Thin films of In2O3 by atomic layer deposition using In(acac)3

Thin films of indium oxide have been deposited using the atomic layer deposition (ALD) technique using In(acac)₃ (acac = acetylacetonate, pentane-2,4-dione) and either H₂O or O₃ as precursors. Successful growth using In(acac)₃ is contradictory to what has been reported previously in the literature [J.W. Elam, A.B.F. Martinson, M.J. Pellin, J.T. Hupp, Chem. Mater. 18 (2006) 3571.]. Investigation of the dependence of temperature on the deposition shows windows where the growth rates are relatively unaffected by temperature in the ranges 165–200 °C for In(acac)₃ and H₂O, 165–225 °C for In(acac)₃ and O₃. The growth rates obtained are of the order 20 pm/cycle for In(acac)₃ and H₂O, 12 pm/cycle for In(acac)₃.     

Atomic layer deposition of iron(III) oxide on zirconia nanoparticles in a fluidized bed reactor using ferrocene and oxygen

Conformal films of amorphous iron(III) oxide and α-Fe₂O₃ have been coated on zirconia nanoparticles (26 nm) in a fluidized bed reactor by atomic layer deposition. Ferrocene and oxygen were alternately dosed into the reactor at temperatures between 367 °C and 534 °C. Self-limiting chemistry was observed via in situ mass spectrometry, and by means of induced coupled plasma-atomic emission spectroscopy analysis. Film conformality and uniformity were verified by high resolution transmission electron microscopy, and the growth rate was determined to be 0.15 Å per cycle. Energy dispersive spectroscopy, X-ray diffractometry, and X-ray photoelectron spectroscopy were utilized as a means to determine film composition at each deposition temperature. Over all of the deposition temperatures investigated, films were deposited as amorphous iron(III) oxide. However, after heat treatment at 850 °C in air and N₂ atmospheres, α-Fe₂O₃ was the predominant species.     

Surface poisoning in the nucleation and growth of palladium atomic layer deposition with Pd(hfac)2 and formalin

Palladium (Pd) atomic layer deposition (ALD) can be performed with Pd(hfac)₂ (hfac = hexafluoroacetyl-acetone) and formalin as the reactants. For Pd ALD on oxide surfaces, the nucleation of Pd ALD has been observed to require between 20 and 100 ALD cycles. To understand the long nucleation periods, this study explored the surface reactions occurring during Pd ALD nucleation and growth on hydroxylated Al₂O₃ substrates. In situ Fourier transform infrared (FTIR) spectroscopy on high surface area nanopowders was used to observe the surface species. The adsorption of Pd(hfac)₂ on hydroxylated Al₂O₃ substrates was found to yield both Pd(hfac)* and Al(hfac)* surface species. The identity of the Al(hfac)* species was confirmed by separate FTIR studies of hfacH adsorption on the hydroxylated Al₂O₃ substrates. Isothermal loss of the Al(hfac)* species revealed second-order kinetics at 448-523 K with an activation barrier of E_d = 39.4 kcal/mol. The lack of correlation between Al(hfac)* and AlOH* species during the loss of Al(hfac)* species suggested that the Al(hfac)* species may desorb as Al(hfac)₃. After Pd(hfac)₂ exposure and the subsequent formalin exposure on hydroxylated Al₂O₃ substrates, only hfac ligands from Pd(hfac)* species were removed from the surface. In addition, the formalin exposure added formate species. The Al(hfac)* species was identified as the cause of the long nucleation period because Al(hfac)* behaves as a site blocker. The surface poisoning by Al(hfac)* species was corroborated by adsorbing hfacH prior to the Pd(hfac)₂ exposures. The amount of Pd(hfac)* species after Pd(hfac)₂ exposures decreased progressively versus the previous hfacH exposure. Pd ALD occurred gradually during the subsequent Pd ALD cycles as the Al(hfac)* species were slowly removed from the Al₂O₃ surface. Ex situ transmission electron microscopy analysis revealed Pd nanoclusters that grew in size and dispersion with increasing number of Pd ALD cycles. These nanoclusters eventually coalesced to form a continuous Pd ALD film. Surface poisoning by the hfac ligands may help to explain the nucleation difficulties for metal ALD on oxide substrates using β-diketonate reactants.     

Atomic layer deposition of palladium films on Al2O3 surfaces

We examined the atomic layer deposition (ALD) of Pd films using sequential exposures of Pd(II) hexafluoroacetylacetonate (Pd(hfac)₂) and formalin and discovered that formalin enables the efficient nucleation of Pd ALD on Al₂O₃. In situ quartz crystal microbalance measurements revealed that the Pd nucleation is hampered by the relatively slow reaction of the adsorbed Pd(hfac)₂ species, but is accelerated using larger initial Pd(hfac)₂ and formalin exposures. Pd nucleation proceeds via coalescence of islands and leaves hfac contamination at the Al₂O₃ interface. Pd films were deposited on the thermal oxide of silicon, glass and mesoporous anodic alumina following the ALD of a thin Al₂O₃ seed layer and analyzed using a variety of techniques. We measured a Pd ALD growth rate of 0.2 Å/cycle following a nucleation period of slower growth. The deposited films are cubic Pd with a roughness of 4.2 nm and a resistivity of 11 μΩ cm at 42 nm thickness. Using this method, Pd deposits conformally on the inside of mesoporous anodic alumina membranes with aspect ratio ∼1500 yielding promising hydrogen sensors.     

Atomic layer deposition of Ru thin film using N2/H2 plasma as a reactant

Ruthenium (Ru) thin films were grown by atomic layer deposition using IMBCHRu [(η6-1-Isopropyl-4-MethylBenzene)(η4-CycloHexa-1,3-diene)Ruthenium(0)] as a precursor and a nitrogen-hydrogen mixture (N₂/H₂) plasma as a reactant, at the substrate temperature of 270 °C. In the wide range of the ratios of N₂ and total gas flow rates (fN₂/N₂ + H₂) from 0.12 to 0.70, pure Ru films with negligible nitrogen incorporation of 0.5 at.% were obtained, with resistivities ranging from ~ 20 to ~ 30 μΩ cm. A growth rate of 0.057 nm/cycle and negligible incubation cycle for the growth on SiO₂ was observed, indicating the fast nucleation of Ru. The Ru films formed polycrystalline and columnar grain structures with a hexagonal-close-packed phase. Its resistivity was dependent on the crystallinity, which could be controlled by varying the deposition parameters such as plasma power and pulsing time. Cu was electroplated on a 10-nm-thick Ru film. Interestingly, it was found that the nitrogen could be incorporated into Ru at a higher reactant gas ratio of 0.86. The N-incorporated Ru film (~ 20 at.% of N) formed a nanocrystalline and non-columnar grain structure with the resistivity of ~ 340 μΩ cm.     

Fluorescent tags to visualize defects in Al2O3 thin films grown using atomic layer deposition

Defects and cracks in thin film barriers that are coated on polymers allow the leakage of reactive species through the polymer substrate. Fluorescent tags have been developed to visualize defects and cracks in thin film barriers and to inspect rapidly the barrier quality with minimal sample preparation. For Al₂O₃ films with a thickness of 25 nm deposited on polyethylene naphthalate polymer substrates using atomic layer deposition techniques, the fluorescent tags have identified cracks ~ 20 nm in width after applied strain and have observed individual defects as small as ~ 200 nm in diameter.     

Thermal properties of TiO2 films grown by atomic layer deposition

We study the thermal properties of amorphous TiO₂ thin films of various thicknesses t, grown by atomic layer deposition. The thermo-optic coefficient dn/dT and the temperature coefficient dρ/dT of film density ρ are determined from ellipsometric data in wavelength range 380 < λ < 1800 nm with the Cauchy model and the Lorentz-Lorenz relation. It is found that dn/dT exhibits negative values for films with t < 150 nm and positive values for thicker films, while no significant changes in the two coefficients take place if t < 200 nm. A qualitative physical explanation based on porosity of the thin films is suggested. Films with t = 60 nm are illustrated in detail at λ = 640 nm: the room-temperature values of the coefficients are found to be dn/dT = − 3.1 × 10^− 5 °C^− 1 and dρ/dT = − 4.8 × 10^− 5g cm^− 3° C^− 1.     

Characteristics and applications of plasma enhanced-atomic layer deposition

Atomic layer deposition (ALD) is expected to play an important role in future device fabrication due to various benefits, such as atomic level thickness control and excellent conformality. Plasma enhanced ALD (PE-ALD) allows deposition at significantly lower temperatures with better film properties compared to that of conventional thermal ALD. In addition, since ALD is a surface-sensitive deposition technique, surface modification through plasma exposure can be used to alter nucleation and adhesion. In this paper, characteristics of PE-ALD for various applications in semiconductor fabrication are presented through comparison to thermal ALD. The results indicate that the PE-ALD processes are versatile methods to enable nanoscale manufacturing in emerging applications.     

Atomic layer deposition of ZnS via in situ production of H2S

Atomic layer deposition (ALD) of ZnS films utilizing diethylzinc and in situ generated H₂S was performed over a temperature range of 60 °C-400 °C. This method for generating H₂S in situ was developed to eliminate the need to store high pressure H₂S gas. The H₂S precursor was generated by heating thioacetamide to 150 °C in an inert atmosphere, producing acetonitrile and H₂S as confirmed with mass spectroscopy. ALD behavior was confirmed by investigation of growth behavior and saturation curves. The properties of the films were studied with X-ray diffraction, transmission electron microscopy, ellipsometry, atomic force microscopy, scanning electron microscopy, ultraviolet-visible spectroscopy, and X-ray photoelectron spectroscopy. The results show a growth rate that monotonically decreases with temperature, and films that are stoichiometric in Zn and S. The root mean square roughness of the films increases with temperature above 100 °C. A change in crystal phase begins at ∼ 300 °C. The band gap is dependent on the crystal phase and is estimated to be 3.6-4 eV.     

Atomic layer deposition grown composite dielectric oxides and ZnO for transparent electronic applications

In this paper, we report on transparent transistor obtained using laminar structure of two high-k dielectric oxides (hafnium dioxide, HfO₂ and aluminum oxide, Al₂O₃) and zinc oxide (ZnO) layer grown at low temperature (60 °C-100 °C) using Atomic Layer Deposition (ALD) technology. Our research was focused on the optimization of technological parameters for composite layers Al₂O₃/HfO₂/Al₂O₃ for thin film transistor structures with ZnO as a channel and a gate layer. We elaborate on the ALD growth of these oxides, finding that the 100 nm thick layers of HfO₂ and Al₂O₃ exhibit fine surface flatness and required amorphous microstructure. Growth parameters are optimized for the monolayer growth mode and maximum smoothness required for gating.     

Growth and characterization of epitaxial anatase TiO2(001) on SrTiO3-buffered Si(001) using atomic layer deposition

Epitaxial anatase titanium dioxide (TiO₂) films have been grown by atomic layer deposition (ALD) on Si(001) substrates using a strontium titanate (STO) buffer layer grown by molecular beam epitaxy (MBE) to serve as a surface template. The growth of TiO₂ was achieved using titanium isopropoxide and water as the co-reactants at a substrate temperature of 225-250 °C. To preserve the quality of the MBE-grown STO, the samples were transferred in-situ from the MBE chamber to the ALD chamber. After ALD growth, the samples were annealed in-situ at 600 °C in vacuum (10^− 7 Pa) for 1-2 h. Reflection high-energy electron diffraction was performed during the MBE growth of STO on Si(001), as well as after deposition of TiO₂ by ALD. The ALD films were shown to be highly ordered with the substrate. At least four unit cells of STO must be present to create a stable template on the Si(001) substrate for epitaxial anatase TiO₂ growth. X-ray diffraction revealed that the TiO₂ films were anatase with only the (004) reflection present at 2θ = 38.2°, indicating that the c-axis is slightly reduced from that of anatase powder (2θ = 37.9°). Anatase TiO₂ films up to 100 nm thick have been grown that remain highly ordered in the (001) direction on STO-buffered Si(001) substrates.     

DC sputter deposition of amorphous indium-gallium-zinc-oxide (a-IGZO) films with H2O introduction

Amorphous indium-gallium-zinc-oxide (a-IGZO) films were deposited by dc magnetron sputtering with H₂O introduction and how the H₂O partial pressure (P_H2O) during the deposition affects the electrical properties of the films was investigated in detail. Resistivity of the a-IGZO films increased dramatically to over 2 × 10⁵ Ωcm with increasing P_H2O to 2.7 × 10^− 2 Pa while the hydrogen concentration in the films increased to 2.0 × 10²¹ cm^− 3. TFTs using a-IGZO channels deposited under P_H2O at 1.6-8.6 × 10^− 2 Pa exhibited a field-effect mobility of 1.4-3.0 cm²/Vs, subthreshold swing of 1.0-1.6 V/decade and on-off current ratio of 3.9 × 10⁷-1.0 × 10⁸.     

Temperature dependence of SiO2 film growth with plasma-enhanced atomic layer deposition

The growth per cycle (GPC) temperature dependence was investigated for SiO₂ films prepared by plasma-enhanced atomic layer deposition (PEALD). During preparation of PEALD-SiO₂ using bis-diethyl-amino-silane, the GPC was saturated via increasing the precursor dose time and flow rate. The saturated GPC decreased with increasing deposition temperature. GPC saturation curves as a function of precursor dose time were analyzed by a two-step adsorption model, where the amino-silane reversibly adsorbed (physisorption) during the first step, and then irreversibly adsorbed (chemisorption) on the SiO₂ surface upon reaction with surface OH absorbents. This model is in good quantitative agreement with the saturation curve. The GPC value was determined by the surface reaction of amino-silane with OH sites, whose surface density was decreased by increasing the deposition temperature. The GPC saturation became slower with increasing deposition temperature, because the desorption rate of the physisorbed precursor increased with increasing temperature.     

Effect of deposition temperature on the properties of CeO2 films grown by atomic layer deposition

Cerium oxide dielectric thin films have been grown on n-type silicon by atomic layer deposition using a monomeric homoleptic Ce^IV alkoxide precursor with water vapour. Herein we report the dielectric properties of CeO₂ films deposited from tetrakis(1-methoxy-2-methyl-2-propanolate)cerium. The resulting films exhibit permittivities in the range 25-42 at 1 MHz with a strong dependency on the deposition temperature. The microstructural origin of this behaviour has been investigated. The as-deposited films were found to be crystalline and they exhibited the cubic fluorite structure for deposition temperatures in the range 150 °C to 350 °C. Variations in the crystallite sizes are governed by the deposition temperature and have been estimated using a Debye-Scherrer analysis of the X-ray diffraction patterns. The changing crystallite size correlates with changes seen in the triply-degenerate F_2g first-order Raman line half-width at 465 cm^− 1. It is concluded that the frequency dependency of the film dielectric properties is strongly influenced by the crystallite size which in turn is governed by the growth temperature.     

Atomic layer deposition of SiO2 from Tris(dimethylamino)silane and ozone by using temperature-controlled water vapor treatment

Atomic layer deposition of SiO₂ from tris(dimethylamino)silane (TDMAS) and ozone as precursors on Si(100) surfaces at near-room temperatures was studied by infrared absorption spectroscopy with a multiple internal reflection geometry. TDMAS can be adsorbed at OH sites on hydroxylated Si surfaces at room temperature. Ozone oxidation of the TDMAS-treated Si surface is effective in removing hydroaminocarbon adsorbates introduced during TDMAS adsorption at room temperature. After oxidation by ozone, treatment with H₂O vapor at a substrate temperature of around 160 °C causes regeneration of OH sites for TDMAS adsorption. Cycles involving TDMAS adsorption and ozonization at room temperature followed by H₂O treatment at 160 °C permit the buildup of layers of SiO₂. The amount of residual hydroaminocarbon at the interface between the growing SiO₂ film and the substrate can be reduced with the ozone treated Si surface as a starting surface.     

Influence of Si(1 0 0) surface pretreatment on the morphology of TiO2 films grown by atomic layer deposition

The effect of water plasma treatment of both hydrophobic and hydrophilic Si(1 0 0) surfaces has been studied using infrared spectroscopy to monitor the various surface species present. Exposure to a water plasma results in a significant increase in the concentration of H-bonded hydroxyls and hydrides. Both atomic force microscopy (AFM) and cross-sectional transmission electron microscopy (XTEM) of TiO₂ films deposited by atomic layer deposition at 300 °C, show that the morphology of the films is dependent on the nature of the initial surface. XTEM of the early stages of growth showed that coatings on hydrophilic substrates deposited as initially amorphous and continuous films, which crystallised with further growth. However, the hydrophobic substrate produced island growth of small, crystalline grains. AFM images of 23-nm thick films showed that films deposited on hydrophobic and hydrophilic Si consisted of 35–100 and 150–350 nm crystallites, respectively. A film on water plasma treated Si, closely resembled that on the hydrophilic surface, indicating that hydroxyl groups are responsible for directing the film growth.     

Atomic layer deposition of Ru films from bis(2,5-dimethylpyrrolyl)ruthenium and oxygen

Ru thin films were grown on hydrogen terminated Si, SiO₂, Al₂O₃, HfO₂, and TiO₂ surfaces by atomic layer deposition from bis(2,5-dimethylpyrrolyl)ruthenium precursor and oxygen. The 4-20 nm thick films on these surfaces consisted of nanocrystalline hexagonal metallic ruthenium, regardless of the deposition temperature. At the lowest temperatures examined, 250-255 °C, the growth of the Ru films was favored on silicon, compared to the growth on Al₂O₃, TiO₂ and HfO₂. At higher temperatures the nucleation and growth of Ru became enhanced in particular on HfO₂, compared to the process on silicon. At 320-325 °C, no growth occurred on Si-H and SiO₂-covered silicon. Resistivity values down to 18 μΩ·cm were obtained for ca. 10 nm thick Ru films.     

Blue-shifted stimulated emission from ZnO films deposited on SiO2 by atomic layer deposition

ZnO films were prepared by atomic layer deposition upon a SiO₂ layer on a Si substrate and treated by rapid thermal annealing. The optically-pumped random lasing actions with low threshold values were observed in the ZnO films on SiO₂/Si substrates. With the decrease in ZnO film thickness or the increase in post-annealing duration, the stimulated emission shifted toward the shorter wavelength and the lasing threshold increased. The results can be attributed to the inter-diffusion between ZnO and SiO₂, which causes the modification of bandgap renormalization in ZnO.     

The uniformity of Al distribution in aluminum-doped zinc oxide films grown by atomic layer deposition

We investigated the aluminum distribution in aluminum-doped zinc oxide films grown by atomic layer deposition. Surface morphology, structure, composition and electrical properties of obtained films were studied. For the aluminum content less than 2 at.%, a periodicity of Al distribution along the layer depth was observed. This periodicity diminished significantly after annealing the samples in nitrogen atmosphere at 300 °C. For the Al content higher than 2 at.%, its distribution in ZnO:Al films was uniform within the depth measurement accuracy of ∼5-10 nm.     

Initial reaction mechanism of H-passivated Ge surface passivation by atomic layer deposition of Al2O3 and AlN

The authors investigated the surface passivation mechanisms of H-terminated Ge(100)(2 × 1) by atomic layer deposition of Al₂O₃, AlN through first-principles calculation method. The formation of initial Al₂O₃ and AlN passivation layer on Ge surface is investigated at atomic scale and the corresponding reaction pathways for both the reaction are also presented. The reaction barrier heights of H₂O and NH₃ half reaction are 0.53 eV/mol and 0.51 eV/mol higher than that of Al(CH₃)₃ half reaction, respectively which indicates that the overall passivation processes of the both reactions are limited by the second half reaction. Moreover, the chemisorption state and product state of the NH₃ half reaction are found to be in the same energy level, and it is possible that the second half reaction of AlN will be trapped in a chemisorption state.