Adhesion strength of sodium dodecyl sulfate-modified soy protein to fiberboard

Thermal and rheological properties of sodium dodecyl sulfate (SDS)-modified soy protein isolate (SPI) adhesives were studied using differential scanning calorimetry (DSC) and rheometry. The ordered structure of native SPI was denatured as SDS concentration increased, and thermal stability of native SPI decreased at high SDS concentration. The enthalpy of SPI denaturation decreased significantly with increasing SDS concentration. Apparent viscosity of the SPI adhesives increased as SDS concentration increased. The SPI adhesives modified by high concentrations of SDS exhibited characteristics of a Newtonian-type flow. The SDS-modified SPI adhesives were applied to fiberboard, and effects of SDS concentration, press conditions, and assembly time on bond strength were investigated. Shear strength of the SPI adhesives increased with SDS concentration, reaching its maximum value at 3 wt% of SDS, and then decreased significantly. The shear strength increased as press time and/or press temperature increased. High press temperature (100 °C) and long press time (5 min) are needed to achieve relatively good adhesion properties. The shear strength also increased as assembly time increased. The shear strength of the SDS-modified SPI adhesives decreased after soaking in water for 24 h.     

Effects of wood-surface roughness,adhesive viscosity and processing pressure on adhesion strength of protein adhesive

The objective of this research was to study the effects of wood-surface roughness, adhesive viscosity and processing pressure on adhesion strength between soybean protein adhesive and wood, and to seek the relative importance of the individual factors in determining adhesion strength. Processing pressure was found to be the most important factor in determining adhesion strength. An optimum pressure, which was about 4.55 MPa in this research, is needed for development of a strong bond. A higher pressure resulted in reduced adhesion strength, possibly due to damage to the wood surface; a lower pressure also resulted in decreased adhesion strength because of the lack of bond formation. Adhesive viscosity had greater effect on adhesion strength than surface roughness. Contact angle, which was found to be mainly determined by adhesive viscosity and surface roughness, was a major factor controlling adhesive penetration. A smaller contact angle, resulting from lower viscosity and rougher surface, produced deeper penetration, while a larger contact angle, resulting from higher viscosity and smoother surface, produced shallower penetration. An optimum penetration is needed to enhance adhesion strength by developing a three-dimensional interactive zone at the interface. Too deep or too much penetration would result in 'dry-out' at the interface; less penetration would limit the formation of the three-dimensional zone at the interface. Both cases resulted in reduced adhesion strength. Contact angles ranging from 35 to 47° provided the optimum penetration needed for good adhesion. The results of this research could be used as reference to determine optimum process parameters in plywood manufacturing when an aqueous based adhesive is used.     

Thermal contact resistance and adhesion studies on thin copper films on alumina substrates

A new photothermal method for measuring the thermal contact resistance in the interfacial area is presented. Copper thin films were prepared on alumina substrates by physical vapour deposition. On the basis of a mathematical model developed here, thermal contact resistance was determined in samples of various thicknesses and processed under various argon pressures. The effects of these parameters on the films and interface properties are discussed. A correlation between the thermal contact resistance and the adhesion, as determined by the scratch test, is found. In order to understand the origin of the mean critical load and the thermal contact resistance evolution, observations were made by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). The results obtained have shown that the change in stress level in the copper film and the formation of a new compound in the interfacial area seem to be the main reasons for the enhancement of heat transfer.     

Characterization of ramie fiber/soy protein concentrate (SPC) resin interface

Ramie fiber/soy protein concentrate (SPC) polymer (resin) interfacial shear strength (IFSS) was measured using the microbond technique. To characterize the effect of plasticization, SPC resin was mixed with glycerin. Fibers were also treated with ethylene plasma polymer to reduce fiber surface roughness and polar nature to control the IFSS. Fiber surfaces after ethylene plasma polymerization, and fracture surfaces of specimens before and after the microbond tests were characterized using a scanning electron microscope (SEM). Some specimens were also characterized using electron microprobe analyzer (EMPA) to map the residual resin on the fiber surface after the microbond test. Effects of glycerin concentration in SPC and ethylene plasma fiber surface treatment time on the IFSS were investigated. Preparation of SPC resin requires a large amount of water. As expected, during drying of SPC resin, the microdrops shrank significantly. The high IFSS values indicate strong interfacial interaction in the ramie fiber/SPC resin system. This strong interfacial interaction is a result of a highly polar nature of both the ramie fiber and the SPC resin and rough fiber surface. Ethylene plasma polymerization was used to control the IFSS. The plasma polymer imparted a polyethylene-like, non-polar polymer coating on the fiber surface. As a result, the fiber surface became smoother compared to the untreated fiber. Both fiber smoothness and non-polar nature of the coating reduced the ramie fiber/SPC resin IFSS. Plasticization of the SPC resin by glycerin also decreased the adhesion strength of the ramie fibers with the SPC resin. The load-displacement plots for IFSS tests obtained for different resin and fiber combinations indicate different interfacial failure modes.     

Chemical modification combined with corona treatment of UHMWPE fibers and their adhesion to vinylester resin

The influence of corona treatment on the near-surface structures of treated ultra-high-molecular-weight polyethylene (UHMWPE) fibers was studied first by atomic force microscopy (AFM). AFM pictures showed that the pits on the corona-treated PE fiber surfaces had different change characteristics in depth compared with in length and breadth with variations of corona power. Then the UHMWPE fibers were subjected to chemical modification following the corona treatment, named the two-stage treatment. Surface morphologies and chemical properties of the treated fibers were analyzed by scanning electron microscopy (SEM), FT-IR–ATR spectroscopy and Raman spectroscopy. The results obtained suggested that some carbon–carbon double bonds had been introduced on the surfaces of the PE fibers after the two-stage treatment. These unsaturated groups could participate in free-radical curing of vinylester resin (VER), and this resulted in improvement of interfacial adhesion strength in the PE fiber/VER composites. In addition, the mechanical properties of the UHMWPE fibers reduced after corona treatment did not reduce further after subsequent chemical treatment with increase of corona power. In short, the two-stage treatment proved to be effective in improving the interfacial adhesion of the composites and maintaining the high mechanical properties of the PE fibers, as this treatment method did not destroy the bulk structure of the UHMWPE fibers.     

Effects of natural-resource-based scavengers on the adhesion properties and formaldehyde emission of engineered flooring

In this study we investigated the effects of using four additives, wheat flour (WF), tannin, rice husk (RH) and charcoal, to melamine-formaldehyde (MF) resin for decorative veneer and base plywood in engineered flooring in order to reduce the formaldehyde emission levels and improve the adhesion properties. We determined the effects of variations in hot-press time, temperature and pressure on the bonding strength and formaldehyde emission. Blends of various MF resin/additive compositions were prepared. To determine and compare the effects of the additives, seven MF resin blends were prepared with the four different additives: four with a wt ratio of 8:2 (MF/WF, MF/tannin, MF/RH and MF/charcoal), and three in the wt ratio of 8:1:1 (MF/WF/tannin, MF/WF/RH and MF/WF/charcoal). The desiccator and perforator methods were used to determine the level of formaldehyde emission. The formaldehyde emission level decreased with all additives, except for RH. At a charcoal addition of only 20%, the formaldehyde emission level was reduced to nearly 0.1 mg/l. Curing of the high WF and tannin content in this adhesive system was well processed, as indicated by the increased lap-shear strength. In the case of WF, the lap shear strength was much lower due to the already high temperature of 130°C. The adhesive layer was broken when exposed to high temperature for extended time. In addition, both WF and tannin showed good mechanical properties. With increasing WF or tannin content, the initial adhesion strength increased. The MF resin samples with 20% added tannin or WF showed both good lap shear and initial adhesion strengths compared to the pure MF resin.     

尿素变性对大豆分离蛋白粘接强度和分子结构的影响

大豆分离蛋白基胶粘剂由于具有环境友好性、生物降解性和可再生性而受到人们的关注。研究了尿素变性对大豆分离蛋白粘接强度及对蛋白分子结构的影响。结果表明,蛋白质经过尿素变性后,随着尿素浓度的增加,蛋白质分子展开的程度过大反而对粘接强度有不利的影响。在对榉木进行粘接时,1mol/L尿素变性获得的粘接强度最大。     

Temperature influence on the physicochemical surface properties and adhesion behaviour of Enterococcus faecalis to glass and silicone

The interest in studies on the physicochemical surface properties of bacteria has increased because they are related to the causes of the initial adhesion of microorganisms to biomaterials and the subsequent biofilm formation on indwelling medical devices. The determination of physicochemical parameters such as hydrophobicity or surface tension is usually done at room temperature, not taking into account the real temperature at which bacteria cause infection inside the human body. In this work, the influence of the experimental temperature on the surface physicochemical characteristics and adhesion behaviour of Enterococcus faecalis ATCC29212 to glass and silicone has been studied. Water, formamide and diiodomethane contact angles on bacterial lawns changed when the experimental temperature was increased from 22°C to 37°C. Moreover, hydrophobicity, as determined by water contact angle, increases with temperature, in agreement with the higher and lower adhesion to silicone and glass, respectively, observed at 37°C, with respect to the results at 22°C. Also, when the formamide and diiodomethane contact angles are considered, the changes in the adhesion behaviour to glass and silicone are predicted by the sum of Lifshitz-van der Waals and acid-base interaction free energies if the measurement temperature is the same as the bacterial growth temperature, i.e. 37°C.     

Internal stresses and adhesion of thin silicon oxide coatings on poly(ethylene terephthalate)

The effect of internal stresses on the cohesion and adhesion of a thin silicon oxide (SiO_x) oxygen-barrier coating, evaporated on a poly(ethylene terephthalate) (PET) film substrate was studied. Internal stresses were generated during annealing in the temperature range for recrystallization of the PET,during calendering in a multilayer structure where two SiO_x /PET films were laminated together with a polypropylene film, and during long-term thermal aging below the glass transition temperature of the polymer. The cohesion of the coating and its adhesion to the polymer substrate were derived from fragmentation tests, in which the failure of the oxide coating was analyzed as a function of the applied stress during uniaxial tensile loading of the substrate. The intrinsic coating strength at critical length and the interfacial shear strength were found to be equal to 1350 MPa and 73 MPa, respectively. It was found that none of the thermal treatments investigated altered the interfacial interactions. Rather, these treatments induced shrinkage of the PET substrate, which increased the coating internal compressive stress and the SiO_x /PET interfacial shear strength. A linear relationship between the SiO_x /PET interfacial shear strength and the coating internal stress was determined from a stress transfer analysis. The coefficient of this linear relationship, equal to-1.34 · h _c/l _c, where h _c is coating thickness and l _c is the critical stress transfer length, reproduces the experimental data with good accuracy.     

Surface characteristics and adhesion performance of black oxide coated copper substrates with epoxy resins

Black oxide is a conversion coating applied onto the copper substrate to improve its interfacial adhesion with polymeric adhesives. A comprehensive study is made to characterize the black oxide coating using various characterization techniques, including SEM, XPS, AFM, XRD, Auger electron spectroscopy, TEM, D-SIMS, RBS and contact angle measurements. It was found that the oxide coating consisted of cupric and cuprous oxide layers from the top surface to inside. The cuprous oxide layer was formed on the copper crystal surface, on which densely-packed fibrillar cupric oxide grew continuously until saturation. The cupric oxide had a fibrillar structure with high roughness at the nanoscopic scale, whereas the cuprous oxide was rather flat and granular. There was a continuous change in oxide composition with no distinct boundary between the two oxide layers. The bond strength between the epoxy resin and the oxide coated copper substrate increased rapidly at a low level of oxide thickness, and became saturated at thicknesses greater than about 800 nm. There were similar dependences of bond strength on surface roughness, oxide thickness especially of cupric oxide and surface energy, reflecting the importance of these surface characteristics in controlling the interfacial adhesion.     

Effect of annealing on the cohesion,adhesion, and tribological behavior of amorphous silicon-containing diamond-like carbon (Si-DLC) coatings on steel

Amorphous silicon-containing diamond-like carbon (Si-DLC) coatings were deposited by Ar+ ion beam-assisted physical vapor deposition of tetraphenyl-tetramethyl-trisiloxane (704 Dow Corning diffusion pump oil) on AISI 4340 low alloy and 440° C high alloy steel specimens, as well as on thin wafers of the same compositions, in order to evaluate residual stresses within the coatings. During annealing in an argon atmosphere at 200°C for up to 30 min, the residual compressive stress, attributed to hydrogen entrapment during deposition, gradually changed to tensile due to loss of hydrogen, and the rate of stress increase decreased with increasing annealing time. The cohesion and adhesion failure loads of the coatings decreased with annealing time, as did the friction coefficient between the coating and a diamond stylus. The specific wear rate, measured by pin-on-disk tribometry, increased with annealing time. These properties are affected not only by the change in residual stress state during annealing, but most likely also by devitrification and the accompanying grain growth. If these effects are neglected, then the properties may be correlated directly with residual stresses in the coating.     

Effects of atmospheric pressure helium/air plasma treatment on adhesion and mechanical properties of aramid fibers

In order to investigate the effect of atmospheric pressure plasmas on adhesion between aramid fibers and epoxy, aramid fibers were treated with atmospheric pressure helium/air for 15, 30 and 60 s on a capacitively-coupled device at a frequency of 5.0 kHz and He outlet pressure of 3.43 kPa. SEM analysis at 10 000× magnification showed no significant surface morphological change resulted from the plasma treatments. XPS analysis showed a decrease in carbon content and an increase in oxygen content. Deconvolution analysis of C1s, N1s and O1s peaks showed an increase in surface hydroxyl groups that can interact with epoxy resin. The microbond test showed that the plasma treatment for 60 s increased interfacial shear strength by 109% over that of the control (untreated). The atmospheric pressure plasma increased single fiber tensile strength by 16-26%.     

Effects of contact time,humidity, and surface roughness on the adhesion hysteresis of polydimethylsiloxane

Dynamic contact mechanics experiments have been performed on small polydimethylsiloxane (PDMS) lenses and several substrates in both ambient air and in dry nitrogen. The experimental results are analyzed with the Johnson-Kendall-Roberts theory. While the theory adequately describes the approach data, it is unable to account for the large hysteresis observed upon retraction. Adhesion hysteresis is shown to scale with the roughness of the substrate, the hydrophilicty of the substrate, the time of contact, and the ambient humidity. The experimental results also demonstrate that this method is sensitive to changes in the surface energy of the substrate. The cumulative adhesion hysteresis is quantified and is shown to be largest for rough, hydrophilic substrates in relatively high humidity and smallest for smooth substrates in dry nitrogen. The origin of the hysteresis is analyzed by considering favorable interfacial bonding resulting from water-mediated bonding between the substrate and oxygen atoms in the PDMS backbone or other polar species on the polymer surface. Capillary forces are also postulated to contribute to the cumulative adhesion hysteresis.     

Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass

Metallization of indium-tin-oxide (ITO)-coated glass using an Al/Cr composite thin film is a common practice for chip-on-glass packaging. However, the reliability of the Cr/ITO interface is always a problem because of poor adhesion due to the chemical inertness of ITO. In this study, the adhesion strength between a Cr film and ITO coated glass was enhanced by forming an intermediate oxide layer at the interface. To find out the optimal interface condition, various amounts of oxygen were doped at the interface. The results show that the adhesion strength and thermal stability are both enhanced by the interfacial doping of oxygen. This enhancement is found to be related to the flow rate of oxygen and, therefore, to the oxide thickness. Maximum improvement occurs when the flow rate of oxygen is set at 6 sccm during doping, and at this rate the interface oxide thickness also reaches its maximum value. Under this condition, the Cr/ITO interface also shows the best thermal stability. Wire bond testing shows that the wire pull strength is affected by the thickness of Al film. The results of this study show that the Al film should not be thicker than 1 μm.     

Effects of hydrolysis degree of soy protein isolate on the structure and performance of hydrolyzed soy protein isolate/urea/formaldehyde copolymer resin

The hydrolyzed soy protein isolate (HSPI) with different hydrolysis degree was applied to modify urea‐formaldehyde resins (UF) via copolymerization process. The properties of HSPI were characterized by attenuated total reflection Fourier transform infrared spectroscopy (ATR‐FTIR) and TGA. The results show that HSPI with different hydrolysis degree is obtained. ¹H NMR and ATR‐FTIR spectra indicate that HSPI with different hydrolysis degree can incorporate into the structure of cured and uncured UF. The UF modified with higher hydrolysis degree of HSPI possess more stable units and contribute to the lower exothermic peak temperature in DSC curves. The bonding strength of HSPI modified UF increases as the hydrolysis degree of HSPI increases at the hot‐press temperature of 120°C and decreases at the hot‐press temperature of 150°C. The best bonding strength is 1.53 MPa at the hot‐press temperature of 135°C and improved 56.12% compared with UF. In addition, the formaldehyde emission is dramatically reduced. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41469.     

Effect of thermal treatment of wood lumbers on their adhesive bond strength and durability

Wood used in outdoor applications needs to undergo either chemical or thermal treatment to improve its decay resistance. Thermal treatment permits to avoid the use of toxic chemicals, increases the dimensional stability and gives a dark color to the wood. However, this process deteriorates the mechanical properties of wood, i.e., the wood becomes more fragile and rigid. The chemical transformation of wood that takes place during the heat treatment changes the interaction between the wood surface and the adhesive. In this work, the interfacial bonding strength (the resistance to the shear stress by compression in parallel direction to the glued interface) and cyclic delamination (resistance to delamination during accelerated exposure) for different wood species and adhesives were tested in accordance with the ASTM D2559 standard. Four wood species: scott pine (Pinus sylvestris), aspen (Populus tremuloides), yellow poplar (Liriodendron tulipifera) and jack pine (Pinus banksiana) both treated and non-treated, and two structural adhesives, phenol resorcinol formaldehyde (PRF) and polyurethane (PUR), were used in the testing. Among the studied species, jack pine is found to be the easiest to bond, while aspen is found to be the most difficult. With the wood species and adhesives evaluated in this study, non-treated wood is found to provide a better bonding strength than the treated wood.     

Effects of moisture and temperature ageing on reliability of interfacial adhesion with black copper oxide substrate

The reliability of adhesion performance of bare Cu, as-deposited and surface-hardened black oxide coatings on Cu substrates was studied. The interfacial adhesion with a polyimide adhesive tape and an epoxy moulding compound was measured using the button shear and tape peel tests after hygrothermal ageing in an autoclave, high temperature ageing and thermal cycles. Moisture adsorption and desorption studies at different aging times suggested that the black oxide coating was effective in reducing the moisture adsorption. The bond strengths for all substrates remained almost unchanged after thermal ageing at 150°C for 8 h. Thermal cycling between ?50°C and 150°C for 500 cycles reduced by about 20% the button shear strength of the as-deposited black oxide substrate, but it did change much the bonding performance of the bare Cu substrate. Hygrothermal ageing at 121°C/100% RH in an autoclave was most detrimental to adhesion performance because of the combined effect of elevated temperature and high humidity. The reduction in button shear strength after the initial ageing for 48 h was 50–67%, depending on the type of coating. In all accelerated ageing tests, the residual interfacial bond strengths were consistently much higher for the black-oxide-coated substrates than the bare Cu surface, confirming a higher reliability of black oxide coating. Fracture surfaces analysis of tape-peeled bare copper substrates after 500 cycles of thermal loading revealed a transition in failure mechanism from interfacial to cohesive failure. In contrast, the failure mechanism remained unchanged for black-oxide-coated substrates. The observations made from the button shear and tape peel tests were generally different because of the different fracture modes involved.     

Effect of gallic acid on the aroma constituents of soymilk and soy protein isolates

Volatile compounds from soymilk were analyzed by gas chromatography/olfactometry/mass spectrometry (GCO/MS) with direct injection of various volumes of static headspaces. The most powerful odorants, determined by the minimum headspace volume required to detect by olfactometry, were (i) hexanal, (ii) acetaldehyde, (iii) methanethiol, (iv) dimethyl trisulfide (DMTS), and (v) 2-pentyl furan. Analyses of soymilk prepared with the addition of 100 ppm gallic acid revealed that the only two detectable odorants were hexanal and acetaldehyde. Sensory analyses of the soymilk treated with 100 ppm gallic acid produced a significantly lower score (P=0.0006) for overall odor intensity compared with the control soymilk. Aqueous slurries of soy protein isolates (SPI) prepared with the addition of 100 ppm gallic acid also had lower odor intensities than the control SPI (P<0.0001). GCO/MS analyses of headspace volatiles revealed that the gallic acid treatment had removed all detectable levels of methanethiol and DMTS while having no significant effect on the level of hexanal (P=0.81).     

The effect of silica (SiO2) nanoparticles and ammonia/ethylene plasma treatment on the interfacial and mechanical properties of carbon-fiber-reinforced epoxy composites

A nanoparticle dispersion is known to enhance the mechanical properties of a variety of polymers and resins. In this work, the effects of silica (SiO₂) nanoparticle loading (0–2 wt%) and ammonia/ethylene plasma-treated fibers on the interfacial and mechanical properties of carbon fiber–epoxy composites were characterized. Single fiber composite (SFC) tests were performed to determine the fiber/resin interfacial shear strength (IFSS). Tensile tests on pure epoxy resin specimens were also performed to quantify mechanical property changes with silica content. The results indicated that up to 2% SiO₂ nanoparticle loading had only a little effect on the mechanical properties. For untreated fibers, the IFSS was comparable for all epoxy resins. With ethylene/ammonia plasma treated fibers, specimens exhibited a substantial increase in IFSS by 2 to 3 times, independent of SiO₂ loading. The highest IFSS value obtained was 146 MPa for plasma-treated fibers. Interaction between the fiber sizing and plasma treatment may be a critical factor in this IFSS increase. The results suggest that the fiber/epoxy interface is not affected by the incorporation of up to 2% SiO₂ nanoparticles. Furthermore, the fiber surface modification through plasma treatment is an effective method to improve and control adhesion between fiber and resin.     

Effects of interactions between soy protein isolate and pectin on properties of soy protein-based films

Composite films in coacervation condition offer an alternative to change properties of protein-based films, and they present potential applications such as inclusion, stabilization, and release of bioactive compounds in foods. Maximum interactions between soy protein isolate (SPI) (5%) and high methoxyl pectin (PEC) (0.5, 1, 1.5, and 2%), by zeta potential analysis, are found at a pH of 3. The transparency of the SPI films is lost at this pH. When PEC is added to SPI films, the elasticity, solubility, and permeability to water vapor are not significantly altered, but the tensile strength increases. Permeabilities to oxygen are higher for low PEC contents, but as PEC is added, their values are typical of SPI films produced at a pH of 11. A homogeneous structure is found at the higher PEC concentrations. The interactions of PEC–SPI can be useful to tailor films and coatings for applications such as to carry and protect substances of interest. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48732.