atmosphere, suggesting excellent high-temperature service performance. The successfully developed multifunctional BN fiber aerogel holds promising potential in high-temperature thermal insulation fields.  相似文献   

13.
环氧树脂/玻璃布/BN导热复合材料的制备与性能研究   总被引:1,自引:0,他引:1  
采用高温模压成型法制备环氧树脂(EP)/玻璃布/氮化硼(BN)导热复合材料。探讨了BN用量和偶联剂处理对复合材料力学性能、导热性能和介电性能等影响。结果表明:当w(BN)=15%时,复合材料的冲击强度较高;导热性能随着BN用量的增加而增大;当w(BN)=25%时,改性复合材料的热导率为0.901 2 W/(m.K),此时复合材料仍保持较低的介电常数和介电损耗。当BN用量相同时,偶联剂表面处理可有效改善复合材料的力学性能和导热性能。  相似文献   

14.
Poly (methyl methacrylate)/boron nitride (PMMA/BN) composites were prepared by dispersing BN particles into methyl methacrylate monomer phase by bulk polymerization method. BN particles modified with silane coupling agent, γ‐methacryloxypropyl trimethoxy silane, were characterized by Fourier transform infrared spectroscopy and thermogravimetric analysis. Effects of modified BN particle content on thermal conductivity were investigated, and the experimental values were compared with those of theoretical and empirical models. With 16 wt% of BN particles, the thermal conductivity of the composite was 0.53 W/(m·K), 1.8 times higher than that of pure PMMA. The microstructures of the PMMA/BN composites were examined by scanning electron microscopy, energy‐dispersive X‐ray analysis, and transmission electron microscopy. Dynamic mechanical analysis and thermogravimetric analysis traces also corroborated the confinement of the polymer in an inorganic layer by exhibiting an increase in glass‐transition temperatures and weight loss temperatures in the thermogram. Mechanical properties and electrical insulation property of the PMMA/BN composites were also determined. These results showed that PMMA/BN composites may offer new technology and business opportunities. POLYM. COMPOS., 36:1675–1684, 2015. © 2014 Society of Plastics Engineers  相似文献   

15.
Thermally conductive and electromagnetic interference shielding composites comprising low content of Ag‐plating carbon fiber (APCF) were fabricated as electronic packing materials. APCF as conductive filler consisting of carbon fiber (CF) employed as the structural component to reinforce the mechanical strength, and Ag enhancing electrical conductivity, was prepared by advanced electroless Ag‐plating processing on CF surfaces. Ag coating had a thickness of 450 nm without oxide phase detected. The incorporation of 4.5 wt % APCF into epoxy (EP) substrate yielded thermal conductivity of 2.33 W/m·K, which is approximately 2.6 times higher than CF–EP composite at the same loading. The APCF–EP composite performed electromagnetic shielding effectiveness of 38–35 dB at frequency ranging from 8.2 to 12.4 GHz in the X band, and electromagnetic reflection was the dominant shielding mechanism. At loading content of APCF up to 7 wt %, thermal conductivity of APCF–EP composites increased to 2.49 W/m·K. Volume resistivity and surface resistivity decreased to 9.5 × 103 Ω·cm and 6.2 × 102 Ω, respectively, which approached a metal. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42306.  相似文献   

16.
采用非离子型/阴离子型/两性型复合乳化剂制备了有机硅改性的丙烯酸酯乳液。考察了聚合温度、乳化剂配比、乳化剂用量及有机硅用量对乳液稳定性能的影响。以自制的改性硅丙乳液为成膜物质,在水性涂料配方的基础上加入中空玻璃微珠,制得隔热保温性能优良的水性隔热涂料,并考察了玻璃微珠用量对涂膜隔热保温性能的影响。  相似文献   

17.
Vacuum insulation panel (VIP) core materials were successfully fabricated by wet method. The phase composition, microstructure, and thermal conductivity of VIP core materials were investigated. The density of VIP core materials was 176 kg/m3, while the mean thermal conductivity of VIP core materials was about 31 mW/(m · K). The mean thermal conductivities of VIPs were 2.78 mW/(m · K), 2.62 mW/(m · K), 2.47 mW/(m · K), 2.5 mW/(m · K), and 2.4 mW/(m · K), which correlated to VIP core materials that had been dried at 150°C for 30 min, 60 min, 90 min, and at 170°C for 30 min and 60 min, respectively. However, the mean thermal conductivity evaluated for VIPs with core material that had not been dried was 3.0 mW/(m · K). The thermal conductivity of VIPs with core material that had been dried reached a maximum on the third day and tended to be a steady value with time, whereas the one with core material that had not been dried recorded a high thermal conductivity value and continued to rise in a fluctuating pattern with time. According to the result of the thermogravimetric curve, drying at 150°C for 60 min showed characteristics of complete drying. In addition, the thermal conductivity of VIPs at this drying condition was low and stable. Theoretical and experimental analysis showed that the optimum drying condition for fiberglass VIP core materials was drying at 150°C for 60 min.  相似文献   

18.
以Al2O3、Si3N4、BN、SiO2和AlN五种无机填料作为环氧树脂(EP)灌封胶的导热填料,研究了填料的种类、粒径大小和颗粒形态等对EP灌封胶热导率的影响。结果表明:EP灌封胶的热导率随着导热填料用量的增加而增大;当φ(BN)=35%(相对于总体积而言)时,相对最大热导率为2.12 W/(m·K),其值约为EP基体的10倍。填料粒子的几何特征对EP灌封胶的导热性能具有较大的影响;当Al2O3粒径为48μm时,EP灌封胶的相对最大热导率为1.3 W/(m·K);填料粒子过大或过小都会降低EP灌封胶的导热性能。层片状填料粒子可以获得较大的堆积密度,在EP灌封胶中能有效形成导热通道,增加其热导率。  相似文献   

19.
In this study, silicon carbide (SiC) composites reinforced with pitch-based carbon fibers and composed of heat transfer channels were fabricated by combining chemical vapor infiltration and reactive melting infiltration method. It was observed that the internal heat conduction skeleton of pitch-based carbon fibers was sequentially formed. The thermal conductivities from room temperature to 500 °C along through-thickness direction and in-plane direction were investigated. The results showed that Cpf/SiC composites with heat transfer channels possessed excellent thermal conductvity in two directions, and the thermal conductivity increased with increasing volume content of heat transfer channels. The thermal conductivity in through-thickness direction reached 38.89 W/(m·K), and that for in-plane direction reached 112.42 W/(m·K). Theoretical calculations were empolyed to study the temperature dependence of the Cpf/SiC composites. The variations in slope A′ and intercept B′ values of fitted curves were in good agreement with the experimental results. To verify the reliablilty of the theoretical model, the Cpf/SiC composites were heated at 1650 °C for 2 h and the thermal conductivity exhibited further improvement due to the formation of more perfect crystalline structure. Thermal conductivity through thickness direction improved to 43.49 W/(m·K), and that in in-plane direction improved to 142.49 W/(m·K), which could be identified by the theoretical model. Finally, the leading edge model was established by using ABAQUS finite element analysis software to evaluate the potential application of the composites. Owing to the outstanding thermal conductivity, the leading edge obtained by using Cpf/SiC composites in this study exhibited lower temperature gradient and a more uniform temperature distribution. Moreover, less thermal stress and displacement were generated during heating process.  相似文献   

20.
《Ceramics International》2023,49(20):33247-33254
In this study, a series of porous ceramics were prepared using different ratios of small and large size MA hollow ceramic spheres as pore-forming agents, and their thermal insulation properties were investigated. The results showed that increasing the proportion of small size hollow ceramic spheres could effectively decrease the thermal conductivity and improve the compressive strength of the porous ceramics. The optimal porous ceramic was prepared with a ratio of 10∼50 of small and large size hollow ceramic spheres, which had a thermal conductivity of 0.368 W/(m·K) at 800 °C and a compressive strength of 22.43 MPa. Microscopic analysis indicated that the enhanced thermal insulation and mechanical properties were due to the improved pore structure and the enhanced bonding strength between the ceramic spheres and the matrix. The findings provide valuable insights for the development of high-performance thermal insulation materials.  相似文献   

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