Analog piezoelectric-driven tunable gratings with nanometer resolution

This work presents the design, fabrication, and characterization of a piezoelectrically actuated MEMS diffractive optical grating, whose spatial periodicity can be tuned in analog fashion to within a fraction of a nanometer. The fine control of the diffracted beams permits applications in dense wavelength-division multiplexing (DWDM) optical telecommunications and high-resolution miniaturized spectrometers. The design concept consists of a diffractive grating defined on a deformable membrane, strained in the direction perpendicular to the gratings grooves via thin-film piezoelectric actuators. The tunable angular range for the first diffracted order is up to 400 /spl mu/rad with 0.2% strain (/spl sim/8 nm change in grating periodicity) at 10 V actuation, as predicted by device modeling. The actuators demonstrate a piezoelectric d/sub 31/ coefficient of -100 pC/N and dielectric constant /spl epsiv//sub r/ of 1200. Uniformity across the tunable grating and the out-of-plane deflections are also characterized and discussed.     

Low-voltage, large-scan angle MEMS analog micromirror arrays with hidden vertical comb-drive actuators

This paper reports on novel polysilicon surface-micromachined one-dimensional (1-D) analog micromirror arrays fabricated using Sandia's ultraplanar multilevel MEMS technology-V (SUMMiT-V) process. Large continuous DC scan angle (23.6/spl deg/ optical) and low-operating voltage (6 V) have been achieved using vertical comb-drive actuators. The actuators and torsion springs are placed underneath the mirror (137/spl times/120 /spl mu/m/sup 2/) to achieve high fill-factor (91%). The measured resonant frequency of the mirror ranges from 3.4 to 8.1 kHz. The measured DC scanning characteristics and resonant frequencies agree well with theoretical values. The rise time is 120 /spl mu/s and the fall time is 380 /spl mu/s. The static scanning characteristics show good uniformity (相似文献   

Microelectromechanical digital-to-analog converters of displacementfor step motion actuators

This paper presents a novel micromechanism for precise positioning by using an N-bit digital code. The mechanism is an N-stage network of connected suspensions, in which an electrostatic actuator is attached to the longer suspensions of compliance 2C, and N of such unit structures are connected side by side with the shorter suspensions of compliance C. Each actuator is an electrostatic shuttle moving back and forth between the driving electrodes, and is operated by the corresponding digit of the input code. The N-bits of local displacement accumulate in the suspension network to synthesize an analog output, which is proportional to the analog value coded with the N-bit input. The output displacement is independent of the fluctuation of the driving voltage since the traveling distance of the shuttle is clipped by mechanical stoppers. We call the mechanism a microelectromechanical digital-to-analog converter (MEMDAC) since the function is equivalent to the electrical digital-to-analog converter known as the R-2R resistor network. Three different types of MEMDAC's are compared. Preliminary results of a silicon micromachined 4-bit MEMDAC successfully showed a total stroke of 5.8 μm with a step of 0.38 μm. The positioning resolution can be made finer by simply increasing the number of chained units     

Gimbal-less MEMS two-axis optical scanner array with high fill-factor

In this paper, we report on a MEMS-based two-axis optical scanner array with a high fill factor (>96%), large mechanical scan angles (/spl plusmn/4.4/spl deg/ and /spl plusmn/3.4/spl deg/), and high resonant frequencies (20.7 kHz). The devices are fabricated using SUMMiT-V, a five-layer surface-micromachining process. High fill factor, which is important for 1/spl times/N/sup 2/ wavelength-selective switches (WSSs), is achieved by employing crossbar torsion springs underneath the mirror, eliminating the need for gimbal structures. The proposed mirror structure can be readily extended to two-dimensional (2-D) array for adaptive optics applications. In addition to two-axis rotation, piston motion with a stroke of 0.8 /spl mu/m is also achieved. [1496].     

Two-axis single-crystal silicon micromirror arrays

This work presents the design, fabrication, and testing of a two-axis 320 pixel micromirror array. The mirror platform is constructed entirely of single-crystal silicon (SCS) minimizing residual and thermal stresses. The 14-/spl mu/m-thick rectangular (750/spl times/800 /spl mu/m/sup 2/) silicon platform is coated with a 0.1-/spl mu/m-thick metallic (Au) reflector. The mirrors are actuated electrostatically with shaped parallel plate electrodes with 86 /spl mu/m gaps. Large area 320-mirror arrays with fabrication yields of 90% per array have been fabricated using a combination of bulk micromachining of SOI wafers, anodic bonding, deep reactive ion etching, and surface micromachining. Several type of micromirror devices have been fabricated with rectangular and triangular electrodes. Triangular electrode devices displayed stable operation within a (/spl plusmn/5/spl deg/, /spl plusmn/5/spl deg/) (mechanical) angular range with voltage drives as low as 60 V.     

Vertical comb array microactuators

A vertical actuator fabricated using a trench-refilled-with-polysilicon (TRiPs) process technology and employing an array of vertical oriented comb electrodes is presented. This actuator structure provides a linear drive to deflection characteristic and a large throw capability which are key features in many sensors, actuators and micromechanisms. The actuation principle and relevant theory is developed, including FastCap simulations for theoretical verification. Design simplifications have been suggested that enable one to use parallel plate analytical expressions which match simulation results with /spl sim/5.6% error. Several actuators were designed and fabricated using the 7-mask TRiPs technology with calculated drive voltages as low as 45 V producing 10 /spl mu/m of deflection. The actuators employed a mechanical structure that was 18 /spl mu/m tall using a polysilicon layer 1.5 /spl mu/m thick and occupying a total area of 750 /spl mu/m by 750 /spl mu/m. The actuators were successfully tested electrostatically and several microns of deflection were observed.     

A micromachined reaction force actuator (RFA) for a nanomanipulator preparation

A reaction force actuator (RFA) was fabricated to translate a microstage with nanostep movement, and its performance was experimentally evaluated using an optical fiber based built-in microinterferometer. The proposed RFA consists of a shuttle mass, movable electrode, fixed electrode, springs, and spring anchor, all of which reside on the movable substrate. The RFA placed on the platform is free to move when the driving force is larger than the static friction. The fixed electrodes are gold-wired to the external electrodes on the platform covered with a dielectric layer for electrical isolation. When external voltage is applied to the electrodes, the springs experience deflections, and the electrostatic force and restoring force react on the movable substrate through the spring anchor and the fixed electrode, respectively. If the driving voltage is large enough that the resultant force overcomes the friction from the platform, the RFA including the movable substrate can make a displacement with no physical collision between the movable and fixed electrodes. In order to suppress the drift motion due to external noise, electrostatic pressure was applied between the movable substrate and the platform on which a 100-/spl mu/m-thick dielectric thin film is positioned. The nanomotion of the fabricated actuator was evaluated with various voltages using an optical fiber interferometer. The minimum step movement 1.21/spl plusmn/0.24 nm was experimentally obtained at the driving voltage of 18 V, and the estimated total displacement was 450 nm at the highest affordable driving voltage of 85 V.     

High-Accuracy Digital-to-Analog Actuators Using Load Springs Compensating Fabrication Errors

We present a high-accuracy digital-to-analog (DA) actuator using a linear load spring capable of compensating the output displacement errors caused by fabrication errors. The load spring is designed to modify the modulation line slope in the presence of fabrication errors, thus reducing the output displacement errors. We compare three prototypes including the uncompensated design, the compensated design at the fabrication error of delta=0, and the compensated design in the fabrication error range of -0.3 mum相似文献   

Surface- and bulk- micromachined two-dimensional scanner driven by angular vertical comb actuators

In this paper, we present the design, fabrication, and measurements of a two-dimensional (2-D) optical scanner with electrostatic angular vertical comb (AVC) actuators. The scanner is realized by combining a foundry-based surface-micromachining process (Multi-User MEMS Processes-MUMPs) with a three-mask deep-reactive ion-etching (DRIE) postfabrication process. The surface-micromachining provides versatile mechanical design and electrical interconnect while the bulk micromachining offers high-aspect ratio structures leading to flat mirrors and high-force, large-displacement actuators. The scanner achieves dc mechanical scanning ranges of /spl plusmn/6.2/spl deg/ (at 55 Vdc) and /spl plusmn/4.1/spl deg/ (at 50 Vdc) for the inner and outer gimbals, respectively. The resonant frequencies are 315 and 144 Hz for the inner and the outer axes, respectively. The 1-mm-diameter mirror has a radius of curvature of over 50 cm. [1454].     

Design and characterization of an electrothermally driven monolithic long-stretch microdrive in compact arrangement

An electrothermally driven long stretch microdrive (LSMD) is presented for planar rectilinear motions in hundreds of micrometers. Design concept is based on connecting several actuation units in series to form a cascaded structure to accumulate relative displacement of each unit, and two cascaded structures are further arranged in parallel by a connection bar to double output force. The proposed area-saving design features monolithic compliant structure in compact arrangement to achieve long stroke. In experiments, the maximum reversible operating voltage is 3 V. In addition, the voltage-displacement relation shows good linearity within /spl plusmn/5% in 0.5-3.0 V. Fabricated nickel LSMD can generate displacement up to 215 /spl mu/m (W=8 /spl mu/m, /spl theta/=0.2/spl deg/, D=34 /spl mu/m) at 3 dc volts (669 mW). The maximum operation temperatures of tested LSMDs at 3 V are below 300 /spl deg/C. Output forces up to 495 /spl mu/N are measured by in situ passive micromechanical test beams. The LSMD can be operated at 100 Hz without degradation on displacement. Two geometrical design parameters, bent angle and constraint bar width, are also investigated analytically and experimentally.     

Large-Stroke Dielectric Elastomer Actuators With Ion-Implanted Electrodes

In this paper, we present miniaturized polydimethylsiloxane (PDMS)-based diaphragm dielectric elastomer actuators capable of out-of-plane displacement up to 25% of their diameter. This very large percentage displacement is made possible by the use of compliant electrodes fabricated by low-energy gold ion implantation. This technique forms nanometer-scale metallic clusters up to 50 nm below the PDMS surface, creating an electrode that can sustain up to 175% strain while remaining conductive yet having only a minimal impact on the elastomer's mechanical properties. We present a vastly improved chip-scale process flow for fabricating suspended-membrane actuators with low-resistance contacts to implanted electrodes on both sides of the membrane. This process leads to a factor of two increase in breakdown voltage and to $RC$ time constant shorter than mechanical time constants. For circular diaphragm actuator of 1.5–3-mm diameter, voltage-controlled static out-of-plane deflections of up to 25% of their diameter is observed, which is a factor of four higher than our previous published results. Dynamic characterization shows a mechanically limited behavior, with a resonance frequency near 1 kHz and a quality factor of 7.5 in air. Lifetime tests have shown no degradation after more than 4 million cycles at 1.5 kV. Conductive stretchable electrodes photolithographically defined on PDMS were demonstrated as a key step to further miniaturization, enabling large arrays of independent diaphragm actuators on a chip, for instance for tunable microlens arrays or arrays of micropumps and microvalves.$ hfill$[2009-0107]      

Position control of parallel-plate microactuators for probe-based data storage

In this paper, we present the use of closed-loop voltage control to extend the travel range of a parallel-plate electrostatic microactuator beyond the pull-in limit. Controller design considers nonlinearities from both the parallel-plate actuator and the capacitive position sensor to ensure robust stability within the feedback loop. Desired transient response is achieved by a pre-filter added in front of the feedback loop to shape the input command. The microactuator is characterized by static and dynamic measurements, with a spring constant of 0.17 N/m, mechanical resonant frequency of 12.4 kHz, and effective damping ratio from 0.55 to 0.35 for gaps between 2.3 to 2.65 /spl mu/m. The minimum input-referred noise capacitance change is 0.5 aF//spl radic/Hz measured at a gap of 5.7 /spl mu/m, corresponding to a minimum input-referred noise displacement of 0.33 nm//spl radic/Hz. Measured closed-loop step response illustrates a maximum travel distance up to 60% of the initial gap, surpassing the static pull-in limit of one-third of the gap.     

Optimal algorithms for the channel-assignment problem on a reconfigurable array of processors with wider bus networks

The computation model on which the algorithms are developed is the reconfigurable array of processors with wider bus networks (abbreviated to RAPWBN). The main difference between the RAPWBN model and other existing reconfigurable parallel processing systems is that the bus width of each network is bounded within the range [2,[/spl radic/(N)]]. Such a strategy not only saves the silicon area of the chip as well as increases the computational power enormously, but the strategy also allows the execution speed of the proposed algorithms to be tuned by the bus bandwidth. To demonstrate the computational power of the RAPWBN, the channel-assignment problem is derived in this paper. For the channel-assignment problem with N pairs of components, we first design an O(T + [N//spl omega/]) time parallel algorithm using 2N processors with a 2N-row by 2N-column bus network, where the bus width of each bus network is /spl omega/-bit for 2 /spl les/ /spl omega/ /spl les/ [/spl radic/N] and T = [log/sub /spl omega//N] + 1. By tuning the bus bandwidth to the natural log N-bit and the extended N/sup 1/c/-bit (N/sup 1/c/ > log N) for any constant c and c /spl ges/ 1, two more results which run in O(log N/log log N) and O(1) time, respectively, are also derived. When compared to the algorithms proposed by Olariu et al. [17] and Lin [14], it is shown that our algorithm runs in the equivalent time complexity while significantly reducing the number of processors to O(N).     

High-resolution electrostatic analog tunable grating with a single-mask fabrication process

We present the design, modeling, fabrication, and characterization of the microelectromechanical systems (MEMS) analog tunable diffraction grating with the concept of transverse actuation. In contrast to the vertically actuated "digital" tunable grating, our prototype design trades angular tunable range for tuning resolution. The prototype shows an angular tunable range of 250 /spl mu/rad with 1-/spl mu/rad resolution at 10 V. Grating pitch changes corresponding to the full range and resolution are 57 nm and 2.28 /spl Aring/, respectively confirmed by experimental measurement and theoretical calculation. Simulation shows that subradian tunable range is feasible with better lithographic design rules or higher actuation voltage. The single-mask fabrication process offers several advantages: 1) Excellent optical flatness; 2) ease of fabrication; and 3) great flexibility of device integration with existing on-chip circuitry. Tunable gratings such as the one presented here can be used for controlling dispersion in optical telecommunications, sensing, etc., applications.     

Torque multiplication and stable range tradeoff in parallel plate angular electrostatic actuators with fixed DC bias

The nonlinear torque-voltage characteristics in two-terminal electrostatic actuators can be utilized to magnify the torque generated by a drive voltage applied to one electrode if a fixed dc bias is applied to the other. The resulting torque is enhanced by torque gain factor G/sub /spl tau//>1, and the drive voltage is effectively multiplied by voltage gain factor G/sub V/>1 compared to that of an actuator with no dc bias. These gain factors are generated at the expense of a reduced stable range. In this paper, we study and determine experimentally the tradeoff between torque and voltage gains versus stable range for one-dimensional (1-D), three-terminal, parallel-plate angular electrostatic actuators under dc bias. Simple approximate analytical relations are derived for voltage and torque gain as functions of applied dc bias voltage. We demonstrate that for voltage gains of 2-4, the angular range is marginally reduced. [1361].     

Monolithic fringe-field-activated crystalline silicon tilting-mirror devices

A new approach is presented for fabricating monolithic crystalline silicon tilting-mirror microoptoelectromechanical systems (MOEMS) devices. The activation electrodes, etched from a thick silicon layer deposited over insulating oxide onto the top surface of a silicon-on-insulator (SOI) wafer, are displaced from the mirrors and interact with these tilting elements via electrostatic fringing fields. In contrast to the more usual parallel-plate activation, the rotation angle saturates at high voltages. This paper discusses concept, design, and processing, and also compares modeling and measured performance of a specific 9/spl deg/ tilt range device array.     

A wafer-scale membrane transfer Process for the fabrication of optical quality, large continuous membranes

This paper describes a new fabrication technique developed for the construction of large area mirror membranes via the transfer of wafer-scale continuous membranes from one substrate to another. Using this technique, wafer-scale silicon mirror membranes have been successfully transferred without the use of sacrificial layers such as adhesives or polymers. This transfer technique has also been applied to the fabrication and transfer of 1 /spl mu/m thick corrugated membrane actuators. These membrane actuators consist of several concentric-ring-type corrugations constructed within a polysilicon membrane. A typical polysilicon actuator membrane with an electrode gap of 1.5 /spl mu/m, fabricated using the wafer-scale transfer technique, shows a vertical deflection of 0.4 /spl mu/m at 55 V. The mirror membranes are constructed from single-crystal silicon, 10 cm in diameter, and have been successfully transferred in their entirety. Using a white-light interferometer, the measured average peak-to-valley surface figure error for the transferred single-crystal silicon mirror membranes is approximately 9 nm as measured over a 1 mm/sup 2/ membrane area. The wafer-scale membrane transfer technique demonstrated in this paper has the following benefits over previously reported transfer techniques: 1) No postassembly release process to remove sacrificial polymers is required. 2) The bonded interface is completely isolated from any acid, etchant, or solvent during the transfer process, ensuring a clean and uniform membrane surface. 3) Our technique is capable of transferring large, continuous membranes onto substrates.     

Large-stroke MEMS deformable mirrors for adaptive optics

Surface-micromachined deformable mirrors that exhibit greater than 10 /spl mu/m of stroke are presented. The segmented arrays described here consist of 61 and 85 hexagonal, piston/tip/tilt mirrors (three actuators each) with diameters of 500 and 430 /spl mu/m, respectively, and fill a 4 mm circular aperture. Devices were packaged in 208 and 256 pin-grid arrays and driven by a compact control board designed for turn-key operation. After metallization and packaging mirror bow is /spl sim/680 nm (/spl lambda//1), but a heat-treatment procedure is proposed for controlling mirror curvature to better than /spl lambda//10. An optical test bed was used to demonstrate basic beam splitting and open-loop aberration correction, the results of which are also presented.     

Design of large deflection electrostatic actuators

Electrostatic, comb-drive actuators have been designed for applications requiring displacements of up to 150 /spl mu/m in less than 1 ms. A nonlinear model of the actuator relates the resonant frequency and the maximum stable deflection to the actuator dimensions. A suite of experiments that were carried out on deep reactive ion etched (DRIE), single-crystal silicon, comb-drive actuators confirm the validity of the model. Four actuator design improvements were implemented. First, a folded-flexure suspension consisting of two folded beams rather than four and a U-shaped shuttle allowed the actuator area to be cut in half without degrading its performance. Second, the comb teeth were designed with linearly increasing lengths to reduce side instability by a factor of two. Third, the folded-flexure suspensions were fabricated in an initially bent configuration, improving the suspension stiffness ratio and reducing side instability by an additional factor of 30. Finally, additional actuation range was achieved using a launch and capture actuation scheme in which the actuator was allowed to swing backward after full forward deflection; the shuttle was captured and held using the backs of the comb banks as high-force, parallel-plate actuators.     

Deep-reactive ion-etched compliant starting zone electrostatic zipping actuators

This paper presents the modeling, design, fabrication and testing of monolithic electrostatic curved-electrode zipping actuators fabricated by deep reactive ion etching (DRIE). In contrast to traditional curved-electrode zipping actuators, the design of the actuators presented here utilizes a compliant starting cantilever to significantly reduce the initial pull-in voltage by closing the gap (kerf) generated by DRIE. Thus, the actuators achieve high actuation force at a relatively low voltage. For example, two actuators each with dimensions of 4.5 mm*100 /spl mu/m*300 /spl mu/m are used to drive a bistable MEMS relay. Together, the two actuators provide up to 10 mN of force over their 80 /spl mu/m stroke at 140 V. Measurements of the force-displacement relation of these actuators confirm theoretical expectations based both on numerical and analytical methods. Finite element analysis is employed to predict the behavior of the complete bistable relay system. [1231].