回流焊炉制造数据处理软件的设计与实现

回流焊接是表面贴装生产中印制板组装的最后一道工序,对回流焊炉制造数据进行有效处理,不仅可以查看设备的状态,还可实时监控回流焊炉的工作过程。因此,文章对回流焊炉制造数据进行了分析,重点研究了回流焊炉的温度曲线,设计并实现了回流焊炉制造数据处理软件,可对回流焊炉的温度曲线进行模拟设置,通过分析历史数据,充分挖掘、利用回流焊炉的生产能力,提高产品质量。     

基于模糊算法的回流焊温度系统仿真设计北大核心CSCD

温度精确控制是SMT回流焊炉最重要的控制单元之一。针对回流焊炉温度控制系统的非线性、大迟滞和易受干扰等特点,提出了一种基于模糊免疫自整定的PID算法。通过采用模糊免疫算法自动调节比例系数、积分系数和微分系数,实现温度的快速和稳态控制。最后,利用Simulink仿真验证了所提算法的有效性。结果表明,该控制器能够明显改善温度控制系统的动态跟随性能,实现参数在线自整定,即使在10%的随机干扰下,依然能够快速恢复到稳定状态。     

基于单片机控制的小型回流焊接炉设计

伴随着表面组装技术(SMT,Surface Mount Technology)的成熟和电子装联技术新的发展高潮的到来,回流焊工艺成为表面组装技术焊接质量优劣的主因。本文结合实际回流焊接时的标准温度曲线的控制要求,通过设计小型回流焊炉保证回流焊接温度上升的速度和温度值的稳定度,实现了对回流焊工艺的实时有效控制,从而有效解决了SMT回流焊产品质量缺陷问题。     

基于μC/OS—Ⅱ的回流焊炉的任务研究

主要对回流焊的温度控制系统设计中的嵌入式操作系统μC/OS-Ⅱ的任务进行研究;首先对回流焊硬件系统进行简单介绍,并对主要的硬件器件和电路做了说明,接着分析μC/OS-Ⅱ任务块的基本原理,然后阐述了任务管理的调度,最后着重讨论了针对回流焊的μC/OS-Ⅱ实时操作系统的任务划分以及三个任务之间的通讯实现;实际运行结果表明该软件系统稳定性好,可靠性高,人机界面友好,维护简单。     

基于μC/OS-II的回流焊炉的任务研究

主要对回流焊的温度控制系统设计中的嵌入式操作系统μC/OS-II的任务进行研究;首先对回流焊硬件系统进行简单介绍,并对主要的硬件器件和电路做了说明,接着分析μC/OS-II任务块的基本原理,然后阐述了任务管理的调度,最后着重讨论了针对回流焊的μC/OS-II实时操作系统的任务划分以及三个任务之间的通讯实现;实际运行结果表明该软件系统稳定性好,可靠性高,人机界面友好,维护简单.     

基于VB的回流焊温度测试系统软件设计

为了提高回流焊接工艺的质量,必须对影响焊接质量的关键因素--温度进行实时测试.基于VB建立了回流焊温度测试系统的软件,介绍了温度测试系统软件的设计目标、系统结构、系统软件设计和实现等内容.探讨了其中的关键技术及设计方法.系统软件根据采集的温度生成回流焊温度曲线并对温度数据进行分析,实践表明该系统具有良好的实时性和准确性、有助于提高回流焊接工艺的质量.     

艾默生-ETC系列温控器

长期以来，温度控制一直是工业控制中的难点，主要体现在温度参数的滞后、时变和非线性，而且温控同时受到负荷变化、燃料波动、多区域温度等多种因素的影响。针对温控的复杂性，艾默生工业自动化（中国）（简称艾默生IAC）特别为工业领域设计了ETC系列多路智能温控器。与普通温控器相比，ETC系列具有高精度、智能化、易用性、多种控制方式等显著优势。目前该系列产品已成功应用于波峰焊、回流焊、吹瓶机、干燥机烘箱、塑料挤出机和包装机械等设备中。     

沉默武士 华硕Silent Knight

做工出色,静音散热800-810-6655499元华硕SilentKnight散热器拥有两列共六根铜制导热管,采用回流焊工艺与底部的纯铜底座相连,可以迅速将热量导到鳍片。在两列散热鳍片中间是VRM导风罩,导风罩内安装了一个90mm的静音风扇,转速2200rpm±10%,风量可以达     

Tt Silent风暴席卷K8

近日,Thermaltake(Tt)针对K8处理器推出了最新热管静音散热器Silent939K8(CL—P0200),市场零售价为195元人民币。它可以支持AMDK8Opteron、Athlon64、Athlon64FX和Sempron754全系列CPU的高效能热管散热器。高导热的铜底+双热管导热设计,并采用Tt领先的精致回流焊工艺将底部和鳍片接合,提高整个散热器的导热能力,搭配50片高密度铝鳍片以及8020风扇,整     

生产

公司员工超过300人。研发、技术及管理人员近百人，拥有系统的现代化生产管理模式，一流的生产设备。工厂分三个车间，四条自动化流水生产线。公司获得了国际质量管理体系ISO9001认证，系列产品通过CE及3C认证。公司现有四台日本最新型的SMT大型设备和美国回流焊设备，各种高低温环境测试设施齐全，完善严格的产品进出测试程序，健全的品质监控体系，深入保障产品品质。     

Neurofuzzy modelling of the reflow thermal profile for surface mount assembly

Troubleshooting and production set-up time are often the major contributors for productivity loss in surface mount assembly. The solder reflow process is one of the least understood process segments. The research proposes a neurofuzzy reflow thermal profile control system for a convection oven. An incompatible temperature profile can result in a poor soldering quality and reduced system throughput. This paper proposes a neurofuzzy-based solder reflow thermal profile control system that responds to facilitate the production set-up process. The model is trained and constructed using data from both an experimental design and from historical production records. Customized computer code is used to generate a user-friendly human–machine interface and to link between neurofuzzy-reasoning rules and reflow oven set-up parameters for thermal profile planning and control. Empirical results illustrate the effectiveness and efficiency of the proposed system to solve a practical application.     

Micro-ball lens array fabrication in photoresist using PTFE hydrophobic effect

This paper presents a simple method for fabricating a micro-ball lens and its array. The core technology involves the hydrophobic characteristics of polyterafluoroethylene (PTFE) substrate. High contact angle between the melted photoresist pattern and PTFE generates the micro-ball lens and array. The PTFE thin film is spun onto a silicon wafer and oven dried. Photoresist AZ4620 is used to pattern micro-columns with various diameters; 60, 70 and 80 μm. A thermal reflow process is then applied to melt these micro-column patterns into a micro-ball lens array. The achieved micro-ball lens array has a diameter of 98 μm fabricated using 80 μm diameter patterns. This method provides a simple fabrication process and low material cost.     

面向TGV衬底的玻璃回流的流动建模

在微机电系统(MEMS)圆片级封装工艺中,为了给制作玻璃通孔(TGV)衬底的玻璃回流工艺提供理论指导意见,提出并建立了一个玻璃回流通用模型,研究槽深、槽宽、温度、时间参数对玻璃回流的影响,并推导出在一定槽宽,槽深,温度下的玻璃在微细槽内流动长度随时间的变化关系.建立玻璃在微细槽内的数学流动模型,运用流体力学的知识,结合微细流体的特征,通过一系列理论分析、推导和简化运算,得出玻璃回流长度随时间等参数的理论变化公式.然后进行玻璃回流实验,当玻璃在恒温T0=800℃、槽宽2b =200 μm、槽深L=1000 μm时,观察并记录玻璃在微细槽内流动长度随时间的变化.将理论回流曲线与实验数据点进行对比,结果表明:实验回流曲线与理论回流曲线趋势一致,且数值基本相符.证明了理论模型及其分析过程的正确性.表明理论分析模型对TGV玻璃回流工艺参数可提供一定的理论指导.     

A knowledge based approach to infrared reflow soldering

When a new batch of Printed Circuit Boards needs to be produced, the bare and the populated board need to be profiled. This paper describes an Expert System that can assist the operator in identifying infrared reflow soldering process parameters and in diagnosing the causes of improperly soldered boards. The Expert System contains the heuristic knowledge used in the profiling and setting up of the different parameters of the infrared reflow process. The ES reduced operator time in the setup of the machine for new batches. It also substantially reduced the response time to possible reflow solder error. There was a resulting reduction in rework and scrap.     

焦炉烘炉温度控制系统设计与实现

焦炉烘炉是焦炉生产的一道重要工序,烘炉质量对焦炉的寿命有着重要的影响,焦炉烘炉工艺复杂,温度监测点众多,监控困难。针对焦炉烘炉过程中温度的变化规律,利用模糊控制开发设计了焦炉烘炉温度监控系统,详细介绍了其硬件设计和软件功能。本系统实现了炉温的自动监控与数据管理,提高了生产效率,有效地保证了烘炉工作的高效运行,具有很高的应用前景。     

Glass reflow on 3-dimensional micro-apertures for electrophysiological measurements on-chip

We propose a new method to fabricate micro-apertures for on-chip electrophysiological measurements of living cells. Thermal reflow of phosphosilicate glass (PSG) is applied to funnel- or nozzle-type microstructures to generate very smooth surfaces on the finalized chip. Such 3-dimensional microstructures show close similarities to fire-polished glass pipette tips. Immobilized cells fit perfectly to these structures offering a large contact area for sealing between the cell membrane and the oxide surface. A tight cell/chip-aperture seal is an important requirement for the present application. We demonstrate the formation of stable gigaseals with Chinese hamster ovary (CHO) cells for both types of microstructures without the need of any post-fabrication surface treatment. By adjusting the PSG reflow parameters, the shape of the apertures can be modified and diameters down to the sub-micrometer range may be achieved. The application of PSG reflow to MEMS fabrication is an interesting new option to create unconventional microstructures.     

自动语音提示系统在焦炉生产中的应用

焦炉操作人员一直以来使用手持对讲机进行重要生产信息的语音传递,随着焦炉生产自动化程度的提高,手持对讲系统的弊端日益显现,已不能满足焦炉现代化的生产。通过研究分析并结合自己的实践经验,基于基础自动化系统,综合运用无线通信及语音技术,开发了一套自动语音播报系统,应用于焦炉生产中。主要介绍了自动语音提示系统在梅山钢铁焦炉生产中的开发和使用情况。     

基于SMT的再流焊工艺仿真设计技术

从SMT的应用前景和几个名词解释入手，提出再流温度曲线及设置，建立再流焊工艺仿真模型，逐层深入，力求使仿真设计技术明了清晰。     

The indent reflow sealing (IRS) technique-a method for thefabrication of sealed cavities for MEMS devices

A variety of microelectromechanical system devices requires encapsulation of their crucial fragile parts in a hermetically sealed cavity for reasons of protection. Hermeticity of the cavity and controllability of the ambient (gas pressure and gas composition) can be critical to the device performance. In order to minimize damage during handling, the cavity is preferably realized at the same time the device is fabricated, i.e., at wafer level. This paper reports the development of a hermetic packaging technique satisfying all the above. The method is referred to as the indent-reflow-sealing (IRS) technique, which relies on a multiple-chip fluxless solder-based joining technique and seal. Key process steps are the creation of an indent in the solder, the plasma pretreatment of the bonding surfaces, the pre-bonding (or sticking) of the chips and, the closing of the indent during a low-temperature (220°C-350°C) solder reflow in a clean controlled ambient using a designated oven. As opposed to other methods, the IRS method allows a greater flexibility with respect to the choice of the sealing gas and pressure, thereby offering a very hermetic seal and compatibility with low-cost high-throughput batch fabrication techniques. Flip-chip assemblies based on SnPb (67/37) solder and Au as the top surface metallization, have been reflowed in a forming gas ambient and have next been characterized on shear strength, hermeticity, and susceptibility to thermal stresses. The method has been successfully implemented in the process flow of an electromagnetic microrelay for the realization of the cavity housing the electrical contacts