新型Au-19.25Ag-12.80Ge钎料的制备及性能

Au-Ag-Ge三元相图,制备了新型Au-19.25Ag-12.80Ge(质量分数,%)钎料合金.利用DTA、扫描电镜对钎料的熔化特性及显微组织进行分析,并对其与纯Ni的润湿性加以研究.结果表明:钎料合金熔化温度为446.76～494.40℃.结晶温度区间为47.64℃.焊接温度在510～550℃范围内时,钎料合金与Ni的润湿性较好,同时有润湿环出现;钎料合金与Ni基体之间形成了一条明显的扩散层,能谱分析表明,该扩散层为Ge-Ni金属间化合物.采用先包覆铝热轧再冷轧,结合中间退火的加工工艺可制备厚度0.1mm的钎料薄带.     

Effect of partial melting on superplasticity ofAlNp/6061Al composite

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Effect of indium on the microstructure of the interface between Sn3.13Ag0.74CuIn solder and Cu substrate

Influence of indium in Sn3.13Ag0.74Cu solder containing 4, 15, 30, 50 and 75 at.% In on the microstructure at the solder/Cu interface after wetting at 523 K for 1800 s was studied. The scanning electron microscopy (SEM) combined with energy-dispersive X-ray spectroscopy (EDX), standard and spatially resolved X-ray diffraction (XRD) techniques were used to determine the phases present at the solder/Cu interface. It was found that for In concentration up to 30 at.% the interface is formed by Cu₆Sn₅ phase. For higher In content (50 and 75 at.% In) interface consists of copper rich Cu₄₁Sn₁₁ phase.     

基于CuSi3焊丝的激光熔钎焊钢/铝异种金属工艺分析

采用直径1.6 mm的CuSi3焊丝对钢/铝异种金属进行激光填丝熔钎焊.使用光学显微镜观察了焊缝宏观成形,利用SEM,EDS,XRD分析了接头微观组织,通过原位纳米压痕仪和拉伸试验机测试了接头力学性能.结果表明,采用CuSi3焊丝实现了6061铝合金和镀锌板的激光搭接熔钎焊,优化了工艺参数,获得了成形良好的焊缝.焊缝呈现三个特征区:钢侧界面区、焊缝中心区和铜焊丝/铝过渡区.进一步研究表明,铜焊丝/铝过渡区组织包含Cu₉Al₄和CuAl₂金属间化合物,呈现带状、粗大骨架状、细小骨架状夹杂层片状和树枝状四种形貌.铜焊丝/铝过渡区硬度远高于相邻区域,粗大骨架状区域硬度最高达到9.97 GPa,拉伸断裂于粗大骨架状区域,断口呈现脆性断裂.     

铝/镀锌钢异种金属旁路分流MIG电弧熔钎焊界面区组织与接头性能

以2 mm厚6061铝合金与镀锌钢板为试验材料,进行旁路分流MIG电弧熔钎焊工艺试验.采用金相显微镜、扫描电镜和拉伸试验机对接头组织及力学性能进行研究,分析了不同焊接速度时界面层组织和接头性能的变化规律.结果表明,随焊接速度增加焊接热输入减少,界面温度下降,元素扩散速度降低,导致接头界面结合层变薄.另外接头强度随焊接速度与界面层厚度增加呈现先增加后减小的趋势,最高强度达135.32 MPa.当焊接速度较低时,界面温度高,易形成脆性金属间化合物,导致其接头性能下降;高速焊接时,铝/钢界面反应不充分,甚至存在未钎合和气孔等缺陷,影响了接头性能.     

Selection of soldering temperature for ultrasonic-assisted soldering of 5056 aluminum alloy using Zn-Al system solders

The conditions for sound butt-joints of 5056 aluminum alloy containing 4.6 mass% Mg using Zn-xAl (x = 5, 13, and 38 mass%) solder at the relevant temperatures were investigated. Each solder foil was inserted between faying surfaces of 5056 aluminum rods. Ultrasonic vibration at a frequency of 19 kHz was applied to the faying surfaces through an aluminum substrate at soldering temperatures for 4 s in air. The strength of obtained solder joints was measured by tensile tests. The microstructure in the solder layer after the soldering process was evaluated with an SEM-EDX. The results of tensile tests revealed that joints soldered under the liquidus temperature of Zn-Al solders showed higher strength than joints soldered over the liquidus temperature. In the joints soldered over the solder liquidus temperature, the joint strength decreased with an increase in soldering temperature. It was caused by the formation of MgZn₂ in the solder layer due to dissolution of 5056-Al into the solder liquid during the soldering process. On the other hand, ultrasonic-assisted soldering under the solder liquidus temperature suppressed dissolution of 5056-Al and improved the joint strength by reducing the formation of MgZn₂.     

Sand Abrasive Wear Behavior of Hot Forged Al 6061-TiO2 Composites

Nickel-coated TiO₂ particulate reinforced Al6061 matrix composites developed using the vortex technique were hot forged at a temperature of 500 °C. A constant deformation ratio of 6:1 was adopted. Hot forged Al6061 alloy and Al6061-TiO₂ composites were then subjected to heat treatment by solutionizing at a temperature of 530 °C for duration of 2 h followed by ice quenching. Both natural and artificial aging at 175 °C were performed on the quenched samples from 2 to 8 h duration in steps of 2. Microstructure, microhardness, and dry sand abrasive wear behavior of both matrix alloy and developed composites in both as-forged and heat-treated conditions have been evaluated. Worn surface studies have been carried out using scanning electron microscope. Results have revealed that nickel-coated TiO₂ particles are uniformly distributed through out the matrix alloy. Microhardness of Al6061-TiO₂ composites increases with increase in percentage of reinforcement. Heat-treated forged alloy and its composites possesses higher hardness when compared with the forged composites. Forged Al6061-TiO₂ composites exhibited lower abrasive wear loss when compared with the forged matrix alloy. Heat treatment has a profound effect on the abrasive wear resistance of both as-forged Al6061 alloy and Al6061-TiO₂ composites.     

单辊旋淬Au-19.25Ag-12.80Ge钎料薄带的显微组织与焊接性能

采用单辊旋淬法制备Au-19.25Ag-12.80Ge钎料薄带,利用差热分析仪、SEM及TEM对钎料薄带的熔化特性及显微组织进行了观察分析,并对其与Ni的焊接性能加以研究。结果表明:单辊旋淬法制备Au-19.25Ag-12.80Ge钎料薄带的液相线温度比钎料母合金有所降低,熔化温度区间缩小了约4℃;单辊旋淬工艺使钎料薄带显微组织分布均匀且显著细化,近辊面一侧形成了尺寸40～50nm的纳米晶层,沿薄带厚度方向存在组织突变,这种突变是由存在的临界冷却速度造成的。钎料薄带与Ni基体表面润湿优良,形成了可靠的冶金结合界面,在相同条件下与Ni的焊接接头抗剪强度比钎料母合金形成的焊接接头提高了近60%。     

Redetermination of the Eutectic Composition of the Ni-P Binary Alloy

A series of Ni-P alloys (Ni-rich) have been synthesized and solidified. It is found that the solidification microstructure of the Ni-19.0 at.%P alloy that has long been regarded as the eutectic composition contains many primary phase dendrites besides rod eutectics. In contrast, only rod eutectic microstructure appears in the samples of Ni-19.6 at.%P, and this alloy shows the lowest end temperature of melting among all the compositions investigated. The results indicate that the actual eutectic composition at the Ni-rich part of the Ni-P system is Ni-19.6 at.%P. The eutectic temperature is determined to be about 1163 K by the differential scanning calorimetry analysis.     

挤压复合铸造7075/6061双金属铸锭的界面组织与性能

采用挤压复合铸造工艺制备出具有“半固态组织/枝晶组织”分布特征的7075/6061包覆型双金属复合铸锭,并对复合铸锭界面处的组织及硬度进行了分析。结果表明,界面结合良好,为冶金结合,无杂质和氧化皮存在。界面处组织过渡平缓,7075铝合金固相颗粒呈一定规律性分布;除Zn元素浓度呈明显梯度变化外,其它合金元素分布较均匀。界面大部分由较细小等轴晶组成,且有大量合金元素沉积在晶界处,致使界面处硬度高于两侧金属,硬度最高达63.3 HRB。     

铝/铜异种材料等离子弧熔钎焊搭接接头工艺分析

采用LHM-200等离子弧焊机和Zn-Al钎料对T2紫铜与LF6防锈铝异种材料进行了等离子弧熔钎焊,通过扫描电镜(SEM)和能谱分析仪(EDS)观察分析其接头显微组织和界面元素组成.结果表明,通过合理设置工艺可以得到较为理想的焊接接头,焊缝表面无裂纹、气孔等现象,搭接接头抗剪强度可达175.5 MPa;控制等离子弧焊工艺可以有效控制钎缝成形,提高接头性能,最佳参数范围为等离子气体的流量0.2,0.75 L/min,焊接电流45~55 A,焊接速度1.41~3.03 cm/s;在铜母材与钎料界面处是Al₂Cu和CuZn₂金属间化合物层;而在铝母材与钎料界面处为Al-Zn共晶组织;焊缝中心的是黑白相间的条纹组织,黑区为富铝区,白区为富锌区.     

选区激光熔化成形工艺对2024铝合金组织性能的影响

采用选区激光熔化(Selective Laser Melting,SLM)技术成形了2024铝合金,研究了扫描间隔对显微组织及室温力学性能的影响。结果表明:扫描间隔0.12 mm时,2024铝合金显微组织细小,硬度达124 HB,抗拉强度为372 MPa,具有较高的室温力学性能。     

2024铝合金粉末选区激光熔化成形工艺研究

采用自主研发的金属增材制造设备对2024铝合金粉末进行了选区激光熔化成形,研究了不同工艺参数下该合金的显微组织及室温拉伸性能。结果表明,激光功率为260 W,扫描速度900 mm/s,扫描间隔0.12 mm时,2024铝合金显微组织细小,结构致密,抗拉强度为372 MPa,伸长率为6.1%,具有较高的室温力学性能。     

Generation and characterization of T40/A5754 interfaces with lasers

Laser-induced reactive wetting and brazing of T40 titanium with A5754 aluminum alloy with 1.5 mm thickness was carried out in lap-joint configuration, with or without the use of Al5Si filler wire. A 2.4 mm diameter laser spot was positioned on the aluminum side to provoke spreading and wetting of the lower titanium sheet, with relatively low scanning speeds (0.1–0.6 m/min). Process conditions did not play a very significant role on mechanical strengths, which were shown to reach 250–300 N/mm on a large range of laser power and scanning speeds. In all cases considered, the fracture during tensile testing occurred next to the TiAl₃ interface, but in the aluminum fusion zone. The interfacial resistance was then evaluated with the LASAT bond strength tester, based upon the generation and propagation of laser-induced shock waves. A 0.68 GPa uniaxial bond strength was estimated for the T40/A5754 interface under dynamic loading conditions.     

SnAgCuEr系稀土无铅钎料的显微组织

系统研究了添加微量稀土Er对Sn3.8Ag0.7Cu无铅钎料合金显微组织和性能的影响.试验发现,微量Er的添加,使Sn3.8Ag0.7Cu钎料合金的熔化温度稍有降低,铺展面积有所增加,抗剪强度有所提高.通过显微组织观察,加Er后网状共晶物体积百分比增大,初晶金属间化合物(IMC)的尺寸变小.微量Er抑制了时效过程钎料与铜基体界面IMC层(IML)的增厚,时效400 h后差别更明显,有利于提高钎料接头的可靠性.指出含微量稀土的SnAgCuEr合金是性能优良的无铅钎料合金.     

Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys

Wetting properties of Sn-Zn and Zn-Al alloys on Cu and Al substrates were studied. Spreading tests were carried out for 3 min, in air and under protective atmosphere of nitrogen, with the use of fluxes. In the case of Zn-Al eutectic, spreading tests were carried out at 460, 480, 500, and 520 °C, and in the case of Sn-Zn eutectic at 250, 300, 350, 400, 450, and 500 °C, respectively. Solidified solder/substrate couples were cross-sectioned and subjected to microstructure examination. The spreading tests indicated that the wetting properties of eutectic Sn-Zn alloys, on copper pads do not depend on temperature (up to 400 °C), but in the lack of protective atmosphere, the solder does not wet the pads. Wettability studies of Zn-Al eutectic on aluminum and copper substrates have shown a negative effect of the protective nitrogen atmosphere on the wetting properties, especially for the copper pads. Furthermore, it was noted that with increasing temperature the solder wettability is improved. In addition, densities of liquid solders were studied by means of dilatometric technique.     

62Sn36Pb2Ag钎料中Ag元素对AgCu/SnPbAg/CuBe焊缝性能的影响

分别采用62Sn36Pb2Ag钎料和63Sn37Pb共晶钎料焊接AgCu合金块和CuBe合金片进行试验,对比分析两种钎料形成的焊缝性能和显微组织结构,阐述了62Sn36Pb2Ag钎料中Ag元素的存在对AgCu/SnPbAg/CuBe焊缝性能的影响机制.结果表明,62Sn36Pb2Ag钎料中的Ag元素对于润湿铺展状态的改...     

Research on microstructure in as-cast 7A55 aluminum alloy and its evolution during homogenization

The microstructure of the as-cast 7A55 aluminum alloy and its evolution during homogenization were investigated by means of optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD), and differential scanning calorimetry (DSC) analysis. The results indicate that the microstructure of the as-cast 7A55 aluminum alloy mainly consists of the dendritic network of aluminum solid solution, Al/AlZnMgCu eutectic phases, and intermetallic compounds MgZn2, Al2CuMg, Al7Cu2Fe, and Al23CuFe4. After homogenization at 470°C for 48 h, Al/AlZnMgCu eutectic phases are dissolved into the matrix, and a small amount of high melting-point secondary phases were formed, which results in an increasing of the starting melting temperature of 7A55 aluminum alloy. The high melting-point secondary phases were eliminated mostly when the homogenization time achieved to 72 h. Therefore, the reasonable homogenization heat treatment process for 7A55 aluminum alloy ingots was chosen as 470°C/72 h.     

Formation of the ζ phase at an interface between an Fe substrate and a molten 0.2 mass% Al–Zn during galvannealing

An interstitial free (IF) steel was dipped in a bath of molten Zn containing 0.2 mass% Al. The as-dipped (galvanized) steel was then annealed above the melting point of Zn (galvannealed), say at 773 K, for a period ranging from 1 to 30 s. Evolution of the microstructure of the Zn-containing coating was examined by transmission electron microscopy (TEM) and the chemical composition around the Zn(Al)/Fe interface was analyzed by energy dispersion spectroscopy (EDS) in a dedicated scanning transmission electron microscope (STEM). In the as-dipped (galvanized) steel a continuous layer of Fe₂Al₅ existed at the Zn(Al)/Fe interface, but no Fe–Zn intermetallic compounds were observed. Galvannealing at 773 K for 1 s resulted in the formation of the ζ phase at the Zn(Al)/Fe₂Al₅ interface, which grew at the expense of the Zn(Al) coating during the subsequent galvannealing. Possible mechanisms of nucleation of Fe–Zn intermetallic compounds are discussed.