Enhanced output power of InGaN-GaN light-emitting diodes with high-transparency nickel-oxide-indium-tin-oxide Ohmic contacts

This study develops a highly transparent nickel-oxide (NiO/sub x/)-indium-tin-oxide (ITO) transparent Ohmic contact with excellent current spreading for p-GaN to increase the optical output power of nitride-based light-emitting diodes (LEDs). The NiO/sub x/-ITO transparent Ohmic contact layer was prepared by electron beam in-situ evaporation without postdeposition annealing. Notably, the transmittance of the NiO/sub x/-ITO exceeds 90% throughout the visible region of the spectrum and approaches 98% at 470 nm. Moreover, GaN LED chips with dimensions of 300 /spl times/ 300 /spl mu/m fabricated with the NiO/sub x/-ITO transparent Ohmic contact were developed and produced a low forward voltage of 3.4 V under a nominal forward current of 20 mA and a high optical output power of 6.6 mW. The experimental results indicate that NiO/sub x/-ITO bilayer Ohmic contact with excellent current spreading and high transparency is suitable for fabricating high-brightness GaN-based light-emitting devices.     

Monolithic super-bright red resonant cavity light-emitting diodegrown by solid source molecular beam epitaxy

Monolithic super-bright resonant-cavity light-emitting diode operating at λ=663 nm has been developed. The diode consisted of a 1λ-thick AlGaInP active region sandwiched between AlAs-AlGaAs distributed Bragg reflectors. The device structure was grown by solid source molecular beam epitaxy. The current aperture of the emitter was created by lateral selective wet thermal oxidation. A record-high peak wall-plug efficiency of 2.2% and a continuous-wave output power of 1.4 mW were attained without heatsinking at room temperature from a diode having a diameter of 80 μm. The emission linewidth was as narrow as 4.5 nm     

Optimization of planar Be-doped InGaAs VCSEL's with two-sidedoutput

Threshold current, output power, wall-plug efficiency and operating voltage of epitaxially grown InGaAs-AlGaAs planar vertical-cavity surface-emitting lasers (VCSEL's) are strongly influenced by the electrical and optical properties of the p-doped Bragg reflector. Here we study in some detail the dependence of output behavior on the composition, interface grading, and modulation doping of the Be-doped AlGaAs-GaAs Bragg reflector. Using optimized p-doped mirrors VCSEL's with low threshold current densities of 300 A/cm² , low driving voltages of 1.6 V and high wall-plug efficiencies of 17.6% are obtained. Transverse single-mode emitting devices show a record low emission linewidth of 30 MHz and a linewidth-power product of 2.2 mW·MHz     

Resonant-cavity light-emitting diodes operating at 655 nm with ahigh external quantum efficiency and light power

Monolithic resonant cavity light-emitting diodes exhibiting an external quantum efficiency (η_ex) up to 6.5% for 84-μm size devices at a wavelength at 655 nm have been demonstrated. Larger diodes, 150-300 μm in diameter, have the maximum η_ex between 5.5% and 4.9% and launch power output up to 8 mW     

High brightness visible (660 nm) resonant-cavity light-emittingdiode

Visible (660 nm) resonant-cavity light-emitting (RCLEDs) have been fabricated. The top-emitting devices employed two AlGaAs-AlAs-Bragg mirrors and GaInP-AlGaInP quantum-well active layers. The device performance was characterized as a function of the device diameters, ranging from 24 to 202 μm. The larger devices exhibited a nearly linear increase of output power with injected current with 8.4-mW emission at 120 mA. A maximum external efficiency of 4.8% was measured at 4 mA on the 84-μm aperture devices. All devices exhibited a narrow emission at 659-661 nm with a linewidth around 3 nm. The results show that RCLED's are promising low-cost light sources for plastic fiber transmission as well as display applications     

AlGaInP microcavity light-emitting diodes at 650 nm on Gesubstrates

We demonstrate microcavity light emitting diodes (MCLEDs) emitting at 650 nm on Ge substrates. Ge has the advantage of lower cost and higher strength compared to GaAs substrates. The multi-quantum well microcavity devices consisted of AlGaAs-based distributed Bragg reflector (DBR) mirrors, AlGaInP active material with an additional 5-μm p-Al_0.55Ga_0.45As current spreading layer on top of the p-DBR. A maximum external quantum efficiency of 4.35% and an optical power higher than 5 mW was obtained for a device with 200-μm diameter. The results indicate the potential use of MCLEDs on Ge for visible LEDs     

Widely tunable high-power external cavity quantum cascade laser operating in continuous-wave at room temperature

A grating-coupled external cavity quantum cascade laser operating in continuous-wave at room temperature is reported. Single-frequency operation tunable over more than 160 cm^-1 around the centre wavelength of 4.6 mum has been observed at a chip temperature of 300 K. The maximum optical power at the gain peak was 300 mW, corresponding to a wall-plug efficiency of 6 %. Observed power output at the gain bandwidth edges was in excess of 125 mW.     

High-power AlGaInN LED chips with two-level metallization

A high-power AlGaInN light-emitting flip-chip crystal with a new configuration of contact pads is developed and fabricated. The implementation of a two-level metallization scheme with a dielectric insulating interlayer significantly improves the active-to-total area ratio of the heterostructure (to 78%). Numerical simulation of the current spread, employed when developing the chip topology, makes it possible to achieve high uniformity of the current distribution over the active-region area and to obtain small values of the differential resistance of the chip (0.3 Ω). Light-emitting diodes with the maximum external quantum efficiency (60%) and output optical power (542 mW) at a working pump current of 350 mA are fabricated on the basis of crystals developed in the study.     

p-GaN与ITO欧姆接触的研究

针对GaN基发光二极管中p-GaN与透明导电薄膜ITO之间的接触进行研究,尝试找出透明导电层ITO的优化制程条件。将在不同氧流量、ITO厚度及退火温度下制备的透明电极ITO薄膜应用于GaN基发光二极管,来增加电流扩展,减小ITO与p-GaN欧姆接触电阻,降低LED工作电压及提高透过率、增强LED发光亮度。将ITO薄膜应用于218μm×363μm GaN基发光二极管LED,分析其在20 mA工作电流条件下正向电压和光输出功率的变化,在优化条件下制得的蓝光LED在直流电流20 mA下的正向电压3.23 V,光输出效率为23.25 mW。     

High-speed modulation of 850-nm intracavity contacted shallowimplant-apertured vertical-cavity surface-emitting lasers

GaAs-AlGaAs quantum-well (850 nn) vertical-cavity surface-emitting lasers, with lateral current injection and shallow implanted apertures, show small signal modulation bandwidths of at least 11 GHz and large signal data rates of at least 10 Gb/s. The devices achieved a maximum output power of 2.1 mW, with a threshold current and voltage of 1 mA and 1.71 V, respectively. The shallow implantation step provides photolithographically precise aperture formation (using O⁺ ions), for efficient lateral current injection into the quantum-well active region of the laser, from intracavity contacts. The device aperture was 7 μm in diameter, and the opening in the annular top contact was 13 μm in diameter. The optical spectrum showed several transverse modes     

Optimizing n-type contact design and chip size for high-performance indium gallium nitride/gallium nitride-based thin-film vertical light-emitting diode

The effects of the n-contact design and chip size on the electrical, optical and thermal characteristics of thin-film vertical light-emitting diodes (VLEDs) were investigated to optimize GaN-based LED performance for solid-state lighting applications. For the small (chip size: 1000×1000 µm²) and large (1450×1450 µm²) VLEDs, the forward bias voltages are decreased from 3.22 to 3.12 V at 350 mA and from 3.44 to 3.16 V at 700  mA, respectively, as the number of n-contact via holes is increased. The small LEDs give maximum output powers of 651.0–675.4 mW at a drive current of 350 mA, while the large VLEDs show the light output powers in the range 1356.7–1380.2 mW, 700 mA, With increasing drive current, the small chips go through more severe degradation in the wall-plug efficiency than the large chips. The small chips give the junction temperatures in the range 51.1–57.2 °C at 350  mA, while the large chips show the junction temperatures of 83.1–93.0 °C at 700  mA, The small LED chips exhibit lower junction temperatures when equipped with more n-contact via holes.     

Extremely high power 1.48 μm GaInAsP/InP GRIN-SCH strained MQWlasers

A record CW output power of 360 mW at 25°C was achieved by investigating the structure of optical confinement layer in 1.48 μm GRIN-SCH MQW lasers. It is experimentally demonstrated that the use of a wide bandgap and thin SCH layer gives a high differential quantum efficiency without expense of threshold current. Low driving currents, 195 mA for 100 mW, 450 mA for 200 mW and 890 mA for 300 mW, were obtained in the optimized cavity lengths     

Pr3+-doped 1.3 μm fibre laser using direct coateddichroic mirrors

A 1.3 μm fibre laser consisting of a 1000 ppm (mol) Pr³⁺ -doped fluoride glass fibre with dichroic mirrors coated onto the fibre endfaces and an Nd-YLF pump laser is presented. The output mirror reflectivity R is calculated to be 50% at the lasing wavelength. Producing a maximum output power of 50 mW. The laser threshold and slope efficiency are 300 mW and 8%, respectively. The theoretically predicted values correspond with the experimental values     

A New AlGaInP Multiple-Quantum-Well Light-Emitting Diode With a Thin Carbon-Doped GaP Contact Layer Structure

A new AlGaInP multiple quantum-well light-emitting diode (LED) with a thin carbon-doped GaP contact layer and a transparent conducting indium tin oxide film is fabricated and studied. For comparison, the LEDs with different contact layer structures are also included in this work. Experimental results indicate that the LED with a carbon-doped GaP contact layer exhibits a higher output power of 31.4 mW and a higher external quantum efficiency of 9%. The light–output power, under dc 20-mA operation, of this LED is increased by a factor of 18% as compared with that of conventional LEDs. These results are mainly attributed to the significantly lower series resistance and lower optical absorption effect. Moreover, the new device shows the reduced wavelength shift with 1.7-nm variation between 10 and 200 mA in electroluminescence spectrum.      

High performance fully selective double recess InAlAs/InGaAs/InPHEMTs

InP HEMTs with a double recess 0.12 μm gate have been developed. The material structure was designed to be fully selective etched at both recess steps for improved uniformity and yield across the whole wafer. Devices demonstrated DC characteristics of extrinsic transconductances of 1000 mS/mm, maximum current density of 800 mA/mm and gate-drain reverse breakdown voltages of -7.8 V. Power measurements were performed at both 20 GHz and 60 GHz. At 20 GHz, the 6×75 μm devices yielded 65% maximum power added efficiency (PAE) with associated gain of 13.5 dB and output power of 185 mW/mm. When tuned for maximum output power it gave an output power density of 670 mW/mm with 15.6 dB gain and 49% PAE. At 60 GHz, maximum PAE of 30% has been measured with associated output power density of 290 mW/mm and gain of 7.4 dB. This represents the best power performance reported for InP-based double recess HEMT's     

Effect of Different Quantum Well Structures on the Output Power Performance of GaN-Based Light-Emitting Diodes

We investigated the effect of two different quantum well (QW) structures having different indium contents on the optical performance of fully packaged GaN-based light-emitting diodes (LEDs). Dual-spectrum QW LEDs exhibit ～4% higher external quantum efficiency (at 350 mA) than single-spectrum QW LEDs. However, the two types of LEDs exhibit similar efficiency droop behavior. For both types of LEDs, the output power decreases with increasing junction temperature. When the junction temperature exceeds 70°C, the dual-spectrum QW LEDs exhibit lower output power than the single-spectrum QW LEDs. The wavelength dependence of the output power (at 350 mA) of single-spectrum QW LEDs shows that the LEDs with shorter wavelengths experience more rapid optical degradation than the LEDs with longer wavelengths. Based on the wavelength- and junction-temperature-dependent output power, the droop behavior of the dual-spectrum QW LEDs is described and discussed.     

InP-based cylindrical microcavity light-emitting diodes

We have investigated the properties of InP-based microcavity light-emitting diodes (λ=1.6 μm). Our objective was mainly to study the effects of lateral confinement of optical modes, which was achieved by the wet oxidation of double In_0.52Al_0.48 As layers. The smallest devices had a cavity radius of 0.5 μm, which becomes comparable to λ/n, where n is the effective refractive index of the photon emitting heterostructure. Two types of devices were tested: the first without any mirrors in the vertical direction, and the second with a combination of MgF/ZnSe DBR (top) and silver (bottom) to produce a low Q~35-45. The latter type of devices exhibited higher output power and narrower spectral linewidth; otherwise, the characteristics were very similar The output slope efficiency monotonically decreases with reduction of lateral cavity size up to ~2-μm in diameter and then is enhanced again for smaller cavity sizes. The slope efficiency of the smallest device (aperture diameter 1 μm) is almost equal to that measured for the largest devices. The maximum output power measured from the devices is 30 μW. The far-field pattern of devices with aperture radii ranging from 1.5 to 20 μm shows an angular width (FWHM) of 50°. On the other hand, devices with smaller aperture (radius ~0.5 μm) exhibit an angular width of 20°. The measured small-signal modulation bandwidth increases from ~0.45 GHz for the larger devices to 0.8 GHz for the smallest devices. Our results indicate that microcavity effects can be observed with only lateral photon confinement, making device fabrication requirements less stringent compared to surface-emitting lasers     

IaAsP/InGaAsP quantum-well 1.3 μm vertical-cavity surface-emitting lasers

1.3 μm vertical-cavity surface-emitting lasers based on a novel gain media consisting of InAsP/InGaAsP strain-compensated multiple quantum wells are reported. SiO₂/TiO₂/ dielectric thin-film pairs and wafer-bonded GaAs/Al(Ga)As distributed Bragg reflectors are used as the top and bottom cavity mirrors, respectively. The device with a 5 μm-diameter selectively etched tunnel-junction aperture exhibits submilliampere threshold current as low as 0.54 mA and single-transverse mode emission. Maximum output optical power of 1.9 mW was observed in multimode lasing devices.     

InP-based short cavity lasers with 2D photonic crystal mirror

The authors have successfully fabricated in-plane emitting InP-based microlasers with cavity lengths of 600-100 μm. The required high reflectivity mirrors consist of a 2D ΓM-oriented triangular photonic crystal of air rods with a lattice constant of 350 nm. The lasers operate CW at room temperature with a threshold current of 29 mA and output power up to 4 mW for the shortest devices     

High-Temperature Stability of 650-nm Resonant-Cavity Light-Emitting Diodes Fabricated Using Wafer-Bonding Technique on Silicon Substrates

AlGalnP-based visible 650-nm GalnP-AlGalnP resonant-cavity light-emitting diodes (RCLEDs) with high-temperature stability were fabricated by wafer-bonding techniques on Si substrates. In this study, the metal-bonding RCLEDs (MBRCLEDs) devices were designed with 84-mum apertures for light output. The MBRCLEDs with a maximum wall-plug efficiency of 13.7% were demonstrated at an injection current of 2.5 mA. In addition, the improved heat sinking of MBRCLEDs led to lower junction temperature, and resulted in a very low power decay of 0.31 dB from room temperature to 100degC at an injection current of 20 mA.