SiO2薄膜辅助硅玻璃热键合技术的研究

为了解决Si和普通玻璃进行直接键合时材料的热失配问题，提出了利用SiO2薄膜辅助进行硅玻璃热
键合（SGTB）的技术.通过分析SiO2薄膜辅助SGTB技术的化学物理过程，对键合过程中的工艺条件进行了
优化.利用反应离子束蚀刻（RIBE）对基片进行抛光，使得键合表面达到2 nm级的表面粗糙度.在大气的环
境下将处理过的玻璃、Si基片干燥，进行预键合.预键合好的Si、玻璃基片在200℃的氧化环境下退火，基
片之间的硅烷醇键发生聚合反应，形成硅氧键键合.实验结果表明，硅和玻璃基片的表面能经过预键合后
有了提高，水分子和Si表面SiO2中的氧原子交连在一起，OH-数量增加，形成硅烷醇键.Si表面热生长SiO2
薄膜的存在，减少了由Si、玻璃热膨胀系数和热传导系数差异引起的诱导应力.     

非超净条件下玻璃微流控芯片加工工艺

为了解决玻璃微流控芯片加工工艺对专业实验室的依赖问题，提出了一种非超净环境下玻璃材料微加工工艺.该工艺包含湿法刻蚀和高温键合两项关键技术，针对刻蚀工艺中高刻蚀速率与高刻蚀表面质量兼具的工艺目标，研究了多种刻蚀剂成分及配比等条件对刻蚀效果的影响，并描述了具体工艺流程与工艺参数.在高温键合工艺试验中针对表面亲和处理、抽真空预键合以及键合温度时序控制等方面进行研究，重点讨论了非超净环境下高效预键合方法.结果表明，所研究的湿法刻蚀和高温键合两项工艺具有简单、高效、设备依赖性低等特点，突破了超净环境对玻璃微加工技术的限制.     

常温低真空键合设备和键合质量的评价

键合工艺是微机电系统的重要工艺,是制作MEMS器件成功的关键.基于硅-硅键合技术,设计了一种能在低洁净、室温、常压环境下使用的低真空键合设备.介绍了基于该键合设备的键合工艺及键合质量的评价办法及标准.使用该设备对不同材质的样品进行键合实验,结果表明,键合出来的样品结合强度高,键合面没有缺陷,表明该设备有一定的实用性.     

MEMS中的静电-热键合技术

在研制压力传感器时,采用静电一热键合相结合的方法,对Si／Au—Glass、Si／Au—Glass／Si结构的键合技术进行了研究．硅与淀积有金加热器引线玻璃的封接：先以Si／Glass静电键合方法进行,再400℃退火2h,使Si／Au热键合．用一次充氮真空检漏法对键合形成的绝压腔进行了测试,结果显示：键合界面接合牢固、气密．此技术被用于Si／Au—Glass／Si结构自检测压力传感器的键合封接,经对传感器测试,性能良好,具有自检测功能．     

厚膜金丝与金导体的超声键合研究

介绍了厚膜金丝与金导体超声键合遇到的工艺问题,并用破坏性拉力和温度循环试验方法,分别在室温和其它环境下试验后,测试金丝与金导体超声键合的性能.分析了金丝与金导体键合的可靠性问题,总结了金丝键合失效的原因,并提出了改进的措施.     

UHV/CVD生长亚微米薄硅外延层及其高频器件研制

为获得亚微米级的薄硅外延层,从而提高硅器件的工作频率,利用自行研制的一台新型超高真空化学气相沉积(UHV/CVD)系统生长用于高频器件的超薄外延层,该系统由气路部分、控制部分、主体部分组成,反应室本底真空可达5.0×10-8Pa,能够实现在超净环境下低温、低压外延生长.利用该系统在重掺硅衬底上成功生长出了高质量的亚微米薄硅单晶层,外延层厚度为0.1～0.5μm,掺杂浓度为1×1017cm3,过渡区非常窄,达到了制备高频器件的要求;并在此基础上制备出了高频肖特基二极管原型器件,由I-V测试并经过计算,截止频率可达31 GHz.     

厚膜金丝与金导体的超声键合研究

介绍了厚膜金丝与金导体超声键合遇到的工艺问题，并用破坏性拉力和温度循环试验方法，分别在室温和其它环境下试验后，测试金丝与金导体超声键合的性能．分析了金丝与金导体键合的可靠性问题，总结了金丝键合失效的原因，并提出了改进的措施．     

低温硅灰-硅酸盐水泥复合胶凝体系力学性能及微观结构

目的研究不同温度体系时不同的硅灰掺量对复合胶凝体系的力学性能及微观结构的影响．方法在低温条件下,将体积分数为0、2％、5％、8％、10％的硅灰掺入到硅酸盐水泥中,测试水泥砂浆的抗压、抗折强度,进行SEM扫描电镜分析．结果随着硅灰掺入量的增加,复合胶凝体系的力学性能呈现先增加后降低的趋势,结构趋于密实;当硅灰的掺量达到8％时,复合胶凝体系的14d抗压、抗折强度达到最大值．结论低温环境影响了复合胶凝体系力学性能的发展,硅灰的加入促进了复合胶凝体系的水化,改善了水泥石的微观结构．     

半导体高温压力传感器的静电键合技术

分析了硅－玻璃静电键合机制，讨论了键合强度与玻璃表面、温度、键合电压的关系；通过缓慢降温等措施减小了键合后的残余应力。针对多晶硅高温压力传感器设计研制了一套装置，给出了其工作机制和键合电流－时间（I-t)关系。经大批量键合封接实验，键合的成品率达到95％以上，有效提高了多晶硅高温压力传感器的可靠性。     

p型轻掺多孔硅的发光特性研究

采用阳极氧化法在p型轻掺硅片上制备多孔硅,研究了电解液配比、电流密度和反应时间对多孔硅发光性能的影响.实验研究发现多孔硅形貌随氢氟酸浓度而变化,电流密度、电化学腐蚀时间对多孔硅的发光均有影响.随着氢氟酸浓度和电流密度的增大,多孔硅的光致发光光谱强度先变大后减小;随反应时间的延长,多孔硅的光致发光光谱峰强度增强.氢氟酸浓度、电流密度和反应时间对傅立叶红外光谱中与Si-H、Si-H2键相关的振动峰具有明显影响,且与发光强度的变化相对应.结合多孔硅的成核理论、量子限制理论以及红外光谱中Si-H、Si-H2键红外振动峰的变化解释了上述现象.     

Fabrication and Properties of Degradable PPC/ EVOH/ starch/ CaCO3 Composites

Thermally stable and biodegradable composites from poly (propylene carbonate) (PPC), poly (ethylene-co-vinyl alcohol) (EVOH), starch and CaCO3, were fabricated by melt blending. Differential scanning calorimetry (DSC), differential thermal analysis/ thermal gravimetric analysis (DTA/TGA), tensile test and scanning electron microscope (SEM) were performed to investigate the miscibility, thermal behavior and tensile properties of the PPC/ EVOH/ Starch/ CaCO3 composites. DSC results indicate that the introduction of EVOH could improve the compatibility between PPC and starch to some extent because of the interfacial interaction between PPC and EVOH, leading to an increase in tensile strength. The tensile strength began to decrease when more starch was added due to the aggregation of starch particles. SEM examination showed the good interfacial bonding between the fillers and polymeric components. The incorporation of both EVOH and fillers can greatly increase the thermal stability of PPC matrix. The PPC/ EVOH/ Starch/ CaCO3 composites can be melt processed and can be used as a common biodegradable material for a wide application.     

Fabrication and properties of degradable PPC/EVOH/starch/CaCO<Subscript>3</Subscript> composites

Thermally stable and biodegradable composites from poly （propylene carbonate） （PPC）, poly （ethylene-co-vinyl alcohol） （EVOH）, starch and CaCO3 were fabricated by melt blending. Differential scanning calorimetry （DSC）, differential thermal analysis/thermal gravimetric analysis （DTA/TGA）, tensile test and scanning electron microscope （SEM） were performed to investigate the miscibility, thermal behavior and tensile properties of the PPC/EVOH/Starch/CaCO3 composites. DSC results indicate that the introduction of EVOH could improve the compatibility between PPC and starch to some extent because of the interfacial interaction between PPC and EVOH, leading to an increase in tensile strength. The tensile strength began to decrease when more starch was added due to the aggregation of starch particles. SEM examination showed the good interracial bonding between the fillers and polymeric components. The incorporation of both EVOH and fillers can greatly increase the thermal stability of PPC matrix. The PPC/EVOH/Starch/CaCO3 composites can be melt processed and can be used as a common biodegradable material for a wide application.     

An improved fabrication method for carbon nanotube probe

An improved arc discharge method is developed to fabricate the carbon nanotube probe. In this method, the silicon probe and the carbon nanotube were manipulated under an optical microscope. When the silicon probe and the carbon nanotube were very close, 30-60 V dc or ae was applied between them, and the carbon nanotube was divided and attached to the end of the silicon probe. Comparing with the arc discharge method, the new method need not coat the silicon probe with metal in advance, which can greatly reduce the fabrication difficulty and cost. The fabricated carbon nanotube probe exhibits the good property of high aspect ratio and can reflect the true topography more accurately than the silicon probe.     

碳纳米管增强水泥砂浆在混凝土修补加固中的应用研究

采用8字形新老砂浆抗拉粘结强度的试验方法,研究了不同粘结砂浆粘结材料在不同配比条件下的粘结性能,得到了不同粘结材料抗拉强度的变化规律。试验结果表明,碳纳米管增强水泥砂浆粘结性能良好,适宜作为新老混凝土界面修补材料。     

Microstructure and thermal properties of SiCp/Cu composites with Mo coating on SiC particles

SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of Si Cp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the Si Cp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. Si Cp/Cu composites with a maximum thermal conductivity of 274.056 W/(m·K) and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these Si Cp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices.     

连接温度对氮化硅陶瓷/镍基高温合金部分液相扩散连接接头性能的影响

采用部分液相扩散连接方法 ,利用Nb/Cu/Ni复合层作中间层 ,在连接压力、连接时间、冷却速度一定 ,连接温度变化的条件下对氮化硅陶瓷 /镍基高温合金进行了部分液相扩散连接试验 .通过剪切试验评价连接温度对接头强度的影响和采用SEM研究连接温度对接头微观组织的影响 ,分析了连接温度对氮化硅陶瓷 /镍基高温合金连接接头性能影响的规律     

有机累托面/聚烯烃弹性体协同增韧补强聚丙烯的研究

分别研究了有机累托石粘土(OREC)、聚烯烃弹性体(POE)改性的聚丙烯(PP)以及POE／OREC／PP三元改性体系的冲击强度、拉伸强度及断裂伸长率。结果表明，在粘土添加量为2phr时(per hundred resin)可对PP同时实施增强、增韧。OREC与POE有协同增韧PP的作用。在OREC添加2phr时，POE／OREC／PP复合材料的强度大于相同用量的POE／PP二元体系的强度。在三元体系中，当POE用量15phr时，复合材料的冲击强度比纯PP提高204％，比POE／PP提高15．6％，拉伸强度比纯PP下降15．6％，比POE／PP提高22．6％。扫描电子显微镜分析(SEM)表明，三元体系呈现多相分散，在研究范围内，分散相尺寸越大，粒径分布越宽，复合材料的韧性越高。     

分光光度法测定ZMS-5分子筛催化剂中的硅

建立了ZMS-5分子筛催化剂中硅含量测定的分光光度测定方法。研究中采用Si（Ⅳ）在盐酸介质中与钼酸铵形成硅钼黄杂多酸,再使用抗坏血酸将硅钼黄还原形成硅钼蓝,进行硅的测定。实验研究表明：体系中硅钼蓝的λmax=806 nm,其标准曲线在0.400～4.000 mg/L范围内服从朗伯—比尔定律,相关系数为r=0.999 0。回收率为94.00%～104.9%,RSD为0.30%。可用于ZMS-5分子筛催化剂中硅的分析,结果令人满意。     

钢管拉伸预应力连接器在钢管拉伸试验中的应用

介绍了钢筋拉伸预应力连接器的研制及其结构形式,它的应用,改变了长期以来钢筋强度检验的试验方法,由于试件属弹性理论中所述的薄壁杆件,不满足圣维南原理,为达到或接近“静力等效”的条件,在钢管试件的受力形心,长度及其端部均做了处理,以利于钢管试件达到实心杆件的要求,使钢管拉伸试验受力更加趋于合理,通过15根不同直径钢管（直径72mm,89mm,275mm）进行了拉伸试验,试验效果达到了预期的目的,表明钢管拉伸预应力连接器可以在钢管拉伸试验中广泛应用。它的研制,解决了长期以来液压试验机无法直接试验钢管的问题,简化了钢管试验。     

A MEMS device for <Emphasis Type="Italic">in-situ</Emphasis> TEM test of SCS nanobeam

In-situ tensile testing in TEM (transmission electron microscopy) is a useful tool for studying mechanical properties of nano-structures because it can provide quantitative information on sample deformation at atomic scale. To facilitate in-situ TEM tensile tests of SCS (single crystal silicon) nanobeam, a MEMS tensile-testing chip was designed and fabricated. The chip was fabricated by means of bulk micromachining and wafer bonding techniques. An SCS nanobeam, a comb drive actuator, a force sensor beam and an electron beam window were integrated into the chip. With the on-chip comb-drive-actuator stretching the nanobeam and in-situ TEM observation, tensile test on a 90 nm-thick nanobeam was performed and the strain-stress relationship was obtained. The Young’s modulus was fitted to be 161 GPa and did not show the size effect. Supported by the National Basic Research (973 Program) (Grant No. 2006CB300406)