Sb对锌液与X80钢表面润湿性影响的研究

目的通过添加不同量的Sb元素降低锌液表面张力,提升X80管线钢热浸镀锌可镀性及镀层质量。方法采用改良座滴法在450℃下进行润湿实验,利用轴对称液滴分析软件(ADSA),计算不同Zn-Sb合金熔体在X80钢基板上的接触角,得到450℃时Zn-Sb合金熔体表面张力。通过能谱仪和扫描电子显微镜对镀层表面及截面的微观形貌和组织结构进行分析。结果当Sb添加量为1.0%时,450℃下Zn-Sb合金表面张力约为0.63 N/m,随Sb含量的增加,表面张力逐渐减小,当Sb含量增加到4.0%时,表面张力达到0.46 N/m,远低于纯锌液的0.79N/m。同时,Zn-Sb合金熔体与X80钢的接触角也从最初的57°逐渐减小到43°。锌合金熔体与X80钢界面处形成铁锌化合物组成的连续反应层,且在反应三相线外存在前驱膜,前驱膜的形成使随后的合金液在其上铺展,促进了润湿。结论Sb的添加能有效降低锌液表面张力,减小Zn-Sb合金熔体与X80钢间的接触角。Sb的表面张力较小,倾向于在锌合金表面富集,其作为表面活性元素降低锌液表面张力,从而提高润湿性。     

Sn-8.5Zn-xBi合金系与NdFeB磁体间的润湿性

采用座滴法分别研究在真空和氮气气氛中和不同温度条件下纯金属Sn,Zn,Bi及Sn-Zn-Bi系合金在NdFeB磁体上的润湿性。结果表明:单一元素Sn和Bi与NdFeB磁体间的润湿性不好,接触角比较大;而Zn与NdFeB磁体间的接触角为零,润湿性非常好。为了获得熔点较低、又与NdFeB磁体间润湿良好的合金,配制一定成分的Zn-Sn-Bi系合金,并测定其熔点。Zn-Sn-Bi合金中,当Bi含量增加到1.0%(质量分数,下同)以后,随着Bi含量的增加,Sn-Zn-Bi合金与NdFeB磁体间的润湿性改善,原因是Bi减小了液态合金的表面张力,计算和实验都证实了这一点。Sn-8.5Zn-7Bi熔点为194.3℃,合金与NdFeB磁体间的接触角仅为53.2°。     

Hf对一种高温合金与陶瓷材料润湿性及界面反应的影响

研究了Hf对一种高温合金与陶瓷材料润湿性及界面反应的影响.测量了合金熔体与陶瓷材料的平衡润湿角,通过SEM,EPMA和XPS研究了合金与陶瓷材料的界面组织形貌、反应区元素分布及界面反应产物,分析了Hf对合金熔体与陶瓷材料润湿性及界面反应的影响,阐述了润湿性与界面反应的关系.结果表明,高温合金中Hf元素的含量会影响合金熔体与陶瓷材料的润湿性.对于本工作的合金,当Hf含量从0.1%逐渐增大至2.0%时,润湿角由132°逐渐减小至112°,润湿性显著增强;当Hf含量达到1.5%时,合金熔体与陶瓷材料发生界面反应,界面反应使润湿角明显减小,反应产物为HfO2.界面反应热力学分析结果表明,Hf和SiO2满足发生置换反应所需的热力学条件.     

铝硅熔体与镀覆Q235钢的润湿行为

目的 探究锡锌合金镀层对铝硅熔体与Q235钢润湿行为的影响。方法 通过磁控溅射法和热浸镀法在Q235钢基底表面镀覆不同厚度(190~5 500 nm)的锡锌合金镀层。采用改良座滴法测试700 ℃下铝硅熔体与不同表面处理的Q235钢基底的润湿行为。利用扫描电子显微镜(SEM)、X射线能谱仪(EDS)对凝固润湿试样截面和表面组织及成分进行表征分析。结果 700 ℃时铝硅熔体与未镀覆基底为部分润湿,初始接触角和终态接触角分别为88°和66°。施加190 nm锡锌合金镀层后,初始铺展速率明显增大,终态接触角约为13°,并在铺展前沿形成前驱膜;随着镀层厚度的增加,终态接触角减小,熔体铺展速率及前驱膜宽度增大,1 680 nm时趋于完全润湿(终态接触角约为2°)。铝硅熔体与未镀覆钢基底界面反应产物为Fe2Al5相和Al8Fe2Si相,反应层垂直界面向熔体侧快速生长而隔离熔体铺展前沿与基底的接触。施加镀层会促进反应层(Fe2Al5相和Al8Fe2Si相)沿铺展前沿快速生长,前驱膜表层主要为Al8Fe2Si相。镀层过厚(5 500 nm)的凝固润湿试样界面附近存在分离的低熔点锡相。结论 锡锌合金镀层主要通过改变界面反应层生长及润湿三相线组态而影响铝硅熔体与Q235钢的润湿行为。锡锌合金镀层能有效改善铝硅熔体与Q235钢的润湿性,有助于铺展前沿前驱膜的形成。随着镀层厚度的增加,熔体铺展速率增大,终态接触角减小。趋于完全润湿(1 680 nm镀层)后继续增大镀层厚度对润湿行为无明显影响,但过厚的镀层会促进低熔点锡相在凝固界面附近形成,这会弱化界面结合。     

In对Sn-8Zn-3Bi无铅钎料润湿性的影响

首先采用铺展法测试了Sn-8Zn-3Bi-(0～5)In钎料合金的铺展性.结果表明,少量In的加入提高了钎料的润湿性.当In含量达到0.5%时(质量分数,下同),钎料在铜基底上的铺展面积最大.采用气泡最大压力法对Sn-8Zn-3Bi-(0～1.5)In钎料熔体进行了表面张力测试.加入0.5%的In大大降低了Sn-8Zn-3Bi钎料熔体的表面张力,但进一步增加In的含量导致熔体表面张力增大.最后采用润湿平衡法对上述钎料进行了润湿力测试.结果表明0.5%In的加入使合金的润湿力达到最大,其原因是钎料/铜界面的界面张力减小.     

Au-30%Si合金熔体与石墨的润湿性及铺展动力学

采用改良座滴法在真空条件下研究Au-30%Si(摩尔分数)合金与石墨在1373~1473 K温度范围内的润湿性及铺展动力学。结果表明:随着温度升高,该体系润湿性得到改善,T=1373 K时,体系终态接触角高达100°,呈不润湿;当T≥1393 K时,随着温度的升高,接触角的变化速率明显加快,接触角减小至16°,呈现良好的润湿性。界面反应产物SiC的形成使得固/液界面能不断降低,为润湿铺展提供驱动力。通过建立新的反应润湿动力学模型,从能量角度阐述润湿铺展机制,预测体系固/液界面能随反应时间的延长呈指数关系降低。在反应控制阶段,理论计算与实验结果一致。     

铝熔体与镀铬氧化铝的润湿行为

为了探究镀层对金属熔体与陶瓷基底润湿行为的作用机理,采用座滴法测试了700~800℃高真空条件下铝熔体与氧化铝、镀铬氧化铝基底及铬块的润湿性,研究了镀铬层厚度及润湿温度对润湿行为的影响。结果表明,铬镀层能够明显改善铝熔体与氧化铝基底的润湿性,随着镀层厚度的增加（260~1200 nm）,终态接触角逐渐减小,铺展速率明显增大,且铝熔体在1200 nm镀铬层上比在铬块上具有更好的润湿性。800℃下铝熔体在镀铬氧化铝基底上会形成明显的前驱膜。铝熔体与镀铬层在界面反应形成了非连续反应产物颗粒,700℃时为Al₇Cr,800℃时为Al₁₁Cr₂,而铝熔体与铬块在界面形成了连续的反应层。结合润湿界面反应及铺展前沿组态变化对上述结果进行了分析。     

C对一种镍基高温合金与陶瓷型壳界面反应及润湿性的影响

采用座滴法研究了C对一种高温合金与陶瓷型壳的界面反应及润湿性的影响.通过SEM和EPMA研究了合金与陶瓷型壳的界面组织形貌及反应区元素分布.利用Thermo-Calc软件计算了合金熔体中C,Cr和Al的活度,分析了C含量对合金熔体中C,Cr和Al的活度的影响.探讨了合金/陶瓷界面反应与润湿性的关系.结果表明,合金中C含量高于0.1%时,C的活度明显增大,合金熔体与陶瓷型壳发生界面反应,合金熔体/陶瓷体系由非反应润湿变为反应润湿,合金表面产生黏砂层且合金中Cr和Al扩散到陶瓷表面.     

液态Ni-P,Ni-Zr-P系的表面张力及其对Al_2O_3的润湿性

利用卧滴法(Sessile drop method)测定了液态Ni-P和Ni-Zr-P合金的表面张力以及熔体与Al_2O_3的润湿性,并用AES测定了磷在上述合金表面层中沿深度的分布。结果表明,磷在液Ni中为表面活性元素,当Ni中有少量Zr存在时,促进磷更加明显地降低液Ni的表面张力,磷在液Ni表面的最大吸附值与AES实测值相近.Ni-P熔体对Al_2O_3的润湿性与磷的含量有关;当合金中含有少量Zr时,其润湿性降低。此外,还测定了镍基合金与Al_2O_3界面的表观剪切强度。     

SURFACE TENSION OF LIQUID Ni-P AND Ni-Zr-P ALLOYS AND THEIR WETTABILITY ONTO ALUMINA

利用卧滴法(Sessile drop method)测定了液态Ni-P和Ni-Zr-P合金的表面张力以及熔体与Al_2O_3的润湿性,并用AES测定了磷在上述合金表面层中沿深度的分布。结果表明,磷在液Ni中为表面活性元素,当Ni中有少量Zr存在时,促进磷更加明显地降低液Ni的表面张力,磷在液Ni表面的最大吸附值与AES实测值相近.Ni-P熔体对Al_2O_3的润湿性与磷的含量有关;当合金中含有少量Zr时,其润湿性降低。此外,还测定了镍基合金与Al_2O_3界面的表观剪切强度。     

Effect of Nd and La on surface tension and wettability of Sn-8Zn-3Bi solders

Maximum bubble pressure measurement was employed to evaluate surface tension of Sn-8Zn-3Bi- （0-0.15）Nd and Sn-8Zn-3Bi-（0 -0. 15）La solder melts. Wetting balance method was used to measure wetting force and wetting time on Cu substrate of the two group solders. The experimental results show that minute amount of Nd or La addition to Sn-8Zn-3Bi solder causes significant decrease of the surface tension of the solder melts at 200 - 240 ℃ and Nd addition is more effective on reduction of surface tension than that of La. Nd or La addition has the effect on enhancing the wetting force of the solder melts on Cu substrate, which results from the de- crease of interracial tension between the solder melt and Cu substrate. The wetting force reaches the maximum when 0.1% Nd is added to the base alloy. The contact angle between Sn-8Zn-3Bi base solders and Cu substrate decreases with the addition of Nd or La and the minimum of the contact angle is obtained from the solder with 0.1% Nd addition.     

Effect of direct electric current on wetting behavior of molten Bi on Cu substrate

The effect of direct electric current on the wetting behavior of molten Bi on Cu substrate at 370°C was investigated by the sessile drop method. The wettability of molten Bi on Cu without an applied current is poor and the spreading time required to form the steady-state contact angle (about 102°) is approximately 30 min. With the increase of the applied electric current, the spreading of molten Bi on Cu is accelerated significantly and the steady-state contact angle decreases considerably. The cross-section SEM micrographs of the solidified Bi droplet on Cu substrate show that the electric current has a marked effect on the convection of melt. Correspondingly, the application of an electric current obviously enhances the dissolution of Cu into Bi melt, which may change the wetting triple line configuration. The improvement of wettability induced by electric current is also related to the additional driving force for wetting provided by the electromagnetic pressure gradient force.     

SURFACE TENSION OF MOLTEN IF STEEL CONTAINING Ti AND ITS INTERFACIAL PROPERTIES WITH SOLID ALUMINA

Surface tension of molten IF steel containing Ti and contact angle between the liquid steel and solid alumina were measured with sessile droplet method under Ar gas atmosphere at 1500, 1575 and 1600℃. The results show that titanium decreases the surface tension of themolten IF steel and the contact angle. The interfacial tension between the molten IF steel containing Ti and solid alumina decreases with increase in titanium content. The work of adhesion between molten IF steel containing Ti and solid alumina decreases slightly at1550~C, but increases at 1600℃ with increasing titanium content. It can be deduced that fine bubbles and fine alumina inclusions are easily entrapped in solidifying interface for IF steel containing Ti.     

Pb-Free solders: Part 1. Wettability testing of Sn−Ag−Cu alloys with Bi additions

Maximum bubble pressure, dilatometric, and meniscographic methods were used in the investigations of the surface tension, density, wetting time, wetting force, contact angle, and interfacial tension of liquid alloys of Sn−Ag−Cu eutectic composition with various additions of Bi. Density and surface tension measurements were conducted in the temperature range 250–900 °C. Surface tensions at 250 °C measured under a protective atmosphere of Ar−H₂ were combined with data from meniscographic studies done under air or with a protective flux. The meniscographic data with a nonwetted teflon substrate provided data on interfacial tension (solder-flux), surface tension in air, and meniscographic data with a Cu substrate allowed determinations of wetting time, wetting force, and calculation of contact angle. The calculated wetting angles from meniscographic studies for binary Sn−Ag eutectic and two ternary Sn−Ag−Cu alloys were verified by separate measurements by the sessile drop method under a protective atmosphere with a Cu substrate. Additions of Bi to both ternary alloys improve the wettability and move the parameters somewhat closer to those of traditional Sn−Pb solders.     

冷金属过渡条件下4043铝合金在不同钢板上的润湿行为

采用激光背光投影技术研究了冷金属过渡条件下4043铝合金分别在Q235钢板和镀锌钢板表面的润湿行为及其与工艺参数的关系,同时分析了镀锌层的作用. 结果表明,铝-Q235钢在CMT条件下的润湿行为与焊接工艺参数中的送丝速度v和点焊时间t密切相关,具体可以表达为:v≤4 m/min时θ(t)=θ₀+2(54-10v)(1-exp[(0.33-3v)t]),v>4 m/min时θ(t)=θ₀+(58-7v)exp[-(1.7-0.15v)t]. 铝-Q235钢、铝-镀锌钢在较大热输入的情况下两者都可以达到较好的润湿性. 锌蒸汽将导致工艺不稳定,主要归结于液-固界面上的锌蒸汽阻隔了熔滴与母材的接触.     

表面毛化对巴氏合金MIG堆焊层界面组织及结合强度的影响

目的 利用MIG焊在表面毛化处理的Q235钢基体上堆焊SnSb11Cu6合金,研究表面毛化作用对界面组织及结合强度的影响.方法 设计毛化形貌分别为直槽和网格槽的毛化形式,槽深分别为0.15、0.3 mm,槽间距分别为1、1.5 mm,采用MIG焊方法在毛化钢基板上堆焊巴氏合金.利用X射线衍射仪分析巴氏合金堆焊层的组织成分.利用金相显微镜、扫描电镜和X射线能谱仪表征巴氏合金堆焊层的界面组织、微观形貌和元素分布.利用电子万能试验机、体视显微镜检测巴氏合金与钢基体间的结合强度以及润湿角.结果 毛化处理虽然会降低巴氏合金与钢基体的浸润性,但是增加了巴氏合金与钢基体间的接触面积;毛化凹槽中嵌合部分巴氏合金,使基体与合金层之间产生机械咬合作用;毛化轮廓边缘的材料易于熔化,从而促进了界面反应.以上因素的共同作用下,巴氏合金与钢基板之间的结合强度由无毛化试样的39.67 MPa提升至毛化试样的50.14 MPa.虽然网格槽毛化试样可以获得比直槽毛化试样更大的接触面积,但增强了毛化轮廓峰对三相线位移产生的钉扎作用,巴氏合金在网格槽毛化基体表面的浸润性更差,使得不同毛化参数试样的结合强度变化不大.结论 通过增加接触面积、生成金属间化合物以及机械咬合等因素共同作用,毛化处理可以有效提升巴氏合金与钢基体之间的结合强度.     

Pb-Free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb Additions

Maximum bubble pressure, dilatometric, and meniscographic methods were used in the investigations of the surface tensions, densities, wetting times, wetting forces, contact angles, and solder-flux interfacial tensions of liquid Sn-Ag-Cu-Bi alloys with various additions of Sb. Density and surface tension measurements were conducted in the temperature range 230 to 900 °C. Surface tensions at 250 °C were measured in air and under a protective atmosphere of Ar-H₂ and were combined with data from meniscographic studies done under air or with a protective flux. Meniscographic data with a nonwetted Teflon substrate provided data on solder-flux interfacial tensions, and meniscographic data with a Cu substrate allowed determinations of wetting times, wetting forces, and calculations of contact angles. Additions of Sb to quaternary Sn-Ag-Cu-Bi alloys improve wettability, move the parameters closer to those of traditional solders, and affirm, as found in previous studies of Bi additions to the Sn-Ag-Cu near-eutectic compositions, that interfacial tensions and contact angles are the two parameters most important as a metric of wettability. However, in contrast to results found in studies of quaternary Sn-Ag-Cu-Bi alloys, the changes in quinary Sn-Ag-Cu-Bi-Sb alloys of interfacial tensions and contact angles do not correlate with decreasing wetting time and increasing wetting force.     

Effect of Trace O Element on High-temperature Wettability Between Ni_3Al Melt and Y_2O_3 Ceramic

Effect of trace O element on the high-temperature wettability between Ni_3Al scrap melt and Y_2O_3 ceramic at 1873 K is investigated. With the increase in O content in Ni_3Al scrap melt from 6 to 21 ppm, the equilibrium contact angle decreases from 93.3° to 88.9°. The initial surface tension and adhesive work of molten Ni_3Al scrap drop from 3153.5 to 807.4 mN m~(-1) and from 2974.6 to 882.2 mN m~(-1), respectively. The average spreading rate increases from 0.03° s~(-1) to 0.17° s~(-1). The whole wetting processes are divided into four periods. The main driving force for spreading in period(1) is the adsorption and diffusion of active atoms around the interface. Trace O content in Ni_3Al scrap has a significant impact on interfacial reactions which mostly take place in the second stage, and can accelerate the spreading process on Y_2O_3 substrate. The reaction products during wetting process are Y_3Al_5O_(12), YAlO_3 and Al_2O_3.