含锡铜废渣制备多元化产品的工艺研究

提出了含锡、铜废渣综合利用的工艺流程,并确定了各工序的技术指标。实验结果表明,该工艺处理下的废渣中锡、铜、镍的回收率较其它工艺有着明显地提高,制备的锡酸钠、硫酸铜、碳酸镍质量达到国家标准。     

铁元素在铜锡钛真空钎料中的作用

针对铜锡钛钎料力学性能、烧结性能、自锐性三者难统一的问题,以铜锡钛为基础原材料,研究铁的加入对铜锡钛结合剂力学性能和微观组织的影响。实验以烧结能否顺利进行为判断依据,即该烧结温度下材料致密化为前提,判断铁元素在材料中的作用。结果表明:基体铜与钛相互间的固溶度较低,主要依靠锡使之强化。铁可以显著增加铜锡钛钎料的硬度和抗弯强度,铁在与钛固溶形成类球形化合物,而铁、钛、铜能形成粒度细小且棱角明显的化合物,这些化合物有利于提升铜锡钛钎料的硬度,但过量的铁将引起材料脆性增加。适度的钛、铁含量及比例,可促进烧结进行,使材料有较高的硬度和适中的脆性,对金刚石具有较强的把持力;同时,拓宽材料的钎焊温度范围,使铜锡钛铁用于金刚石工具成为可能。     

化学捕集回收剥锡废液中溶解性铅和铜的研究

本文采用有机重金属捕集剂铜试剂（DDTC）对剥锡废液中的溶解性铅和铜离子进行分离,并加入高分子絮凝剂PAM强化固液分离。通过添加还原性铁粉抑制废液对捕集剂的氧化作用,着重研究了Fe加入量、DDTC加入量、pH对分离效果的影响。结果表明：每升废液中还原性铁粉最佳加入量为20-30g,当DDTC加入量为理论值的1．2-1．4倍,pH为3-5时,铅和铜的捕集率分别可以达到98％和97％以上。     

甲基磺酸铅(Ⅱ)、甲基磺酸锡(Ⅱ)的制备

介绍了以甲基磺酸为原料,制备甲基磺酸铅（Ⅱ）,甲基磺酸锡（Ⅱ）的固体化合物及溶液,经分析检测,甲基磺酸锡溶液色泽透明;氯离子的质量分数小于0．005％,铁离子和铜离子的质量分数分别低于0．0001％和0．0005％,产品纯度达到电子产品电镀的要求。     

含锡、镍、铜、锌离子废水的处理

采用化学沉淀一铁氧体法研究了锡、铜、锌、镍等重金属离子回收利用和废水达标排放问题。研究结果表明,采用分步沉积法可先后去除锡、铜重金属离子,其中锡和铜的最佳沉淀pH值分别为3和7,此时,锡和铜的沉淀率分别达到了97．0％和99．9％,沉淀物高温煅烧后经XRD验证分别为SnO2和CuO2采用铁氧体法处理锌、镍最佳工艺条件为：pH=10,FeSO4·7H2O浓度0．24g／100mL,温度65℃,lmL浓度1．5％的H2O2。在此条件下,锌离子由处理前的100mg／L降低到0．023mg／L,镍离子由处理前的200mg／L降低到0．1lmg／L,均可实现达标排放。     

我国电镀行业主要镀种世纪回眸和现状(续)

4　装饰性合金电镀工艺　　早在 50年代末期 ,由于众所周知的原因 ,国外对我国许多原材料实行禁运。那时 ,我们缺乏镍板 ,于是不得不寻找代镍镀层。成功的代镍镀层有锌铜合金 (白黄铜 )和低锡铜锡合金。以锌铜合金来说 ,还从普通的无光镀层发展到光亮的。 80年代末期 ,镍板价格飞涨时 ,含锡 8%～ 1 2 %的低锡铜锡合金代镍镀层又一次热火起来 ,并诞生出了光亮的铜锡合金镀层。光亮剂是以商品形式供应的 ,配方没有公开。如果控制得当 ,其光亮度能达到光亮镍镀层的程度 ,也就是可以免抛光 ,但是整平性要比光亮镍镀层稍差。锌铜合金镀层由于容易…     

铜锡合金电镀液中铜、锡含量的测定

提出采用交流示波极谱法连续测定铜锡合金电镀液中铜锡的含量。该方法不用指示剂,利用铅标准溶液及EDTA标准溶液,借助交流示波极谱仪中示波图上．TPB切口的出现检测终点。通过实验确定酸度为5．8、掩蔽剂为硫脲。对该方法与指示剂法分析结果进行了比较。结果表明,该方法的精密度更高,准确度更好,是一种快速、简便、经济实用且无污染的测定镀铜锡合金电镀液中铜锡含量的新方法。     

专利实例

电镀铜-锡合金两则20110301焦磷酸盐电镀铜-锡合金电解液该发明提供了一种不含氰化物的焦磷酸盐电镀铜-锡合金的电解液。电解液由可溶性铜盐、可溶性亚锡盐、碱金属的焦磷酸盐、添加剂A和添加剂B组成。     

剥锡废液资源回收的工业研究

剥锡废液是印制线路板行业主要废液之一,产生量大,可利用资源含量高。本文侧重于研究工业生产中利用综合沉淀法对剥锡废液的处理回收,得到干基含锡57%以上的锡泥,干基含铜18%以上的铜泥,废水经处理后达到国家废水一级排放标准,资源再利用效果良好,可用于实际生产。     

电镀锡及锡合金电解液

1 焊锡镀层 下面介绍的电解液适宜于在铜、铜合金及钢铁基体上电镀光亮锡和锡．铅合金可焊性镀层。其特点是可以进行高速电镀，ηκ较高。所得焊锡镀层中ω（C）小于0．1％。     

活性炭纤维的改性及对苯酚的吸附性能研究

用硫酸铜、高锰酸钾、硫酸亚铁、氢氧化钾、柠檬酸、硝酸铜、乙酸铅、硝酸等溶液浸渍处理活性炭纤维,考察了改性活性炭纤维对废水中苯酚的吸附性能。结果表明,用硫酸铜溶液改性的活性炭纤维对苯酚的吸附性能强于未改性的活性炭纤维,经高锰酸钾、硫酸亚铁、氢氧化钾、柠檬酸、硝酸铜、乙酸铅、硝酸等溶液改性的活性炭纤维对苯酚的吸附能力下降。浓度为0.05%~1%的硫酸铜溶液对0.2 g活性炭纤维进行改性的效果优于其它浓度的硫酸铜溶液。活性炭纤维上负载的铜离子过多会降低活性炭纤维对苯酚的吸附量。     

用含铜废渣制取试剂硫酸铜

用两种流程对铅冶炼厂的含铜废渣进行处理,均可制取试剂硫酸铜。第１种流程的焙烧过程使物料中的铜产生了约１８％～３０％的损失。第２种流程因无焙烧过程,使得产品直收率显著提高,从铜渣到试剂硫酸铜的直收率约为７７％。     

利用酸性CuCl2蚀刻废液制备微米级Cu2O粉体

以含CuCl2酸性蚀刻废液为原料,葡萄糖为还原剂,采用液相还原法制备分散性好的微米级Cu2O粉. 实验确定最佳制备条件为：反应温度80℃,终点pH值8~9,反应时间1 h,还原剂和铜离子摩尔比为0.8. 所制Cu2O产品纯度为99.34%,Cu回收率可达99.7%. 进一步采用XRD, SEM, LZS, TG等手段对产物进行表征,结果表明产品为高纯Cu2O,粒径为1.8~2.2 mm,空心多面体结构,且常温下抗氧化性好,有可能用于催化剂、涂料、染料等的制备.     

利用电子元件废引线制取硫酸铜

提出了回收电子元件废引线并以此为原料制取硫酸铜的方法。针对不同样品讨论确定了相应工艺,结合实际样品进行试验,该方法简单实用,同时获得了较高的产品收率。     

氯气浸出硫渣制备四氯化锡

四氯化锡的生产是用精锡与氯气反应得到的。为了降低工业四氯化锡的生产成本,采用硫渣（粗锡精炼产出的一种废渣）与氯气反应,制备四氯化锡。研究了氯气浸出反应温度,反应时间,液固比,搅拌速度等因素对硫渣中锡浸出率的影响。实验结果表明,氯气能够与硫渣中的锡反应,生成四氯化锡,硫渣中锡的浸出率可以达到90%以上。最佳浸出条件：四氯化锡与硫渣的初始液固质量比为2∶1,反应温度为80～90 ℃,反应时间为6 h,搅拌速度为100 r/min。浸出液经过精馏,脱除三氯化砷、三氯化锑等杂质,实验产出的四氯化锡产品的质量达到用精锡生产的四氯化锡产品的质量标准要求。     

硝酸型废退锡水的分离特性与蒸馏强化偏锡酸回收

针对电路板硝酸型废退锡液再生和锡提取技术的改进,对硝酸型废退锡水的物理化学特征、氧化还原与沉淀反应规律、真空蒸馏特性进行了理论分析和实验研究。结果表明：硝酸溶液中三价铁离子的存在可以将锡离子氧化为四价;硝酸浓度的提高可促进β型偏锡酸沉淀的形成;蒸馏是硝酸的浓缩过程,当水的蒸出率达到67.75%时,硝酸质量分数提高到40.04%,锡的质量分数降到了0.04%。废退锡水中锡以β型偏锡酸形式析出,析出率达到97.36%。经过蒸馏强化所获得沉淀物具有更好的沉淀特性;蒸馏底液保留了退锡水的有效成分,可作为再生退锡水。     

端羟基聚环氧氯丙烷的合成与表征

比较了用于合成端羟基聚环氧氯丙烷的3种催化体系:四氯化锡、四氯化锡/三氯乙酸共催化体系、四氯化锡/三氟乙酸共催化体系,结果表明共催化剂三氟乙酸能够有效减少环状齐聚物的生成,提高产物官能度。并提出了四氯化锡/强羧酸共催化体系催化环氧氯丙烷阳离子开环聚合的机理。     

Characterization of microvoids in mulberry and tussah silk fibers using stannic acid treatment

To investigate the volume, size, and number of microvoids in mulberry and tussah silk fibers, stannic acid gel was used as a contrasting medium to the small-angle X-ray scattering (SAXS). The influence of the stannic acid treatment on the structure of silk fibers was first investigated by using the wide-angle X-ray diffraction prior to characterization of the microvoids. The changes in crystallite size and degree of orientation with increasing stannic acid gel fraction in fibers are investigated, and it was found that the stannic acid treatment does not cause serious changes in crystallite size and degree of orientation. The changes in crystallinity indices were observed when the volume fractions of stannic acid gel in the fibers exceeded about 10%. Thus, it was confirmed that the structure of silk fibers was retained in the region of the stannic acid gel fraction less than 10%. SAXS measurements revealed that the number and the fraction of the microvoids are larger, while the sizes of the microvoids are smaller, for the mulberry silk fibers compared with the tussah silk fibers. The fraction macrovoids, however, is considered to be larger for the tussah silk fibers. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 363–367, 1999     

Metal–polymer nanocomposites produced by the melt‐compounding interaction of an aliphatic polyamide with metal particles

Composites prepared at 200°C by the melt compounding of copolymer polyamide 6/66 and ferric chloride, ferric oxalate, cupric chloride, cupric formiate, cupric acetate, Cr‐carbonyl, Mo‐carbonyl, or W‐carbonyl have been studied. The solution stability and aggregation suppression for nanoparticles in a polyamide can be explained by the formation of stable polymer–metal complexes. The nitrogen atoms of amide and amine groups of polymers serve as ligands for the coordination compounds that form. The dynamic viscosity of the solutions suggests that Cr‐carbonyl forms mostly intermolecular complexes, whereas ferric oxalate, ferric chloride, cupric formiate, cupric acetate, cupric chloride, Cr‐carbonyl, Mo‐carbonyl, and W‐carbonyl form intramolecular complexes. The critical concentrations for metal‐containing compounds at which a dispersion rises to nanodimensions without aggregating in the polymer matrix under the experimental conditions are 0.024 wt % for ferric oxalate, 0.12 wt % for ferric chloride, 0.08 wt % for cupric formiate, 0.096 wt % for cupric acetate, and 0.19 wt % for cupric chloride. Metal carbonyls undergo dispersion (with their concentration up to 5 wt %) in polyamide 6/66 without aggregating into larger formations. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Influence of doped platinum nanoparticles on photocatalytic performance of CuO–SiO2 for degradation of Acridine orange dye

Preparation of cupric oxide-silicon dioxide nanoparticles was carried out using a sol-gel method. Cupric oxide-silicon dioxide nanoparticles were decorated by different weight percent of platinum (0.5, 1.0, 3.0 and 5.0 wt %) using method of photoassisted deposition. XRD remarks revealed that XRD patterns for all samples are composed of cupric oxide. Therefore, silicon dioxide is amorphous and decoration of cupric oxide-silicon dioxide nanoparticles by platinum has no effect on the formed phase. Also, due to low percent of platinum there are no peaks for platinum oxide or platinum. Cupric oxide has bandgap energy absorb in visible region but has high e-h recombination rate. Decoration of cupric oxide-silicon dioxide nanoparticles by platinum was decreased bandgap energy from 2.38 to 1.91 eV and also decrease rate of e-h recombination rate. The photocatalytic activity of platinum decorated cupric oxide-silicon dioxide nanoparticles was measured under visible light for Acridine orange dye degradation. 100% of Acridine orange dye can be degraded using 3.0 wt % of platinum decorated cupric oxide-silicon dioxide photocatalyst, 1.2 g/L dose of platinum decorated cupric oxide-silicon dioxide photocatalyst and 30 min reaction time. 3.0 wt % of platinum decorated cupric oxide-silicon dioxide photocatalyst has photocatalytic stability for five times.