食品包装涂层用树脂对镀锡板基材附着性能的影响

本文以食品包装材料常用环氧涂层和环氧改性聚酯涂层为例，利用附着力测试、 SEM、XPS和 EDS等分析表征方法，从涂层组成及结构、基材 -涂层的表面 -界面特性等角度出发，分析了不同树脂涂层对镀锡板基材附着性能的影响。研究发现：涂层树脂的种类不同，涂层对镀锡板基材的附着性能存在差异。论文还初步探究了环氧涂层和环氧改性聚酯涂层对镀锡板基材的附着机理。     

纯聚脲在引水渠抗裂防渗方面的研究与应用

对Qtech-407纯聚脲新型抗裂防渗材料在模拟水渠环境中进行浸泡和抗渗试验,测试其力学性能、与基材的附着力和抗渗性能变化.浸泡试验结果:浸泡360 d后,涂层拉伸强度下降了6.26％,断裂伸长率基本不变,硬度下降了14.47％,涂层与基材的附着力仍可达4.5 MPa,总体涂层力学性能及与基材的附着力变化较小.抗渗试验结果:厚约2.0 mm的涂层在0.7 MPa水压作用下并不出现渗水现象,且随着涂层厚度增加,其抗渗性越强.目前Qtech-407纯聚脲涂层已成功应用于青岛书院水库饮用水水渠抗裂防渗工程.详细介绍了其技术优势及施工要点.     

聚碳酸酯用无底涂有机硅耐磨增硬涂料的制备

以己二酸、1,4-丁二醇、2-甲基-1,3-丙二醇和邻苯二甲酸酐为原料,合成了一系列聚酯二元醇。以其作为附着力促进剂,可以提高有机硅耐磨增硬涂层在聚碳酸酯表面的附着力。研究了聚酯的结构、相对分子质量、添加量以及甲基硅树脂固化剂的种类对涂膜性能的影响。结果表明:以数均相对分子质量为1 170的聚己二酸-1,4-丁二醇酯为附着力促进剂、乙酰丙酮铝为固化剂制备的聚碳酸酯用无底涂有机硅耐磨增硬涂料综合性能最为优异,涂膜固化后硬度为H,附着力为0级,耐乙醇性和耐水煮性能较佳,耐磨性和透光性较未涂覆的基材都有了明显提高。     

有机硅改性聚酯多元醇树脂的研究

以三羟甲基丙烷、季戊四醇等常见多元醇为原料经酯化缩聚成聚酯多元醇,对有机硅中间体进行改性,把改性后的树脂涂于马口铁上成膜,分别分析几种聚酯多元醇改性后树脂对基材的附着力、硬度及柔韧性,通过数据可知在硅含量相同时,聚酯乙二醇的附着力最好,且柔韧性也最好,但耐热性能最差,季戊四醇的柔韧性一般,附着力和色差也介于两者之间,故在综合考虑的基础上,三羟甲基丙烷的性能最好。     

水性抗迁移聚酯分散体氨基烤漆的制备及性能研究

为解决现用水溶性聚酯氨基转印清漆抗迁移性差、有机挥发物（ VOC）含量高的问题,本文以低酸值（ 10~20 mgKOH/g）水性聚酯分散体、氨基树脂为主要成膜物制备了一种水性抗迁移聚酯分散体氨基烤漆,研究了不同水性聚酯分散体与氨基树脂质量比、酸催化剂、消光剂对漆膜抗迁移性等性能的影响,结果表明：当水性聚酯分散体与氨基树脂固体质量比为 4∶1,固化温度为 130 ℃/20 min时,漆膜抗迁移性最佳,能达到 600 d以上;人工加速老化 500 h,色差为 0. 8;漆膜耐盐雾 500 h,划叉单侧腐蚀 <2 mm;附着力达到 1级,不挥发物含量符合要求,漆膜可替代现用水溶性聚酯氨基烤漆。     

多羟基化合物对6063铝合金表面钛锆转化膜的影响

以6063铝合金为基材,研究了一种基于多羟基化合物的钛锆体系有机-无机复合转化处理体系。考察了该复合膜的膜重、沸水附着力、耐硝酸点滴腐蚀性能及其后续粉末涂料膜层的抗杯突、耐沸水和耐盐水性能,并与单纯钛锆转化膜及传统铬酸盐转化膜进行了比较。在质量分数为3.5%的NaCl溶液中通过极化曲线和电化学阻抗谱(EIS)分析了多羟基化合物的加入对6063铝合金表面钛锆转化膜耐蚀性的影响。采用扫描电镜(SEM)及能谱(EDS)表征了有机-无机复合转化膜的表面形貌及元素组成。结果表明:多羟基化合物的加入使钛锆转化膜由无色变成淡黄色,由疏松有孔的粒状结构变成致密少孔的层状结构,膜重有一定增加,沸水附着力及后续涂层的抗杯突、耐盐水性能更优异,耐腐蚀性能也有显著提高。该复合无铬转化膜层主要由C、O、Mg、Al、Ti、Si和Zr元素组成。     

聚苯乙烯/聚酯共混微球的制备及性能

采用相反转乳化工艺制备了亚微米级聚苯乙烯/聚酯共混微球。分析了制备机理、微球中聚酯与聚苯乙烯的相容性及微球形貌,讨论了聚酯用量对微球粒径及分布的影响,测试了共混微球的抗冲击性能、软化温度、附着性以及熔体流动性能。结果表明:微球中聚酯与聚苯乙烯构成不相容体系;共混微球表面粗糙;微球粒径及分布随聚酯用量变化显著,当聚酯质量分数约为14%、乳化剂用量为11%时[乳化剂用量为乳化剂与单体相(苯乙烯和聚酯)质量比],可以得到平均粒径365.3 nm、分散性系数为0.101的亚微米级共混微球;当聚酯质量分数为12%～18%时,随着聚酯含量的增加,共混微球的冲击强度、附着力显著增加,但熔体流动速率降低。     

Al2O3-ZrN-Sialon-C复相耐火材料抗渣侵性能研究

以板状刚玉、石墨、α-Al2O3、金属铝粉、单质硅粉为主要原料,ZrN-Sialon复相粉体为添加剂,采用酚醛树脂结合制备了Al2O3-ZrN-Sialon-C复相耐火材料.采用静态坩埚法研究了ZrN-Sialon复相粉体加入量对材料抗渣侵蚀性能的影响,借助SEM与EDS面扫描对渣蚀后材料的结构和成份进行分析,并探讨了Al2O3-ZrN-Sialon-C复相耐火材料的抗渣侵蚀机理.结果表明:ZrN-Sialon复相粉体加入量为9wt％时,材料表现突出的抗钢渣侵蚀性能.研究表明材料中Sialon氧化后生成的SiO2能形成致密的氧化保护层,同时ZrN氧化后形成的ZrO2有利于提高抗钢渣的浸润,阻止钢渣的渗透与侵蚀.分析认为Al2O3-ZrN-Sialon-C复相耐火材料的钢渣侵蚀机理为氧化-熔蚀-渗透.     

有机-无机复合金属防腐涂料的制备与性能研究

采用水性硅溶胶与硅丙树脂复配制备了水性硅溶胶-硅丙树脂复合金属防腐涂料。以Q235钢板为基材,研究了不同硅溶胶用量下涂层的力学性能、防腐性能及耐久性能,考察了喷砂与打磨两种不同的基材表面处理工艺对防腐涂料性能的影响。试验结果表明:硅溶胶改性后,复合涂层的耐盐雾时间长达3 000 h以上,氙灯照射250 h后,涂层不粉化、不脱落,附着力达0级,耐冲击性为50 cm,综合性能优异。     

盐浸蚀条件下水泥基材料耐久性能研究

根据乌鲁木齐市土壤及地下水中侵蚀性离子浓度分布情况,采用"浸泡抗蚀性能试验方法"(K法)对水泥基材料在长期盐浸蚀条件下的抗侵蚀性能进行系统的研究。研究结果显示:当硫酸根离子浓度小于2500mg/L时,侵蚀性离子的存在对水泥基材料强度发展有促进作用;当硫酸根离子浓度大于4000mg/L时,侵蚀性离子的存在对水泥基材料有破坏作用,降低水胶比有利于提高水泥基材料的抗侵蚀性能;掺加一定量的粉煤灰有利于提高水泥基材料的抗侵蚀性能。     

低温柔韧型水性聚氨酯丙烯酸酯复合分散体的合成与性能

以甲苯二异氰酸酯(TDI-80)、聚醚二元醇(N220)、1,4-丁二醇(BDO)、二羟甲基丙酸(DMPA)、环氧树脂(E-20)和甲基丙烯酸甲酯(MMA)等用原位合成技术制备具有核壳结构的水性聚氨酯-丙烯酸酯(WPUA)复合分散体。研究了环氧树脂(E-20)、MMA加入量等对分散体及涂膜性能的影响,从而确定了最佳合成配方,获得了具有优良的低温成膜性好、贮存稳定性好、高硬度、耐有机溶剂性佳和附着力强的水性聚氨酯涂料。     

耐溶剂聚碳酸酯/聚酰胺1010共混物的制备及其性能探讨

用碳链较长、韧性较好的聚酰胺（PA）1010对聚碳酸酯（PC）进行改性。对PC/PA1010合金体系的力学性能、耐热性能、耐溶剂性能以及动态流变性能等进行了研究,并探讨了PA1010及相容剂聚乙烯接枝甲基丙烯酸缩水甘油酯（PE-g-GMA）对PC/PA1010合金的性能影响。结果发现,PA1010能够较好地保持合金的冲击强度,同时明显改善了PC的耐溶剂性能;PE-g-GMA对PC/PA1010有很好的反应增容作用;当PC/PA1010/PE-g-GMA的配比为80/15/5（质量比,下同）时,合金获得最佳综合性能。     

丙烯酸丁酯改性富马海松酸型水性聚氨酯复合乳液的研究

以富马海松酸聚酯多元醇(FAPP)、聚醚二元醇(N-210)、甲苯二异氰酸酯(TDI)与丙烯酸丁酯(BA)等为主要原料合成富马海松酸型水性聚氨酯-丙烯酸酯复合乳液(FWPUA).探讨了引发剂的种类、聚合温度和丙烯酸丁酯加入量等因素对反应的影响.对所得产品进行了红外光谱分析,测试了漆膜的拉伸强度、摆杆硬度、镜面光泽、耐溶剂性和低温柔韧性.结果表明:用偶氮二异丁腈和过硫酸铵为复合引发剂,聚合温度为80℃,BA的加入量为30％～40％时,复合乳液综合性能优良.     

Synthesis and thermal polymerization of new polyimides with pendant phthalonitrile units

New polyimides with pendant phthalonitrile units were synthesized via the conventional two-step polymerization approach. The chemical structure of the PIs was confirmed by IR and ¹H NMR spectra. The thermogravimetric analysis and differential scanning calorimetry revealed that the thermal properties of the new PIs along with their solvent-resistance can be promoted after thermal treatment at 300 °C. This promotion can be attributed to the nitrile cure reaction of the phthalonitrile units indicated by the decrease in nitrile absorptions at around 2231 cm⁻¹ of the IR spectra.     

Production of leather-like composites using short leather fibers. II. Mechanical characterization

Leather-like composites were prepared by addition of chemically modified short leather fibers (SLF) into a plasticized polyvinyl chloride (pPVC) matrix. The fibers were subjected to chemical modification by emulsion polymerization to achieve good interfacial adhesion between SLF and the pPVC matrix. The SLF with chemical modification were obtained from three different reaction conditions where these SLF have different percentages of grafted and deposited PMMA polymer onto the fiber surface. The incorporation of the SLF into the thermoplastic matrix was carried out using a torque-rheometer and the composites obtained were molded by compression. Tensile and tear mechanical tests were performed on composite samples, and the morphology of the fractured surfaces was analyzed using scanning electron microscopy (SEM). The results show that the incorporation by grafting of polymethyl metacrylate (PMMA) onto the fibers produced a significant improvement of their interfacial adhesion to pPVC, promoting the compatibilization between the fiber surface and matrix. The findings are discussed and interpreted in terms of enhanced adhesion at phase boundaries. Overall, the results confirm that it is possible to produce modified leather composites based on a pPVC matrix, which exhibit relatively high tensile strength, tear resistance and flexibility. These composites are very suitable candidate materials for applications in the footwear industry.     

淀粉纳米晶对天然胶乳性能的影响

将淀粉纳米晶作为天然胶乳的补强剂,研究其对天然胶乳的胶体性能及硫化胶膜的物机性能、耐水性和耐溶剂的影响。研究结果表明:将淀粉纳米晶加入天然胶乳后,胶乳的粘度变化不大,机械稳定度提高;硫化胶膜的物机性能明显提高,耐溶剂性提高,而耐水性降低。     

乳液插层法制备丁苯橡胶/蒙脱土纳米复合材料的结构与性能

选用一种能够在水中分散良好的有机改性蒙脱土（OMMT），采用乳液插层法制备了SBR／OMMT纳米复合材料，X射线衍射和透射电镜观察显示制得了半剥离型与插层型共存的纳米复合材料。研究了复合材料的力学性能和耐溶剂性能。测试结果表明，随着蒙脱土用量的增加，复合材料的定伸应力、拉伸强度和撕裂强度均大幅度提高。复合材料具有优异的耐溶剂性能。     

Biomimetic approach to tunable adhesion of polyurethane adhesives through Fe3+ crosslinking and hydrophobic tween units with balance of adhesion/cohesion forces

Biocompatible adhesives have some limitations such as weak adhesion and low flexibility. To overcome these limitations, we described multiple strategies to provide strong adhesion and high flexibility through Tweens, chlorogenic acid (CLA) and polyethylene glycol (PEG) by reducing excessive interaction between tissue and the adhesive. We synthesized polyurethane-based adhesives using aliphatic 4,4′-methylenebis(cyclohexyl isocyanate) (HMDI), PEG, CLA and Tween units. Hydrophobic side chains in polymer resulted in lower Tg (−36.95-30.36 °C) which indicated more flexibility. The highest adhesion strengths were found as almost 346 kPa for bare polyurethane and 492 kPa for chelated polymer (PU-T40-CLA-15% (5% Tween 40, 15% chlorogenic acid and 80% PEG 200 containing polymer)) with FeCl₃. The addition of Tween units provided more stable structure to polymers which proved with in vitro erosion studies. Relatively low erosion values were seen as 5.7, 5.6 and 8.2% in PU-T40-CLA-5% (15% Tween 40, 5% chlorogenic acid and 80% PEG 200 containing polymer), PU-T40-CLA-10% (10% Tween 40, 10% chlorogenic acid and 80% PEG 200 containing polymer), and PU-T40-CLA-15% (5% Tween 40, 15% chlorogenic acid and 80% PEG 200 containing polymer), respectively. In vitro biocompatibility results showed high cell viability in PU-T40-15% as more than 100%. Overall, our findings indicated that these material designs (PU-T-CLAs) provided to overcome the significant challenges of tissue adhesives by improving the flexible character and adhesive strength of the adhesives.     

Improvement in the adhesion of polyimide/epoxy joints using various curing agents

An improvement in the adhesion strength of polyimide/epoxy joints was obtained by (1) introducing a functional group on the polyimide surface, (2) improving the mechanical properties of the epoxy adhesive, (3) increasing the curing temperature, and (4) using polyamic acid as an adhesion‐promoting layer. The functional group on polyimide was introduced via treatment with aqueous KOH. An adhesion‐promoting layer was formed by spin coating polyamic acid onto a modified polyimide surface. The maximum adhesion strength of the polyimide/epoxy joint was obtained using polyamic acid as both the adhesion‐promoting layer and as the curing agent. The surface energy of the modified polyimide was examined using contact angle measurements and Fourier transform infrared spectroscopy, and the peel strength was determined by the T‐peel method. The peeled surfaces were analyzed using scanning electron microscopy and X‐ray photoelectron spectroscopy.© 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 812–820, 2002     

Formation of polyimide- Cu complexes: improvement of direct Cu-on-PI and PI-on-Cu adhesion

Polyimides containing triazole or imidazole functionalities have been synthesized. Poly(3,3',4,4'-benzophenone tetracarboxylic dianhydride-3,5-diamino-1,2,4-triazole) (BTDA-TADA) contains triazole groups as repeat units and poly(4,4'-oxydiphthalic anhydride-1,3-aminophenoxybenzene-8-azaadenine) (ODPA-APB-8-azaadenine) consists of triazole (8-azaadenine) groups as the end caps. While the BTDA-TADA polyimide starts to decompose at 350°C, the ODPA-APB-8-azaadenine polyimide is thermally stable at 400°C. The peel strength of copper to BTDA-TADA polyimide without surface modification is 200-400 J/m². For the adhesion of polyimide to copper, ODPA-APB-8-azaadenine polyisoimide (1.0 μm) and poly(pyromellitic dianhydride-oxydianiline) (20 μm) were coated onto the copper substrate and then the two layers were cured together to polyimides at 400°C. Peel strengths of 500-800 J/m² were obtained. The failure of the copper/polyimide interface by peeling either the copper or the polymer layer occurred in the near-interface region of the polymer. Both PI/Cu and Cu/PI adhesion was enhanced due to the formation of Cu-polyimide complexes. In the case of PI/Cu adhesion, the polymer chain flexibility of ODPA-APB-8-azaadenine polyimide also plays a significant role in improving adhesion.