光电子器件的发展

本文分别对光电子学有源器件、无源器件、控制器件及光电子集成器件等进行了评述,并且着重指出,光电子器件是发展光电子学及其应用的重要基础。     

半导体激光器组件封装中光纤的固定方法

激光器件组件封装中发光设备与光纤之间的耦合要达到微米级甚至亚微米级精度,光纤的固定技术成为光电子封装中的关键.综述了激光器件组件封装中光纤的各种固定方法,其中包括激光熔焊、环氧树脂粘接、钎焊、机械固定以及电铸等,并对各种方法的优缺点进行了评价.     

半导体光电器件应用专集

半导体光电器件主要指光发射器件和各种光传感器。前者主要有各种波长的半导体激光器、发光二极管以及以它们为主体的组件和集成器件;后者包括有以光电二极管、雪崩光电二极管为主的各类光电探测器、电荷耦合器件、液晶传感器以及包含有这些器件的组件等。近几年来,这些光电子器件的理论研究非常活跃,器件制造工艺由于和半导体电子器件相容,因此器件的生产和应用都有了很大发展。半导体光电子器件的应用领域非常广泛,由它们组成的光纤传输系统比同轴电缆有损耗低、宽带快速、抗电磁干扰等优点,因此在通讯网路、数据网路、工     

国际电子组件及生产技术展2006

区内数一数二的元器件、组件、电子生产及显示技术展示平台 国际电子组件及生产技术展在2005年举行时，吸引了超过32,000名来自128个国家及地区的业内买家出席，采购各色各样的技术及产品，满足业务需要。     

新型室外光纤连接器ODC

法国雷迪埃集团(RADIALL)最新推出新型ODC室外光纤连接器.雷迪埃集团是全球领先的专业连接器件制造厂商.主要产品涵盖射频连接器件、电缆组件、光纤产品、无源微波器件和多插针领域,产品广泛服务于汽车、电信、国防、航空航天及专业设备市场.     

基于Openstack部署云计算管理平台

文章对云计算及Openstack进行了简要的介绍,提出了基于Openstack的多节点部署构建云平台的方案,并详细对其工作原理及关键组件的安装部署进行了说明,最后对平台的各个组件的服务进行了测试,各组件均可正常运行。     

彩色显示技术面面观（15）

二十九、可视性高的VFD微型组件介绍以前我们介绍的彩色平板显示屏,大都是自然光较暗的室内应用的产品。本文将介绍高识别显示器件。这种高识别显示器件,即便在户外应用也十分“抢眼”,十分醒目。因此这种高识别显示器件,最适合制作户外应用的宣传广告、公司标示、行道路标等这类“公示信息”平板显示器件。例如大家熟知的LED发光二极管微组件阵列,就是这类屡见不鲜的产品。     

重庆光电技术研究所15个项目通过鉴定

2000年元月24日,重庆光电技术研究所集成光学器件等15个项目通过了信息产业部的设计定型鉴定,其中10项属国内首创或填补国内空白,5项达到了国外20世纪90年代中期或初期水平。这些新型光电子产品经用户试用证明,提高了尖端武器系统的性能,为国防建设做出了积极贡献。 该所这次通过鉴定的15个项目中,八路并入并出光电隔离组件、光纤型行波管栅极调制器组件、光纤型脉冲行波管栅极调制器组件等3种产品都用于雷达系统;超辐射发光二极管组件、集成光路组件、双波导集成光路器件、推挽调制多功能集成光路器件、光波导三开关集成组件等5种产品都是光纤陀螺的关键器件(组件),或作光源,或作信号处理;高重复频率半导体激光器、砷化镓脉冲激光器等2种产品用作激光引信光源;高精度光电隔离传输组件、高速高压光开关、Hartmann光束诊断器、宽带高速激光器组件、高强度水压光接收组件等产品,有的用在紫外波段激光波前测量系统中,有的用于大功率强激光系统,有的用于通信、计算机网络,用途非常广泛。不少产品都可以军民两用,如八路并入并出光电隔离组件可广泛应用在计算机控制系统中,具有很高的使用价值;超辐射发光二极管组件等用于光纤陀螺的产品都可以广泛用于光传感、光通信。这些产品大都具有体积小、重量轻、响应快、适应性强、功能多、质量稳定、使用方便等特点。 1999年,该所一大批器件进入了整机系统,如3种光耦合器成功地用在了某重点武器型号的飞行试验中,光分路器件进入了“神舟”号试验飞船。这批科研项目通过鉴定后,也将进一步做到实用化,努力拓宽应用领域,以期形成批量生产,投入市场竞争,争取创造良好的经济效益。     

光电子器件的封装技术

<正> 激光器件是光通讯应用的关键器件之一,在光电子器件的组装过程中,封装的费用占了通常制作费用的60～80%。据预测,在未来3年内光电子器件的市场将以35～45%的速率增长。光电子器件的封装和工艺的改进是降低光网络成本的关键。在光网络中的一些关键有源器件是源激光器和泵激光器。了解影响它们的成品率、性能及可靠性的一些     

强劲增长的OEIC市场

由于光纤通信技术的飞速发展和庞大的通信市场需求,把光学和电学功能集成在同一个衬底上的器件极受欢迎。随着Si和InP、GaAsⅢ-V族材料技术和器件制作工艺技术的发展,使制作各种复杂功能的高性能半导光电子集成器件和组件成为可能,相继出现了发射模块、接收模块和收发模块等光电子集成电路(OEIC)。把光学部件、     

Miniaturized Battery‐Free Wireless Systems for Wearable Pulse Oximetry

Development of unconventional technologies for wireless collection and analysis of quantitative, clinically relevant information on physiological status is of growing interest. Soft, biocompatible systems are widely regarded as important because they facilitate mounting on external (e.g., skin) and internal (e.g., heart and brain) surfaces of the body. Ultraminiaturized, lightweight, and battery‐free devices have the potential to establish complementary options in biointegration, where chronic interfaces (i.e., months) are possible on hard surfaces such as the fingernails and the teeth, with negligible risk for irritation or discomfort. Here, the authors report materials and device concepts for flexible platforms that incorporate advanced optoelectronic functionality for applications in wireless capture and transmission of photoplethysmograms, including quantitative information on blood oxygenation, heart rate, and heart rate variability. Specifically, reflectance pulse oximetry in conjunction with near‐field communication capabilities enables operation in thin, miniaturized flexible devices. Studies of the material aspects associated with the body interface, together with investigations of the radio frequency characteristics, the optoelectronic data acquisition approaches, and the analysis methods capture all of the relevant engineering considerations. Demonstrations of operation on various locations of the body and quantitative comparisons to clinical gold standards establish the versatility and the measurement accuracy of these systems, respectively.     

Demonstrating a bright future [optoelectronic demonstrators]

Reviewed the technologies behind two successful optoelectronic demonstrator systems. These demonstrators show that the optics-in-computing technologies are reaching a level of sophistication where their deployment in "real-world" computing/networking environments becomes increasingly likely. The primary requirements for the successful transfer of these technologies from the laboratory to the "real world" are larger, more uniform arrays of the optoelectronic devices and highly stable optical and optomechanical assemblies. The advent of high-efficiency, low-power consumption arrays of oxide-confined VCSELs has reduced the overall optical complexity of these demonstrators with subsequent gains in the mechanical stability of these optical systems. Although at present the maximum array size of VCSELs that is readily available is 8 /spl times/ 8, there is, in principle, no reason why larger arrays cannot be developed. In tandem with these developments, the design and fabrication of micro-optical elements has reached the stage where they can be regarded as the standard optoelectronic interconnection method. Micro-optical optoelectronic system demonstrators show that optics-in-computing interconnection technologies are nearing real-world readiness.     

无人平台光电装备发展动向与光电创新概念——Eurosatory 2006防务展回顾之三

参观了法国Eurosatory 2006地面和防空装备展览新增的无人平台和创新项目展区,从光电技术的角度归类整理这些展区典型展品的特点,从顶置武器光电系统、无人车/无人机和技术创新概念等三个领域分析了这些装备和项目,相应总结了当前国际陆军无人平台即光电领域中的新趋势和新概念,分析了其中的关键技术,提出了相关领域的发展重点,主要包括适应武器发射环境的总体设计及稳定技术,快速响应的电子学系统设计,成像光电系统及其传输接口的小型化研究,嵌入式光电仿真技术研究,主动成像技术的实用化研究.     

GaN材料键合技术研究进展

GaN材料及其有关光电子器件的研制是近年来光电子研究领域内的研究热点之一,而键合技术又是光电子集成研究领域内一项新的制作工艺。利用键合技术也可以研制出一些新型的光电子器件,这些器件用其他生长技术是不可能实现的。概括地介绍了近年来键合技术在GaN光电子器件及其集成领域内的研究进展和应用情况。     

Nanowires for UV–vis–IR Optoelectronic Synaptic Devices

Simulating biological synaptic functionalities through artificial synaptic devices opens up an innovative way to overcome the von Neumann bottleneck at the device level. Artificial optoelectronic synapses provide a non-contact method to operate the devices and overcome the shortcomings of electrical synaptic devices. With the advantages of high photoelectric conversion efficiency, adjustable light absorption coefficient, and broad spectral range, nanowires (NWs)-based optoelectronic synapses have attracted wide attention. Herein, to better promote the applications of nanowires-based optoelectronic synapses for future neuromorphic systems, the functionalities of optoelectronic synaptic devices and the current progress of NWs optoelectronic synaptic devices in UV–vis–IR spectral range are introduced. Furthermore, a bridge between NWs-based optoelectronic synaptic device and the neuromorphic system is established. Challenges for the forthcoming development of NWs optoelectronic synapses are also discussed. This review may offer a vision into the design and neuromorphic applications of NWs-based optoelectronic synaptic devices.     

Textile Electronics for VR/AR Applications

Textile electronics addresses fibers or fiber assemblies with electronic functions to generate, transmit, modulate, and detect electrons. Interactive textile electronic devices may provide suitable platforms for virtual reality (VR)/augmented reality (AR) applications because of their excellent performance and unique immersive features such as lightweight, handiness, flexibility, comfort, and low strain even under high deformations. This paper presents a systematic review of the literature on the state-of-the-art of interactive devices, fabrication technologies, system integration, promising applications, and challenges involved in textile-based VR/AR systems.     

Micromachining for optical and optoelectronic systems

Micromachining technology opens up many new opportunities for optical and optoelectronic systems. It offers unprecedented capabilities in extending the functionality of optical devices and the miniaturization of optical systems. Movable structures, microactuators, and microoptical elements can be monolithically integrated on the same substrate using batch processing technologies. In this paper, we review the recent advances in this fast-emerging field. The basic bulk- and surface-micromachining technologies applicable to optical systems are reviewed. The free-space microoptical bench and the concept of optical prealignment are introduced. Examples of micromachined optical devices are described, including optical switches with low loss and high contract ratio, low-cost modulators, micromechanical scanners, and the XYZ micropositioners with large travel distance and fine positioning accuracy. Monolithically integrated systems such as single-chip optical disk pickup heads and a femtosecond autocorrelator have also been demonstrated     

Progress of Si-based Optoelectronic Devices

Si-based optoelectronics is becoming a very active research area due to its potential applications to optical communications. One of the major goals of this study is to realize all-Si optoelectronic integrated circuit. This is due to the fact that Si- based optoelectronic technology can be compatible with Si microelectronic technology. If Si - based optoelectronic devices and integrated circuits can be achieved, it will lead to a new irtformational technological revolution. In the article, the current developments of this exciting field are mainly reviewed in the recent years. The involved contents are the realization of various Si- based optoelectronic devices, such as light- emitting diodes, optical waveguides devices, Si photonic bandgap crystals, and Si laser,etc. Finally, the developed tendency of all-Si optoelectronic integrated technology are predicted in the near future.     

光纤通信用光电子器件的研究动向

介绍了近年来光纤通信用几种主要光电子器件研究的现状和存在的问题,提出了解决光电子器件研究发展中存在的问题的设想。     

Orientation‐Controlled Selective‐Area Epitaxy of III–V Nanowires on (001) Silicon for Silicon Photonics

Monolithic integration of III–V nanowires on silicon platforms has been regarded as a promising building block for many on‐chip optoelectronic, nanophotonic, and electronic applications. Although great advances have been made from fundamental material engineering to realizing functional devices, one of the remaining challenges for on‐chip applications is that the growth direction of nanowires on Si(001) substrates is difficult to control. Here, catalyst‐free selective‐area epitaxy of nanowires on (001)‐oriented silicon‐on‐insulator (SOI) substrates with the nanowires aligned to desired directions is proposed and demonstrated. This is enabled by exposing {111} planes on (001) substrates using wet chemical etching, followed by growing nanowires on the exposed planes. The formation of nanowire array‐based bottom‐up photonic crystal cavities on SOI(001) and their coupling to silicon waveguides and grating couplers, which support the feasibility for on‐chip photonic applications are demonstrated. The proposed method of integrating position‐ and orientation‐controllable nanowires on Si(001) provides a new degree of freedom in combining functional and ultracompact III–V devices with mature silicon platforms.