Research on reverse recovery characteristics of SiGeC p-i-n diodes

This paper analyses the reverse recovery characteristics and mechanism of SiGeC p-i-n diodes. Based on the integrated systems engineering (ISE) data, the critical physical models of SiGeC diodes are proposed. Based on heterojunction band gap engineering, the softness factor increases over six times, reverse recovery time is over 30% short and there is a 20% decrease in peak reverse recovery current for SiGeC diodes with 20% of germanium and 0.5% of carbon, compared to Si diodes. Those advantages of SiGeC p-i-n diodes are more obvious at high temperature. Compared to lifetime control, SiGeC technique is more suitable for improving diode properties and the tradeoff between reverse recovery time and forward voltage drop can be easily achieved in SiGeC diodes. Furthermore, the high thermal-stability of SiGeC diodes reduces the costs of further process steps and offers more freedoms to device design.     

大功率低功耗快速软恢复SiGeC功率开关二极管

为满足电力电子电路对功率开关二极管高频化的发展要求，提出了一种大功率低功耗快速软恢复p⁺(SiGeC)-n^--n⁺异质结二极管.与常规的Si p-i-n二极管相比，在正向电流密度不超过1000 A/cm²情况下，p⁺(SiGeC)-n^--n⁺二极管的正向压降减少了约1/5，有效降低了器件的通态功耗；反向恢复时间缩短了一半多，反向峰值电流降低了约25%，软 关键词： 快速软恢复 大功率低功耗 SiGeC/Si异质结功率二极管     

A Closed-Form Model for Position-Dependent Potential across the Channel in DG-MOSFETs

A closed-form model for electrostatic potential distribution in the direction normal to the channel for double-gate （DG） MOSFETs is presented. The effects of doping （NA for nMOS） and minority carriers both are taken into account for the first time, in solving Poisson＇s equation analytically. Excellent agreement between model-predicted results and numerical device simulation is achieved for a wide range of body thickness, light or high channeldoping, under various bias conditions. This complete closed form for position-dependent potential distribution has wide applications for MOS compact modelling and device design.     

A note on TiN/Si (1 0 0) contacts

The contact properties of TiN on p- and n-type Si (1 0 0) obtained by magnetron reactive sputtering were investigated. Schottky diode characteristics were observed on p-type Si (1 0 0) as determined by forward current-voltage (I-V) measurements, but on n-type Si (1 0 0) the reverse I-V relation has shown a nonsymmetrical character. The zero-bias barrier heights evaluated by I-V on both type diodes were in the range of ∼0.60-0.64 V within the range of a few mVs, not more than ∼±(10-30) mV from each other. Incorporation of the effect of the series resistance in the I-V analysis resulted in a significant reduction in the magnitude of the ideality factor of the TiN/p-type specimen. Almost no change has occurred in the barrier height values. The contradictory reports on the TiN/n-type Si (1 0 0) diode characteristics in earlier works have been explained in terms of surface passivation of Si by the HF cleaning solution. It was stated in these reports that following annealing at 673 K the diodes have shown rectifying behavior. It has been speculated, that the nonsymmetrical nature of the TiN/n-Si (1 0 0) showing an intermediate behavior between Ohmic and rectifying behavior is a result of the specimen being exposed to a temperature lower than 673 K during sputtering where no complete depassivation took place. In order to obtain a rectifying behavior of TiN on both n-type and p-type Si surface passivation has to be eliminated.     

Electrical characteristics of hole resonant tunneling diodes with high Ge fraction (x > 0.4) Si/strained Si1−xGex/Si(1 0 0) heterostructure

Effectiveness of a Ge fraction modulated spacer in hole resonant tunneling diodes (RTDs) with Si/strained Si_1−xGe_x heterostructures epitaxially grown on Si(1 0 0) was investigated to improve the electrical characteristics at higher temperatures. Electrical characteristics measured for 30 RTDs, with the modulated spacer at higher Ge fraction (x = 0.48) on a single wafer, show that the deviation of the peak current and voltage at the resonant peak falls in ranges of ±25% and ±10%, respectively. For the RTDs, negative differential conductance (NDC) characteristics are obtained even at higher temperatures around 230 K than that for the RTDs with x = 0.42. The result indicates that the introduction of higher Ge fraction is effective for NDC in RTD at higher temperature.     

n,p柱宽度对超结SiGe功率二极管电学特性的影响

结合SiGe材料的优异性能与超结结构在功率器件方面的优势,提出了一种超结SiGe功率二极管.该器件有两个重要特点:一是由轻掺杂的p型柱和n型柱相互交替形成超结结构,取代传统功率二极管的n^-基区;二是阳极p⁺区采用很薄的应变SiGe材料.该二极管可以克服常规Si p⁺n^-n⁺功率二极管存在的一些缺陷,如阻断电压增大的同时,正向导通压降随之增大,反向恢复时间也变长.利用二维器件模拟软件MEDICI仿真 关键词： 超结 锗硅二极管 n p柱宽度 电学特性     

Majority carrier transistor based on voltage-controlled thermionic emission

A new type of transistor is proposed based on gate-controlled charge injection in unipolar semiconductor structures. Its design has some similarity with the recently fabricated triangular barrier diodes but contains an additional input circuit which allows an independent control of the barrier height for thermionic emission. This circuit is provided by a MOS gate on the semiconductor surface. In the proposed device the current flows perpendicular to the semiconductor surface over a planar potential barrier controlled by the gate. The static transconductance characteristics and dynamical response are analyzed. The characteristic response time is limited by the time of flight of electrons across the structure and can be in the picosecond range. The gate voltage required to switch the output current at room temperature is of order 0.2 V.     

Synthesis,Characterization of 9, 9＇-Bianthracene and Fabrication of 9, 9＇-Bianthracene Field-Effect Transistors

We synthesize and purify 9, 9＇-bianthracene with the purity up to 96.4%. The electronic and crystallographic structures of 9, 9＇-bianthracene are studied. The results of a joint experimental investigation based on a combination of x-ray diffraction （XRD） spectra, hydrogen nuclear magnetic （HNMR） spectra, infrared absorption （FT-IR） spectra, and mass spectra （MS） of 9, 9＇-bianthracene are obtained. The uniform compact film is observed by an atomic-force microscope （AFM）. Organic field effect transistors （OFETs） with an active layer based on the synthesized 9, 9＇-bianthracene are fabricated for the first time. Its field-effect mobility is as large as 0.067 cm^2 /（V·s） and the on/off ratio is above 5 ×10^4. The result demonstrates that the oligomerization of a small semiconductor molecule is an effective method to develop high-mobility organic semiconductors.     

Electroluminescence study on electron hole plasma in strained SiGe epitaxial layers

The electroluminescence (EL) of thick fully strained SiGe layers is investigated in order to clarify the recombination mechanisms. In the investigated temperature range of 20–80 K and for SiGe thickness of 70–450 nm an electron–hole plasma (EHP) is observed even at low current densities of 1 Acm⁻². In SiGe-based quantum devices the EHP condition is expected to be attained at even lower injection levels. We used the band filling model for EHP to extract the renormalized gap of SiGe in dependence on the plasma density by performing a line shape analysis of EL spectra. The results were compared with the theoretical prediction. Based on this analysis as well as on measurements and modelling of the spectral photocurrent and the external quantum efficiency, we were able to evaluate parameters of recombination transitions for EHP in SiGe. Above 200 K there is an important contribution to EL from the silicon regions. For a better evaluation of the SiGe contribution, we compared EL of SiGe diodes with EL of pure silicon diodes.     

Capacitance of Organic Schottky Diodes Based on Copper Phthalocyanine （CuPc）

The capacitance of an organic Schottky diode based on copper phthalocyanine （CuPc） is investigated. Based on the organic small-signal equivalent model established, we calculate the reverse capacitance CMetal Of the organic Schottky diode with different kinds of metal cathodes （Mg, Al, Au）. It is found that the reverse capacitance of the organic Schottky diode shows behavior as CMg 〉 CAl 〉 CAu at the same frequency, and according to our analysis, the reverse Schottky junction capacitance Cj is expected to have little effect on the reverse capacitance of the organic Schottky diode, and the space-charge limited current capacitance Us is considered to dominate the reverse capacitance, which limits the improvement of frequency characteristics of organic Schottky diodes.     

Dual-Material Surrounding-Gate Metal-Oxide-Semiconductor Field Effect Transistors with Asymmetric Halo

Asymmetrical halo and dual-material gate structure are used in the sub-100 nm surrounding-gate metal oxidesemiconductor field effect transistor （MOSFET） to improve the performance. Using three-region parabolic potential distribution and universal boundary condition, analytical surface potential and threshold voltage models of the novel MOSFET are developed based on the solution of Poisson＇s equation. The performance of the MOS- FET is examined by the analytical models and the 3D numerical device simulator Davinci. It is shown that the novel MOSFET can suppress short channel effect and improve carrier transport efficiency. The derived analytical models agree well with Davinci.     

Base doping and dopant profile control of SiGe npn and pnp HBTs

Incorporation of high doping concentrations and the creation and maintaining of steep doping profiles during processing are key enabler for high level RF performance of heterojunction bipolar transistors (HBTs). In this paper, we discuss results of base doping and dopant profile control for npn and pnp SiGe HBTs fabricated within 0.25 μm BiCMOS technologies. High level of electrically active B and P doping concentrations (up to 10²⁰ cm⁻³) have been incorporated into SiGe. By adding C to SiGe steep doping profiles have been maintained due to the prevention of dopant diffusion during device processing. It is shown that broadening of P doping profiles caused by segregation could be reduced by lowering the deposition temperature for the SiGe cap. B and P atomic layer doping is shown to be suitable for the creation of steep and narrow doping profiles. This result is demonstrating the capability of the atomic layer processing approach for future devices with critical requirements of dopant dose and location control.     

A novel type of ultra fast and ultra soft recovery SiGe/Si heterojunction power diode with an ideal ohmic contact

A novel type of p^+(SiGe)－n^-－n^+ heterojunction switching power diode with high-speed capability is presented to overcome the drawbacks of existing power diodes. The improvement is achieved by using a p^+－n^+ mosaic layer as a substitute for the n^+ region in the conventional p^+(SiGe)－n^-－n^+ diode to realize an `ideal ohmic' contact for electrons and holes simultaneously. Compared with conventional p^+(SiGe)－n^-－n^+ diodes, the ideal ohmic contact p^+(SiGe)－n^-－n^+ diodes have about one third of the reverse recovery time and a half of peak reverse recovery current. Furthermore, the softness factor increases nearly two times and the leakage current decreases 1－2 orders of magnitude. These improvements are achieved without resorting special process step to lower the carrier lifetime and thus the devices could be easily integrated into power ICs. The Ge percentage content of p^+(SiGe) layer is an important parameter for the optimal device design.     

Growth and properties of SiGe structures obtained by selective epitaxy on finite areas

Selective epitaxy growth (SEG) was used to build SiGe optoelectronic devices and nanoscale structures for the future nanotechnology. The growth of strained SiGe on small areas offers some advantages for improvement of device performances. In particular, with relative large area light emitting diodes (LED), the emission efficiency of SiGe diodes can be increased up to 0.1% internal value at room temperature. Further improvements are expected for nanoscale devices. By SEG on mesas, Ge islands can be obtained ordered in lines along the mesas edges. Precise localization of Ge dots can be obtained by SEG in very small oxide windows and even only one island/window is formed. It was shown that nanostructures of size down to 5 nm can be grown by this method. PACS 81.15Kk; 81.07.-b; 78.60.Fi     

Investigation of electrical and ammonia sensing characteristics of Schottky barrier diode based on a single ultra-long ZnO nanorod

Novel ultra-long ZnO nanorods, with lengths about 0.5-1.5 mm and diameters ranging from 100 to 1000 nm, in mass production have been synthesized via the vapor-phase transport method with CuO catalyst at 900 °C. Rectifying Schottky barrier diodes have been fabricated by aligning a single ultra-long ZnO nanorod across paired Ag electrodes. The resulting current-voltage (I-V) characteristics of the SBD exhibit a clear rectifying behavior. The ideality factor of the diode is about 4.6, and the threshold voltage is about 0.54 V at room temperature (300 K). At the same time the detailed I-V characteristics have been investigated in the temperature range 423-523 K. In addition, after exposure of the Schottky diodes to NH₃, the forward and reverse currents increase rapidly, indicating a high sensitivity to NH₃ gas.     

Investigation of ruthenium Schottky contacts to n-GaAs

Ruthenium was evaporated on n-GaAs to form Schottky contacts. Initial electrical measurements revealed a near ideal Schottky behaviour with low leakage currents. The Schottky diodes exhibit good stability upon thermal aging at elevated temperatures up to 300° C. However, the diode parameters rapidly deteriorate after aging at temperatures in excess of 400° C. The room temperature (300 K) median life of the diodes, based on a failure criterion of a tenfold increase in the diode saturation current, J _riv ^s , from reverse bias current-voltage (I–V) data, was of the order of 10⁴ h.     

Room-temperature SiGe light-emitting diodes

In the present paper the electroluminescence of PIN diodes with either strained SiGe/Si or Ge islands in the i-region has been investigated experimentally and by quantitative modelling. The modelling helped to improve the diode structure. Consequently, diodes with strained Si_0.80Ge_0.20 could be improved so as to reveal emission up to room temperature, if the thickness was high enough. To overcome the thickness limitation due to plastic relaxation, we used selective epitaxy on small areas. We also present results for diodes with Ge islands in the active region. The internal quantum efficiency of light emitting diodes with strained SiGe was at room temperature 10⁻⁴, while diodes with islands emitted ten times less light.     

Element Substitution Effect in Transition Metal Oxypnictide Re(O1-xFx)TAs (Re=rare earth, T=transition metal)

Different element substitution effects in transition metal oxypnictide Re(O_1-xF_x)TAs, with Re=La, Ce, Nd, Eu, Gd, Tm, T=Fe, Ni, Ru, are studied. Similarto the La- or Ce-based systems, we find that the pure NdOFeAs shows a strong resistivity anomaly near 145K, which is ascribed to the spin-density-wave instability. Electron doping by F increases T_c to about 50K. While in the case of Gd, Tc is reduced below 10K. The tetragonal ZrCuSiAs-type structure could not be formed for Eu or Tm substitution in our preparing process. For the Ni-based case, although both pure and F-doped LaONiAs are superconducting, no superconductivity is found when La is replaced by Ce in both the cases, instead a ferromagnetic ordering transition is likely to form at low temperature in the undoped sample. We also synthesize LaO_1-xF_xRuAs and CeO_1-xF_xRuAs compounds. The metallic behaviour is observed down to 4K.     

Temperature and composition dependence of the energy band gap of Pb1−x Mn x S solid solution

Photovoltaicp-n junctions inn-type Pb_1–xMn _x Sx0.04, have been made by sulphur diffusion. Current-voltage and resistance-voltage characteristics have been examined at various temperatures. The spectral responses of the diodes have been measured within the temperature range from 5 to 300 K at a zero bias. From these measurements the energy band gap of Pb_1–x Mn _x S solid solution has been determined as a function of temperature and manganese content. A phenomenological expression describing the variation of the energy gap of Pb_1–x Mn _x S with temperature and alloy composition has been proposed.     

Room temperature fabrication Oxide TFT with Y2O3 as a gate oxide and Mo contact

In this investigation, an operating voltage as low as 5 V has been achieved for Oxide TFT with Y₂O₃ as a gate oxide and a-IGZO as an active layer. The OTFT has been fabricated at room temperature using RF sputter. The mobility and threshold voltages are 11.3 cm²/V s and 3.4 V for the device with W/L = 0.8, respectively. The annealing at 400 °C in N₂ containing 5% H₂ ambient has been utilized to improve the electrical performance of TFT. The on-off current which is determined by gate dielectric has been observed to be 10⁴. It has also been observed that the dielectric properties of gate oxide deteriorate on annealing. The dielectric constant of Y₂O₃ is observed in the range between 5.1 and 5.4 measured on various devices.