PERC结构多晶硅太阳电池的研究

高效、低成本是目前硅太阳电池追求的主要目标。多晶硅太阳电池成本低,但其电性能较差。背面钝化及局部背接触是提高多晶硅太阳电池电性能的主要技术。通过采用SiO2/SiNx叠层膜作为背钝化介质层,依次经过背面开槽、丝网印刷、烧结形成背面局部接触,制备钝化发射极和背表面电池(PERC)结构多晶硅太阳电池。采用恒光源I-V特性测试系统测试其电性能,结果表明:较之常规铝背场多晶硅太阳电池,PERC结构电池在开路电压Voc、短路电流密度Jsc、转换效率η方面分别提高了13 mV、1.8 mA/cm2和0.67%(绝对值),其转换效率达到17.27%。PERC结构多晶硅电池采用了常规丝网印刷工艺,有利于实现高效多晶硅电池的产业化生产,具有很高的实际意义。     

PERC太阳电池背面SiNx折射率的优化

提高背反射率、降低背表面复合速率是提高太阳电池转换效率的重要研究方向之一。SiNx薄膜因其良好的钝化特性不仅应用在传统太阳电池发射极钝化,也同时应用在局部背接触太阳电池(PERC)背表面,起到背面钝化及增加背反射的作用。为增强PERC太阳电池背钝化、提高电池背面长波光子的反射率,在背表面AlOx/SiNx叠层膜模型基础上,提出并研究了不同折射率的双层SiNx对PERC太阳电池性能的影响,实验结果表明:采用折射率2.4/2.0的SiNx薄膜,PERC太阳电池电性能相对较好,相对常规背钝化电池,开路电压、电流密度以及转换效率分别提高了1.8 mV,0.16 mA/cm2,0.11%。     

PERC背钝化结构提升多晶硅太阳电池的光电转换性能研究

在工业产线上制备了PERC结构的多晶硅太阳电池,并研究了在电池背表面引入PERC背钝化结构对其光电转换性能的影响。结果表明:PERC背钝化结构能够提升电池的短路电流和开路电压,光电转换效率超过了20%。结合光学仿真及分析电池的关键光电参数知,其光电转换性能改善的原因可归结为PERC背钝化结构降低了长波太阳光子在背铝电极的寄生吸収损失和光生载流子的背表面复合损失。PERC背钝化结构能够提升多晶硅太阳电池的光电转换效率,并且其制备工艺与传统产线兼容,是一种优选的产业电池结构。     

聚苯乙烯微球辅助制备超薄PERC太阳电池

利用旋涂法将自制的聚苯乙烯(PS)微球涂覆到不同厚度的单晶硅片上,作为钝化发射极和背面电池(PERC)的背接触开口的掩模,然后用快速热退火工艺使PS微球挥发形成PERC电池的背接触开口,最后用磁控溅射在PERC电池背面生长一层Ag电极。利用该方法制备了面积为40 mm×40 mm、厚度分别为40、55和70μm的三种超薄单晶PERC太阳电池。制备的超薄太阳电池未出现任何翘曲。超薄太阳电池的电流密度-开路电压(Jsc-Voc)曲线和外量子效率(EQE)曲线测试结果表明,随着电池厚度的减小,电池的转换效率随之下降。其中,40μm厚的电池转换效率最高达13.6%,平均转换效率为13.3%,并展现出良好的柔韧性,极限弯曲角度达到135°。     

n型IBC太阳电池磷掺杂工艺

为了兼顾叉指背接触(IBC)太阳电池背表面场(BSF)区域的钝化性能和接触性能,在现有IBC太阳电池制备工艺基础上引入离子注入技术,对电池背表面场区域进行磷离子注入.研究了不同磷离子注入剂量对IBC电池钝化性能和接触性能的影响,并研究了烧结工艺对IBC电池接触性能的影响.实验结果表明,当磷离子注入剂量为6.6×1014...     

纳秒激光熔覆硅纳米薄膜的仿真分析及实验研究

以重掺杂硼的纳米硅浆料为硼源,采用纳秒激光熔覆工艺,在钝化发射极及背接触(PERC)电池背面形成了重掺杂硼的硅熔覆层。通过建立三维瞬态温度场的有限元仿真模型,并利用单因素仿真实验,得到了激光工艺参数对温度场的影响规律,初步确定了各激光工艺参数的合理范围。利用极差分析获得了激光工艺参数与激光熔覆温度场分布的相互作用规律。将激光熔覆工艺兼容到PERC电池的制备实验中,结果表明:仿真模型与实验结果较为吻合,电池的平均光电转化效率提升了0.27%。     

基于Quokka优化叉指背接触太阳电池的效率

叉指背接触太阳电池因前表面无栅线所带来的高短路电流及栅线位于背面所获得的组件高密度封装的优势,吸引了众多光伏制造者的关注。然而,由于电池背面的p~+发射区和n~+背表面场(BSF)区呈交叉分布,在电池制备过程中需进行掩膜技术和激光烧蚀技术的隔离,显然增加了电池制备成本。因此,首先选用Quokka软件从钝化减反层及p~+发射区占比的角度探究了优化电池效率的方向,其次利用实验验证了结果的正确性。仿真及实验结果均表明在n~+背场区和p~+发射区分别沉积SiO_2/SiN_x/SiO_xN_y叠层和Al_2O_3/SiN_x/SiO_xN_y层的钝化效果均优于不含SiO_xN_y层,而p~+发射区与相邻的n~+背场区单元宽度越窄且p~+发射区占比越高则电池效率越高。     

掺硼p型晶硅太阳电池LID恢复研究

随着p型晶体硅太阳电池转换效率的不断提高,由于光致衰减(LID)造成的效率损失问题也日益突显.文章通过光辐照的方式分别对电池片和经过光衰处理后的电池片进行抑制光衰和光衰恢复处理,前者光衰幅度极大下降,后者光衰得到很好的恢复,并且达到了一个相对稳定的状态,表明光恢复处理可以很好地改善掺硼p型晶体硅太阳电池的LID现象.特别地,针对p型高效电池结构钝化发射区和背表面电池(PERC)技术来说,光恢复处理工艺基本上克服了LID的现象,24 h光衰幅度仅为0.03％.LID现象的解决,将为PERC技术的大规模推广奠定基础.     

飞秒激光刻蚀增强非晶硅薄膜太阳电池性能的研究

通过恒速移动线偏振飞秒激光焦点对非晶硅(a-Si) pin型薄膜太阳电池n型硅膜表面进行绒化刻蚀处理,形成不同周期间隔“凹槽”状结构.采用扫描电子显微镜(SEM)和X射线衍射仪(XRD)对刻蚀后薄膜表面形貌进行了表征,证实了刻蚀区域表面能够诱导晶态多孔微结构形成.比较了飞秒激光刻蚀前后a-Si太阳电池的光电转换效率(η)、开路电压、短路电流密度和填充因子.结果表明,当飞秒激光脉冲能量为0.75 J/cm2、刻蚀周期间隔为15μm时,太阳电池光电转换效率达到14.9％,是未经过激光刻蚀处理电池光电转换效率的1.87倍.同时,反射吸收谱表明,电池表面多孔“光俘获”微结构的形成对其光电转换效率的提高起到了关键作用.     

背表面场结构参数对双面太阳电池电流特性的影响

针对正面光照、背面光照及双面光照三种不同光照条件,利用TCAD半导体器件仿真软件全面系统地分析了背表面场结构参数对P型双面单晶硅太阳电池内量子效率(IQE)和短路电流密度(JSC)的影响。仿真结果表明:在300~700 nm短波段范围,双面光照情况下的IQE主要由BSF结构对背面光照光生载流子的影响决定。在700~1200 nm长波段范围,双面光照情况下的IQE主要由BSF结构对正面光照光生载流子的影响决定。当BSF扩散深度一定时,随着BSF表面浓度的增大,双面光照情况下JSC的变化特点与背面光照情况一致。BSF结构的变化对正面光照情况下JSC的影响较小((35)JSC=0.26×10~(–3)A/cm~2),而BSF结构参数的变化对背面光照情况下JSC的影响较大((35)JSC=10.59×10~(–3)A/cm~2),BSF结构对背面光照光生载流子的影响是导致双面光照JSC出现大幅变化的主要因素。     

Optimization of the rear contact pattern of high-efficiency silicon solar cells with and without local back surface field

The influence of the point spacing and size on the cell efficiency is studied for different silicon solar cell structures with local rear contacts: the PERC (passivated emitter and rear cell) with its high recombination at the rear contacts and the LBSF (local back surface field) or PERL (passivated emitter and rear locally diffused) cell with reduced combination at the rear contacts due to a diffused high-low junction (or LBSF) beneath the contacts. Float zone materials of different resistivities have been investigated. The experimental results are explained by three-dimensional finite difference simulations for the open-circuit voltage, the short-circuit current and the fill factor.     

Characterization of 23-percent efficient silicon solar cells

A silicon solar cell structure, PERC (passivated emitter and rear cell), has very recently demonstrated energy conversion efficiency above 23%. A number of interesting features of the PERC cell design are discussed. Rear contact design is based on a balance between the beneficial effects of small sparsely spaced contact points upon the open circuit voltage and short-circuit current of the cell and the corresponding negative effects upon cell fill factor. The noncontacted regions of the rear surface are held in weak depletion by an optically isolated but electrically connected rear Al reflector. Once bulk injection levels become appreciable, the disadvantage of this surface condition disappears. The structure incorporates a reasonably effective light-trapping scheme, although there remains scope for improvements in this area. Along with other improvements, efficiency approaching 24% seems feasible with the present cell structure. If a processing regime can be found which allows boron passivation of the contact holes or the entire rear surface without loss of the present exceptionally high bulk lifetimes, efficiencies above 24% are likely     

20.7% efficient ion‐implanted large area n‐type front junction silicon solar cells with rear point contacts formed by laser opening and physical vapor deposition

In this work, we report on ion‐implanted, high‐efficiency n‐type silicon solar cells fabricated on large area pseudosquare Czochralski wafers. The sputtering of aluminum (Al) via physical vapor deposition (PVD) in combination with a laser‐patterned dielectric stack was used on the rear side to produce front junction cells with an implanted boron emitter and a phosphorus back surface field. Front and back surface passivation was achieved by thin thermally grown oxide during the implant anneal. Both front and back oxides were capped with SiN_x, followed by screen‐printed metal grid formation on the front side. An ultraviolet laser was used to selectively ablate the SiO₂/SiN_x passivation stack on the back to form the pattern for metal–Si contact. The laser pulse energy had to be optimized to fully open the SiO₂/SiN_x passivation layers, without inducing appreciable damage or defects on the surface of the n⁺ back surface field layer. It was also found that a low temperature annealing for less than 3 min after PVD Al provided an excellent charge collecting contact on the back. In order to obtain high fill factor of ~80%, an in situ plasma etching in an inert ambient prior to PVD was found to be essential for etching the native oxide formed in the rear vias during the front contact firing. Finally, through optimization of the size and pitch of the rear point contacts, an efficiency of 20.7% was achieved for the large area n‐type passivated emitter, rear totally diffused cell. Copyright © 2014 John Wiley & Sons, Ltd.     

Front and rear silicon‐nitride‐passivated multicrystalline silicon solar cells with an efficiency of 18.1%

A solar cell process designed to utilise low‐temperature plasma‐enhanced chemical vapour deposited (PECVD) silicon nitride (SiN_x) films as front and rear surface passivation was applied to fabricate multicrystalline silicon (mc‐Si) solar cells. Despite the simple photolithography‐free processing sequence, an independently confirmed efficiency of 18.1% (cell area 2 × 2 cm²) was achieved. This excellent efficiency can be predominantly attributed to the superior quality of the rear surface passivation scheme consisting of an SiN_x film in combination with a local aluminium back‐surface field (LBSF). Thus, it is demonstrated that low‐temperature PECVD SiN_x films are well suited to achieve excellent rear surface passivation on mc‐Si. Copyright © 2002 John Wiley & Sons, Ltd.     

Reduced temperature coefficients for recent high-performance silicon solar cells

The PERC cell (passivated emitter and rear cell) and PERL (passivated emitter and rear locally-diffiused) cell have recently demonstrated improved cell performance owing to the high quality of surface passivation and high bulk carrier lifetimes. the effect of temperature on the performance of these cells is reported. As anticipated, owing to higher open-circuit voltages these cells should have a lower temperature sensitivity of performance. the PERL cells demonstrated a normalized efficiency temperature variation of −2632 ppm °C⁻⁻¹, which is the lowest ever reported for a silicon cell. However, PERC cells with a similarly high open-circuit voltage showed a higher temperature sensitivity owing to the bulk resistance component, which limits the performance of PERC cells.     

高效率n型硅离子注入双面太阳电池

为进一步提升n型硅双面太阳电池的转化效率,采用了磷离子注入技术制备n型硅双面太阳电池的背场.基于离子注入技术准直性和均匀性好的特点,掺杂后硅片的表面复合电流密度降低到了1.4×10-13 A/cm2,隐性开路电压可达670 mV,且分布区间更紧凑.在电阻率为1～3 Ω·cm的n型硅片基底上,采用磷离子注入技术工业化生产的n型硅双面太阳电池的正面平均转化效率达到了20.64％,背面平均转化效率达到了19.52％.内量子效率的分析结果显示,离子注入太阳电池效率的增益主要来自长波段光谱响应的提升.     

Development of high‐efficiency large‐area screen‐printed solar cells on direct kerfless epitaxially grown monocrystalline Si wafer and structure

This paper demonstrates the potential of epitaxially grown Si wafers with doped layers for high‐efficiency solar cells. Boron‐doped 239 cm² 180–200 µm thick 2 Ω‐cm wafers were grown with and without 15 µm thick p⁺ layer, with a doping in the range of 10¹⁷~10¹⁸ cm⁻³. A layer transfer process involving porous Si layer to lift off epi‐Si wafers from the reusable substrate was used. The pp⁺ wafers were converted into n⁺pp⁺ passivated emitter rear totally diffused (PERT) cells by forming an oxide‐passivated POCl₃‐diffused n⁺ emitter at the front, and oxide/nitride‐passivated epitaxially grown p⁺ BSF at the entire back, with local screen‐printed contacts. To demonstrate and quantify the benefit of the epi‐grown p⁺ layer, standard passivated emitter and rear cells (PERCs) with local BSF and contacts were also fabricated on p‐type epi‐Si wafers as well on commercial‐grade Cz wafers. Sentaurus 2D device model was used to assess the impact of the epi‐grown p⁺ layer, which showed an efficiency gain of ~0.5% for this PERT structure over the traditional PERC. This was validated by the cell results, which showed an efficiency of ~20.1% for the PERC, and ~20.3% for the PERT cell using epi‐Si wafers. Experimental data showed higher FF in PERT cells, largely because of the decrease in lateral resistance on the rear side. Efficiency gain, a result of higher FF, was greater than the recombination loss in the p⁺ layer because of the lightly doped thick p⁺ epi‐grown region used in this study. Copyright © 2016 John Wiley & Sons, Ltd.     

An optimized rapid aluminum back surface field technique forsilicon solar cells

Screen-printing and rapid thermal annealing have been combined to achieve an aluminum-alloyed back surface field (Al-BSF) that lowers the effective back surface recombination velocity (S_eff) to approximately 200 cm/s for solar cells formed on 2.3 Ω-cm Si. Analysis and characterization of the BSF structures show that this formation process satisfies the two main requirements for achieving low S_eff: (1) deep p⁺ regions and (2) uniform junctions. Screen-printing is ideally suited for fast deposition of thick Al films which, upon alloying, result in deep BSF regions. Use of a rapid alloying treatment is shown to significantly improve the BSF junction uniformity and reduce S_eff. The Al-BSFs formed by screen-printing and rapid alloying have been integrated into both laboratory and industrial-type fabrication sequences to achieve solar cell efficiencies in excess of 19.0 and 17.0%, respectively, on planar 2.3 Ω-cm float zone Si. For both process sequences, these cell efficiencies are 1-2% (absolute) higher than analogous cells made with unoptimized Al-BSFs or highly recombinative rear surfaces     

Towards thinner and low bowing silicon solar cells: form the boron and aluminum co‐doped back surface field with thinner metallization film

Using thinner wafers can largely reduce the cost of silicon solar cells. One obstacle of using thinner wafers is that few methods can provide good dopant concentration for the back surface field (BSF) and good ohmic contact while generated only in low bowing. In this paper, we have demonstrated the screening–printing B and Al (B/Al) mixture metallization film technique, making use of the screen‐printing technique and the higher solubility of B in silicon to form a B/Al‐BSF. This technique can raise the carrier concentration in the BSF by more than one order of magnitude and reduce the back surface recombination at a low firing temperature (≤800 °C). We have also shown that through the new technique, the metallization paste thickness at the rear could be reduced largely, which however did not degrade the solar cell efficiency. All these efforts are aiming for pushing forward the application of thinner wafers. Copyright © 2011 John Wiley & Sons, Ltd.