吉尔130汽车发动机供油系统O形密封圈的研制

含有活性添加剂的Ｍ－８＿Ｂ１和Ｍ－８＿Ｔ２Ｋ的两种油品对ＮＢＲ－１８Ｏ形密封圈有一定的副作用，通过调整ＮＢＲ胶料硫化体系（硫黄０．３；促进剂ＣＺ１．５；促进剂Ｍ０．５；硫化剂ＤＣＰ２．０）和补强剂炭黑的用量（高耐磨炭黑５５；喷雾炭黑４０）．可以使其满足抗两种油品侵蚀的性能要求。另外，在ＮＢＲ胶料中添加２５份耐寒增塑剂（邻苯二甲酸二丁酯１０；癸二酸二辛酯１５）．可提高胶料的耐低温性能，并使脆性温度降至－６５℃以下。     

氯化乙烯橡胶的胶料

氯化乙烯橡胶的胶料氯化乙烯橡胶料具有良好的交联性能。贮存期间性能稳定，屈挠性和耐热性都非常好。这种胶料的组成如下：（Ａ）氯化乙烯聚合物１００份；（Ｂ）容酸的水滑石１．０－１．５份；（Ｃ）苯并噻唑胺盐（见图１）或二硫代氨基甲酸胺盐（Ｒ４ＮＣ（：Ｓ）ＳＨ...     

丁腈橡胶－40/三元共聚型氯醚橡胶并用的研究

对丁腈橡胶－４０（ＮＢＲ－４０）与三元共聚型氯醚橡胶（ＣＨＣ）进行了并用研究。发现二之间的相容性良好。ＮＢＲ－４０／ＣＨＣ并用比为８０／２０时，胶料的综合物理性能较好；为７０／３０时，胶料耐４０＾＃机油的性能最好；耐四氯化碳溶剂的性能随并用比的减小（ＣＨＣ用量增加）而提高。胶料硫化体系以过氧化物硫化体系最佳，补强剂选择中超耐磨炭黑。     

丁腈橡胶－40／三元共聚型氯醚橡胶并用的研究

对丁腈橡胶－４０（ＮＢＲ－４０）与三元共聚型氯醚橡胶（ＣＨＣ）进行了并用研究．发现二者之间的相容性良好。ＮＢＲ－４０／ＣＨＣ并用比为８０／２０时，胶料的综合物理性能较好；为７０／３０时．胶料耐４０＃机油的性能最好；耐四氯化碳溶剂的性能随并用比的减小（ＣＨＣ用量增加）而提高。胶料硫化体系以过氧化物硫化体系［过氧化二异丙苯（ＤＣＰ）／硫黄／四氧化三铅／促进剂ＮＡ－２２］最佳，补强剂选用中超耐磨炭黑。     

纳米碳酸钙对溶聚丁苯橡胶胶料的补强作用

探讨了纳米碳酸钙中白燕华ＣＣ对溶聚丁苯橡胶（ＳＳＢＲ）胶料的补强作用。结果表明,白燕华ＣＣ与Ｓ－ＳＢＲ的混炼加工工艺完全可行;单用白燕华ＣＣ作补强填料时,随着其用量的增大,ＳＳＢＲ胶料的硫化速度加快,性能显著提高,硬度变化不大;白燕华ＣＣ与ＨＡＦ并用具有协同作用。可使Ｓ－ＳＢＲ胶料的物理性能满足实际使用要求;白燕华ＣＣ／ＨＡＦ并用的Ｓ－ＳＢＲ／ＮＲ和Ｓ－ＳＢＲ／ＢＲ并用胶硫化速度较快,加工性能和物     

纳米碳酸钙对溶聚丁苯橡胶胶料的补强作用

探讨了纳米碳酸钙中白燕华ＣＣ对溶聚丁苯橡胶（ＳＳＢＲ）胶料的补强作用。结果表明,白燕华ＣＣ与ＳＳＢＲ的混炼加工工艺完全可行;单用白燕华ＣＣ作补强填料时,随着其用量的增大,ＳＳＢＲ胶料的硫化速度加快,强力性能显著提高,硬度变化不大;白燕华ＣＣ与ＨＡＦ并用具有协同作用,可使ＳＳＢＲ胶料的物理性能满足实际使用要求;白燕华ＣＣ／ＨＡＦ并用的ＳＳＢＲ／ＮＲ和ＳＳＢＲ／ＢＲ并用胶硫化速度较快,加工性能和物理性能较好     

纳米碳酸钙填充NBR的研究

对纳米碳酸钙白燕华ＣＣ单独使用或与高耐磨炭黑（ＨＡＦ）并用填充中等丙烯腈含量ＮＢＲ Ｎ－２４０的基本力学性能和硫化性能进行了研究。结果表明,随着白燕华ＣＣ用量的增大,胶料表现出比填充非极性ＳＢＲ更高的拉伸强度和撕裂强度,而硫化速度支明显减慢。通过调整硫化体系,硫化性能可得到显改善,甚至可以达到低温（１１０￣１３０℃）短时间硫化的效果,胶料的物理性能也相应获得提高。此外,白燕华ＣＣ填充的ＮＢＲ Ｎ     

活性硅铝炭黑的性能及应用

将硅铝炭黑（ＳＡＣ）进行活化改性制成活性硅铝炭黑（ＡＳＡＣ）,并对ＳＡＣ和ＡＳＡＣ填充ＮＲ和ＳＢＲ胶料的硫化特性、物理性能及流变性能进行研究。结果表明,ＡＳＡＣ能明显改善ＳＡＣ的延迟硫化效应,提高填充胶料的力学性能;ＡＳＡＣ在ＮＲ中的填充补强效果接近半补强炭黑,在ＳＢＲ中的填充补强效果略优于优质陶土;ＡＳＡＣ填充ＮＲ胶料的流动性好,挤出胀大效应与填充半补强炭黑胶料相近     

TCY／硫黄对ACM／NBR并用胶的交联作用

从混炼胶的硫化特性和硫化胶物理性能等方面考察了三聚硫氰酸（ＴＣＹ）、硫黄和ＴＣＹ／硫黄对丙烯酸酯橡胶（ＡＣＭ）、丁腈橡胶（ＮＢＲ）及其并用胶的交联作用。结果表明,ＴＣＹ／硫黄硫化体系适用于ＡＣＭ／ＮＢＲ并用胶、并用胶的物理性能达到甚至超过了两种胶料的物理性能的加和水平;ＡＣＭ／ＮＢＲ共混并用,加工性能得到明显改善     

EVM/NBR动态硫化共混物性能的研究

研究了橡胶型乙烯醋酸乙烯酯共聚物（ＥＶＭ）／ＮＢＲ共混比、硫黄和叔丁基酚醛树脂（２４０２树脂）硫化体系对共混物性能的影响，并对比了动态硫化和静态硫化共混物在性能上的差异。试验结果表明，ＥＶＭ／ＮＢＲ共混比显著影响共混物的力学性能，而采用ＮＢＲ预先动态硫化的方法后，共混物胶料的挤出口型膨胀率明显减小，老化性能得到改善，同时减弱了硫黄和２４０２树脂等硫化体系对ＥＶＭ硫化的影响，使多种硫化体系可以共存于共混物中。ＤＳＣ分析表明ＥＶＭ／ＮＢＲ动态硫化共混物只有一个玻璃化温度，且介于ＥＶＭ和ＮＢＲ之间，说明ＥＶＭ和ＮＢＲ具有良好的相容性。     

Differences in physico-mechanical behaviors of resol(e) and novolac type phenolic resin based composite bipolar plate for proton exchange membrane (PEM) fuel cell

Composite bipolar plates for Proton Exchange Membrane Fuel Cell (PEMFC) are prepared by compression molding technique using polymer as binder and graphite as electric filler material with some other reinforcements. Study on the effect of resole and novolac type phenolic resin on the properties of composite bipolar plate, such as bulk density, porosity, bulk conductivity, hardness, flexural strength, etc. shows that both of the resin shows different physico-mechanical properties. Moreover, single cell performance analysis also shows variation for resole and novolac based composites. A novel concept of triple continuous structure to provide graphite polymer blends with high electrical conductivity, high shore hardness, high flexural strength, less porosity and low density has been proposed and study on the effect of different types of phenolic resin on the properties and performance of bipolar plate reveals that novolac type powdered phenolic resin gives better mechanical properties than resole type phenolic resin. However, resole type phenolic resin compound has slightly higher electrical conductivity due to more number of polar -OH group presents on its cured form. But due to the less porosity and higher mechanical strength, bipolar plates with novolac type phenolic resin gives better performance in I-V analysis than bipolar plates with resole type phenolic resin.     

C_5树脂对SIS/RLPO基热熔压敏胶性能的影响

以SIS/RLPO(苯乙烯-异戊二烯-苯乙烯与丙烯酸乙酯-甲基丙烯酸甲酯-甲基丙烯酸氯化三甲胺基乙酯)共混物作为HMPSA(热熔压敏胶)的基体树脂,考察了C5树脂对基体树脂的相容性及其HMPSA黏附性能的影响。结果表明:随着C5树脂用量的不断增加,PS(聚苯乙烯)相的Tg(玻璃化转变温度)基本不变,PI(聚异戊二烯)相的Tg逐渐趋近于C5树脂的Tg,说明C5树脂与PI相具有较好的相容性,而与PS相的相容性相对较差;当SIS/C5/RLPO共混物中三者质量比为30∶50∶60时,相应HMPSA具有适宜的黏附性能,同时其双连续相结构有利于亲水性药物的释放。     

新型环氧树脂灌封材料的研究

研究了环氧树脂灌封材料中,羟基化合物对固化物性能的影响。羟基化合物和环氧基发生扩链反应,降低了固化物的交联度;冲击强度达到25kJ/m~2以上,电性能也得到一定的改善,是较理想的F级灌封材料。     

增粘树脂对丁苯橡胶流变性能的影响

对对－叔丁基苯酚甲醛树脂和对－叔辛基苯酚甲醛树脂对丁苯橡胶的流变性能、混炼功耗和物理性能的影响进行了研究。结果表明：加入树脂后，胶料的表观粘度、表观切应力下降，流动性能改善，挤出物外观质量变好，混炼功耗减少；随着树脂用量增加，效果更加明显；树脂用量少时，对硫化胶物理性能无不良影响，用量超过１０份时，混炼出现严重的粘辊现象。     

适用于RFI工艺的改型双马来酰亚胺树脂的研究

本文用二烯丙基双酚Ａ和热塑性聚醚砜改性双马来酰亚胺树脂（ＢＭＩ），研制出了适用于树脂膜熔渗（ＲＦＩ）工艺的树脂体系。结果表明：该树脂体系工艺性良好，浇注体和玻璃布复合材料耐热性和力学性能较佳。     

环氧树脂和氧化锌对含磷化合物阻燃HIPS力学性能的影响

研究环氧树脂（EP）和氧化锌用量对含磷化合物阻燃高抗冲聚苯乙烯（HIPS）力学性能的影响。结果表明,EP可以改善含磷化合物在HIPS中的分散,提高含磷化合物阻燃HIPS的强度和刚度,但使材料的韧性下降：适量的氧化锌进一步提高了（EP-含磷化合物）复合阻燃HIPS的力学性能,当其用量为6份时,材料具有较好的综合力学性能。     

A study on the effects of reaction conditions on the characteristics of resol resins for foams by statistical analysis

A two-level full factorial experimental design with three variables, formaldehyde-to-phenol (F/P) molar ratios, hydroxy-to-phenol (OH/P) wt%, and reaction temperature was implemented to determine the effect of the variables on the properties of phenol-formaldehyde (PF) resol resins for insulation foam. Ten resins were prepared with F/P molar ratios between 1.5 and 2.5, OH/P wt% between 0.5 and 1.5 and reaction temperature between 80 and 90 ‡C. The effect of three independent variables on the resin properties was analyzed by using three-way ANOVA of SPSS. All three production variables had a significant effect on resin properties. The F/P molar ratio and OH/P wt% were found to have the most frequent effect on resin properties. F/P molar ratio and OH/P wt% had an increasing effect, while reaction temperature showed a decreasing effect on free formaldehyde. The present study confirms that experimental design is a very valuable and capable tool for evaluating multiple variables in resin production.     

耐高低温的电器灌封环氧密封胶的研究

耐高、低温构电器灌封密封胶是由环氧树脂,聚硫橡胶,低分子聚酰胺组成。适合于在恶劣条件下应用的各种电器灌封、密封用。本文介绍了该材料的配制方法、性能。探讨了固化剂用量对固化物低温性能的影响。     

透明聚丙烯的研制

以均聚聚丙烯(PP)为基体树脂，探索了不同牌号的PP、不同类型的成核剂和其它助剂等对透明PP性能的影响，以及加工成型工艺参数对透明PP性能的影响。结果表明，选用T30S型连续均聚PP作透明PP的基体树脂，添加复配后的成核剂，可生产出综合性能优异的透明PP。     

Effects of phenolic resin contents on microstructures and properties of c/sic-diamond composites

In this paper, C/SiC-diamond composites were obtained by chemical vapor infiltration (CVI) and reactive melt infiltration (RMI), and the effects of phenolic resin contents on the microstructures and properties of as-obtained C/SiC-diamond composites were studied. The results suggested a significant influence of phenolic resin contents on the pore structure of the composites before reactive melt infiltration (RMI), as well as phase composition and density of the matrix after RMI. The mechanical properties of composites were shown to correlate with the threshold effect of phenolic resin. Sample R5 prepared with high phenolic resin contents displayed significantly declined mechanical properties. On the other hand, adjustment of the phenolic resin content yielded samples with maximum room temperature thermal conductivity reaching 14.75 W/(m·K). The theoretical thermal conductivity of the composites calculated by the Hasselman-Johnson (H-J) theoretical model was estimated to 24.52 W/(m·K). Overall, the increase in phenolic resin content led to unreacted diamond-C regions and the formation of substantial porosity. These features reduced the thermal conductivity of the resulting C/SiC-diamond composites.