Influence of process steps on the performance of microcrystalline silicon thin film transistors

Bottom gate microcrystalline silicon thin film transistors (μc-Si TFT) have been realized with two types of films: μc-Si(1) and μc-Si(2) with crystalline fraction of 80% and close to 100% respectively. On these TFTs we applied two types of passivation (SiN_x and resist). μc-Si TFTs with resist as a passivation layer present a low leakage current of about 2.10^− 12 A for V_G = − 10 and V_D = 0.1V an ON to OFF current ratio of 10⁶, a threshold voltage of 7 V, a linear mobility of 0.1 cm²/V s, and a sub-threshold voltage of 0.9 V/dec. Microcrystalline silicon TFTs with SiN_x as a passivation present a new phenomenon: a parasitic current for negative gate voltage (− 15 V) causes a bump and changes the shape of the sub-threshold region. This excess current can be explained by and oxygen contamination at the back interface.     

Cadmium oxide, indium oxide and cadmium indate thin films obtained by the sol-gel technique

Thin films of the mixed CdO-In₂O₃ system were deposited on glass substrates by the sol-gel technique. The precursor solution was obtained starting from the mixture of two precursor solutions of CdO and In₂O₃ prepared separately at room temperature. The In atomic concentration percentages (X) in the precursor solution with respect to Cd (1 − X), were: 0, 16, 33, 50, 67, 84 and 100. The films were sintered at two different sintering temperatures (Ts) 450 and 550 °C, and after that, annealed in a 96:4 N₂/H₂ gas mixture at 350 °C. X-ray diffraction patterns showed three types of films, excluding those constituted only of CdO and In₂O₃ crystals: i) For X ≤ 50 at.%, the films were constituted of CdO + CdIn₂O₄ crystals, ii) For X = 67 at.%, the films were only formed of CdIn₂O₄ crystals and iii) For X = 84 at.% the films were constituted of In₂O₃ + CdIn₂O₄ crystals. In all films in the 0 < X < 100 range, the formation CdIn₂O₄ crystals of this material was prioritized with respect to the formation of CdO and In₂O₃ materials. All films showed high optical transmission and an increase of the direct band gap value from 2.4 (for CdO) to 3.6 eV (for In₂O₃), as the X value increases. The resistivity values obtained were in the interval of 8 × 10^− 4 Ω cm to 10⁶ Ω cm. The CdIn₂O₄ films had a resistivity value of 8 × 10^− 3 Ω cm and a band gap value of 3.3 eV.     

A comparison of Ga:ZnO and Ga:ZnO/Ag/Ga:ZnO source/drain electrodes for In–Ga–Zn–O thin film transistors

We compared the characteristics of single Ga:ZnO (GZO) and GZO/Ag/GZO multilayer electrodes for source/drain (S/D) contacts in amorphous In–Ga–Zn–O (a-IGZO)-based thin film transistors (TFTs). Due to the existence of a Ag metallic layer between the GZO layers, the GZO/Ag/GZO multilayer electrode exhibited low sheet resistance (3.95 ohm/sq.) and resistivity (3.32 × 10^?5 ohm-cm). The saturation mobility (10.2 cm² V^?1 s^?1) of the a-IGZO TFT with GZO/Ag/GZO S/D electrodes is much higher than that attained for the a-IGZO TFT with single GZO S/D electrodes (0.7 cm² V^?1 s^?1) due to the lower resistivity of the GZO/Ag/GZO multilayer S/D electrode. Furthermore, it is expected that the high transparency of the GZO/Ag/GZO multilayer will allow for the possible realization of fully transparent a-IGZO TFTs.     

Fabrication of TiO2-based transparent conducting oxide on glass and polyimide substrates

We report on preparation and properties of anatase Nb-doped TiO₂ transparent conducting oxide films on glass and polyimide substrates. Amorphous Ti_0.96Nb_0.04O₂ films were deposited at room temperature by using sputtering, and were then crystallized through annealing under reducing atmosphere. Use of a seed layer substantially improved the crystallinity and resistivity (ρ) of the films. We attained ρ = 9.2 × 10^− 4 Ω cm and transmittance of ~ 70% in the visible region on glass by annealing at 300 °C in vacuum. The minimum ρ of 7.0 × 10^− 4 Ω cm was obtained by 400 °C annealing in pure H₂.     

Thin film passivation of organic light emitting diodes by inductively coupled plasma chemical vapor deposition

The characteristics of an SiN_x passivation layer grown by a specially designed inductively coupled plasma chemical vapor deposition (ICP-CVD) system with straight antennas for the top-emitting organic light emitting diodes (TOLEDs) are investigated. Using a high-density plasma on the order of ∼ 10¹¹ electrons/cm³ formed by nine straight antennas connected in parallel, a high-density SiN_x passivation layer was deposited on a transparent Mg-Ag cathode at a substrate temperature of 40 °C. Even at a low substrate temperature, single SiN_x passivation layer prepared by ICP-CVD showed a low water vapor transmission rate of 5 × 10^− 2 g/m²/day and a transparency of ∼ 85% respectively. In addition, current-voltage-luminescence results of the TOLED passivated by the SiN_x layer indicated that the electrical and optical properties of the TOLED were not affected by the high-density plasma during the SiN_x deposition process.     

High mobility bottom gate nanocrystalline-Si thin-film transistors

We developed high mobility bottom gate nanocrystalline (nc)-Si thin-film transistors (TFTs). nc-Si film was deposited using inductively coupled plasma chemical vapor deposition method on SiN_x gate insulator. Because of good film crystallinity and low ion damage, we could get high performance TFT characteristics. Our TFT showed field effect mobility of 9.4 cm² V^− 1 s^− 1 for electrons. These results showed that bottom gate nc-Si TFT could be used in applications such as next generation high definition television and organic light-emitting diode display.     

Operation model with carrier-density dependent mobility for amorphous In-Ga-Zn-O thin-film transistors

An operation model for an amorphous In-Ga-Zn-O (a-IGZO) based thin film transistor (TFT) is studied. The model is not based on the exponential tail states employed in hydrogenated amorphous Si (a-Si:H) TFT, but on a power function of the carrier density which is observed in the TFT and Hall mobilities of a-IGZO. A 2D numerical simulator employing this model reproduced current-voltage characteristics under on operation of coplanar homojunction a-IGZO TFTs. Although the mathematical expression of the mobility is similar to the field effect mobility of a-Si:H TFT, the present model explains the temperature dependence of the on characteristics of a-IGZO TFT.     

Deposition, characterization and biological application of epitaxial Li:ZnO/Al:ZnO double-layers

Double-layers of lithium doped ZnO (LZO) and aluminum doped ZnO (AZO) are grown on r-cut sapphire (r-Al₂O₃) crystal substrates by pulsed-laser deposition. The epitaxial double-layers are a-axis lattice oriented to the substrate. The LZO/AZO/r-Al₂O₃ samples have high optical transmission in the visible range and a bandgap energy of E_g = 3.28 eV according to the absorption edge of ZnO. The AZO bottom layers are electrically conductive (resistivity at room temperature ρ ~ 10^− 3 Ω cm) and LZO top layers are highly resistive (ρ ≥ 10⁵ Ω cm). Acoustic shear mode resonances in r-Al₂O₃ are excited by employing electric fields to the piezoelectric LZO layer (frequency interval 1.5-3 GHz). For biological applications, Madin-Darby canine kidney cells are cultivated on Platinum coated LZO/AZO/r-Al₂O₃ samples. Osmotic pressure applied to the cells increases or reduces the cell volume depending on the osmolarity of the medium.     

Crystal structure, thermal expansion and electrical properties of a new compound Al0.33DyGe2

A new ternary compound Al_0.33DyGe₂ has been synthesized and studied from 298 K to773 K by means of X-ray powder diffraction technique. The crystal structural refinement of Al_0.33DyGe₂ has been performed by using the Rietveld method. The ternary compound Al_0.33DyGe₂ crystallizes in the orthorhombic of the defect CeNiSi₂-type structure (space group Cmcm, a = 0.41018(2)nm, b = 1.62323(6)nm, c = 0.39463(1)nm, Z = 4 and D_calc = 8.004 g/cm³). The average thermal expansion coefficients α_a, α_b and α_c of Al_0.33DyGe₂ are 1.96 × 10^− 5 K^− 1, 0.93 × 10^− 5 K^− 1 and 1.42 × 10^− 5 K^− 1, respectively. The bulk thermal expansion coefficient α_V is 4.31 × 10^− 5 K^− 1. The resistivity is observed to fall from 387 to 308 µΩ cm between room temperature and 25 K.     

Polycrystalline films of tungsten-doped indium oxide prepared by d.c. magnetron sputtering

Electrical and optical properties of polycrystalline films of W-doped indium oxide (IWO) were investigated. These films were deposited on glass substrate at 300 °C by d.c. magnetron sputtering using ceramic targets. The W-doping in the sputter-deposited indium oxide film effectively increased the carrier density and the mobility and decreased the resistivity. A minimum resistivity of 1.8 × 10^− 4 Ω cm was obtained at 3.3 at.% W-doping using the In₂O₃ ceramic targets containing 7.0 wt.% WO₃. The 2.2 at.% W-doped films obtained from the targets containing 5.0 wt.% WO₃, showed the high Hall mobility of 73 cm² V^− 1 s^− 1 and relatively low carrier density of 2.9 × 10²⁰ cm^− 3. Such properties resulted in novel characteristics of both low resistivity (3.0 × 10^− 4 Ω cm) and high transmittance in the near-infrared region.     

Properties of indium tin oxide films deposited on unheated polymer substrates by ion beam assisted deposition

The optical, electrical and mechanical properties of indium tin oxide (ITO) films prepared on polyethylene terephthalate (PET) substrates by ion beam assisted deposition at room temperature were investigated. The properties of ITO films can be improved by introducing a buffer layer of silicon dioxide (SiO₂) between the ITO film and the PET substrate. ITO films deposited on SiO₂-coated PET have better crystallinity, lower electrical resistivity, and improved resistance stability under bending than those deposited on bare PET. The average transmittance and the resistivity of ITO films deposited on SiO₂-coated PET are 85% and 0.90 × 10^− 3 Ω cm, respectively, and when the films are bent, the resistance remains almost constant until a bending radius of 1 cm and it increases slowly under a given bending radius with an increase of the bending cycles. The improved resistance stability of ITO films deposited on SiO₂-coated PET is mainly attributed to the perfect adhesion of ITO films induced by the SiO₂ buffer layer.     

AC plasma induced modifications in β-In2S3 thin films prepared by spray pyrolysis

β-In₂S₃ thin films, deposited by spray pyrolysis, were treated in N₂ and air plasmas at 240 and 400 Pa. X-ray diffraction, SEM, and EDS analysis, and optical and electrical studies have been used to characterize the as-prepared and plasma treated thin films. The post-deposition plasma treatments affect the morphology and the optoelectronic properties of the In₂S₃ thin films. The In₂S₃ thin films treated with N₂ plasma at 240 Pa showed an optical band gap, E_g, of 2.16 eV and an electrical conductivity of 2 × 10^− 2 (Ω cm)^− 1.     

Dependence of efficiency of thin-film CdS/CdTe solar cell on parameters of absorber layer and barrier structure

Dependences of the open-circuit voltage, short-circuit current, fill factor, and efficiency of a CdS/CdTe solar cell on the resistivity and thickness of the p-CdTe absorber layer, the noncompensated acceptor concentration N_a-N_d, and carrier lifetime τ in CdTe, are investigated, and optimization of these parameters in order to improve the solar cell efficiency is performed. It has been shown that the observed low efficiency of CdS/CdTe solar cells is caused by the too short electron lifetime in the range of 10^− 10-10^− 9 s and too thin (3-5 µm) CdTe layer currently used for fabrication of CdTe/CdS solar cells. To achieve an efficiency of 28-30%, the resistivity and thickness of the CdTe absorber layer, the noncompensated acceptor concentration, and carrier lifetime should be ∼ 0.1 Ω·cm, ≥ 20-30 µm, ≥ 10¹⁶ cm^− 3, and ≥ 10^− 6 s, respectively.     

Structural, electrical, and optical properties of copper indium diselenide thin film prepared by thermal evaporation method

Stoichiometric compound of copper indium diselenide (CuInSe₂) was synthesized by direct reaction of high-purity elemental copper, indium and selenium in an evacuated quartz ampoule. The phase structure and composition of the synthesized pulverized material analyzed by X-ray diffraction (XRD) and energy dispersive analysis of X-rays (EDAX) revealed the chalcopyrite structure and stoichiometry of elements. Thin films of CuInSe₂ were deposited onto organically cleaned soda lime glass substrates held at different temperatures (i.e. 300 K to 573 K) using thermal evaporation technique. CuInSe₂ thin films were then thermally annealed in a vacuum chamber at 573 K at a base pressure of 10^− 2 mbar for 1 h. The effect of substrate temperature (T_s) and thermal annealing (T_a) on structural, compositional, morphological, optical and electrical properties of films were investigated using XRD, transmission electron microscopy, EDAX, atomic force microscopy (AFM), optical transmission measurements and Hall effect techniques. XRD and EDAX studies of CuInSe₂ thin films revealed that the films deposited in the substrate temperature range of 423-573 K have preferred orientation of grains along the (112) plane and near stoichiometric composition. AFM analysis indicates that the grain size increases with increase of T_s and T_a. Optical and electrical characterizations of films suggest that CuInSe₂ thin films have high absorption coefficient (10⁴ cm^− 1) and resistivity value in the interval 10^− 2-10¹ Ω cm influenced by T_s and T_a.     

Improved performance of fluorinated copper phthalocyanine thin film transistors using an organic pn junction: Effect of copper phthalocyanine film thickness

We have investigated the effect of film thickness of copper phthalocyanine (CuPc) on improving fluorinated copper phthalocyanine (F₁₆CuPc) thin film transistor (TFT) performance with an organic pn junction. Electron field-effect mobility is exponentially enhanced up to 2.0 × 10^− 2 cm² V^− 1 s^− 1 with increasing of CuPc film thickness, and then unchanged when the CuPc thickness is over the saturation thickness (3 monolayers). The charge carrier density at the interface of F₁₆CuPc/CuPc decreases the total TFT resistance, which leads to the increase of mobility. Threshold voltage is suppressed with increasing CuPc films. On the other hand, larger current on/off ratio is obtained when islanded CuPc films are formed on the surface of F₁₆CuPc films. Therefore, employing an organic pn junction is an effective and simple method to fabricate high performance of n-channel transistors for practical applications.     

Post deposition annealing temperature effect on silicon quantum dots embedded in silicon nitride dielectric multilayer prepared by hot-wire chemical vapor deposition

The preparations of the 20-period of a Si quantum dot (QD)/SiN_x multilayer in a hot-wire chemical vapor deposition (HWCVD) chamber is presented in this paper. The changes in the properties of Si-QDs after the post deposition annealing treatment are studied in detail. Alternate a-Si:H and SiN_x layers are grown in a single SiN_x deposition chamber by cracking SiH₄, and SiH₄ + NH₃, respectively at 250 °C. The as-deposited samples are annealed in the temperature range of 800 °C to 950 °C to grow Si-QDs. All the samples are characterized by confocal micro Raman, transmission electron microscope (TEM), and photoluminescence (PL) to study the changes in the film structures after the annealing treatment. The micro Raman analysis of the samples shows the frequency line shifting from 482 cm^− 1 to 500 cm^− 1 indicating the Si transition from an amorphous to a crystalline phase. The TEM micrograph inspection indicates the formation of Si-QDs of size 3 to 5 nm and a density of 5 × 10¹²/cm². The high resolution TEM micrographs show an agglomeration of Si-QDs with an increase in the annealing temperature. The PL spectra show a peak shifting from 459 nm to 532 nm with increasing the annealing temperature of the film.     

Synthesis of ZnTe nanowires onto TiO2 nanotubular arrays by pulse-reverse electrodeposition

Growth of ZnTe nanowires using a pulse-reverse electrodeposition technique from a non-aqueous solution is reported. ZnTe nanowires were grown on to an ordered nanotubular TiO₂ template in a propylene carbonate solution at 130 °C inside a controlled atmosphere glove box. The pulse-reverse electro deposition process consisted of a cathodic pulse at − 0.62 V and an anodic pulse at 0.75 V Vs Zn²⁺/Zn. Stoichiometry growth of crystalline ZnTe nanowires was observed in the as-deposited condition. The anodic pulse cycle of the pulse-reverse electrodeposition process presumably introduced zinc vacancies as deep level acceptors at an energy level of E_v + 0.47 eV. The resultant ZnTe nanowires showed p-type semiconductivity with a resistivity of 7.8 × 10⁴ Ω cm and a charge carrier density of 1.67 × 10¹⁴ cm^− 3. Annihilation of the defects occurred upon thermal annealing that resulted in marginal decrease in the defect density.     

Structural, electrical and optical properties of zirconium-doped zinc oxide films prepared by radio frequency magnetron sputtering

Transparent and conducting zirconium-doped zinc oxide films have been prepared by radio frequency magnetron sputtering at room temperature. The ZrO₂ content in the target is varied from 0 to 10 wt.%. The films are polycrystalline with a hexagonal structure and a preferred orientation along the c axis. As the ZrO₂ content increases, the crystallinity and conductivity of the film are initially improved and then both show deterioration. Zr atoms mainly substitute Zn atoms when the ZrO₂ content are 3 and 5 wt.%, but tend to cluster into grain boundaries at higher contents. The lowest resistivity achieved is 2.07 × 10^− 3 Ω cm with the ZrO₂ content of 5 wt.% with a Hall mobility of 16 cm² V^− 1 s^− 1 and a carrier concentration of 1.95 × 10²⁰ cm^− 3. All the films present a high transmittance of above 90% in the visible range. The optical band gap depends on the carrier concentration, and the value is larger at higher carrier concentration.     

Temperature dependence of the microstructure and resistivity of indium zinc oxide films deposited by direct current magnetron reactive sputtering

Indium zinc oxide (IZO) films were deposited as a function of the deposition temperature using a sintered indium zinc oxide target (In₂O₃:ZnO = 90:10 wt.%) by direct current (DC) magnetron reactive sputtering method. The influence of the substrate temperature on the microstructure, surface roughness and electrical properties was studied. With increasing the temperature up to 200 °C, the characteristic properties of amorphous IZO films were improved and the specific resistivity was about 3.4 × 10^− 4 Ω cm. Change of structural properties according to the deposition temperature was also observed with X-ray diffraction patterns, transmission electron microscopy, X-ray photoelectron spectroscopy, and atomic force microscopy. IZO films deposited above 300 °C showed polycrystalline phases evolved on the amorphous IZO layer. Very flat surface roughness could be obtained at lower than 200 °C of the substrate temperature, while surface roughness of the films was increased due to the formation of grains over 300 °C. Consequently, high quality IZO films could be prepared by DC magnetron sputtering with O₂/Ar of 0.03 and deposition temperature in range of 150-200 °C; a specific resistivity of 3.4 × 10^− 4 Ω cm, and the values of peak to valley roughness and root-mean-square roughness are less than 4 nm and 0.5 nm, respectively.     

Electrical and optical properties of Al-doped ZnO films deposited by hollow cathode gas flow sputtering

Al-doped ZnO (AZO) films were deposited on glass by hollow cathode gas flow sputtering using Zn-Al alloy targets. Sputtering power for all the depositions was fixed at 1500 W. Resistivities of 0.81-1.1 × 10^− 3 Ω cm were obtained for AZO films deposited at room temperature with an O₂ flow from 38 to 50 standard cubic centimetre/minute (SCCM), while static deposition rates were almost constant at 270-300 nm/min. On the other hand, lower resistivities of 5.2-6.4 × 10^− 4 Ω cm were obtained for AZO films deposited at 200 °C with an O₂ flow from 25 to 50 SCCM, while the static deposition rates were almost constant at 200-220 nm/min. Average transmittances in the visible light region were above 80% for both sets of films.