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键合金丝的合金化研究动向 总被引:4,自引:3,他引:1
根据最新的专利文献综述了高弧度,低弧度,高强度键合金丝的发展现状,介绍了微量添加元素的作用和Au-Cu-Ca,Au-Ag,Au-Ni,Au-Sn(In),Au-Pt(Pd)等合金化键合金丝的研究动向,以及键合金丝的微量添加元素复合化,组成合金化,加工细线化,低成本化的发展趋势。 相似文献
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C. D. Breach 《Gold bulletin》2010,43(3):150-168
Thermosonic ball bonding is a major interconnect process in microelectronics packaging and is positioned to remain one of
the key process technologies available to package designers in the near future. However, the main wire material used in fine
pitch (FP) and ultra-fine pitch (UFP) ball bonding is gold and with significant increases in gold price, gold ball bonding
has become a more costly process that has a considerable economic effect on the assembly of packages used in consumer electronics.
An alternative wire material to gold is copper, which is much cheaper and has several technical benefits including better
electrical conductivity and has been widely used in discrete and power devices with wire diameters typically larger than 30μm
in diameter for many years. However, copper wire behaves quite differently than gold due to its different physical properties,
some of which are beneficial and others detrimental to bonding performance. In this article, we briefly review some of the
advantages and difficulties with using copper wire advanced packaging and explain why copper cannot replace gold in many applications
and why gold offers significant benefits. 相似文献
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在半导体制造工艺中,Al焊盘表面的氧化膜会阻碍金丝键合。针对某公司新半导体工艺中出现键合失效问题的芯片,采用SEM,EDS和AES对切片前后的芯片进行了分析,结果发现,切片前后Al焊盘表面的元素成分基本一致。可以认为清洗工艺对金丝键合基本没有影响,它不是导致金丝键合失效的原因;通过AES对焊盘进行深度剖析,在深度接近Al焊盘高度的一半时,氧的含量仍然高达40%左右,如此高含量的氧已经足以将Al完全氧化,其所形成的氧化膜阻碍了金丝键合所必需的金属连接和扩散过程,从而导致键合质量差,甚至无法实现键合。 相似文献
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射频器件超细引线键合射频性能仿真 总被引:1,自引:1,他引:0
随着雷达性能指标不断提高、体积不断压缩,作为其关键组成部分成之一的T/R(transmitter and receiver)组件也不断向小型化和高密度方向发展. 采用超高密度引线键合技术能够实现高密度射频器件封装,但也会带来键合焊点可靠性下降、电路射频性能差等问题. 针对键合线尺寸减小而引起射频性能下降的问题,采用HFSS软件探究了在0 ~ 20 GHz金带尺寸变化对电路射频性能的影响规律,并利用ANSYS Q3D和ADS软件对超细引线键合的电路进行阻抗匹配. 结果表明,对于金丝和金带而言,插入微带双枝短截线匹配结构均能明显提高电路的射频性能. 对于类型1结构,S21与S12的传输功率能达到?0.049 dB. 对于类型2结构,S21与S12的传输功率能达到?7.245 × 10?5 dB,说明类型2结构下的信号传输几乎无损耗. 该结果为超细引线键合技术在射频电路中的应用提供了理论指导. 相似文献
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半导体微电子技术用贵金属材料的应用与发展 总被引:1,自引:1,他引:0
贵金属具有良好的化学稳定性,高电导率和热导率,特有的电学、磁学、光学等性能,是发展半导体微电子技术必不可少的材料.文章综述了半导体器件欧姆接触、线路和电极、金属化系统、半导体包封,以及化合物半导体、液体金属离子源等用贵金属材料的应用和发展. 相似文献
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介绍超细金丝的生产及其对生产环境和原料的要求,金丝的品种类型和化学成分,金丝的力学性能及其与键合特性的关联.着重介绍两种主要的生产方法和技术特点,讨论金丝代用材料的研制情况. 相似文献
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用电子背散射衍射仪对具有不同力学特征金丝的微区组织进行表征,采用扫描电镜和光学显微镜观察线弧轮廓、热影响区和焊点形貌,并通过推拉力测试仪测量线弧拉力和焊球剪切力,分析金丝力学特征对球键合质量的影响。结果表明:半硬态1和半硬态2的金丝芯部保持纤维状组织,边缘晶粒为细小的等轴晶,沿径向微区组织形貌有明显差异。打火烧球后形成的热影响区长度短,球颈部的组织有明显的梯度性,键合后弧高较小。软态金丝的组织为粗大的等轴晶,沿径向分布均匀,键合拉力低,易发生滑球现象。半硬态2金丝与焊盘的结合力强,引线键合拉力高,综合键合质量优,是最适合球键合工艺的金丝。 相似文献
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综述了目前制备高纯金的各种方法的原理及工艺,并对其优缺点进行了分析。化学还原分离法效率高、周期短,但酸耗大、污染严重;熔融氯化法对原料适应范围广,但存在氯化过程复杂、工艺难于精准控制和产品质量不稳定等不足;溶剂萃取法效率高、产品质量稳定,但试剂消耗大、有机污染严重和易燃易爆;电解法具有成本低、除杂效果好、产品纯度稳定性强及环境污染小的优点,但原料适应性相对较差、生产周期相对较长且会积压金。高纯金具体应用形式为键合用金丝、溅射靶材及高纯度金基合金,涉及电子、半导体及航空航天等领域。 相似文献
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Fine gold wires with diameters down to 15μm are used for bonding semiconductor devices. Increasing miniaturization of electronic circuits calls for smaller wire diameters. This requires the development of gold wires with increased mechanical strength and good bondability to replace thicker wire diameters without detriment to their functionality. The first gold bonding wires were pure gold, and then doped gold wires of high purity were developed because of their stabilized and improved mechanical characteristics. Nowadays and in the near future low alloyed gold wires are increasingly replacing doped gold wires. This paper gives an overview of the mechanical characteristics of doped and low-alloyed gold bonding wires and their bondability. 相似文献
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Marian Zeman 《Welding International》2013,27(2):83-90
This study evaluated both the joint strength of copper wire on a copper substrate with tin plating and the joint reliability of copper wire bonding after heat treatment. The suitable tin thickness and bonding conditions, which are stage temperature, wire bonding power and bonding time, were chosen by the peel test after copper wire bonding. Tin thickness of 10 m showed a high bonding rate under the conditions of stage temperature 373 K, bonding power 500–700 mW and bonding time 30 50 ms. Before heat treatment, the peel strength of the copper wire on the copper substrate with tin plating conditions was weaker than that of gold wire on a gold substrate. After heat treatment for more than 70 h at 298 K, the peel strength of the copper wire became higher than that of the gold wire and twice as high as the initial bonding strength. The tin layer remained between the copper wire and copper substrate before heat treatment. When the samples were held at 298 K, tin reacted with copper and turned into a Cu–Sn intermetallic compound. Upon completion of this reaction at 298 K for over 70 h, the soft tin layer between the copper wire and copper substrate disappeared. Therefore, the peel strength of copper wire after heat treatment increased. These results were observed by scanning electron microscope images of the interface between the copper wire and copper substrate before and after heat treatment. 相似文献
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Seoung-Bum Son Hyunchul Roh Suk Hoon Kang Hee-Suk Chung Do Hyun Kim Yong Seok Choi Jong Soo Cho Jeong-Tak Moon Kyu Hwan Oh 《Gold bulletin》2011,44(4):231-237
Inhomogeneous microtexture evolution during the cold drawing process usually results in lean, sway, or sweep failure. The
<111> longitudinal fiber texture has higher stiffness than the <100> texture and its proportion and distribution in the cross-section
are critical for the bonding stability of fine gold wire. We investigated the inhomogeneous microtexture evolution of gold
wire that was cold drawn through an asymmetric diamond die. In this study, the distributions of the <111> and <100> textures
in a 20 μm diameter fine gold wire are the variables and their effects on the bonding stability of the wire were estimated
by electron backscattered diffraction (EBSD) and finite element method (FEM) simulations. The use of a focused ion beam apparatus
enabled a high quality of band contrast of the EBSD to be achieved in the exact half cross-sectional area of the fine gold
wire. The detailed three-dimensional FEM results show that the asymmetric distribution of the textures plays a crucial role
in increasing the spatial displacement of the gold bonding wire. 相似文献
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利用"热—力—超声"增量耦合有限元模型,对采用不同引线(金,铜)以及采用铜引线在不同银镀层厚度(48,1,6μm)条件下的键合过程进行了模拟.结果表明,在其它条件不变的情况下,金引线键合过程对硅基板内应力状态的影响远小于铜引线,且应力集中的位置更接近键合中心;随着镀层厚度的增加,基板所受到的压应力逐渐减小,但基板所受到的最大压应力在硅的抗压力范围之内;同时基板所受到的剪应力也逐渐减小,由于剪应力是硅基板损坏的决定性因素,因此采用厚度为16μm的镀层对减小基板损坏更有利. 相似文献
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采用金相显微镜、双束离子显微镜、高低温拉力仪及纳米压痕仪对不同真应变条件的金包银复合键合丝的组织和力学性能进行表征,研究了金包银复合键合丝的组织结构演变、力学性能及变形行为特点。结果表明:金包银复合键合丝的银合金芯材沿着拉伸方向从胞状树枝晶演变为纤维组织,靠近界面的过渡层始终保持细小的等轴晶或球状晶粒,金包覆层在变形过程中均匀连续。各组分在变形过程中尺寸变化不一致,拟合后的尺寸变化常数与试样直径的变化不成正比。显微硬度、抗拉强度、延伸率均随着变形量的增加而增大。在单轴拉伸过程中,金包银复合键合丝组分之间相互制约,使单向拉应变变为复杂的二维应力状态,交替变化的应力状态可抑制裂纹的形核,提高材料的塑性和韧性。 相似文献
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Muhammad Nubli Zulkifli Shahrum Abdullah Norinsan Kamil Othman Azman Jalar 《Gold bulletin》2012,45(3):115-125
The bonding mechanisms of gold, to give the desired strength of wire bonding, still require detailed investigation, including establishing adequate and reliable testing procedures. The current practices for analysing the mechanisms of wire bonding are inadequate and do not provide a comprehensive picture. This is because the focus of the tests is not clear, which causes variation in the results obtained, changing the conclusions about the responsible mechanism. Furthermore, as the size of Au wire bonds decreases, the mechanism responsible for thermosonic Au wire bonding may change. This paper provides a comprehensive analysis of the current and possible future methods for elaborating the bonding mechanism and strength of thermosonic Au wire bonds. We discuss the testing methods, their limitations and advantages, and suggest ways in which they can be improved. 相似文献
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Cratering on thermosonic copper wire ball bonding 总被引:1,自引:0,他引:1
Copper wire bonding offers several mechanical and electrical advantages as well as cost saving compared to its gold wire predecessor.
Despite these benefits, silicon cratering, which completes the fracture and removal of bond pad underlayers, has been a major
hurdle to overcome in copper wire bonding. Copper wire is harder than gold, and thus needs greater ultrasonic power and bond
force to bond it onto metal pads such as aluminum. This paper reports a study on the influence of wire materials, bond pad
hardness, and bonding-machine parameters (i.e., ultrasonic power and bond force) on silicon cratering phenomenon. Ultrasonic
power and z-axis bond force were identified as the most critical bonding machine parameters in silicon cratering defects. A combination
of greater bond force and lower ultrasonic power avoids silicon cratering and gives the desired effects. Results also show
that a harder bond pad provides relatively good protection from silicon cratering. 相似文献