电解锰渣制备多孔陶瓷及性能表征

以电解锰渣、废玻璃和偏高岭土为原料,锯末为造孔剂制备出多孔陶瓷,研究了烧结温度、保温时间对多孔陶瓷体积密度、抗压强度、气孔率的影响;用XRD分析多孔陶瓷的物相组成,SEM-EDS分析多孔陶瓷的微观结构,导热系数仪测试多孔陶瓷的导热系数。实验结果表明:烧结温度为1020℃,保温时间为45 min时多孔陶瓷的综合性能最佳,体积密度为600kg/m~3,抗压强度为3.9 MPa,气孔率为77.2%,导热系数为0.052 W/(m·K),可用于外墙保温材料。     

粉煤灰合成钙长石多孔陶瓷的结构与性能

以高钙粉煤灰为主要原料,通过添加造孔剂,采用高温固相烧结法合成出钙长石多孔陶瓷。考察了烧成制度和造孔剂含量对多孔陶瓷显气孔率及抗折强度的影响。利用X射线衍射仪和扫描电子显微镜表征了多孔陶瓷的物相组成和微观结构。结果表明:提高烧成温度和延长保温时间会降低多孔陶瓷的显气孔率,增强其抗折强度;增加造孔剂含量会导致显气孔率升高,但过量添加反而造成显气孔率下降。当烧成温度为1 140℃、保温时间为90 min、造孔剂含量为35%(质量分数)时,多孔陶瓷具有较高的显气孔率和抗折强度(分别达到58.05%和9.41 MPa)。多孔陶瓷的主晶相为钙长石,孔径分布为数微米到150μm。     

SiC/莫来石复相多孔陶瓷气孔率和强度的影响因素

以煅烧高岭土、Al(OH)3粉末、SiC粉末为主要原料,以石墨为造孔剂制备了SiC/莫来石复相多孔陶瓷,研究了造孔剂含量、碳化硅颗粒粒径以及烧结温度对SiC/莫来石复相多孔陶瓷抗弯强度和气孔率的影响,并分别用XRD和SEM分析晶相组成和断面显微结构.结果表明:当SiC粒径为60 μm,造孔剂含量为15％时,在1400℃下保温3h制备的样品综合性能最佳,其孔隙率为30.3％,抗折强度达到58.0 MPa.     

造孔剂和增强剂对工业固废基多孔陶瓷性能的影响

以镁渣,粉煤灰为原料,添加造孔剂(电石渣、碳粉)和增强剂(高岭土、膨润土)制备多孔陶瓷,并研究造孔剂和增强剂种类和含量对多孔陶瓷性能的影响.结果表明,添加造孔剂后,多孔陶瓷的烧失率、吸水率和气孔率升高,体积密度和强度降低.同等含量时,碳粉具有较好的造孔效果;多孔陶瓷的烧失率、吸水率和气孔率最高可分别达到30％,38％和53％,体积密度最小达到1.4 g/cm3;添加增强剂后,多孔陶瓷的强度大为提高,但其吸水率、气孔率降低,体积密度增加.高岭土的含量不大于10％时,其粘结增强效果明显优于同等含量膨润土的;多孔陶瓷的压缩强度可至28 MPa.     

淀粉为造孔剂制备碳化硅多孔陶瓷

以微米碳化硅基体,氧化铝和氧化钇为烧结助剂,淀粉为造孔剂,采用无压烧结技术制备碳化硅多孔陶瓷.通过测试合成多孔陶瓷的密度、收缩率、力学强度以及扫描电子显微镜(SEM)和X-射线衍射(XRD)等研究了不同造孔剂含量对SiC粉体的力学性能、微观形貌和物相的影响.研究表明:随造孔剂含量的升高,碳化硅陶瓷密度和强度降低,气孔率增加,而造孔剂含量对碳化硅陶瓷的物相组成基本没有影响.     

碳化硅/堇青石复相多孔陶瓷的制备及性能研究

采用碳化硅、烧高岭土、氢氧化铝、滑石为主要原料,石墨为造孔剂制备了碳化硅/堇青石复相多孔陶瓷.研究了烧结温度和烧结助剂二氧化铈对碳化硅/堇青石复相多孔陶瓷气孔率和强度的影响,并分别用XRD和SEM分析晶相组成和断面显微结构表明:制备出的SiC多孔陶瓷的主相是SiC,结合相是堇青石与方石英,多孔陶瓷具有相互连通的开孔结构;在1350℃烧结,并保温3h,当造孔剂含量为15％时,碳化硅/堇青石复合多孔陶瓷性能最佳,其气孔率31.80％,相应的弯曲强度为63.74 MPa.在1200℃下,添加不同含量的CeO2,对烧结样品的相组成有影响,能够降低生成堇青石的温度,在CeO2含量为3％的样品中,堇青石的峰最明显,但是过量的氧化铈会抑制了堇青石的生成;随着CeO2加入量的增加,其气孔率和弯曲强度也会随之变化,1200℃下,在CeO2加入量为4％时其弯曲强度最优.但随着CeO2的含量的增加,其气孔率逐渐下降.     

不同铝源对SiC/堇青石复相多孔陶瓷的制备及性能影响

以碳化硅、氮化铝、层析氧化铝、氢氧化铝、氟化铝、滑石为主要原料,石墨为造孔剂通过原位反应烧结技术制备碳化硅/堇青石复相多孔陶瓷.研究了含铝化合物种类、烧结温度、石墨含量对SiC/堇青石复相多孔陶瓷相组成、微观结构、气孔率和抗折强度的影响,同时对S0组在1200℃烧结温度下制得的SiC/堇青石复合多孔陶瓷的孔径分布进行了测试分析.结果表明:以AlN为铝源在1200℃下烧结,石墨含量在15％时,堇青石结合SiC多孔陶瓷的抗弯强度和气孔率两项综合性能达到最优,气孔率为31.99％,相应的弯曲强度86.20 MPa.S0组的平均孔径大小在3.0191 μm.     

造孔剂种类及含量对高孔隙率多孔陶瓷性能的影响

本文以碳粉和淀粉为造孔剂制备高孔隙率多孔陶瓷,研究了造孔剂的种类和含量对多孔陶瓷气孔率、体积密度和力学性能的影响。结果表明:碳粉和淀粉造孔剂含量分别小于37.5%和25%时,多孔陶瓷形态结构完整,无破损。随着两种造孔剂含量增加,多孔陶瓷气孔率均呈增长趋势,体积密度和抗弯强度相应降低。当造孔剂的含量相同时,该体系中淀粉造孔剂的造孔效果优于碳粉造孔剂,其多孔陶瓷孔隙率最高可达33%、体积密度为1.7 g/cm3。但研究发现,碳粉造孔剂制备的多孔陶瓷强度高于淀粉造孔剂多孔陶瓷。     

铝土矿尾矿多孔陶瓷的制备研究

以铝土矿尾矿为主要原料,分别选用碳粉、石墨粉、碳酸氢钠和淀粉作为造孔剂制备出铝土矿尾矿多孔陶瓷试样,采用抗弯测试、XED、SEM等对其主要力学性能和热物理性能进行测试与表征,结果表明:不同的造孔剂制备的铝土矿尾矿多孔陶瓷试样的抗弯强度、显气孔率、晶相组成和显微组织不同;以碳粉作为造孔剂制备的铝土矿尾矿多孔陶瓷试样的综合性能较好,因此最终选用碳粉作为制备铝土矿尾矿多孔陶瓷试样的造孔剂。     

碳粉和锯末复合造孔制备多孔吸声陶瓷

以低品位岩浆土为原料,以碳粉和锯末作为造孔剂制备多孔吸声陶瓷.结合岩浆土、碳粉和锯末的热分析结果,研究了单一碳粉或锯末和两者复配作为造孔剂对陶瓷结构和性能的影响,并采用Voronina经验模型对材料的吸声系数进行了理论计算.采用传递函数法和超景深显微系统测试材料的吸声性能并对其形貌进行表征.结果 表明:与单一碳粉或锯末作造孔剂相比,两者复配分别将样品的吸声系数提高了27％和45％;当碳粉与锯末的用量分别为1.5％和1.5％时,样品性能最优.此条件下,样品在500 ～ 6300 Hz下的平均吸声系数为0.61,第一吸收峰频率在2000 Hz出现,峰值为0.95,Voronina模型可较好的拟合具有高显气孔率样品的吸声系数.     

加速量热仪在锂离子电池热安全性研究领域的应用

加速量热仪(Accelerating RateCalorimeter,简称ARC)是用于危险品评估的新型热分析仪器,可以提供绝热条件下化学反应的时间、温度、温升速率和压力数据。本文着重介绍了加速量热仪应用在锂离子二次电池热安全性研究方面的研究成果,总结了锂离子二次电池的正负极材料、电解液和粘结剂等对锂离子二次电池热安全性的影响,并对ARC在离子电池热安全性研究发展方向的应用进行了展望。     

填充型导热橡胶研究开发现状

综述了填充型导热橡胶的典型理论模型和导热机理,介绍了单组分导热填料填充体系和多组分导热填料填充体系的国内外研究开发状况,指出了今后导热橡胶的开发方向。     

导热胶粘剂的研究和应用

综述了导热胶粘剂的导热机理、导热模型以及提高胶粘剂导热性能的途径；详细介绍了非绝缘导热胶粘剂和绝缘导热胶粘剂的技术研究与应用,最后对导热胶粘剂的发展前景作了展望。     

填充型导热高分子研究进展

总结了导热高分子复合材料的导热理论研究,综述了近年来国内外几种常用的提高填充型导热高分子材料导热性能的方法,并对未来研究及发展方向进行了展望。     

导热塑料研究进展

介绍导热绝缘及导热非绝缘塑料的导热性能、导热机理及导热填料粒子表面处理研究概况。并介绍了导热塑料的成型工艺条件选择及优化。综述了各类导热塑料的研究进展,讨论了提高塑料导热性能的途径,并展望了其应用前景。     

热老化橡胶的导热率的测量和分析

为了适应测量热老化橡胶的导热率,改进了传统的稳态法测定导热率的测量方法.用该方法测量了热老化橡胶的导热率,并对热老化橡胶的导热率的变化机理进行了初步探讨.     

Synthesis and thermophysical properties of RETa3O9 (RE = Ce,Nd, Sm,Eu, Gd,Dy, Er) as promising thermal barrier coatings

Thermal barrier coatings (TBCs) are one of the most important materials in gas turbine to protect the high temperature components. RETa₃O₉ compounds have a defect‐perovskite structure, indicating that they have low thermal conductivity, which is the critical property of TBCs. Herein, dense RETa₃O₉ bulk ceramics were fabricated via solid‐state reaction. The crystal structure was characterized by X‐ray diffraction (XRD) and Raman Spectroscope. Scanning electron microscope (SEM) was used to observe the microstructure. The thermophysical properties of RETa₃O₉ were studied systematically, including specific heat, thermal diffusivity, thermal conductivity, thermal expansion coefficients, and high‐temperature phase stability. The thermal conductivities of RETa₃O₉ are very low (1.33‐2.37 W/m·K, 373‐1073 K), which are much lower than YSZ and La₂Zr₂O₇; and the thermal expansion coefficients range from 4.0 × 10^?6 K^?1 to 10.2×10^?6 K^?1 (1273 K), which is close to La₂Zr₂O₇ and YSZ. According to the differential scanning calorimetry (DSC) curve there is not phase transition at the test temperature. Due to the high melting point and excellent high‐temperature phase stability with these oxides, RETa₃O₉ ceramics were promising candidate materials for TBCs.     

PA66导热绝缘塑料的制备与性能

通过尼龙66(PA66)与大粒径MgO共混经双螺杆挤出机挤出制备了导热绝缘塑料。研究了热导率与MgO填充量的关系。该导热绝缘塑料的热扩散系数和热导率随MgO填充量的增加而增大。在MgO填充量达到70%时,热导率达到1.9 W/(m.K),同时仍保持较好的力学性能和一定的电绝缘性能。热失重分析表明,该导热绝缘塑料的热分解温度受MgO填充量的影响,有约10℃的变化,低填充量(40%和50%)时,因MgO具有良好的导热性能,试样中的PA66几乎完全被分解汽化。     

3D interconnected high aspect ratio tellurium nanowires in epoxy nanocomposites: serving as thermal conductive expressway

Heat removal via thermal management materials is attracting more and more attention in the electronic industry. Conventional particle/polymer thermal conductive composites require a high filler loading ratio (>30 vol %), which cause severe thermal interfacial resistance and mechanical issue. In this work, we fabricate tellurium nanowires (NWs)/epoxy nanocomposites via a facile bar coating method. According to Agari model and Maxwell–Eucken model, the as-synthesized ultra-long NWs with high aspect ratio (>100) construct the 3D interconnected thermal conductive network better in resin matrix to facilitate the heat transfer process. The results show that at a low loading ratio of 2.4 vol %, this nanocomposite exhibits the out-of-plane and in-plane thermal conductivity of 0.378 and 1.63 W m⁻¹ K⁻¹, respectively, which is 189 and 715% higher than that of pure epoxy resin. Importantly, good stability, and flexibility of nanocomposites are well maintained. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47054.     

Thermal decomposition of poly(tetramethyloxydisilaethylene)

Thermal decomposition of poly[oxybis(dimethylsilylene)] having chains terminated with trimethylsiloxy groups was studied by thermogravimetry, pyrolysis-mass spectrometry, and infrared spectroscopy. The polymer is thermally less stable than poly(dimethylsiloxane). Depolymerization occurs at temperatures of 250–350°C, although this process also takes place at lower temperatures. The depolymerization produces cyclic oligomers of general formula [(Me₂Si)₂O] _n , with predominant formation of the oligomern=2. The depolymerization is accompanied by processes which are referred to as restructurization because they change the structure of the polymer backbone. Decomposition may lead also to the formation of branching points. The shape of the thermograms taken under isothermal conditions is in agreement with an unzipping mechanism for depolymerization involving random initiation. Excluding the short initial period of the process, the unzipping is terminated at a restructurization point. A low activation energy points to initiation induced by electron transfer, presumably involving traces of contaminant. At higher temperatures, 350–600°C, loss of organic parts of the polymer takes place along with further restructurization. At higher temperatures the polymer was also found to undergo easily oxygenation of its backbone with atmospheric oxygen, which leads to the formation of siloxane groups.