共查询到17条相似文献,搜索用时 31 毫秒
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通过结合BSIMCMG模型与负电容(NC)模型,构建了NC-FinFET模型。基于所建立的NC-FinFET模型,推导分析了其等效电容模型。利用Hspice对NC-FinFET的器件特性进行了系统仿真与分析。结果表明,与FinFET相比,NC-FinFET在电学特性上有更加明显的优势,亚阈值摆幅更低。此外,分析了铁电材料的厚度对亚阈值摆幅及栅压放大倍数的影响,以及衬偏电压对NC-FinFET性能的影响,为在NC-FinFET中降低功耗和抑制寄生效应提供了理论依据和解决思路。 相似文献
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Si/Ge异质结双栅隧穿场效应晶体管(DGTFET)较传统硅基DGTFET有更好的电学性能。文章基于Sentaurus TCAD仿真软件,构建了有/无Pocket两种结构的Si/Ge异质结DGTFET器件,定量研究了Pocket结构及Pocket区厚度、掺杂浓度等参数对器件开态电流、关态电流、亚阈值摆幅、截止频率和增益带宽积的影响。通过仿真实验和计算分析发现,Si/Ge异质结DGTFET的开态/关态电流、亚阈值摆幅、截止频率和增益带宽积随Pocket区掺杂浓度增大而增大,而Pocket区厚度对器件性能没有明显影响。研究结果为TFET器件的直流、频率特性优化提供了指导。 相似文献
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设计并研究了一种带有轻掺杂漏(LDD)和斜向扩展源(OES)的双栅隧穿场效应晶体管(DG-TFET),并利用Sentaurus TCAD仿真工具对栅长及扩展源长度等关键参数进行了仿真分析。对比了该器件与传统TFET的亚阈值摆幅、关态电流和开关电流比,并从器件的带带隧穿概率分析其优势。仿真结果表明,该器件的最佳数值开关电流比及亚阈值摆幅分别可达3.56×1012和24.5 mV/dec。另外,该DG-TFET在双极性电流和接触电阻方面性能良好,且具有较快的转换速率和较低的功耗。 相似文献
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研究了具有不同栅漏间距的AlGaN/GaN高电子迁移率晶体管(HEMT)的亚阈值摆幅特性在0.4 MeV质子辐照(质子总注量为2.16×1012 cm-2)后的变化规律。质子辐照前,各器件的亚阈值摆幅基本一致;质子辐照后,器件的亚阈值摆幅随着栅漏间距的减小而逐渐降低。基于辐照前后器件的电容-电压曲线和输出特性得到低场载流子输运特性,并据此分析了亚阈值摆幅的变化原因。发现与器件尺寸相关的极化散射效应是不同尺寸器件在辐照后亚阈值摆幅发生不同变化的主要原因。为AlGaN/GaN HEMT的性能优化提供了全新的视角与维度。 相似文献
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采用旋涂法制备了基于铁电聚合物薄膜的Al/PVDF/SiO_2/n-Si(MFIS)结构。通过测量MFIS结构的电容-频率特性和电容-电压特性,观察到负电容效应。测量频率越低,正向偏压越大,负电容效应越显著。在时域中,施加脉冲电压,出现瞬态电流随时间增大的电感现象。研究结果表明,MFIS结构中的负电容效应是一种电感现象。构建能带图分析MFIS结构中负电容效应的产生原因,是由于大量电子注入到界面中被捕获使得电流的相位落后于电压导致。基于铁电薄膜的负电容MFIS结构有望应用于低功耗器件中。 相似文献
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《Microelectronics Journal》2015,46(10):981-987
This paper presents the concept of a new field effect transistor based on ferroelectric insulator. The proposed design is named Partially Depleted Silicon-on-Ferroelectric Insulator Field Effect Transistor (PD-SOFFET). The design combines the concepts of negative capacitance in ferroelectric material and silicon-on-insulator (SOI) device. The structure varies from the conventional SOI technology by substituting the buried SiO2 with a layer of ferroelectric insulator. This new material stack can extract an effective negative capacitance (NC) in the body of the device. The NC effect can provide internal signal boosting. It is demonstrated that the subthreshold swing and the threshold voltage of the proposed device can be lowered by carefully selecting the doping density, the types of the gate oxide and the thicknesses of the ferroelectric film, the silicon layer above the buried insulator and the gate oxide. Lower subthreshold swing is a prime requirement for ultra-low-power design. This paper focuses on studying several parameters to tune the subthreshold swing of the SOFFET device. We have recently introduced the concept of the new transistor, SOFFET, with ferroelectric insulator embedded inside the silicon substrate to lower the subthreshold swing. This paper investigates the impacts of different oxide materials, ferroelectric thicknesses and doping profiles on the negative capacitance inside the body of the proposed PD-SOFFET. It is observed that some emerging gate oxide materials can improve subthreshold flexibility, lower leakage and provide better control over the channel in the proposed device. 相似文献
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This paper presents the concept of a new field effect transistor (FET) named a Partially Depleted Silicon-on-Ferroelectric Insulator Field Effect Transistor (PD-SOFFET). Our design proposes to utilize the negative capacitance (NC) of ferroelectric material in a partially depleted silicon-on-insulator (PD-SOI) device structure. We suggest to substitute the buried insulator oxide (SiO2) inside the SOI substrate with a ferroelectric material, which converts it to the Silicon-on-Ferroelectric Insulator (SOF) substrate. The proposed integration of a ferroelectric material into the body of the MOSFET device will provide the required NC effect to overcome the fundamental thermionic barrier of the current and emerging FETs. This new SOFFET device would provide enhanced device gain, speed and channel conduction. A theoretical model is developed to validate the concept of the new device, which can lower the subthreshold swing (S) below the theoretical minimum S=60 mV/decade that is imposed by the thermodynamic limit (kT/q) of the FET devices. Analytical models have been derived to show that the subthreshold swing and the threshold voltage of the proposed device depend on the thicknesses of ferroelectric insulator and gate oxide, and the doping profile of the silicon body. It has been demonstrated that by carefully optimizing different geometric and electrical parameters the proposed PD-SOFFET can provide S value significantly below 60 mV/decade. 相似文献
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《Electron Device Letters, IEEE》1983,4(4):78-80
A new high power voltage-controlled differential negative resistance device using the LAMBDA bipolar transistor structure, called the LAMBDA bipolar power transistor, is proposed and studied. The basic structure of this new device consists of the simultaneous integration of an interdigitated bipolar junction transistor and a merged metal-oxide-semiconductor field effect transistor. Two basic interconnection configurations of the integrated devices are also discussed. Several interesting applications based on the fabricated devices are also demonstrated. It is shown that the proposed device can be used as power signal generator and amplitude modulator using very simple circuits. 相似文献
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Transient Performance Estimation of Charge Plasma Based Negative Capacitance Junctionless Tunnel FET
We investigate the transient behavior of an n-type double gate negative capacitance junctionless tunnel field effect transistor (NC-JLTFET). The structure is realized by using the work-function engineering of metal electrodes over a heavily doped n+ silicon channel and a ferroelectric gate stack to get negative capacitance behavior. The positive feedback in the electric dipoles of ferroelectric materials results in applied gate bias boosting. Various device transient parameters viz. transconductance, output resistance, output conductance, intrinsic gain, intrinsic gate delay, transconductance generation factor and unity gain frequency are analyzed using ac analysis of the device. To study the impact of the work-function variation of control and source gate on device performance, sensitivity analysis of the device has been carried out by varying these parameters. Simulation study reveals that it preserves inherent advantages of charge-plasma junctionless structure and exhibits improved transient behavior as well. 相似文献
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Kadow C. Dahlstrom M. Bae J.-U. Lin H.-K. Gossard A.C. Rodwell M.J.W. Brar B. Sullivan G.J. Nagy G. Bergman J.I. 《Electron Devices, IEEE Transactions on》2005,52(2):151-158
We report a submicrometer, self-aligned recess gate technology for millimeter-wave InAs-channel heterostructure field effect transistors. The recess gate structure is obtained in an n/sup +/-InAs-InAlAs double cap layer structure with a citric-acid-based etchant. From molecular-beam epitaxy-grown material functional devices with 1000-, 500-, and 200-nm gate length were fabricated. From all three device geometries we obtain drive currents of at least 500 mA/mm, gate leakage currents below 2 mA/mm, and RF-transconductance of 1 S/mm. For the 200-nm gate length device f/sub /spl tau// and f/sub max/ are 162 and 137 GHz, respectively. For the 500-nm gate length device f/sub /spl tau// and f/sub max/ are 89 and 140 GHz, respectively. We observe scaling limitations at 200-nm gate length, in particular a negative threshold voltage shift from -550 to -810 mV, increased kink-effect, and a high gate-to-drain capacitance of 0.5 pF/mm. The present limitations to device scaling are discussed. 相似文献
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Low-voltage high-gain differential OTA for SC circuits 总被引:1,自引:0,他引:1
Carvajal R.G. Palomo B. Torralba A. Munoz F. Ramirez-Angulo J. 《Electronics letters》2003,39(16):1159-1160
A new differential operational transconductance amplifier (OTA) for SC circuits that operates with a supply voltage of less than two transistor threshold voltages is presented. Its simplicity relies on the use of a low-voltage regulated cascode circuit, which achieves very high output impedance under low-voltage restrictions. The OTA has been designed to operate with a supply voltage of V/sub DD/=1.5 V, using a 0.6 /spl mu/m CMOS technology with transistor threshold voltages of V/sub TN/=0.75 V and V/sub TP/=-0.85 V. Post-layout simulation results for a load capacitance (C/sub L/) of 2 pF show a 75 MHz gain-bandwidth product and 100 dB DC gain with a quiescent power consumption of 750 /spl mu/W. 相似文献
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对基于全耗尽绝缘体上硅(FDSOI)的隧穿场效应晶体管(TFET)器件和金属氧化物半导体场效应晶体管(MOSFET)器件进行了总剂量(TID)效应仿真,基于两种器件不同的工作原理,研究了总剂量效应对两种器件造成的电学影响,分析了辐照前后TFET和MOSFET的能带结构、载流子密度等关键因素的变化。仿真结果表明:两种器件在受到较大辐射剂量时(1 Mrad (Si)),TFET受辐射引起的固定电荷影响较小,仍能保持较好的开关特性、稳定的阈值电压;而MOSFET则受固定电荷的影响较大,出现了背部导电沟道,其关态电流增加了几个数量级,开关特性发生了严重退化,阈值电压也严重地向负电压偏移。此外,TFET的开态电流会随着辐照剂量的增加而减小,这与MOSFET的表现恰好相反。因此TFET比MOSFET有更好的抗总剂量效应能力。 相似文献