Ti/Nb/Cu作缓冲层的TiC金属陶瓷/304不锈钢扩散连接

采用Ti/Nb/Cu复合中间层在连接温度为925℃、保温时间20min、焊接压力8MPa的条件下对TiC金属陶瓷和304不锈钢进行真空扩散连接。通过光学金相显微镜(OM)、扫描电镜(SEM)、能谱(EDS)及X射线衍射(XRD)分析观察接头微观组织、断口形貌、反应界面元素分布、断面的物相组成。结果表明:在TiC金属陶瓷和304不锈钢之间形成一个明显的转变过渡区,界面反应产物主要为[Ti,Nb]固溶体+Ti+NbTi4,Nb和剩余Cu+[Cu,Fe]固溶体+Cr。接头抗剪强度达到84.6MPa,断裂发生在TiC和Ti之间的位于TiC上的扩散反应层上。Nb对接头残余应力的改善起到关键作用,界面强度高于因残余应力作用而弱化了的陶瓷基体强度。     

Nb对Zr基钎料及钎焊连接SiC陶瓷的影响

研究在Zr-20Cu钎料基础上添加元素Nb对钎料及SiC陶瓷钎焊接头微观结构和力学性能的影响.结果表明:添加Nb后钎料的相组成物主要是α-Zr、β-Zr、β-Nb和CuZr2,且随着Nb含量增加,晶界处的大尺寸第二相CuZr2不断减少,从而提高了钎料的耐腐蚀性;添加Nb钎料可有效地填充SiC陶瓷之间的间隙,且钎焊接头中无孔隙和裂缝;钎焊接头处形成了一定厚度的界面反应层,生成物质主要有ZrC、Zr2 Si、Nb2 C和Nb5 Si3;Nb2 C和Nb5 Si3可降低钎焊接头的脆性,其与Nb的固溶强化共同作用,提高了接头的剪切强度.当Nb含量较低时,SiC陶瓷接头的剪切强度随Nb含量(0％～10％,质量分数,下同)的增加而提高,其中Nb含量为10％时,接头断口处存在大量韧窝,接头强度达到最大值(86 MPa);但当Nb含量继续增加到15％时,由于Nb过量导致钎料熔点升高,使得接头剪切强度有所降低.     

采用Ag-Cu-Ti钎料钎焊Cf/SiC接头的组织和强度

选用Ag-35.5Cu-1.8Ti和Ag-27.4Cu-4.4Ti两种钎料,在880℃/10min钎焊规范下进行了Cf/SiC陶瓷基复合材料的钎焊实验。实验结果表明,钎焊接头中央为典型的Ag-Cu共晶组织,而在钎料与Cf/SiC母材的界面处形成了扩散反应层,Ti在该层中富集。通过界面X射线衍射分析,确定界面存在TiC相,但未检测到Ti-Si相。分析了界面反应机理。接头强度试验结果表明,采用Ag-35.5Cu-1.8Ti钎料获得接头的三点弯曲强度为132.5MPa,而Ag-27.4Cu-4.4Ti对应的接头强度为159.5MPa,分析认为,Ti在钎料中的活性是决定接头性能的关键因素之一,即接头强度随着钎料中Ti活性的提高而呈现增加的趋势。     

采用Ag-Cu-Ti钎料真空钎焊SiO2f/SiO2复合陶瓷与C/C复合材料

分别在880℃/10min和880℃/60min规范下,采用Ag-Cu-Ti活性钎料实现了SiO2f/SiO2复合陶瓷与C/C复合材料的真空钎焊连接,通过电子探针(EPMA)、能谱仪(XEDS)和X射线衍射仪(XRD)分析了接头微观组织,室温下测试了接头的抗剪强度。结果表明:两种规范下所得接头界面结合良好,接头中靠近两侧母材均形成了一层扩散反应层,钎缝基体主要由均匀的共晶组织组成。880℃/10min规范下钎焊接头界面产物依次为:SiO2f/SiO2→Ti4O7→Ti5Si4+Cu(s,s)+Ag-Cu共晶合金→TiC→C/C;对于880℃/60min规范下的接头,界面组织结构与保温10min的接头基本类似,但是不存在Cu(s,s),并且接头反应层明显增厚。880℃/60min条件下所得钎焊接头剪切强度平均值为16.6MPa。     

采用Al-Zn-Mg-Cu封接Al_2O_3陶瓷与304不锈钢工艺

以Al-Zn-Mg-Cu合金为封装材料,采用粉末冶金技术对Al_2O_3陶瓷和304不锈钢进行了封接试验,研究了烧结合金组织、接头特征点成分和物相,并探讨了烧结温度和保温时间对接头界面组织和连接强度的影响。结果表明,在烧结温度570℃,保温时间1 h条件下获得主要由α-Al和MgZn_2组成的较为致密的铝合金,304不锈钢/铝合金侧剪切强度为24 MPa、Al_2O_3陶瓷/铝合金侧剪切强度为6.4 MPa。在304不锈钢/铝合金界面处,Fe、Al元素均发生扩散,形成了不同金属间化合物的扩散层。铝合金/Al_2O_3陶瓷界面处Mg与Al_2O_3反应生成了MgAl_2O_4相,改善了铝合金和Al_2O_3陶瓷的润湿性。     

TiC陶瓷/NiCrSiB/铸铁钎焊连接的界面组织和强度分析

采用NiCrSiB钎料对TiC陶瓷与铸铁进行钎焊连接,分析了接头的界面组织和剪切强度.结果表明:当连接规范一定时,在钎料内部、钎料与母材的界面处有TiC从TiC陶瓷侧扩散过来,同时在钎料内部和界面处有[Ni,Fe]和Ni基固溶体生成.当连接温度为1373K,连接时间为20 min时,接头的剪切强度最高可达78.6 MPa.     

Al-Si-Cu-Zn钎料钎焊3003铝合金的接头组织及力学性能

采用自制的Al-Si-Cu-Zn钎料对3003铝合金进行钎焊实验,利用X射线衍射、扫描电镜、能谱仪对接头微观组织和断口进行分析,并研究了钎焊温度对接头组织和性能的影响。结果表明:在540~580℃保温10min工艺下钎焊3003铝合金,均可获得良好的钎焊效果。钎焊接头均由钎缝中心区的α(Al)固溶体、θ(Al2Cu)金属间化合物、细小Si相和AlCuFeMn+Si相,两侧扩散区的α(Al)固溶体与元素扩散层以及母材组成;钎焊接头室温剪切断裂于扩散区齿状α(Al)/钎缝中心区的交界面,断口主要呈脆性解理断裂特征。随着钎焊温度的升高,扩散区的α(Al)固溶体晶粒长大,接头结合界面犬牙交错;当钎焊温度为560℃,保温10min时,接头的室温抗剪强度达到最大值92.3MPa,约为母材强度的62.7%。     

Al2O3陶瓷/AgCuTi/可伐合金钎焊接头力学性能

为实现Al2O3陶瓷与可伐合金的可靠连接,分析影响接头力学性能的因素,测试了Al2O3陶瓷/AgCuTi/可伐合金钎焊接头的抗剪强度,通过光学显微镜、SEM及EDS对断口形貌、成分进行分析,确定了断裂路径.研究表明,钎焊温度为900 ℃,保温时间为5 min时,接头抗剪强度最高,达144 MPa.此时,断裂大部分发生在Al2O3陶瓷/钎料界面处,小部分发生在界面中的TiFe2、TiNi3金属间化合物层.钎焊温度升高,保温时间延长时,界面上出现大量的TiFe2、TiNi3金属间化合物,界面性能弱化,断裂发生在TiFe2、TiNi3金属间化合物层,造成Al2O3陶瓷/AgCuTi/可伐合金接头连接强度降低.     

电流辅助下CoFeCrNiCuTi2高熵合金钎焊SiC陶瓷接头组织与性能

采用电流辅助连接技术，以CoFeCrNiCuTi₂高熵合金为连接层材料，在1125℃的温度下，实现了SiC陶瓷的快速钎焊，提高了连接效率的同时保证了元素的充分扩散，系统研究了钎焊温度对连接接头界面微观结构和力学性能的影响。结果表明：所获得的钎焊接头无明显缺陷，焊缝组织主要由高熵FCC相、TiC相、Cr₂₃C₆相组成。界面致密的TiC反应层的形成在一定程度上抑制了高熵合金的分解和金属间化合物的生成，并缓解了SiC基体界面与高熵合金钎料之间的热应力。同时，由于高熵合金钎料的迟滞扩散效应，焊缝中心主体钎料仍保持高熵合金的FCC结构。力学性能测试表明：钎焊接头强度随钎焊温度升高呈先降低后增大的变化趋势。当连接温度为1125℃时，碳化硅接头获得最大弯曲强度，达到37 MPa,高于普通镍基钎料约21.3 MPa。     

Al-Ti合金钎焊SiC陶瓷接头界面微观结构与力学性能

SiC陶瓷具有优异的综合性能, 通过钎焊获得高强度接头是其获得广泛应用的重要前提。研究采用Al-(10, 20, 30, 40)Ti(Ti的名义原子含量10%、20%、30%、40%)系列合金, 在1550 ℃条件下, 对SiC陶瓷进行钎焊30 min。当中间层厚度为~50 μm时, SiC钎焊接头的平均剪切强度处于100~260 MPa范围内。当采用Al-20Ti合金作为钎料时, 随着中间层厚度从~100 μm减小至25 μm, 钎焊接头的平均强度逐渐提高, 且最大强度~315 MPa。同时, 钎焊中间层中(Al)相逐渐减少直至消失, 只留下Al₄C₃、TiC和(Al,Si)₃Ti相。SiC/Al-20Ti/SiC钎焊接头的断裂主要发生在靠近中间层/陶瓷界面位置的陶瓷基体内。     

Microstructure and strength of TiC cermet/cast iron brazed with Ag – Cu – Zn filler metal

Abstract

The brazing of TiC cermet to cast iron was carried out at 1223 K for 5 – 30 min using Ag – Cu – Zn filler metal. The formation phases, interface structures and shear strengths of the joints were investigated. The experiment result and analysis identify that three new phases, namely Cu base solid solution, Ag base solid solution and (Fe, Ni) have formed during the brazing of TiC cermet to iron. The interface structure of the joints can be expressed as TiC cermet/Cu base solid solution/Ag base solid solution + a little Cu base solid solution/Cu base solid solution + (Fe, Ni)/cast iron. The highest shear strength of the joints is 292.0 MPa, obtained with a brazing time of 20 min.     

Effect of welding parameters on diffusion bonding of type 304 stainless steel–copper bimetal

Abstract

Stainless steel AISI type 304 and electrolytic cold rolled copper were joined by diffusion bonding at temperatures ranging from 650 to 950°C, for times from 5 to 45 min, and at pressures from 2 to 12 MPa. After bonding the microstructure of the interface was investigated, including the grain size, and shear and tensile strengths of the bonded specimens were determined. From the results, it was seen that the bond shear strength was dependent on interface grain boundary migration and on grain growth during the bonding process. In addition, attempts were made to find a relationship between grain size and shear strength in the bonding area. Taking into account the results of shear testing and microstructural observation, for a sound bond, optimum bonding conditions were obtained at temperatures of 800–850°C for 15–20 min at 4–6.5 MPa. The fracture behaviour of the diffusion bonded joint was investigated by means of shear and tensile testing under different bonding conditions. It was found that both shear and tensile strengths of the bonds were sensitive to the bonding conditions, and the intermetallic phases did not affect these parameters. Furthermore, the value of shear strength of the bond surface determined by shear testing was higher than the shear strength of the fracture surface determined by tensile testing.     

Vacuum diffusion bonding of TiB2 cermet to TiAl based alloys

Abstract

Vacuum diffusion bonding of TiB₂ cermet to TiAl based alloys was carried out at 1123 – 1323 K for 0.6 – 3.6 ks under 80 MPa. The microstructural analyses indicate that a compound Ti(Cu, Al)₂ is formed in the interface of the TiB₂ /TiAl joints, and the width and quantity of the Ti(Cu, Al)₂ compound increase with the increase of the bonding temperature and bonding time. The experimental results show that the shear strength of the diffusion bonded TiB₂ /TiAl joint is 103 MPa, when TiB₂ cermet is bonded to TiAl based alloy at 1223 K for 1.8 ks under 80 MPa.     

5A06/TA2 diffusion bonding with Nb diffusion-retarding layers

The structure and performance of 5A06/TA2 diffusion bonding joints with or without Nb diffusion-retarding layers were studied by means of scanning electron microscopy (SEM), X-ray diffraction (XRD) and shear strength measurement. The results showed that a diffusion reaction occurred and Al₁₈Ti₂Mg₃ was formed, which markedly decreased the joint strength, and the highest shear strength of 5A06/TA2 joint in direct bonding was 83 MPa. The Nb interlayer impeded the diffusion of Mg atoms from the Al side to the Ti side and also retarded the diffusion of Ti atoms from the Ti side to the Al side, which was acting as a diffusion-retarding layer. The joint strengths were increased by the Nb diffusion-retarding layers, and the highest shear strength reached 105 MPa. When Ti diffused across the Nb layer and achieved saturation nearby the interface with Al alloy, the diffusion reaction of Ti, Al and Mg occurred and Al₁₈Ti₂Mg₃ appeared which decreased the joint strength.     

采用BNi-7的Ti（C，N）基金属陶瓷与17-4PH沉淀硬化不锈钢的真空钎焊研究

采用镍基共晶钎料BNi-7对Ti（C,N）基金属陶瓷与17—4PH沉淀硬化不锈钢行了真空钎焊连接。研究了钎焊温度和焊缝厚度对焊接接头力学性能和微观结构的影响。结果表明,BNi-7对金属陶瓷粘结相具有较强的溶解能力,这是熔降元素（磷）能够在金属陶瓷侧大范围分布、钎焊接头获得良好界面结合的主要原因。随钎焊温度升高,磷在金属...     

致密TiC-Al2O3-Fe 金属陶瓷的自蔓延高温合成

通过自蔓延高温合成结合准热等静压法(SHS/PH IP) 制备出了致密的TiC₂Al₂O₃-20Fe 金属陶瓷。研究了延迟时间、高压持续时间、压力等工艺参数对金属陶瓷密实度的影响, 分析了金属陶瓷的相组成、微观组织及性能。结果表明, 燃烧合成过程中气体的排放和液相的存在是合成密实材料的关键, 通过优化工艺合成了密实度为97. 7% 的TiC₂Al₂O₃-20Fe 金属陶瓷。金属陶瓷由TiC、Al₂O₃ 和Fe 粘结相组成。粘结相Fe 与Al₂O₃ 之间界面光滑,Fe 与T iC 之间有一较薄扩散层。TiC₂Al₂O₃-20Fe 金属陶瓷的抗弯强度和抗压强度分别为890M Pa 和18. 4 GPa。      

TiAl合金与高温合金的扩散焊接头组织及性能

采用直接扩散焊和加中间层的扩散焊方法进行了TiAl合金和高温合金异种材料组合的连接实验。在1000℃/20MPa/1h规范下直接扩散焊获得的TiAl/GH2036接头组织中存在大量未焊合的孔洞,接头室温剪切强度平均值仅有16MPa。采用Ti-Zr-Cu-Ni合金作为中间层在935℃加压3MPa保温10min和1h进行了TiAl/GH3536组合接头的液相扩散焊,获得的扩散焊缝中含有Ti3Al,NiTi等多种物相,中间层合金与两侧母材发生作用形成了具有一定厚度的反应层。在935℃/3MPa/1h规范下获得了与两侧母材结合良好的无缺陷扩散焊接头,室温剪切强度达到125MPa。     

Interface microstructure and strength properties of Ti–6Al–4V and microduplex stainless steel diffusion bonded joints

The diffusion bonding of Ti–6Al–4V alloy and micro-duplex stainless steel was carried out in the temperature range of 850–1000 °C for 45 min in vacuum. The influence of bonding temperature on the microstructural development, micro-hardness and strength properties across the joint region was determined. The layer wise σ phase, λ + FeTi and λ + FeTi + β-Ti phase mixtures were observed at the bond interface when the joint was processed at 900 °C and above temperature. The maximum tensile strength of ∼520.1 MPa and shear strength of ∼405.5 MPa along with 6.8% elongation were obtained for the diffusion couple processed at 900 °C. Fracture surface observation in scanning electron microscopy (SEM) using energy dispersive X-ray spectroscope (EDS) demonstrates that, failure takes place through λ + FeTi phase when bonding was processed at 900 °C, however, failure takes place through σ phase for the diffusion joints processed at and above 950 °C.     

Diffusion bonding of TI-6AL-4V to AISI 316L stainless steel: mechanical resistance and interface microstructure

The interface microstructure and mechanical strength of joints obtained by diffusion bonding of alloy Ti-6A1-4V to AISI 316L stainless steel are presented. Bonding took place at 850, 900 and 950°C, maintained for different lengths of time (60 to 180 min). The highest recorded shear strength was equal to 382 MPa and was displayed by the specimen bonded at 950°C/180 min. Three different fracture paths were identified, each correlated to a characteristic strength range. From microprobe measurements and x-ray diffraction studies the following interface reaction products were identified: phase, -Ti, Fe₂Ti, -Ti and Fe-Ti. The interface growth kinetics obeyed a quadratic law, indicating diffusion controlled growth of the -Ti layer. Finally, from correlations identified between -Ti layer thickness and shear strength variations, some hypotheses on the role of both pores and interface reaction product on mechanical strength were presented.     

Evaluation of the microstructure and mechanical properties of diffusion bonded joints of titanium to stainless steel with a pure silver interlayer

Solid-state diffusion bonding of commercially pure titanium to 304 stainless steel using an Ag interlayer was carried out at 825–875 °C under a uniaxial pressure of 8 MPa for 20 min in vacuum. The microstructural observations revealed that the resultant joints were composed of the remnant Ag interlayer, TiAg intermetallic phase and Ti–Ag solid solution. An optimized bonding strength of up to 414 MPa was achieved. Fracture took place through the remnant Ag interlayer during tensile tests and the interfacial TiAg phase exhibited no detrimental effect on the bonding strength. Extensive dimples were observed on the fracture surfaces, indicating that the joints were ductile in nature.