熔焊

20092106氧化物弥散强化高温合金MGH956的基本焊接性研究/淮军锋…//材料工程.-2008(9):52~55氧化物弥散强化(ODS)高温合金MGH956是机械合金化工艺制造的氧化物弥散强化高温合金,针对MGH956材料采用电子束、氩弧焊、钎焊及扩散处理等连接工艺方法进行了基本的焊接性研究。对接头组织及接头性能进行了测试分析,三种焊接方法室温接头力学性能相当,接头强度系数均达到95%左右,氩弧焊焊缝中的气孔较多,而电子束焊焊缝中气孔相对比较少、室温塑性比较明显。从接头高温强度而言,真空钎焊工艺有明显优势。图3表2参1020092107Ti-Ni合金对SiCp/Al MMCs等离子弧原位焊接焊缝性能的影响/雷玉成…//焊接学报.-2008,29(10):13~16以Ti-Ni合金作为填加材料,采用氮氩混合等离子气对SiCp/Al基复合材料进行等离子弧原位焊接。结果表明,填加Ti-Ni合金进行等离子弧原位焊接,在焊缝组织中生成了新的增强颗粒Ti N,TiC,Al N,Al3Ti和Al3Ni,未发现明显的针状相生成,有效地抑制了脆性相Al4C3,并且接头组织致密,结合较好。Ni元素的添加,降低了SiC溶解程...     

熔焊

20092106氧化物弥散强化高温合金MGH956的基本焊接性研究/淮军锋…//材料工程.-2008(9):52~55氧化物弥散强化(ODS)高温合金MGH956是机械合金化工艺制造的氧化物弥散强化高温合金,针对MGH956材料采用电子束、氩弧焊、钎焊及扩散处理等连接工艺方法进行了基本的焊接性研究。对接头组织及接头性能进行了测试分析,三种焊接方法室温接头力学性能相当,接头强度系数均达到95%左右,氩弧焊焊缝中的气孔较多,而电子束焊焊缝中气孔相对比较少、室温塑性比较明显。从接头高温强度而言,真空钎焊工艺有明显优势。图3表2参1020092107Ti-Ni合金对SiCp/Al MMCs等离子弧原位焊接焊缝性能的影响/雷玉成…//焊接学报.-2008,29(10):13~16以Ti-Ni合金作为填加材料,采用氮氩混合等离子气对SiCp/Al基复合材料进行等离子弧原位焊接。结果表明,填加Ti-Ni合金进行等离子弧原位焊接,在焊缝组织中生成了新的增强颗粒Ti N,TiC,Al N,Al3Ti和Al3Ni,未发现明显的针状相生成,有效地抑制了脆性相Al4C3,并且接头组织致密,结合较好。Ni元素的添加,降低了SiC溶解程...     

IC10合金TLP扩散焊接头拉伸性能研究

TLP扩散焊技术是IC10合金涡轮导向器叶片关键制造工艺之一,TLP扩散焊接头性能直接影响着IC10合金涡轮导向器叶片的使用性能。钎焊工序是继TLP扩散焊工序之后叶片的又一制造工艺,TLP扩散焊对接接头性能及经历了钎焊工序的TLP扩散焊接头性能如何,是文中研究的重点内容。研究发现:IC10合金TLP扩散焊接头性能优良,对接接头横向室温屈服强度R_(p0.2)达到母材相应强度的98%,对接接头纵向室温屈服强度R_(p0.2)达到母材相应强度的89%;IC10合金TLP扩散焊对接接头横向高温抗拉强度达到母材相应强度的99%,对接接头纵向高温抗拉强度达到母材相应强度的98.6%。经历了钎焊循环的TLP扩散焊接头室温和高温拉伸强度均没有明显降低,与TLP扩散焊接头性能相当。     

T91钢管TLP与TIG+MIG焊接接头组织与性能

分别采用瞬时液相扩散焊(TLP)和TIG+MIG对T91钢管进行焊接,通过对比试验,分析了TLP和TIG+MIG焊接接头在力学性能和显微组织上的差异.结果表明:采用TLP焊接T91钢管时,接头抗拉强度和抗弯强度均强于TIG+MIG焊接;接头组织更加均匀细小,与母材接近.得出更低的焊接温度、更短的高温停留时间、合金元素均匀扩散和等温凝同使得TLP焊接接头性能优于TIG+MIG焊接接头.     

钎焊循环对IC10合金TLP扩散焊接头高温持久性能影响

研究了钎焊循环对过渡液相扩散焊(TLP)接头高温持久性能的影响。结果表明:钎焊循环对IC10合金TLP扩散焊接头高温持久性能没有不利影响。IC10合金TLP纵向焊接接头在980℃/100 h的持久强度达到母材相应强度的87%,IC10合金TLP横向接头在980℃/100 h持久强度为120 MPa,达到母材同样条件下持久强度的92%。钎焊循环对TLP扩散焊接头断口形貌影响不大,宏观断口形貌均呈现细小凸凹,高倍微观断口呈现韧窝形貌,表明IC10合金接头为韧性断裂。     

IC10合金TLP扩散焊接头组织与强度分析

IC10合金是Ni3Al基金属间化合物材料,对该材料的过渡液相(TLP,transient liquid phase)扩散焊试验进行分析.结果表明,采用合适的中间层和焊接工艺,IC10合金TLP扩散焊接头组织与基体相同,由γ γ'网状组织和少量碳化物组成,接头980℃持久强度超过128MPa,达到基体强度的80%以上.TLP扩散焊接头经过高温长时间使用后,接头室温、高温抗拉强度与基体更接近;室温抗拉断口以准解理形貌为主,高温抗拉断口以韧窝形貌为主.     

DD6高温合金TLP焊接接头组织形成规律

采用镍基中间层合金,在真空钼丝炉中对第二代镍基单晶高温合金DD6进行了瞬时液相扩散焊(TLP焊)连接,焊接温度为1200℃、保温时间为12h。用标准热处理制度对其接头进行热处理,分析了热处理工艺对接头组织的影响规律。结果表明,设计的中间层合金熔点在1084~1095℃范围,组织细小均匀,满足DD6单晶的扩散连接需要;TLP焊焊缝组织由γ相和γ′相组成,无片状共晶组织形成;焊缝金属与母材结合良好,经标准热处理后γ′相发生明显的晶粒长大和立方化,并以典型的立方形形貌均匀弥散地分布于基体之中,形成了微观结构理想的扩散连接接头。     

扩散时间对DD6单晶高温合金TLP接头界面组织的影响

采用厚度30μm的商用BNi2钎料为中间层,在钎焊温度1 100℃,保温时间20 min条件下实现了DD6单晶高温合金的TLP连接.研究了在温度1 180℃不同扩散时间对DD6单晶高温合金TLP接头界面组织的影响规律,重点分析了接头区域合金元素随扩散时间的分布规律.结果表明,随着扩散时间的延长,接头界面处形成的针棒状硼...     

DD6单晶TLP焊用中间层合金研究

DD6单晶是制造航天发动机涡轮叶片用新一代高温合金,TLP焊是实现DD6单晶焊接的有效方法。在合理地设计中间层合金化学成分的基础上,采用单辊急冷法制备出厚度40⁶0μm,宽约4mm的中间层合金箔,用以进行DD6单晶TLP焊,分析了接头微观组织特征及合金元素的扩散行为。结果表明,快速凝固中间层合金箔成分均匀,组织细小,熔化温度在1 07060μm,宽约4mm的中间层合金箔,用以进行DD6单晶TLP焊,分析了接头微观组织特征及合金元素的扩散行为。结果表明,快速凝固中间层合金箔成分均匀,组织细小,熔化温度在1 070¹ 074℃范围。在焊接温度T=1 200℃,保温时间t=8 h,焊接压力P=0.3 MPa条件下,获得了与单晶母材结合良好、组织致密的扩散连接接头。接头由焊缝中心区、等温凝固区及扩散区3部分组成。随着中间层中合金元素含量的减小,硼元素扩散能力增强,扩散区硼化物残留量趋于减少。     

CMSX-4单晶高温合金TLP接头组织与性能

采用含Si的BNi-5非晶箔片作为中间层合金对CMSX-4镍基单晶合金棒在放电等离子体烧结炉中进行TLP连接,采用SEM观测了TLP接头在不组织形貌特征,借助于EDS分析了TLP接头界面处的物相组成及其对接头力学性能的影响。采用常温和高温拉伸试验验证了不同焊接工艺条件对TLP接头性能的影响。结果表明,在1 200℃/5 k N/20 min工艺参数下可得到满意的TLP接头,此时组织分布较为均匀,常温抗拉强度达到了母材的95%,760℃高温抗拉强度达到母材的99%。     

Ni3Al单晶高温合金过渡液相扩散焊工艺

采用KNi3中间层,对Ni3Al单晶高温合金进行过渡液相扩散焊,分析不同焊接保温时间的接头和基体组织的变化,测试接头的高温持久性能.结果表明,1 240℃保温12 h,TLP扩散焊接头局部区域有少量的γ＋γ＇共晶组织及小块状的硼化物组织,其它区域均为与基体组织一致的γ＋γ＇双相组织;基体γ＇相由四方形转变成不规则状.焊接接头在1 000℃高温持久强度达到标准状态的基体强度90%.试样组织出现γ＇相筏形化,焊缝区域筏形组织粗化,且形状不规则,与持久应力方向呈一定角度.     

IC10单晶过渡液相扩散焊接头微观组织与力学性能

采用扫描电镜（SEM）和能谱分析仪（EDS）研究IC10单晶高温合金过渡液相（TLP）扩散焊接头微观组织演变．结果表明,接头由连接区和基体区所组成,连接区由等温凝同区和快速凝固区组成．快速凝固区可以通过延长保温时间的方法予以消除．随着保温时间从2h增加到8h,基体内的γ＇相尺寸达到了0．9μm．通过限制TLP扩散焊接头内晶界的形成,以及焊后固溶处理的方法可以有效提高接头的力学性能．在温度1000℃下,接头平均抗拉强度为507MPa．在温度1000℃、应力144MPa下接头持久寿命可达到120h以上．     

Bonding phenomena of transient liquid phase bonded joints of a Ni base single crystal superalloy

The bonding phenomena of Ni base single crystal superalloy CMSX-2 during transient liquid phase (TLP) bonding have been investigated using MBF-80 and F-24 insert metals. TLP bonding of the superalloy was carried out at 1373-1548K for 0-19.6ks in vacuum and the (100) plane of each test specimen was always aligned perpendicular to the joint interface. The dissolution width increased when the bonding temperature and holding time increased. The eutectic width decreased linearly with the square root of holding time during isothermal solidification. After homogenization treatment, the microstructure, distributions of hardness and alloying elements in the bonded interlayer become similar to those of the base metal.     

Cu中间层SiCp/Al MMCs TLP扩散连接过程分析

采用铜箔作中间层,在连接温度为853 K、无压的条件下进行了瞬间液相连接,对TLP扩散连接过程及其动力学模型进行了分析,并对试验结果进行了的验证.结果表明TLP扩散连接理论模型和试验结果之间还存在着一些差异,对等温凝固过程还需要进一步探讨.分析认为,AlMMCs中大量的晶界、亚晶界、位错等短路扩散通道的存在,直接影响TLP连接过程及其动力学.     

Microstructural and mechanical properties assessment of transient liquid phase bonding of CoCuFeMnNi high entropy alloy

The transient liquid phase (TLP) bonding of CoCuFeMnNi high entropy alloy (HEA) was studied. The TLP bonding was performed using AWS BNi-2 interlayer at 1050 °C with the TLP bonding time of 20, 60, 180 and 240 min. The effect of bonding time on the joint microstructure was characterized by SEM and EDS. Microstructural results confirmed that complete isothermal solidification occurred approximately at 240 min of bonding time. For samples bonded at 20, 60 and 180 min, athermal solidification zone was formed in the bonding area which included Cr-rich boride and Mn₃Si intermetallic compound. For all samples, the γ solid solution was formed in the isothermal solidification zone of the bonding zone. To evaluate the effect of TLP bonding time on mechanical properties of joints, the shear strength and micro-hardness of joints were measured. The results indicated a decrement of micro-hardness in the bonding zone and an increment of micro-hardness in the adjacent zone of joints. The minimum and maximum values of shear strength were 100 and 180 MPa for joints with the bonding time of 20 and 240 min, respectively.     

瞬时液相扩散焊连接压力的研究

瞬时液相扩散连接过程中由于过渡液相的产生降低了连接过程中所需要的压力,但是压力在瞬时液相扩散连接过程中起着重要的作用,是保证焊接接头质量,提高焊接效率的主要影响因素之一。本文对连接压力在连接过程中排除氧化膜、减少等温凝固时间等作用进行了总结,并对其选择依据和控制原则进行了讨论。     

Thermal Properties of Ni-Cr-Si-B-Fe Based Interlayer Material and Its Application in TLP Bonding of IN 718 Superalloy

A new Ni-Cr-Si-B-Fe filler material is prepared for transient liquid-phase (TLP) bonding of Inconel 718 superalloy by mechanical alloying technique. The melting temperature range of the filler material and its activation energy of melting are determined by differential scanning calorimetry technique. The activation energy and melting temperature of the alloy powder decrease with increasing milling time. Inconel 718 alloy was joined via TLP by using the newly developed filler material. The effect of TLP bonding temperature and time on microstructural evolution and mechanical properties of the joint was investigated. Three distinct microstructural regions were observed in the bonding area: isothermal solidification zone consisting of a single-phase solid solution, diffusion affected zone consisting of extensive diffusion-induced precipitates of metallic boride, and unaffected base material. The ultimate shear strength and microhardness of the TLP-bonded joint increase with bonding time and temperature.     

DD3单晶合金TLP扩散焊接头组织及持久性能

采用粉状中间层合金D1P对镍基单晶高温合金DD3进行了TLP扩散焊,并对接头组织与性能进行分析研究.结果表明,D1P粉状中间层合金TLP扩散焊接头的焊缝主要由γ+γ'双相组织、枝状化合物(Mo,W,Cr,Ni)3B2和条状化合物(Cr,Mo)23(C,B)6组成,近缝区中存在块状或针状化合物相(Mo,W,Cr,Ni)3B2.接头中存在明显的组织不均匀现象,对接头性能具有明显的不利影响.接头组织不均匀现象可经过高温长时间保温消除,1 250℃/24 h/空冷扩散焊的接头,并在焊后进行时效处理,其980℃持久强度可达到母材的90%.     

High temperature diffusion induced liquid phase joining of a heat resistant alloy

Transient liquid phase bonding (TLP) of a nickel base superalloy, Waspaloy, was performed to study the influence of holding time and temperature on the joint microstructure. Insufficient holding time for complete isothermal solidification of liquated insert caused formation of eutectic-type microconstituent along the joint centerline region in the alloy. In agreement with prediction by conventional TLP diffusion models, an increase in bonding temperature for a constant gap size, resulted in decrease in the time, t_f, required to form a eutectic-free joint by complete isothermal solidification. However, a significant deviation from these models was observed in specimens bonded at and above 1175 °C. A reduction in isothermal solidification rate with increased temperature was observed in these specimens, such that a eutectic-free joint could not be achieved by holding for a time period that produced complete isothermal solidification at lower temperatures. Boron-rich particles were observed within the eutectic that formed in the joints prepared at the higher temperatures. An overriding effect of decrease in boron solubility relative to increase in its diffusivity with increase in temperature, is a plausible important factor responsible for the reduction in isothermal solidification rate at the higher bonding temperatures.     

采用Al及Al-12Si中间层的AZ31B镁合金TLP接头的组织和性能

采用Al及Al-12Si为中间层对AZ31B镁合金进行过渡液相扩散焊,用环境扫描电镜及万能试验机测试并分析了接头组织与强度之间的关系。研究结果表明：采用Al作为中间层时,随着保温时间的增加,Al12Mg17金属间化合物含量降低,接头强度升高;采用Al-12Si作为中间层时,含硅相Mg2Si对焊缝的强化提高了接头强度,但保温时间过长时,Mg2Si偏聚于焊缝中心会降低接头性能。