Fabrication of Y2O3 buffer layer on polished Ni substrates for YBCO superconducting tape

Highly cube textured Ni tapes are produced by heavy cold rolling and recrystallization annealing. The textured nickel tapes have been proven to be suitable substrates for YBCO superconducting tape. Nevertheless, rolling damage and grain boundary grooves on Ni influence the epitaxial growth of highly textured buffer and YBCO layers. The polishing of the Ni substrate surface may play a crucial role in making it beneficial to epitaxial film deposition. In our work, several polishing methods were adopted on Ni to reduce the depth of rolling damage and grain boundary grooves. On the polished Ni substrates, textured Y2O3 buffer layers were deposited using RF sputtering. XRD results show that in-plane texture of Y2O3 films will minish with the decreasing of the Ni substrate surface roughness. AFM results show that average grain size of the Y2O3 film is biggest and surface is coarse in film on flatter Ni surface.     

Fabrication of Y2O3 buffer layer on polished Ni substrates for YBCO superconducting tape

Highly cube textured Ni tapes are produced by heavy cold rolling and recrystallization annealing. The textured nickel tapes have been proven to be suitable substrates for YBCO superconducting tape. Nevertheless, rolling damage and grain boundary grooves on Ni influence the epitaxial growth of highly textured buffer and YBCO layers. The polishing of the Ni substrate surface may play a crucial role in making it beneficial to epitaxial film deposition. In our work, several polishing methods were adopted on Ni to reduce the depth of rolling damage and grain boundary grooves. On the polished Ni substrates, textured Y2O3 buffer layers were deposited using RF sputtering. XRD results show that in-plane texture of Y2O3 films will minish with the decreasing of the Ni substrate surface roughness. AFM results show that average grain size of the Y2O3 film is biggest and surface is coarse in film on flatter Ni surface.     

The surface morphologies of (Pb,Sr)TiO_3 thin film fabricated on Si-buffered Pt/Ti/SiO_2/Si substrate

1Introduction(Pb,Sr)Ti O3(PST)thin fil mhas great potentials in the application of microelectronic devices such astunable microwave filters,infrared detectors,DRAM,etc[1-3].Preparation of PST thin fil ms can be a-chieved by many methods including PLD and sol-gel[4].Perovskite thin fil msuch as(Ba,Sr)Ti O3(BST)prepared on Pt/Ti/Si O2/Si substrates has considerably higher dielectric loss compared with correspondingbulk materials,O2-vacancies generated ontheinterfaces between electrod…     

The surface morphologies of (Pb, Sr) TiO3 thin film fabricated on Si-buffered Pt/Ti/SiO2/Si substrate

(Pb, Sr)TiO3 (PST) thin film are fabricated by RF magnetron sputtering on Si-buffered Pt/Ti/SiO2/Si substrates with different buffer layer deposition time. Surface morphologies of the buffer layer indicate an improving surface roughness and larger grains with the prolongation of sputtering time. Deposition of PST thin films shows excellent surface fluctuation filling ability to improve the surface roughness of substrates. PST surface morphologies exhibit apparently different grain forms according to the preparation time durance of buffer layer.     

The surface morphologies of (Pb, Sr) TiO3 thin film fabricated on Si-buffered Pt/Ti/SiO2/Si substrate

(Pb, Sr)TiO3 (PST) thin film are fabricated by RF magnetron sputtering on Si-buffered Pt/Ti/SiO2/Si substrates with different buffer layer deposition time. Surface morphologies of the buffer layer indicate an improving surface roughness and larger grains with the prolongation of sputtering time. Deposition of PST thin films shows excellent surface fluctuation filling ability to improve the surface roughness of substrates. PST surface morphologies exhibit apparently different grain forms according to the preparation time durance of buffer layer.     

Influence of the substrate thickness on texture of tape

Fabrication of a strong cube texture Ni substrate through thermomechanical process is reported by ORNL research group. Decreasing the substrate thickness, the engineering critical current density will be improved. Rolled substrates are electropolished to the final thichness of 100, 80, 50, 40, and 20 μm, respectively. Electropolished substrates are recrystallized at temperatures between 800-1000C and in a mixed atmosphere of 4, H2 in 99.99, purity Ar. Orientation mappings of recrystallizated tapes are conducted through an EBSD system mounted on a LEO-1450 SEM. The influence of the substrate thickness on texture of the tape is studied in this paper. Results show that with the decrease of substrate thickness, the texture of the tapes with the same recrystallization process is more and more closed to the exact position of cube orientation.     

纳米Al2O3对Ni基合金激光抛光表面光洁度的影响

为提高激光抛光表面光洁度,采用1 070nm,200W光纤激光器(SPI激光器SP-200C-A-A6-A-C)进行激光抛光实验。首先在电镀纯Ni样品上进行实验,采用相同的参数对Ni/Al_2O_3(4.4%,体积百分比)纳米复合材料进行激光抛光。在其他参数相同的情况下,通过改变激光能量密度进行实验,最后通过形貌和微观结构表征研究Al_2O_3纳米颗粒对Ni抛光性能的影响,再利用光学和热物理性质对激光熔化进行了数值模拟。结果表明,在最佳激光抛光工艺条件下,Ni/Al_2O_3的表面粗糙度由323nm降低到72nm,纯Ni的表面粗糙度由254nm降低到107nm。在纳米颗粒的帮助下,标准化表面粗糙度降低了近2倍。激光加工区截面的微观结构研究表明,通过添加Al_2O_3纳米粒子,激光熔化区(MZ)深度从1.8μm增加到3.2μm,而热影响区(HAZ)的大小从8.4μm显著减小到2.9μm。激光抛光中通过纳米粒子调节熔池动力学,克服了激光抛光的基本限制。随着纳米粒子对热物理性质的改变,热毛细流动的开始发生了改变,从而为毛细区提供了更宽的处理窗口。纳米颗粒的增黏作用提高了毛细区的平滑效率。数值模拟进一步证明了纳米颗粒抑制了热传递,增强了表面层内的热积累,从而降低了MZ深度。纳米粒子限制了晶粒的生长,提高了晶粒生长温度,使热影响区缩小。     

Ni-Ti合金电化学抛光性能研究

为提高Ni-Ti合金的表面质量和抗蚀性,改善生物相容性,基于自行研制的电化学抛光系统及抛光液,以Ti50.8Ni(at.%)为基材在最佳工艺参数下进行纳米级电化学抛光实验。研究了电化学抛光对试件表面粗糙度和表面形貌的影响;与砂纸打磨、机械抛光、酸洗等表面处理方法做对比,研究了不同表面处理方法对试件亲疏水性能和腐蚀性能的影响。分别利用白光干涉仪、扫描电子显微镜、接触角测量仪、电化学工作站检测分析了材料表面粗糙度、表面形貌、亲疏水性能及腐蚀性能。结果表明,在最佳工艺参数下试件电化学抛光质量良好,表面粗糙度值显著降低至27.8 nm,表面平整均匀、光亮如镜;经电化学抛光的Ni-Ti合金表面呈疏水特性,改善了生物相容性,提高了耐腐蚀性。     

红色长余辉发光材料Y_2O_2S∶Eu,Mg,Ti光谱性能的研究

对高温固相法制备的新型长余辉发光材料Y2O2S∶Eu,Mg,Ti,通过分析其激发光谱和发射光谱发现,主要是由Eu,Mg,Ti的掺杂引起激发波峰加强并红移,产生了纯正的红色长余辉.该发光材料适合紫外光和可见光激发,具有广泛的应用前景.     

晶界特征分布对1Cr18Ni9Ti奥氏体不锈钢绝热剪切带自组织的影响

通过形变热处理工艺优化不锈钢的晶界特征分布,并采用厚壁圆筒外爆压缩加载实验对形变热处理前后的试样进行动态加载,研究了晶界特征分布对1Cr18Ni9Ti奥氏体不锈钢绝热剪切带自组织的影响。结果表明,形变热处理工艺优化了不锈钢的晶界特征分布,特殊晶界比例尤其是∑3晶界比例分别从27.8%,18.9%提高到72.5%,55.8%,一般大角度晶界被小角度晶界和特殊晶粒团簇取代或阻断。加载后两种状态试样的剪切带的数量和间距差别较小,但是固溶试样剪切带的平均扩展速率为446 m/s,最长剪切带长度为2.33 mm,而形变热处理试样分别为338 m/s和1.75 mm。晶界特征分布优化对剪切带的形核影响较小,但是由于特殊晶界比例的提高,明显阻碍了绝热剪切带的扩展,提高了高速变形条件下的抗损伤能力。     

纳米氧化钇的制备及表征

采用碳铵沉淀工艺, 进行了纳米氧化钇的制备研究。研究了沉淀过程中表面活性剂对沉淀颗粒大小的影响; 添加表面活性剂隔离碳酸钇颗粒之间的相互接触, 从而起到了在煅烧过程中控制粉末硬团聚的作用; 分析了煅烧温度对比表面和氯离子含量的影响; 制备出了单一粒径小于50 nm、团聚体粒度分布D₅₀<150 nm, 粉末的比表面积大于35 m²/g,粉末的团聚常数(D₅₀/D_BET)小于6, 形状为球形的纳米氧化钇粉末。     

不同Ni含量的合金钢在高温水蒸气中的氧化行为研究

为了探究Ni含量与温度对合金钢氧化腐蚀行为的影响, 对3.5%Ni、5%Ni和9%Ni钢在540 ℃高温水蒸气中的氧化行为进行了研究, 并与9%Ni钢在600 ℃高温水蒸气中的氧化行为进行了对比。采用非连续称量法测定其动力学曲线, 通过扫描电子显微镜(SEM)观察氧化膜形貌, 用能谱仪(EDS)和X射线衍射(XRD)对元素成分和相组成进行了分析。结果表明, 在540 ℃氧化时, 3种合金钢的氧化动力学均符合抛物线规律;Ni含量增加, 氧化速率下降, 但有促进氧化膜脱落的倾向; 3种合金钢的氧化膜均由Fe₃O₄、Fe₂O₃和NiFe₂O₄组成, Ni元素增多可以促进产物中Fe₃O₄向Fe₂O₃转化。氧化膜分为两层, 层间存在孔洞; 内层富含NiFe₂O₄的尖晶石氧化物, 外层以Fe₃O₄和Fe₂O₃为主。温度升高时, 9%Ni钢的氧化速率提高, 氧化膜脱落时间提早; 表面氧化物形貌发生了改变, 从片状组织转化为颗粒状组织, 但温度升高并未改变9％Ni钢的氧化产物类别。     

Study on nickel nanoparticles surfacemodified SnO2 film

SnO2 film is widely used as a gas sensor, whereas, its gas sensitivity at low temperature is not satisfactory. Surface modification is an effective way to enhance sensitivity of SnO2 which is closely related to the surface morphology and microstructure of SnO2. In this paper, nickel nanoparticles surface-modified SnO2 films were prepared by D. C. magnetron sputtering. The effects of distribution and morphology of Ni particles on the surface of SnO2 on hydrogen sensitivity were studied. The results show that the sputtering time of Ni influences gas sensitivity of SnO2. With increasing the annealing temperature, Ni particles separate from SnO2 particles and gradually aggregate into spherical particles distributing uniformly on the surface of SnO2 film. The particle size, porosity, and specific surface area of Ni influence the gas sensitivity of SnO2 directly. Gas sensitivity examination indicates that the spherical Ni particles in a diameter of 100nm lead to the best modification. After heat treated at 800℃ for 3 hours, SnO2 film with 30s sputtering of Ni shows a gas sensitivity of 112, for 4000 ppm H2 at a operating temperature of 60℃.     

Cu-15Ni-8Sn-0.4Si合金铸态组织结构及成分偏析研究

用金相、扫描电镜及电子能谱微区成分分析等方法对添加少量Si的Cu-15Ni-8Sn合金的铸态组织结构及成分偏析进行了研究。结果发现：Cu-15Ni-8Sn-0.4Si合金的铸态组织分为三层，除具有明显的枝晶外，还有块状的（Cu、Ni)3Sn相和溶有少量Cu的Ni2Si和Ni3Sn相组成的第二层，在两层之间为组织形态复杂的过渡区。宏观上铸态组织存在Sn的反偏析，Sn的含量从外到内呈现下降趋势。与非真空熔铸相比真空熔铸能明显改善Cu-15Ni-8Sn-0.4Si合金反偏析现象。均匀化退火对改善Sn的反偏析作用不大；枝晶组织可基本消除，但Ni、Si元素形成的化合物仍难以完全溶解。添加少量Si的Cu-15Ni-8Sn合金由于Ni2Si和Ni3Si相的形成，通过阻碍晶粒长大和时效沉淀而强化合金。     

低应变SiGe/Si异质结构的应变弛豫与界面扩散

利用透射电子显微镜(TEM)和同步辐射X射线白光形貌术研究了低应变SiGe/Si异质结构应变弛豫和界面扩散。观察到SiGe外延层未发生应变弛豫,Si缓冲区和Si衬底中有颗粒状析出物。     

红柱石矽线石矿物陶瓷蓄热材料的性能

根据蓄热式加热炉的生产实际,通过比较蓄热材料中各种矿物组成的性质差异,选择了红柱石、矽线石为骨料,配加α-A l2O3、镁砂,经过合适的成型和烧结工艺,制作成蓄热陶瓷球。用水骤冷实验法测试不同配方制作的陶瓷球在高温下的抗热震性能和用坩埚法测试陶瓷球抗Fe2O3、FeO渣侵蚀性能。结果表明:以红柱石为骨料,适当添加α-A l2O3的蓄热球抗热震性能较好,急冷急热次数平均达到20次;以矽线石为骨料,适当添加镁砂粉的蓄热球抗渣性能较好。     

SCR7000连铸连轧铜杆扭转裂纹的关键影响因素

针对SCR7000工艺生产低氧光亮铜杆的扭转裂纹问题,采用SEM+EDS、OM等研究了铜杆中的杂质元素,中心与边部的晶粒尺寸及硬度差异,铜坯凝固组织异常等关键影响因素对扭转裂纹的影响。结果表明：铜杆扭转裂纹中存在Fe、Ni、Cr、Si等杂质元素的局部富集,产生了应力集中,诱导了铜杆表层的扭转裂纹。分析认为,这些杂质元素主要来自浇包、过滤器及钢溜嘴等材料的熔损;铜杆中心部位的平均晶粒尺寸、硬度与边部的差异大,导致扭转裂纹敏感性大,这是铜坯的入轧温度、轧制过程的铜杆冷却不合适、轧机与铜坯间的摩擦作用以及SCR7000工艺多道次轧制所致;铸轮结垢的严重程度与扭转裂纹的发生率存在明显的正相关关系,这是严重的铸轮结垢导致铜坯凝固组织异常所致。     

电沉积FeCoNi层状氢氧化物作为碱性水电解析氧反应催化剂的研究

在-0.8至-1.2 V（vs. SCE）的电位范围内,通过不同时间的电沉积,制备了FeCoNi层状氢氧化物。在-1.0 V下沉积600 s得到的FeCo5Ni13,均匀分布在NF基体表面,呈层状结构。FeCo5Ni13的层厚约30 nm,彼此交织形成蜂窝状,不仅提供了高的比表面积,还增强了FeCo5Ni13与基底之间的结合。FeCo5Ni13作为析氧反应的催化剂时,最低初始电位仅为1.48 V (vs. RHE),最小的过电位为100 mAcm-2时的310 mV,以及最低的Tafel斜率,仅为39 mVdec-1,表现出最佳的催化性能。在10 mAcm-2条件下电解120 小时后,FeCo5Ni13仍保持蜂窝结构并且催化性能几乎没有退化。因此,电沉积FeCo5Ni13层状氢氧化物在碱性水电解析氧反应中具有良好的应用前景。     

32Cr3Mo1V表面激光合金化层热疲劳性能的研究

采用万瓦横流CO2激光器在32Cr3Mo1V基体表面合金化Cr粉及Co基粉,获得富含Cr和Co的合金层,并对合金层的成分、组织、硬度及热疲劳性能进行了分析.结果表明:合金层与基体形成完全的冶金结合,组织致密、晶粒细小、无裂纹及孔隙夹杂等缺陷,添加的合金元素Cr与基体形成了富含18.7％Cr的Fe-Cr固溶体,Co合金与...     

1420轧机第4机架电机负荷的仿真

结合冷轧机的轧制特点与轧制原理建立第4机架电机负荷的模型,根据建立的模型采用VB程序对电机负荷进行仿真,分析带材几何尺寸、轧辊直径以及摩擦系数对电机负荷状况的影响。