Diffusion-limited etching for compact, low-loss semiconductor integrated optics

It is shown that diffusion-limited wet chemical etching can be used to fabricated single-mode GaAs/AlGaAs rib waveguides suitable for compact circular waveguide bends (300- mu m radius). The waveguides exhibit lower propagation losses (1-4 dB/cm at 1.52- mu m wavelength) than previously reported guides fabricated for compact bend applications by dry etching. To study the radius dependence of waveguide bend loss, a set of nested 90 degrees circular bends was fabricated simultaneously on a single chip.<>     

1.31-1.55-/spl mu/m phased-array demultiplexer on InP

The first demultiplexers on InP at 1.31-1.55 /spl mu/m based on low-order waveguide arrays have been fabricated and characterized. We show the calculated and measured spectral responses of two devices with 6 and 10 waveguides in the grating. The on-chip loss of the devices is 4.5 dB and the crosstalks are down to -25 dB. Thanks to their large bandwidth, the devices are polarization insensitive and no strong influence of the temperature is seen.     

An optimized InGaAsP/InP polarization converter employing asymmetric rib waveguides

In this paper, we report on the design of a compact (/spl ap/ 226 /spl mu/m) on-chip InGaAsP/InP polarization converter based on an asymmetric rib waveguide. Our theoretical analysis demonstrates that the device displays a conversion efficiency of < -25 dB (> 99.68% power conversion between orthogonal polarization) at 1550-nm wavelength with a nearly flat response over the optical C band. Regarding fabrication tolerances, we predict that the most sensitive design parameter is the waveguide width as the conversion efficiency drops to 10 dB for a deviation of /spl plusmn/ 0.1 /spl mu/m from the optimized value.     

On-chip crosstalk mitigation for densely packed differential striplines using via fence enclosures

The measured crosstalk characteristics for close-packed via fence enclosed differential stripline structures in a standard digital CMOS process are reported. The transmission lines achieve a packing pitch of 16 /spl mu/m of interconnect width per differential pair. The nearest neighbour far-end differential crosstalk is measured to be better than -43 dB and the near-end differential crosstalk is better than -37 dB below the drive signal at frequencies up to 20 GHz for 600 /spl mu/m lines. This is sufficient for use in high-density, high-speed analogue and digital integrated circuits.     

Novel compact polarization converters based on ultra short bends

A novel integrated polarization converter based on ultra short bends is presented, which has a potential for low loss and small device size. A conversion value of 85% was experimentally measured with excess loss of 2.7 dB and overall dimensions of 975/spl times/83 /spl mu/m. Also 45% conversion was measured with extremely low excess loss of 0.4 dB for a device size of 760/spl times/86 /spl mu/m.     

Photonic integrated circuits by DUV-induced modification of polymers

The results achieved with polymer Y-splitters, codirectional couplers, and multimode interference couplers, realized by deep ultraviolet lithography are presented. The devices are designed and fabricated for the 1.55-/spl mu/m wavelength region and have a waveguide loss of 1 dB/cm. The waveguide width is 7.5 /spl mu/m. The fiber-chip coupling loss is 0.5 dB per facet. The polarization-dependent loss is <0.15 dB.     

Coupling efficiencies in reflective self-organized lightwave network (R-SOLNET) simulated by the beam propagation method

The reflective self-organized lightwave network (R-SOLNET) enables the formation of self-aligned waveguides in the photorefractive (PR) material between misaligned optical devices by introducing a write beam. The incident write beam from one device and the reflected write beam from the second device induce self-focusing in the PR material and construct a coupling waveguide. A wavelength filter on the waveguide edge is used to facilitate the reflected beam. The beam propagation method reveals that R-SOLNET exhibits higher coupling efficiencies and better tolerances than the one-beam-writing SOLNET and the free-space coupling. The apparent usefulness of R-SOLNET is remarkable for gaps wider than 100 /spl mu/m in 8-/spl mu/m-wide waveguide circuits. For 240-/spl mu/m gap, coupling efficiency better than 50% can be achieved even when the lateral misalignment is as large as 4 /spl mu/m. The results indicate that R-SOLNET may be useful for vertical waveguide constructions of optical z-connections in three-dimensional intrachip optical interconnects and switching systems, as well as for self-aligned optical couplings with devices that cannot emit write beams such as vertical-cavity surface-emitting lasers, photodetectors, and electrooptic switches.     

Vertical-cavity surface-emitting lasers with monolithically integrated horizontal waveguides

We present the development of novel 980-nm Ga/sub 0.8/In/sub 0.2/As-GaAs vertical-cavity surface-emitting lasers (VCSELs) with an internal waveguide structure. The monolithic integration of a horizontal waveguide in the top distributed Bragg reflector (DBR) creates the potential for achieving VCSEL-based photonic integrated circuits. In this work, an AlGaAs-GaAs-AlGaAs waveguide designed for horizontal propagation of light was monolithically integrated as part of the upper GaAs-AlGaAs DBR of the device. VCSELs with 9-/spl mu/m apertures emitted 3-mW single-mode power with both longitudinal and lateral mode suppression ratio of 40 dB under room-temperature continuous-wave operation.     

Single-mode and polarization-independent silicon-on-insulator waveguides with small cross section

The fabrication restrictions that must be imposed on the geometry of optical waveguides to make them behave as single-mode devices are well known for relatively large waveguides, with shallow etch depth. However, the restrictions for small waveguides (/spl sim/1 /spl mu/m or less in cross section) are not well understood. Furthermore, it is usually a requirement that these waveguides are polarization independent, which further complicates the issues. This paper reports on the simulations of the conditions for both single-mode behavior and polarization independence, for small and deeply etched silicon-on-insulator (SOI) waveguides. The aim is to satisfy both conditions simultaneously. The results show that at larger waveguide widths, waveguide etch depth has little effect on the mode birefringence because the transverse-electric (TE) mode (horizontal-polarized mode) is well confined under the rib region. However, at smaller rib widths, the etch depth has a large influence on birefringence. An approximate equation relating the rib-waveguide width and etch depth to obtain polarization-independent operation is derived. It is possible to achieve single-mode operation at both polarizations while maintaining polarization independence for each of the waveguide heights used in this paper but may be difficult for other dimensions. For example, a 1-/spl mu/m SOI rib waveguide with an etch depth of 0.64 /spl mu/m and rib width of 0.52 /spl mu/m is predicted to exhibit such characteristics.     

Compact polarization-independent Mach-Zehnder space switch combining carrier depletion and the quantum confined Stark effect

We have developed an n-doped InGaAs-InAsP quantum well between InP, which is suited for a polarization-independent Mach-Zender interferometric (MZI) space switch operating at 1.55 /spl mu/m. The InAsP is compressively strained and the InGaAs is tensile strained for polarization independence and for strain balancing. The important boundary condition for the design of this structure is the waveguide loss, which we limit to 0.6 dB/cm, and the crosstalk due to imbalance in the MZI, which we limit to <-30 dB. To reduce the size of the phase shifting region, while imposing this boundary condition, we combine the quantum confined Stark effect (QCSE) effect and the carrier-depletion effect by using an n-doped quantum well. The QCSE was first optimized for an undoped InGaAs-InAsP quantum well. A polarization independent /spl Delta/n of 7.8/spl middot/10/sup -4/ at 100 kV/cm was obtained at the expense of 0.2-dB/cm excess waveguide loss and 0.1-dB/mm electroabsorption loss. The carrier-depletion effect in a 2/spl middot/10/sup 11/cm/sup -2/-doped QW increases /spl Delta/n with a factor 2.6 to 2/spl middot/10/sup -3/, at the expense of 0.4-dB/cm free-carrier absorption-induced waveguide loss. The combination of the QCSE and carrier depletion results in a phase-shifter length of 0.46 mm for an MZI in push-pull configuration.     

A W-band InAs/AlSb low-noise/low-power amplifier

The first W-band antimonide based compound semiconductor low-noise amplifier has been demonstrated. The compact 1.4-mm/sup 2/ three-stage co-planar waveguide amplifier with 0.1-/spl mu/m InAs/AlSb high electron mobility transistor devices is fabricated on a 100-/spl mu/m GaAs substrate. Minimum noise-figure of 5.4dB with an associated gain of 11.1 dB is demonstrated at a total chip dissipation of 1.8 mW at 94 GHz. Biased for higher gain, 16/spl plusmn/1 dB is measured over a 77-103 GHz frequency band.     

High-efficiency broad-band transmission through a double-60/spl deg/ bend in a planar photonic Crystal single-line defect waveguide

We present two designs to improve the transmission of a conventional double-60/spl deg/ bend in a single-line defect planar photonic crystal waveguide by locally optimizing the shape and the size of air holes of a photonic crystal lattice at the corners. We fabricate these devices on a silicon-on-insulator substrate and characterized them using tunable laser sources over a wavelength range from /spl lambda/=1.259 /spl mu/m to /spl lambda/=1.641 /spl mu/m. As we show, over a 9% bandwidth, less than 1-dB loss/bend was observed. In order to theoretically validate these experimental results, the three-dimensional finite-difference time-domain simulations are performed and found to agree with the experimental results.     

Slanted-rib waveguide InGaAsP-InP polarization converters

We summarize experimental and theoretical results for a compact (330 /spl mu/m), low-loss on-chip InGaAsP-InP polarization converter. The converter, which contains a single asymmetric rib waveguide segment, exhibits a measured conversion efficiency of -16 dB and a response of /spl plusmn/3 dB with a maximum excess loss of 0.02 dB over the entire wavelength region from 1530 to 1570 nm.     

Polarization characteristics of index-guided surface-emitting lasers with tilted pillar structure

We report precise control of polarization states for index-guided surface-emitting lasers by tilted-etching of the laser pillar. Circular laser pillars were etched by tilting the substrate toward ~110 or ~11~0 direction with an angle of 15/spl deg/-30/spl deg/ using reactive ion beam etching. For the laser device with a diameter of 7-10 /spl mu/m, we observed selectivity of the polarization state. We found a dominant polarization with an electric field perpendicular to the tilted direction of laser pillar. The maximum orthogonal polarization suppression ratio was about 25 dB. The selectivity of polarization in the tilted laser pillar devices is interpreted to be originated from the difference in optical losses for the two waves polarized to ~110 and ~11~0 directions.     

5/spl times/9 integrated optical star coupler in silicon-on-insulator technology

We describe fabrication of the first optical star coupler in silicon-on-insulator (SOI) technology. The 5/spl times/9 coupler consists of two silicon rib waveguide arrays with a radiative slab waveguide region. The star geometry was analyzed and designed using the beam propagation method. The coupler exhibits low loss (average excess insertion loss /spl alpha//spl sim/1.3 dB) and good coupling uniformity (standard deviation /spl sigma//spl sim/1.4 dB) at /spl lambda/=1.55 /spl mu/m. It represents a key component for realization of photonic circuits in a silicon integrated circuit technology.     

Eight-channel microdisk CW laser arrays vertically coupled to common output bus waveguides

1.6-nm spectrally spaced eight-channel semiconductor microdisk laser arrays are presented, where high-Q disk lasing modes are vertically coupled out through a common bus waveguide. The spectral channel spacing is achieved by varying the disk resonator radii from 10.6 to 10.95 /spl mu/m. Typical linewidth of 0.25 nm and side-mode suppression ratio of -20dB are observed under continuous-wave lasing operation near /spl lambda/=1.51 /spl mu/m. This is the first demonstration of integrated microresonator laser arrays.     

Low-loss and thermally stable TE-mode selective polymer waveguide using photosensitive fluorinated polyimide

A low-loss, thermally stable TE-mode selective optical waveguide was fabricated using a photosensitive fluorinated polyimide. The polymer undergoes photocrosslinking under UV exposure, thus changing its refractive index. The photocrosslinking-induced refractive index change was utilized to form channel waveguides. The propagation losses of the photosensitive fluorinated polyimide waveguides were less than 0.3 and 0.5 dB/cm for TE polarization at wavelengths of 1.3 and 1.55 /spl mu/m, respectively. The measured polarization extinction ratio was higher than 29 and 28 dB at wavelengths of 1.3 and 1.55 /spl mu/m, respectively. The refractive index of fluorinated polyimide film remains almost constant after being stored at 150/spl deg/C for 600 min.     

Crosstalk between finite ground coplanar waveguides over polyimide layers for 3-D MMICs on Si substrates

Finite-ground coplanar (FGC) waveguide lines on top of polyimide layers are frequently used to construct three-dimensional Si-SiGe monolithic microwave/millimeter-wave integrated circuits on silicon substrates. Requirements for high-density, low-cost, and compact RF front ends on silicon can lead, however, to high crosstalk between FGC lines and overall circuit performance degradation. This paper presents theoretical and experimental results and associated design guidelines for FGC line coupling on both highand low-resistivity silicon wafers with a polyimide overlay. It is shown that a gap as small as 6 /spl mu/m between two adjacent FGC lines can reduce crosstalk by at least 10 dB, that the nature of the coupling mechanism is not the same as with microstrip lines on polyimide layers, and that the coupling is not dependent on the Si resistivity. With careful layout design, isolation values of better than -30 dB can be achieved up to very high frequencies (50 GHz).     

A fully integrated SOI RF MEMS technology for system-on-a-chip applications

In this paper, a silicon-on-insulator (SOI) radio-frequency (RF) microelectromechanical systems (MEMS) technology compatible with CMOS and high-voltage devices for system-on-a-chip applications is experimentally demonstrated for the first time. This technology allows the integration of RF MEMS switches with driver and processing circuits for single-chip communication applications. The SOI high-voltage device (0.7-/spl mu/m channel length, 2-/spl mu/m drift length, and over 35-V breakdown voltage), CMOS devices (0.7-/spl mu/m channel length and 1.3/-1.2 V threshold voltage), and RF MEMS capacitive switch (insertion loss 0.14 dB at 5 GHz and isolation 9.5 dB at 5 GHz) are designed and fabricated to show the feasibility of building fully integrated RF systems. The performance of the fabricated RF MEMS capacitive switches on low-resistivity and high-resistivity SOI substrates will also be compared.     

Broad-band array multiplexers made with silica waveguides onsilicon

A waveguide array multiplexer design that is particularly suitable for making broadband low-order devices is presented. Two-channel multiplexers at 1.0-1.55 μm, 1.31-1.53 μm, and 1.47-1.55 μm are demonstrated. Compared to conventional waveguide multiplexers, these devices have wide spectral ranges of low crosstalk. The devices are polarization independent. The crosstalk and fiber-to-fiber insertion loss for the 1.31-1.53 μm multiplexer were about -35 and -2 dB, respectively