A 15-mW fully integrated I/Q synthesizer for Bluetooth in 0.18-/spl mu/m CMOS

A low-power fully integrated synthesizer for Bluetooth applications is presented. The circuit with quadrature output signals at 2.45 GHz and 15-mW power dissipation has been designed in a digital 0.18-/spl mu/m CMOS process with 1.8-V supply voltage. The only external component is a 64-MHz crystal. Measurements have been performed on packaged samples mounted on an FR-4 board and show that the Bluetooth requirements are met. The measured phase noise is below -120 dBc/Hz at 3-MHz offset, and the resulting residual frequency modulation is 7.4-kHz rms. The tuning range consists of an analog and digital tuning mechanism, resulting in more than 15% overall tuning range.     

A complete single-chip GPS receiver with 1.6-V 24-mW radio in 0.18-/spl mu/m CMOS

We have developed a complete single-chip GPS receiver using 0.18-/spl mu/m CMOS to meet several important requirements, such as small size, low power, low cost, and high sensitivity for mobile GPS applications. This is the first case in which a radio has been successfully combined with a baseband processor, such as SoC, in a GPS receiver. The GPS chip, with a total size of 6.3 mm /spl times/ 6.3 mm, contains a 2.3 mm /spl times/ 2.0 mm radio part, including RF front end, phase-locked loops, IF functions, and 500 K gates of baseband logic, including mask ROM, SRAM, and dual port SRAM . It is fabricated using 0.18-/spl mu/m CMOS technology with a MIM capacitor and operates from a 1.6-2.0-V power supply. Experimental results show a very low power consumption of, typically, 57 mW for a fully functional chip including baseband, and a high sensitivity of -152dBm. Through countermeasures against substrate coupling noise from the digital part, the high sensitivity was successfully achieved without any external low-noise amplifier.     

A complete single-chip GPS receiver with 1.6-V 24-mW radio in 0.18-/spl mu/m CMOS

A compact ultra-broadband MMIC-compatible uniplanar balun has been developed using offset air-gap coupler. The offset air-gap coupler presents tight coupling and low conductor loss, and thus allows the balun to show low loss at mm-wave frequencies. The measured insertion loss was less than 2 dB from 26 to 55 GHz, and amplitude and phase imbalance was less than /spl plusmn/1dB and 5/spl deg/, respectively over a wide frequency range from 27 to 69 GHz.     

A Bluetooth radio in 0.18-/spl mu/m CMOS

This paper describes the results of an implementation of a Bluetooth radio in a 0.18-/spl mu/m CMOS process. A low-IF image-reject conversion architecture is used for the receiver. The transmitter uses direct IQ-upconversion. The VCO runs at 4.8-5.0 GHz, thus facilitating the generation of 0/spl deg/ and 90/spl deg/ signals for both the receiver and transmitter. By using an inductor-less LNA and the extensive use of mismatch simulations, the smallest silicon area for a Bluetooth radio implementation so far can be reached: 5.5 mm/sup 2/. The transceiver consumes 30 mA in receive mode and 35 mA in transmit mode from a 2.5 to 3.0-V power supply. As the radio operates on the same die as baseband and SW, the crosstalk-on-silicon is an important issue. This crosstalk problem was taken into consideration from the start of the project. Sensitivity was measured at -82 dBm.     

A fully integrated SOC for 802.11b in 0.18-/spl mu/m CMOS

A fully integrated system-on-a-chip (SOC) intended for use in 802.11b applications is built in 0.18-/spl mu/m CMOS. All of the radio building blocks including the power amplifier (PA), the phase-locked loop (PLL) filter, and the antenna switch, as well as the complete baseband physical layer and the medium access control (MAC) sections, have been integrated into a single chip. The radio tuned to 2.4 GHz dissipates 165 mW in the receive mode and 360 mW in the transmit mode from a 1.8-V supply. The receiver achieves a typical noise figure of 6 dB and -88-dBm sensitivity at 11 Mb/s rate. The transmitter delivers a nominal output power of 13 dBm at the antenna. The transmitter 1-dB compression point is 18 dBm and has over 20 dB of gain range.     

A fully integrated 5.8 GHz U-NII band 0.18-/spl mu/m CMOS VCO

A fully integrated 5.8 GHz CMOS L-C tank voltage-controlled oscillator (VCO) using a 0.18-/spl mu/m 1P6M standard CMOS process for 5 GHz U-NII band WLAN application is presented. The VCO core circuit uses only PMOS to pursue a better phase noise performance since it has less 1/f noise than NMOS. The measurement is performed by using a FR-4 PCB test fixture. The output frequency of the VCO is from 5860 to 6026 MHz with a 166 MHz tuning range and the phase noise is -96.9 dBc/Hz at 300 kHz (or -110 dBc/Hz at 1 MHz) with V ctrl = 0 V. The power consumption of the VCO excluding buffer amplifiers is 8.1 mW at V/sub DD/ = 1.8 V and the output power is -4 dBm.     

A 56-mW 23-mm/sup 2/ single-chip 180-nm CMOS GPS receiver with 27.2-mW 4.1-mm/sup 2/ radio

A 56-mW 23-mm/sup 2/ GPS receiver with CPU-DSP-64 kRAM-256 kROM and a 27.2-mW 4.1-mm/sup 2/ radio has been integrated in a 180-nm CMOS process. The SoC GPS receiver, connected to an active antenna, provides latitude, longitude, height with 3-m rms precision with no need of external host processor in a [-40, 105]/spl deg/C temperature range. The radio draws 17 mA from a 1.6-1.8-V voltage supply, takes 11 pins of a VFQFPN68 package, and needs just a few passives for input match and a crystal for the reference oscillator. Measured radio performances are NF=4.8 dB, Gp=92 dB, image rejection > 30 dB, -112 dBc/Hz phase noise @ 1 MHz offset from carrier. Though GPS radio linearity and ruggedness have been made compatible with the co-existence of a microprocessor, radio silicon area and power consumption is comparable to state-of-the-art stand-alone GPS radio. The one reported here is the first ever single-chip GPS receiver requiring no external host to achieve satellite tracking and position fix with a total die area of 23 mm/sup 2/ and 56-mW power consumption.     

An 11b 70-MHz 1.2-mm/sup 2/ 49-mW 0.18-/spl mu/m CMOS ADC with on-chip current/voltage references

This work proposes an 11b 70-MHz CMOS pipelined analog-digital converter (ADC) as one of core circuit blocks for very high speed digital subscriber line system applications. The proposed ADC for the internal use has the strictly limited number of externally connected I/O pins while the ADC employs on-chip CMOS current/voltage references and a merged-capacitor switching technique to improve ADC performances. The ADC implemented in a 0.18-/spl mu/m 1P4M CMOS technology shows the maximum signal-to-noise distortion ratio (SNDR) of 60 dB at 70 MSample/s. The ADC maintains the SNDR of 58 dB and the spurious-free dynamic resistance of 68 dB for input frequencies up to the Nyquist rate at 60 MSample/s. The measured differential and integral nonlinearities of the ADC are within /spl plusmn/0.63 and /spl plusmn/1.21 LSB, respectively. The active chip area is 1.2 mm/sup 2/ and the ADC consumes 49 mW at 70 MSample/s at 1.8 V.     

A 21-mW 8-b 125-MSample/s ADC in 0.09-mm/sup 2/ 0.13-/spl mu/m CMOS

This paper presents an 8-b two-step subranging analog-to-digital (ADC) using interpolation, averaging, offset compensation, and pipelining techniques to accomplish an effective number of bits of 7.6 b at 125 MSample/s. The 0.13-/spl mu/m CMOS ADC occupies 0.09 mm/sup 2/ and consumes 21 mW.     

A 24-GHz, +14.5-dBm fully integrated power amplifier in 0.18-/spl mu/m CMOS

A 24-GHz +14.5-dBm fully integrated power amplifier with on-chip 50-/spl Omega/ input and output matching is demonstrated in 0.18-/spl mu/m CMOS. The use of substrate-shielded coplanar waveguide structures for matching networks results in low passive loss and small die size. Simple circuit techniques based on stability criteria derived result in an unconditionally stable amplifier. The power amplifier achieves a power gain of 7 dB and a maximum single-ended output power of +14.5-dBm with a 3-dB bandwidth of 3.1 GHz, while drawing 100 mA from a 2.8-V supply. The chip area is 1.26 mm/sup 2/.     

A fully integrated 0.18-/spl mu/m CMOS direct conversion receiver front-end with on-chip LO for UMTS

This paper presents a 0.18-/spl mu/m CMOS direct-conversion IC realized for the Universal Mobile Telecommunication System (UMTS). The chip comprises a variable gain low-noise amplifier, quadrature mixers, variable gain amplifiers, and local oscillator generation circuits. The solution is based on very high dynamic range front-end blocks, a low-power superharmonic injection-locking technique for quadrature generation and continuous-time dc offset removal. Measured performances are an overall gain variable between 21 and 47 dB, 5.6 dB noise figure, -2 dBm out-of-band IIP3, -10 dBm in-band IIP3, 44.8-dBm minimum IIP2, and -155-dBc/Hz phase noise at 135 MHz from carrier frequency, while drawing 21 mA from a 1.8-V supply.     

A 0.18-/spl mu/m CMOS bioluminescence detection lab-on-chip

The paper describes a bioluminescence detection lab-on-chip consisting of a fiber-optic faceplate with immobilized luminescent reporters/probes that is directly coupled to an optical detection and processing CMOS system-on-chip (SoC) fabricated in a 0.18-/spl mu/m process. The lab-on-chip is customized for such applications as determining gene expression using reporter gene assays, determining intracellular ATP, and sequencing DNA. The CMOS detection SoC integrates an 8 /spl times/ 16 pixel array having the same pitch as the assay site array, a 128-channel 13-bit ADC, and column-level DSP, and is fabricated in a 0.18-/spl mu/m image sensor process. The chip is capable of detecting emission rates below 10/sup -6/ lux over 30 s of integration time at room temperature. In addition to directly coupling and matching the assay site array to the photodetector array, this low light detection is achieved by a number of techniques, including the use of very low dark current photodetectors, low-noise differential circuits, high-resolution analog-to-digital conversion, background subtraction, correlated multiple sampling, and multiple digitizations and averaging to reduce read noise. Electrical and optical characterization results as well as preliminary biological testing results are reported.     

A low-voltage folded-switching mixer in 0.18-/spl mu/m CMOS

Scaling of CMOS technologies has a great impact on analog design. The most severe consequence is the reduction of the voltage supply. In this paper, a low voltage, low power, AC-coupled folded-switching mixer with current-reuse is presented. The main advantages of the introduced mixer topology are: high voltage gain, moderate noise figure, moderate linearity, and operation at low supply voltages. Insight into the mixer operation is given by analyzing voltage gain, noise figure (NF), linearity (IIP3), and DC stability. The mixer is designed and implemented in 0.18-/spl mu/m CMOS technology with metal-insulator-metal (MIM) capacitors as an option. The active chip area is 160 /spl mu/m/spl times/200 /spl mu/m. At 2.4 GHz a single side band (SSB) noise figure of 13.9 dB, a voltage gain of 11.9 dB and an IIP3 of -3 dBm are measured at a supply voltage of 1 V and with a power consumption of only 3.2 mW. At a supply voltage of 1.8 V, an SSB noise figure of 12.9 dB, a voltage gain of 16 dB and an IIP3 of 1 dBm are measured at a power consumption of 8.1 mW.     

A matrix amplifier in 0.18-/spl mu/m SOI CMOS

A fully integrated matrix amplifier with two rows and four columns (2-by-4) fabricated in a three-layer metal 0.18-/spl mu/m silicon-on-insulator (SOI) CMOS process is presented. It exhibits an average pass-band gain of 15 dB and a unity-gain bandwidth of 12.5 GHz. The input and output ports are matched to 50 /spl Omega/ using m-derived half sections; the measured S/sub 11/ and S/sub 22/ values exceed -7 and -12 dB, respectively. Integrated in 2.0/spl times/2.9mm/sup 2/, it dissipates 233.4 mW total from 2.4- and 1.8-V power supplies.     

0.18 /spl mu/m 3-6 GHz CMOS broadband LNA for UWB radio

A 3-6 GHz CMOS broadband low noise amplifier (LNA) for ultra-wideband (UWB) radio is presented. The LNA is fabricated with the 0.18 /spl mu/m 1P6M standard CMOS process. Measurement of the CMOS LNA is performed using an FR-4 PCB test fixture. From 3 to 6 GHz, the broadband LNA exhibits a noise figure of 4.7-6.7 dB, a gain of 13-16 dB, and an input/output return loss higher than 12/10 dB, respectively. The input P/sub 1 dB/ and input IP3 (IIP3) at 4.5 GHz are about -14 and -5 dBm, respectively. The DC supply is 1.8 V.     

A 1.3-V 5-mW fully integrated tunable bandpass filter at 2.1 GHz in 0.35-/spl mu/m CMOS

A 2.1-GHz 1.3-V 5-mW fully integrated Q-enhancement LC bandpass biquad programmable in f/sub o/, Q, and peak gain is implemented in 0.35-/spl mu/m standard CMOS technology. The filter uses a resonator built with spiral inductors and inversion-mode pMOS capacitors that provide frequency tuning. The Q tuning is through an adjustable negative-conductance generator, whereas the peak gain is tuned through an input G/sub m/ stage. Noise and nonlinearity analyses presented demonstrate the design tradeoffs involved. Measured frequency tuning range around 2.1 GHz is 13%. Spiral inductors with Q/sub o/ of 2 at 2.1 GHz limit the spurious-free dynamic range (SFDR) at 31-34 dB within the frequency tuning range. Measurements show that the peak gain can be tuned within a range of around two octaves. The filter sinks 4 mA from a 1.3-V supply providing a Q of 40 at 2.19 GHz with a 1-dB compression point dynamic range of 35 dB. The circuit operates with supply voltages ranging from 1.2 to 3 V. The silicon area is 0.1 mm/sup 2/.     

A 25-MS/s 14-b 200-mW /spl Sigma//spl Delta/ Modulator in 0.18-/spl mu/m CMOS

The design of a fifth-order 4-b quantizer single-loop /spl Sigma//spl Delta/ modulator is presented that achieves 25-MS/s conversion rate with 84 dB of dynamic range and 82 dB of signal-to-noise ratio. Implemented in a 0.18-/spl mu/m CMOS technology, the 0.95-mm/sup 2/ chip has a power consumption of 200 mW from a 1.8-V supply.     

A 1-V 24-GHz 17.5-mW phase-locked loop in a 0.18-/spl mu/m CMOS process

A 1-V 24-GHz 17.5-mW fully integrated phase-locked loop employing a transformer-feedback voltage-controlled oscillator and a stacked divide-by-2 frequency divider for low voltage and low power is presented. Implemented in a 0.18-/spl mu/m CMOS process and operated at 24 GHz with a 1-V supply, the PLL measures in-band phase noise of -106.3 dBc at a frequency offset of 100 kHz and out-of-band phase noise of -119.1 dBc/Hz at a frequency offset of 10 MHz. The PLL dissipates 17.5 mW and occupies a core area of 0.55 mm/sup 2/.     

A 17-mW transmitter and frequency synthesizer for 900-MHz GSM fully integrated in 0.35-/spl mu/m CMOS

A fractional-N phase-locked loop (PLL) serves as a Gaussian minimum-shift keying (GMSK) transmitter and a receive frequency synthesizer for GSM. The entire transmitter/synthesizer is fully integrated in 0.35-/spl mu/m CMOS and consumes 17.4 and 12 mW from 2.5 V in the transmit and receive modes, respectively, including an on-chip voltage-controlled oscillator. The circuit meets GSM specifications on modulation accuracy in transmit mode, and measured phase noise from the closed-loop PLL is -148 dBc/Hz and -162 dBc/Hz, respectively, at 3- and 20-MHz offset. Worst case spur at 13-MHz offset is -77 dBc.     

A low-power oscillator mixer in 0.18-/spl mu/m CMOS technology

A downconversion double-balanced oscillator mixer using 0.18-/spl mu/m CMOS technology is proposed in this paper. This oscillator mixer consists of an individual mixer stacked on a voltage-controlled oscillator (VCO). The stacked structure allows entire mixer current to be reused by the VCO cross-coupled pair to reduce the total current consumption of the individual VCO and mixer. Using individual supply voltages and eliminating the tail current source, the stacked topology requires 1.0-V low supply voltage. The oscillator mixer achieves a voltage conversion gain of 10.9 dB at 4.2-GHz RF frequency. The oscillator mixer exhibits a tuning range of 11.5% and a single-sideband noise figure of 14.5 dB. The dc power consumption is 0.2 mW for the mixer and 2.94 mW for the VCO. This oscillator mixer requires a lower supply voltage and achieves a higher operating frequency among recently reported Si-based self-oscillating mixers and mixer oscillators. The mixer in this oscillator mixer also achieves a low power consumption compared with recently reported low-power mixers.