Synthesis,Characterization and Performance of Amine Modified Linseed Oil Fatty Amide Coatings

A novel attempt has been made to develop ambient cured polyamine amide (PAA) resins by the condensation polymerization reaction of oil fatty amide diol (N,N-bis 2-hydroxy ethyl linseed oil fatty amide) (HELA) and o-phenylene diamine, which was further modified by poly(styrene-co-maleic anhydride) (SMA) at different phr (parts per hundred part of resin) to get a series of PAA–SMA resins. The structural elucidation of HELA, PAA and PAA–SMA were carried out by FT-IR, ¹H-NMR and ¹³C-NMR spectroscopic techniques. The physico-chemical and physico-mechanical analyses were carried out by standard laboratory methods. Thermal analyses of these resins were accomplished by thermogravimetric analyses (TGA) and differential scanning calorimetry (DSC) techniques. Coatings of PAA–SMA were prepared on mild steel strips to evaluate their physico-mechanical and chemical/corrosion resistance performance under various corrosive environments. It was found that among the PAA–SMA systems, PAA-35 showed the best physico-mechanical and corrosion resistance performance. Thermal studies reveal that the coatings can be safely used up to 305 °C.     

Thermal stability of polyurethane elastomers before and after UV irradiation

In this work, we investigated the thermal degradation behavior of segmented polyurethane (PUR) elastomers before and after UV irradiation. The thermal degradation of PUR elastomers was studied over the temperature range of 25–600°C in an atmosphere of nitrogen using thermal gravimetric analysis (TGA). Four series of PUR elastomers derived from poly(oxytetramethylene)glycol (PTMO) of 1000 and 2000 molecular weight and poly(caprolactone glycol) (PCL) of 1250 molecular weight, 4,4′‐diphenylmethane diisocyanate (MDI), and 4,4′‐dicyclohexylmethane diisocyanate (H₁₂MDI) and 1,4‐butanediol as an chain extender were synthesized by the prepolymer method. The derivative thermogravimetric (DTG) peaks observed in the experiments indicated that PUR elastomers degraded through two steps. We attributed the first step to degradation of the hard segment. The second degradation step could be ascribed to degradation of the soft segment. We found that the PUR elastomers based on poly(ester polyol) and aromatic diisocyanate exhibit better thermal stability than that of PUR elastomers based on the poly(ether polyol) soft segment in both steps of degradation. The thermal degradation is more prevalent in PUR elastomers based on cycloaliphatic diisocyanate. The higher values of the temperature of initial decomposition (Tⁱ) indicate a higher thermal stability of UV‐exposed elastomers on the beginning of degradation. This may be due to the formation of a crosslinking structure in the presence of UV irradiation. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 864–873, 2001     

Syntheses of epoxy‐bridged polyorganosiloxanes and the effects of terminated alkoxysilanes on cured thermal properties

A series of epoxy‐bridged polyorganosiloxanes have been synthesized by reacting multifunctional aminoalkoxysilanes with diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The reactions of trifunctional 3‐aminopropyltriethoxysilane (APTES), difunctional 3‐aminopropylmethyldiethoxysilane (APMDS), and monofunctional 3‐aminopropyldimethylethoxysilane (APDES) with DGEBA epoxy have been monitored and characterized by FTIR, ¹H NMR, and ²⁹Si NMR spectra in this study. The synthesized epoxy‐bridged polyorganosiloxanes precursors, with different terminated alkoxysilane groups, are thermally cured with or without the addition of curing catalysts. Organometallic dibutyltindilaurate, and alkaline tetrabutylammonium hydroxide have been used as curing catalysts to investigate the thermal curing behaviors and cured properties of epoxy‐bridged polyorganosiloxanes precursors. The maximum exothermal curing temperatures of epoxy‐bridged polyorganosiloxanes precursors are found to appear around the same region of 120°C in DSC analysis. The addition of catalysts to the epoxy/APTES precursor shows significant influence on the cured structure; however, the catalysts exhibit less influence on the cured structure of epoxy‐APMDS precursor and epoxy/APDES precursor. Curing catalysts also show significant enhancement in increasing the thermal decomposition temperature (T_d50s) of cured network of trifunctional epoxy‐bridged polyorganosiloxane (epoxy/APTES). High T_d50s of 518.8 and 613.6 in the cured hybrids of epoxy/APTES and epoxy/APMDS precursors are also observed, respectively. When trialkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes precursor are cured, with or without the addition of catalyst, no obvious T_g transition can be found in the TMA analysis of cured network. The cured network of trialkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes also exhibits the lowest coefficient of thermal expansion (CTE) among the three kinds of alkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes investigated. The organic–inorganic hybrid, from epoxy‐bridged polyorganosiloxanes after the thermal curing process, shows better thermal stability than the cured resin network of pure epoxy‐diaminopropane. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3491–3499, 2006     

A novel amide and imide copolymer as matrix resin for UV photoresist

A novel amide and imide copolymer, poly(N‐phenylmethacrylamide‐co‐N‐(p‐hydroxyphenyl)maleimide) was synthesized for the matrix resin of ultraviolet (UV) photoresist. Elemental analysis and self‐polymerization experiment verified that this copolymer was very close to 1:1 (molar ratio) in composition and was predominately alternating. It was able to dissolve in various organic solvents and form uniform curing film when spin‐coating. Its differential scanning calorimetry and thermogravimetry analysis test showed good thermal stability and its glass transition temperature (T_g) was about 280°C. Photolithographic experiment indicated that the UV photoresist formulated with this copolymer as matrix resin was achieved the resolution of about 5 μm, the contrast of 3.001, and the sensitivity of 32 mJ/cm². With good plasma etching resistance, the photoresist studied was able to bear 250°C for 30 min without thermal deformation during the thermal resistance test. POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers     

Preparation of 2‐ethyl‐4‐methylimidazole derivatives as latent curing agents and their application in curing epoxy resin

Three kinds of 2‐ethyl‐4‐methylimidazole (EMI) derivatives (N‐acetyl EMI, N‐benzoyl EMI, and N‐benzenesulfonyl EMI) were synthesized through the reaction of EMI with acetyl chloride, benzoyl chloride, and benzenesulfonyl chloride, respectively. And the structure was confirmed by Fourier transform infrared spectroscopy (FTIR) and ¹H‐nuclear magnetic resonance spectroscopy (¹H NMR) spectra. Furthermore, the synthesized EMI derivatives were applied in diglycidyl ether of bisphenol A epoxy resin (DGEBA) as latent curing agent. Differential scanning calorimeter (DSC) was used to analyze the curing behavior of DGEBA/EMI derivative systems, indicating DGEBA could be efficiently cured by the EMI derivatives at 110～160°C, and the corresponding curing activation energy ranged from 71 to 86 kJ/mol. Viscosity data proves that the storage life of DGEBA with N‐acetyl EMI (NAEMI), N‐benzoyl EMI (NBEMI), and N‐benzenesulfonyl EMI (NBSEMI) at room temperature was 38 d, 50 d, and 80 d, and that at 10°C was 90 d, 115 d, and 170 d, respectively. Besides, thermogravimetry (TG), izod impact strength (IIS), and tensile shear strength (TSS) were tested to characterize the thermal stability and mechanical properties of DGEBA cured by EMI derivatives. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42563.     

Studies on Ambient Cured Biobased Mn(II), Co(II) and Cu(II) Containing Metallopolyesteramides

In this paper linseed oil based metallopolyesteramides (Mn(II)-/Co(II)-/Cu(II)-LPEA) containing metals [with half filled (d ⁵) and partially filled (d ⁷ and d ⁹) d orbitals] were synthesized via green route for the application of eco-friendly protective green material. This paper also described the role of occupancy of d orbitals on the performance of such polymers. The synthesis reaction was carried out in situ through condensation polymerization among linseed fatty amide diol (HELA), phthalic anhydride and respective metal acetates [M (OCOCH₃)₂; M = Mn(II), Co(II), Cu(II); different mole ratios] in absence of any harmful organic solvent. The structural determination (FTIR, ¹H-NMR and ¹³C-NMR), curing, thermal, physico-chemical, physico-mechanical, anticorrosive/chemical resistance, antibacterial properties of Mn(II)-/Co(II)-/Cu(II)-LPEA were carried out. The curing mechanism of the resin was confirmed by the comparison of FTIR spectra of uncured and cured resin. The curing mechanism of Mn(II)-/Co(II)-/Cu(II)-LPEA is found to be contrary to that of reported oil based polymer that involves the lipid autoxidation (slow process) in which driers are required to speed up the room temperature curing process. The incorporation of metals in Mn(II)-/Co(II)-/Cu(II)-LPEA improved the thermal stability as compared to virgin linseed oil based polyesteramide (LPEA). Mn(II)-/Co(II)-/Cu(II)-LPEA also show excellent antibacterial performance against Staphylococcus aureus and Escherichia coli. The observed diversity in material properties suggests that Mn-LPEA may be useful as an eco-friendly protective green material with thermal stability up to 320–330 °C.     

Studies on the curing kinetics and thermal stability of the novel tetrafunctional epoxy resin N,N,N′N′-tetrakis(2,3-epoxypropyl)-4,4′-(1,4-phenylenedioxy)dianiline

A novel tetrafunctional epoxy resin, namely N,N,N′N′-tetrakis(2,3-epoxypropyl)-4,4′-(1,4-phenylenedioxy)dianiline, has been synthesized. The curing kinetics has been studied by differential scanning calorimetry (DSC) using various amine curing agents. Thermal stabilities of the cured products have been investigated by thermogravimetric (TG) analyses. The overall activation energies for the curing reactions are observed to be in the range 63.6–196.7 kJ·mol^–1. The cured products have good thermal stability.     

Pongamia glabra seed oil based poly(urethane–fatty amide)

Poly(urethane–fatty amide) (PUPGFA) was developed to use nonedible and nondrying Pongamia glabra seed oil. The resin was synthesized by the reaction of N,N‐bis(2‐hydroxyethyl) P. glabra fatty amide (HEPGFA) and tolylene‐2,4‐diisocyanate through a one‐shot technique with a minimal amount (8–10%) of organic solvent. The structural elucidation of the resin was carried out by Fourier transform infrared (FTIR), ¹H‐NMR, and ¹³C‐NMR spectroscopic techniques, whereas the curing mechanism was confirmed by FTIR spectroscopy and differential scanning calorimetry. The solubility of the resin was studied in different polar and nonpolar solvents. Thermal analysis was carried out by thermogravimetric analysis and differential thermal analysis techniques. Antibacterial studies of HEPGFA and PUPGFA were performed in the presence of Gram‐negative Salmonella and Gram‐positive Staphylococcus aureus bacteria by an agar diffusion method. Physicochemical, physicomechanical, and corrosion‐resistance tests were performed by standard laboratory methods. PUPGFA had good physicomechanical properties, excellent chemical/corrosion resistance, and moderate antibacterial activities. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Property evaluation and structure analysis of polyurethane/epoxy graft interpenetrating polymer networks

Polyurethanes obtained from 4,4′‐diphenylmethane diisocyanate (MDI) and polydiols with different molecular weights (polyethylene glycol and polyoxypropylene diols) were used as modifiers for diglycidyl ether of bisphenol A. Impact strength (IS), critical stress intensity factor (K_C), flexural strength and flexural strain at break were measured as a function of polyurethane (PUR) type and content. Scanning electron microscopy (SEM), differential scanning calorimetry (DSC), and infrared spectroscopy (FTIR) were employed for the structure and morphology analysis. It was found that the addition of polyurethane with an excess of isocyanate groups to epoxy resin resulted in the formation of a grafted interpenetrating polymer network structure. The mechanical properties of epoxy resin were improved with 5 and 10% PUR. Moreover, it was observed that composites containing PUR based on higher molecular weight (PUR 1002 and PUR 2002) with long flexible segments exhibited higher impact strength while PUR prepared from polyethylene glycol had a higher flexural energy to break and a higher flexural modulus. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

High performance moisture cured poly(ether–urethane) amide coatings based on renewable resource (cottonseed oil)

In this investigation, polyetheramide resin was prepared through the condensation polymerization of N,N-bis (2-hydroxyethyl) cottonseed oil fatty amide (HECOFA) with bisphenol-A. It was further modified by 2,4-toluene diisocyanate (TDI) in 10–30 wt% of polyetheramide to develop a series of moisture curing urethane-modified polyetheramide resins (UMCOPEtA). The synthesized resin was characterized using ¹H NMR, ¹³C NMR, FTIR and solubility in various organic solvents at room temperature. The thermal and curing behavior of the resin was investigated using thermogravimetric analysis and differential scanning calorimetric techniques. The physico-chemical properties such as hydroxyl value, iodine value, specific gravity and mechanical properties like scratch hardness, impact, and flexibility were determined by standard laboratory methods. Coatings of UMCOPEtA resin were prepared on mild steel panels to evaluate chemical resistance performance against acid, alkali, water and xylene. The newly developed UMCOPEtA coatings showed improved hardness, impact, gloss, water and chemical resistance when compared with unmodified polyetheramide coatings, and thus were found to be suitable as a high performance coating material.     

Synthesis,characterization and properties of a castor oil modified biodegradable poly(ester amide) resin

A biodegradable poly(ester amide) resin was synthesized from N,N-bis(2-hydroxy ethyl) fatty amide of castor oil with maleic anhydride, phthalic anhydride and isophthalic acid (100:30:35:35 mole ratio) by the polycondensation process. The fatty amide of the oil was obtained for the first time with 95% yield. The chemical structure of the synthesized resin was characterized by spectroscopic techniques like FTIR, ¹H NMR and ¹³C NMR. Various physical properties such as acid value, saponification value, iodine value, specific gravity and viscosity of the resin were also determined. Further the rheological behavior, studied in the steady shear mode showed shear thinning behavior of the resin. The epoxy cured poly(ester amide) thermoset using poly(amido amine) hardener exhibited better properties than with the cycloaliphatic amine hardener cured system. TGA studies also revealed higher thermal stability of the former system than the latter. In vitro-biodegradation study of the poly(ester amide) thermoset using Pseudomonas aeruginosa and Bacillus subtilus bacteria revealed superior biodegradability of the thermoset using the former bacterial strain. Excellent chemical resistance against various chemical media including alkali was observed for epoxy-poly(amido amine) cured poly(ester amide) resin over epoxy-cycloaliphatic amine one. The epoxy-poly(amido amine) cured poly(ester amide) thermoset thus has the potential to be used as surface coating material.     

Synthesis of a novel phosphorus‐containing dicyclopentadiene novolac hardener and its cured epoxy resin with improved thermal stability and flame retardancy

A novel phosphorus‐containing dicyclopentadiene novolac (DCPD‐DOPO) curing agent for epoxy resins, was prepared from 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) and n‐butylated dicyclopentadiene phenolic resin (DCPD‐E). The chemical structure of the obtained DCPD‐DOPO was characterized with FTIR, ¹H NMR and ³¹P NMR, and its molecular weight was determined by gel permeation chromatography. The flame retardancy and thermal properties of diglycidyl ether bisphenol A (DGEBA) epoxy resin cured with DCPD‐DOPO or the mixture of DCPD‐DOPO and bisphenol A‐formaldehyde Novolac resin 720 (NPEH720) were studied by limiting oxygen index (LOI), UL 94 vertical test and cone calorimeter (CCT), and differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. It is found that the DCPD‐DOPO cured epoxy resin possess a LOI value of 31.6% and achieves the UL 94 V‐0 rating, while its glass transition temperature (T_g) is a bit lower (133 °C). The T_g of epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 increases to 137 °C or above, and the UL 94 V‐0 rating can still be maintained although the LOI decreases slightly. The CCT test results demonstrated that the peak heat release rate and total heat release of the epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 decrease significantly compared with the values of the epoxy resin cured by NPEH720. Moreover, the curing reaction kinetics of the epoxy resin cured by DCPD‐DOPO, NPEH720 or their mixture was studied by DSC. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44599.     

Studies on the curing behavior,thermal, and mechanical properties of epoxy resin-co-amine-functionalized lead phthalocyanine

A high performance copolymer was prepared by using epoxy (EP) resin as matrix and 3,10,17,24-tetra-aminoethoxy lead phthalocyanine (APbPc) as additive with dicyandiamide as curing agent. Fourier-transform infrared spectroscopy, dynamic mechanical analysis (DMA), differential scanning calorimetric analysis (DSC), and thermogravimetric analysis (TGA) were used to study the curing behavior, curing kinetics, dynamic mechanical properties, impact and tensile strength, and thermal stability of EP/APbPc blends. The experimental results show that APbPc, as a synergistic curing agent, can effectively reduce the curing temperature of epoxy resin. The curing kinetics of the copolymer was investigated by non-isothermal DSC to determine kinetic data and measurement of the activation energy. DMA, impact, and tensile strength tests proved that phthalocyanine can significantly improve the toughness and stiffness of epoxy resin. Highest values were seen on the 20 wt% loading of APbPc in the copolymers, energy storage modulus, and impact strength increased respectively 388.46 MPa and 3.6 kJ/m², T_g decreased 19.46°C. TGA curves indicated that the cured copolymers also exhibit excellent thermal properties.     

Thermal degradation study of interpenetrating polymer network based on modified bismaleimide resin and cyanate ester

Interpenetrating polymer networks (IPNs) based on different ratios of a modified bismaleimide resin (BMI/DBA) and cyanate ester (b10) have been synthesized via prepolymerization followed by thermal curing. A systematic thermal degradation study of these new BMI/DBA‐CE IPN resin systems was conducted by thermogravimetric analysis at different heating rates both in N₂ (thermal stability) and in air (thermal‐oxidative stability). The cured BMI/DBA‐CE IPN resin systems show excellent thermal stability, which could be demonstrated by 5% weight loss temperature (T_5%) ranging between 409 and 423 °C, maximum decomposition rate temperature (T_max) ranging between 423 and 451 °C, and the char yields at 800 °C ranging from 37% to 41% in nitrogen at a heating rate of 10 °C min^?1. The apparent activation energy associated with the main degradation stage of the cured BMI/DBA‐CE IPN resin systems was determined using the Kissinger method. The obtained results provide useful information in drawing correlation between thermal properties and structure. © 2003 Society of Chemical Industry     

Synthesis and curing properties of a novel curing agent based on N‐(4‐hydroxyphenyl) maleimide and dicyclopentadiene moieties

A new type of epoxy resin curing agent, containing pendant phenol functions, was synthesized by the free‐radical copolymerization of N‐(4‐hydroxyphenyl) maleimide with dicyclopentadiene (DCPD) monomer in the presence of a radical initiator. The chemical structure was characterized with Fourier transform infrared spectroscopy and nuclear magnetic resonance. The molecular weight of the new curing agent was determined by gel permeation chromatography. The activity and activation energy of this new curing agent with o‐cresol formaldehyde novolac epoxy (CNE) was investigated with a nonisothermal differential scanning calorimetry technique at different heating rates. The thermal properties of the cured polymers were evaluated with thermogravimetric analysis, and the results exhibit good thermal stability. In addition, this new curing agent with CNE showed low moisture absorption because of the hydrophobic nature of the DCPD structure. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Development of linseed oil based polyesteramide without organic solvent at lower temperature

Linseed oil based polyesteramide was synthesized at lower temperature in the absence of organic solvent through condensation polymerization reaction [Sf‐LPEA]. In this reaction N,N‐bis(2‐hydroxyethyl) linseed oil fatty amide and phthalic anhydride were heated at temperature lower than their onset of melting points and the by‐product, such as water was removed by application of vacuum technique. This approach was employed to overcome the use of volatile organic solvents used during processing and application of resin, which are ecologically harmful. The solubility of Sf‐LPEA was checked in different polar and nonpolar solvents. The FTIR, ¹H NMR, and ¹³C NMR spectral techniques were used to confirm the structure of Sf‐LPEA. The physicochemical, physicomechanical, and chemical resistance properties of the resin were investigated by standard methods. DSC and TGA were used to determine, respectively, the curing behavior and thermal stability of the resin. The comparative study of these properties of Sf‐LPEA with reported polyesteramide [LPEA], which are normally synthesized at higher temperature in organic solvent, was done. It was found that Sf‐LPEA exhibited improved physicomechanical, chemical resistance properties, and higher thermal stability compared with LPEA, and hence can find application as corrosion protective coating. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1143–1148, 2007     

Investigation of the postcure reaction and surface energy of epoxy resins using time‐of‐flight secondary ion mass spectrometry and contact‐angle measurements

Time‐of‐flight secondary ion mass spectrometry (ToF‐SIMS) was used to investigate correlations between the molecular changes and postcuring reaction on the surface of a diglycidyl ether of bisphenol A and diglycidyl ether of bisphenol F based epoxy resin cured with two different amine‐based hardeners. The aim of this work was to present a proof of concept that ToF‐SIMS has the ability to provide information regarding the reaction steps, path, and mechanism for organic reactions in general and for epoxy resin curing and postcuring reactions in particular. Contact‐angle measurements were taken for the cured and postcured epoxy resins to correlate changes in the surface energy with the molecular structure of the surface. Principal components analysis (PCA) of the ToF‐SIMS positive spectra explained the variance in the molecular information, which was related to the resin curing and postcuring reactions with different hardeners and to the surface energy values. The first principal component captured information related to the chemical phenomena of the curing reaction path, branching, and network density based on changes in the relative ion density of the aliphatic hydrocarbon and the C₇H₇O⁺ positive ions. The second principal component captured information related to the difference in the surface energy, which was correlated to the difference in the relative intensity of the C_xH_yN_z⁺ ions of the samples. PCA of the negative spectra provided insight into the extent of consumption of the hardener molecules in the curing and postcuring reactions of both systems based on the relative ion intensity of the nitrogen‐containing negative ions and showed molecular correlations with the sample surface energy. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Preparation and properties of halogen-free flame retardant epoxy resins with phosphorus-containing siloxanes

Novel epoxy resin modifiers, DOPO–TMDS and DOPO–DMDP were synthesized by addition reaction of divinylsiloxane with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO). Halogen-free flame retardant epoxy resins were obtained through modification of o-cresol novolac epoxy resin cured by phenol novolac resin using DOPO–TMDS and DOPO–DMDP which were characterized by ¹H NMR, ¹³C NMR, ³¹P NMR and FT-IR measurements. Effects of the phosphorus-containing siloxanes on thermal stabilities, mechanical properties and flame retardant properties of the epoxy resins were investigated. The cured epoxy resins exhibited better mechanical properties and greatly improved flame retardant properties due to the presence of phosphorus-containing siloxanes. The cured epoxy resins with phosphorus loading of 2.0 wt% showed LOI values of 32–33 and achieved UL94V-0 ratings.     

Phosphaphenanthrene‐containing borate ester as a latent hardener and flame retardant for epoxy resin

Borate ester containing the phosphaphenanthrene group with N → B coordination structure (PBN) was synthesized by transesterification of tributyl borate, 2‐(6‐oxido‐6H‐dibenz?c,e??1,2?oxaphos‐phorin‐6‐yl) methanol and N,N‐dimethylethanolamine. A thermally latent curing utility for diglycidyl ether of bisphenol A epoxy resin (E51) was confirmed by differential scanning calorimetry. Additionally, its flame‐retarding function in the cured epoxy was demonstrated in terms of the limiting oxygen index (LOI) and vertical burning test. The cured epoxy with 100:20 mass ratio of E51 to PBN passed UL94 V‐0 rating with 34.3% of LOI. The flame retardation mode and thermal and mechanical properties of the cured epoxy were carefully evaluated. The results of this work suggest that application of PBN would permit the formulation of environmentally friendly one‐pot flame‐retardant epoxy resin. © 2015 Society of Chemical Industry     

Synthesis and characterization of high‐performance epoxy resin based on disiloxane and 4,4′‐oxybis(benzoic acid) ester

Epoxy‐terminated siloxane‐contained resin (BCDS/OBBA‐ETS) with high tensile strength and lap shear strength as well as good thermal stability was synthesized and characterized by ¹H‐NMR and Fourier transform infrared spectroscopy. Carboxy‐capped disiloxane‐4,4′‐oxybis (benzoic acid) ester oligomer (BCDS/OBBA) was firstly prepared from the reaction between 1,3‐bis(chloromethyl)‐1,1,3,3‐tetramethyl‐disiloxane and 4,4′‐oxybis(benzoic acid) (OBBA) in N,N‐dimethylformamide in the presence of triethylamine. Then, the BCDS/OBBA oligomer was reacted with epichlorohydrin to obtain the title BCDS/OBBA‐ETS resin. Cured with liquid polyamide L‐651, or diethylenetriamine, the mechanical and thermal properties as well as the lap shear strength of the BCDS/OBBA‐ETS resin were evaluated. The results indicated that the BCDS/OBBA‐ETS resin exhibited good thermal stability below 200°C, and the glass transition temperature (T_g) was about 64°C after cured with L‐651. The tensile strength of same cured BCDS/OBBA‐ETS resin was 27.46 MPa with a stain at break of 42.11%, and the lap shear strength for bonding stainless steel was 18.59 MPa. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012