Curing characteristics of epoxy resin systems that include a biphenyl moiety

The curing characteristics of epoxy resin systems that include a biphenyl moiety were investigated according to the change of curing agents. Their curing kinetics mainly depend on the type of hardener. An autocatalytic kinetic reaction occurs in epoxy resin systems with phenol novolac hardener, regardless of the kinds of epoxy resin and the epoxy resin systems using Xylok and DCPDP (dicyclopentadiene‐type phenol resin) curing agents following an nth‐order kinetic mechanism. The kinetic parameters of all epoxy resin systems were reported in terms of a generalized kinetic equation that considered the diffusion term. The fastest reaction conversion rate among the epoxy resin systems with a phenol novolac curing agent was obtained in the EOCN‐C epoxy resin system, and for systems with Xylok and DCPDP hardeners, the highest reaction rate values were obtained in NC‐3000P and EOCN‐C epoxy resin systems, respectively. The system constants in DiBenedetto's equation of each epoxy resin system with different curing agents were obtained, and their curing characteristics can be interpreted by the curing model using a curing agent as a spacer. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1942–1952, 2002     

基于变活化能模型的T800/环氧树脂预浸料固化反应动力学研究

为了深入了解某新型高温固化T800/环氧树脂预浸料的固化行为,借助差示扫描量热仪(DSC),采用非等温DSC法研究了T800/环氧树脂预浸料的固化反应过程。基于唯象模型,系统研究了该预浸料的固化反应特征温度及固化动力学参数,确定该预浸料中环氧树脂的固化反应动力学模型为自催化模型。采用等转化率法,分析了预浸料中环氧树脂的反应活化能随固化度的变化情况,结果表明在整个固化反应过程中,树脂固化反应活化能变化较大,传统模型法基于全固化过程活化能不变的假设无法准确描述该固化反应。采用变活化能自催化模型,利用粒子群全局优化算法,得到了T800/环氧树脂预浸料的固化动力学方程,结果表明该模型能较好地描述实验现象,可为进一步研究该预浸料的热力学性能及其成型过程中的质量控制提供理论基础。     

Cure kinetics and thermal stability of micro and nanostructured thermosetting blends of epoxy resin and epoxidized styrene‐block‐butadiene‐block‐styrene triblock copolymer systems

The compatibility of styrene‐block‐butadiene‐block‐styrene (SBS) triblockcopolymer in epoxy resin is increased by the epoxidation of butadiene segment, using hydrogen peroxide in the presence of an in situ prepared catalyst in water/dichloroethane biphasic system. Highly epoxidized SBS (epoxy content SBS >26 mol%) give rise to nanostructured blends with epoxy resin. The cure kinetics of micro and nanostructured blends of epoxy resin [diglycidyl ether of bisphenol A; (DGEBA)]/amine curing agent [4,4′‐diaminodiphenylmethane (DDM)] with epoxidized styrene‐block‐butadiene‐block‐styrene (eSBS 47 mol%) triblock copolymer has been studied for the first time using differential scanning calorimetry under isothermal conditions to determine the reaction kinetic parameters such as kinetic constants and activation energy. The cure reaction rate is decreased with increasing the concentration of eSBS in the blends and also with the lowering of cure temperature. The compatibility of eSBS in epoxy resin is investigated in detailed by Fourier transform infrared spectroscopy, optical and transmition electron microscopic analysis. The experimental data of the cure behavior for the systems, epoxy/DDM and epoxy/eSBS(47 mol%)/DDM show an autocatalytic behavior regardless of the presence of eSBS in agreement with Kamal's model. The thermal stability of cured resins is also evaluated using thermogravimetry in nitrogen atmosphere. POLYM. ENG. SCI., 2012. © 2012 Society of Plastics Engineers     

Effect of the anhydride structure and the epoxy fortifier on the reactivity in curing of epoxy resins

The curing reactions of the epoxy resin triglycidyl-p-aminophenol with acid anhydrides using tertiary amine as catalyst were studied kinetically by differential scanning calorimetry. The dynamic scans in the temperature range 30–300°C were analyzed to estimate the activation energy and the order of the reaction for the curing process using some empirical relations. The curing process was found to follow a simple Arrhenius type kinetics having activation energies in the range 75 – 142 kJ/mol and the order of the reaction is about 1. The effect of the variation in acid anhydride structure and of the incorporation of the epoxy fortifier on the cure characteristics is investigated.     

Kinetics of aryl phosphinate anhydride curing of epoxy resins using differential scanning calorimetry

The curing reaction of two kinds of epoxy resins, (bisphenol A epoxy DER331, and novolac epoxy DEN438) with aryl phosphinate anhydride (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide)-methyl succinic anhydride (DMSA), and benzyldimethylamine (BDMA) as the catalyst, was investigated by differential scanning calorimetry (DSC) using an isothermal approach over the temperature range 130–160°C. The experimental results showing autocatalytic behaviour were compared with the model proposed by Kamal, including two rate constants (k₁ and k₂) and two reaction orders (m and n). The model predictions are in good agreement with the experimental data and demonstrate that the autocatalytic model is capable of predicting the curing kinetics of both systems without any additional assumptions. The activation energies for the rate constants of DER331/DMSA and DEN438/DMSA are 77–92 kJmol^-1 and 83–146 kJmol^-1, respectively. The obtained overall reaction order of 2 is in agreement with the reaction mechanism reported by several workers. © 1998 SCI.     

Relationship between viscoelastic properties and gelation in the epoxy/phenol‐novolac blend system with N‐benzylpyrazinium salt as a latent thermal catalyst

A study of viscoelastic properties and gelation in epoxy/phenol‐novolac blend system initiated with 1 wt % of N‐benzylpyrazinium hexafluoroantimonate (BPH) as a latent cationic thermal initiator was performed by analysis of rheological properties using a rheometer. Latent behavior was investigated by measuring the conversion as a function of curing temperature using traditional curing agents, such as ethylene diamine (EDA) and nadic methyl anhydride (NMA) in comparison to BPH. In the relationship between viscoelastic properties and gelation of epoxy/phenol‐novolac blend system, the time of modulus crossover was dependent on high frequency and cure temperature. The activation energy (E_c) for crosslinking from rheometric analysis increased within the composition range of 20–40 wt % phenol‐novolac resin. The 40 wt % phenol‐novolac (N40) to epoxy resin showed the highest value in the blend system, due to the three‐dimensional crosslinking that can take place between hydroxyl groups within the phenol resin or epoxides within the epoxy resin involving polyaddition of the initiator with BPH. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 79: 2299–2308, 2001     

Characterization of cure reactions of anhydride/epoxy/polyetherimide blends

The cure kinetics of blends of epoxy (diglycidyl ether of bisphenol A)/anhydride (nadic methyl anhydride) resin with polyetherimide (PEI) were studied using differential scanning calorimetry under isothermal conditions to determine the reaction parameters such as activation energy and reaction constants. By increasing the amount of PEI in the blends, the final cure conversion was decreased. Lower values of final cure conversions in the epoxy/PEI blends indicate that PEI hinders the cure reaction between the epoxy and the curing agent. The value of the reaction order, m, for the initial autocatalytic reaction was not affected by blending PEI with epoxy resin, and the value was approximately 1.0. The value of n for the nth order component in the autocatalytic analysis was increased by increasing the amount of PEI in the blends, and the value increased from 1.6 to 4.0. A diffusion‐controlled reaction was observed as the cure conversion increased and the rate equation was successfully analyzed by incorporating the diffusion control term for the epoxy/anhydride/PEI blends. Complete miscibility was observed in the uncured blends of epoxy/PEI at elevated temperatures up to 120 °C, but phase separations occurred in the early stages of the curing process. © 2002 Society of Chemical Industry     

Cure kinetics of biphenyl epoxy resin system using latent catalysts

The investigation of the cure kinetics of a biphenyl epoxy–phenol resin system with different kinds of latent catalysts was performed by differential scanning calorimetry using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicated that the curing reaction of the biphenyl epoxy resin system in this experiment proceeded through an autocatalytic kinetic mechanism, irrespective of the kind of catalyst. The epoxy resin system with acid/diazabicycloundecene (DBU) salt as the latent catalyst showed a second overall reaction order; however, a third reaction order was represented for microencapsulated triphenylphosphine (TPP). The storage stability tests for these systems were performed, and a good shelf life was observed in the epoxy resin system with pyromellitic acid/DBU salt, trimellitic acid/DBU salt, and microencapsulated TPP as the latent catalyst. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2711–2720, 2001     

Adhesive and thermal characteristics of maleimide-functional novolac resins

A novel, addition-curable maleimide-functional novolac phenolic resin was evaluated for adhesive properties such as lap shear strength and T-peel strength using aluminium adherends, when thermally self-cured and cocured with epoxy resins. The adhesive properties of the self-cured resin, although inferior at ambient temperature, improved at high temperature and were found to depend on the cure conditions. When cocured with epoxy resin, the adhesive properties improved significantly and showed a strong dependence on the nature of the epoxy resin used, on the stoichiometry of the reactants, on the concentration of imide groups in the phenolic resin, and on the extent of polymerization of the maleimide groups. Optimum adhesive properties were obtained for novolac resins with a moderate concentration of maleimide groups, taken on a 1 : 1 hydroxyl–epoxy stoichiometry with a novolac epoxy resin. In comparison to the conventional novolac, the imide–novolac contributed to improved adhesion and better adhesive property retention at higher temperature when cured with the novolac–epoxy resin. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 695–705, 1999     

Kinetic study of the effect of catalysts on the curing of biphenyl epoxy resin

The investigation of cure kinetics of biphenyl epoxy (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl)dicyclopentadiene type phenolic resin system with different kinds of catalysts was performed by a differential scanning calorimeter using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of the formulations using triphenylphosphine (TPP), 1-benzyl-2-methylimidazole (1B2MI), and tris(4-methoxyphenyl)phosphine (TPAP) as a catalyst proceeds through an nth-order kinetic mechanism, whereas thatof the formulations using diazabicycloundecene (DBU) and tetraphenyl phosphonium tetraphenyl borate (TPP–TPB) proceeds by an autocatalytic kinetic mechanism. To describe the cure reaction in the latter stage, we have used semiempirical relationship proposed by Chern and Poehlein. By combining an nth-order kinetic model or an auto-catalytic model with a diffusion factor, it is possible to predict the cure kinetics of each catalytic system over the whole range of conversion. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 68: 1125–1137, 1998     

最概然Malek法分析TDE 85/MeNA环氧树脂体系固化机理

 采用非等温DSC法对三官能团环氧树脂TDE 85与甲基纳迪克酸酐（MeNA）固化体系进行了放热特性分析,升 温速率分别为5k/min、10k/min、15k/min、20k/min、25k/min及35k/min。在此基础上重点提出最概然Malek Flynn Wall Ozawa分析法,对其固化反应机理进行固化动力学参数分析,建立了能够正确描述固化反应过程的机 理模型。该方法求得固化体系反应表观活化能为E=67.05kJ/mol,表观指前因子为A=5.05×109s 1,反应机理函数 为f(a)=22.24(1-a)1.76。最后通过实验数据对最概然Malek Flynn Wall Ozawa分析法进行验证,证明该方法 能够精确的描述固化反应过程和机理特征。     

Cure kinetics of neat and graphite-fiber-reinforced epoxy formulations

An investigation was carried out into the cure kinetics of neat and graphite fiber-reinforced epoxy formulation, composed of tetraglycidyl 4,4′-diaminodiphenyl methane (TGDDM) resin and diaminodiphenyl sulfone (DDS) curing agent. Two experimental techniques were employed: isothermal differential scanning calorimetry (IDSC) and dynamic differential scanning calorimetry (DDSC). An autocatalytic mechanism with the overall reaction rate order of 2 was found to describe adequately the cure kinetics, of the neat resin and the composite. All kinetic parameters, including reaction rate constants, activation energies and preexponential factors, were calculated and reported. The presence of graphite fibers in the composite had only a very small initial effect on the kinetics of cure.     

Modeling of Multi-Autocatalytic Cure Reactions of An Epoxy/Amine Terminated Polyetherimide/NMA System

Summary Amine terminated polyetherimide (ATPEI) as a modifier for epoxy resin was synthesized, then blended with a diglycidyl ether bisphenol A (DGEBA)/nadic methyl anhydride (NMA)/catalyst. A study on cure kinetics and morphology was conducted for a blend of a DGEBA/NMA/Catalyst/ATPEI (5phr) system. In the curing process, two major reactions were observed. Each reaction was identified, and a novel model equation for the cure kinetics is suggested.     

Cure kinetics of epoxy resin used for advanced composites

The cure kinetics of an epoxy resin used for the preparation of advanced polymeric composite structures was studied by isothermal differential scanning calorimetry (DSC). A series of isothermal DSC runs provided information about the kinetics of cure over a wide temperature range. According to the heat evolution behavior during the curing process, several influencing factors of isothermal curing reactions were evaluated. The results showed that the isothermal kinetic reaction of this epoxy resin followed an autocatalytic kinetic mechanism. In the latter reaction stage, the curing reaction became controlled mainly by diffusion. Cure rate was then modeled using a modified Kamal autocatalytic model that accounts for the shift from a chemically controlled reaction to a diffusion‐controlled reaction. The model parameters were determined by a nonlinear multiple regression method. Copyright © 2004 Society of Chemical Industry     

Cure kinetics and mechanical properties of the blend system of epoxy/diaminodiphenyl sulfone and amine terminated polyetherimide-carboxyl terminated poly(butadiene-co-acrylonitrile) block copolymer

The cure kinetics of blends of epoxy resin (4,4’-tetraglycidyl diaminodiphenyl methane; TGDDM)/curing agent (diaminodiphenyl sulfone; DDS) with ATPEI (amine terminated poly-etherimide) -CTBN (carboxyl terminated poly (butadiene-co-acrylonitrile)) block copolymer (AB type) were studied using differential scanning calorimetry under isothermal conditions to determine the reaction kinetic parameters such as activation energy and reaction constants. Final cure conversion decreased with increasing amount of AB in the blends. A diffusion controlled reaction was observed as the cure conversion increased, and the curing reaction was successfully analyzed by incorporating the diffusion control term in the rate equation for the epoxy/DDS/AB blends. The fracture toughness was improved to about 350% compared to that of the unmodified resin at 30% of AB block copolymer. This is attributed to the formation of co-continuous morphology between the epoxy phase and AB block copolymer phase. By increasing the amount of AB, the modulus of the cured blends decreased, which was due to the presence of CTBN rubbery phases.     

Curing kinetics and chemorheology of epoxy/anhydride system

The curing kinetics and chemorheology of a low‐viscosity laminating system, based on a bisphenol A epoxy resin, an anhydride curing agent, and a heterocyclic amine accelerator, are investigated. The curing kinetics are studied in both dynamic and isothermal conditions by means of differential scanning calorimetry. The steady shear and dynamic viscosity are measured throughout the epoxy/anhydride cure. The curing kinetics of the thermoset system is described by a modified Kamal kinetic model, accounting for the diffusion‐control effect. A chemorheological model that describes the system viscosity as a function of temperature and conversion is proposed. This model is a combination of the Williams–Landel–Ferry equation and a conversion term originally used by Castro and Macosko. A good agreement between the predicted and experimental results is obtained. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 3012–3019, 2003     

New type of phenolic resin: Curing reaction of phenol‐novolac based benzoxazine with bisoxazoline or epoxy resin using latent curing agent and the properties of the cured resin

In this study, we aimed to reduce the cure time, and to lower the cure temperature of the benzoxazine compound. Therefore, curing reaction of benzoxazine with bisoxazoline or epoxy resin using the latent curing agent and the properties of the cured resins were investigated. The cure behavior of benzoxazine with bisoxazoline or epoxy resin using the latent curing agent was monitored by differential scanning calorimetry and measurements for storage modulus (G′). The properties of the cured resin were estimated by mechanical properties, electrical insulation, water resistance, heat resistance, and flame resistance. As a result, it was confirmed that by using the latent curing agent, cure time of benzoxazine and bisoxazoline or epoxy resin was reduced, and cure temperature was lowered. And it was found that the curing reaction using phenol‐novolac based benzoxazine (Na) as the benzoxazine compound could proceed more rapidly than that using bisphenol‐A based benzoxazine (Ba) as the benzoxazine compound. However, the cured resins from Ba and bisoxazoline or epoxy resin using the latent curing agent showed good heat resistance, flame resistance, and mechanical properties compared with those from Na and bisoxazoline or epoxy resin using the latent curing agent. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

等温DSC法研究液态橡胶改性环氧树脂固化动力学

用等温差示扫描量热法(DSC)在三个不同的固化温度下研究了不同含量端羧基液态橡胶(CTBN)改性环氧树脂的等温固化过程,考察了不同CTBN含量对环氧树脂固化动力学的影响。通过Kamal方程对不同含量CTBN改性环氧树脂固化过程数据进行拟合,得到反应速率常数k1、k2及反应级数m、n,计算得到反应活化能的值,结果表明CTBN质量分数由0%到20%,k1、k2逐渐增大,反应前期活化能由67.34kJ/mol增加到80.31kJ/mol,增加了19.26%,反应后期活化能由94.19kJ/mol增加到180.07kJ/mol,增加了91.18%。