凸点载带自动焊接工艺(BTAB)实用指南

在混合微电路制造中已经用过好几种群焊接技术来取代线焊法,但至今还没有一种达到普遍接受程度。近几年来,载带技术,典型的称为载带自动焊接工艺(简称 TAB 工艺),获得人们的重视。凸点载带自动焊接工艺(简称 BTAB 工艺)是一项新的发展,它除了保留常规 TAB 工艺的优点外,还具有自己的特色,能与常规铝金属化集成电路芯片很好的配合。本文从混合微电路生产实际和性能角度出发来介绍 BTAB 工艺目前的发展情况。     

TAB OLB工艺在LCM制造中的应用

本文介绍了TAB器件及其制造工艺，通过讲述ACF特性，细致地阐述了TABOLB的工艺原理及参数设定方法，并对工艺中容易出现的不良现象进行了分析。     

大型液晶显示用COF带的现状和未来

概述了从TAB带到COF带的转换,大型LCD用的COF带的微细线路形成技术和高可靠性技术以及COF带制造技术的未来。     

解析从BMS模式下,电视产业链的巨变

一、产业链的剧烈整合-从合资LCM走向BMS经营模式电视产业由2008年后开始兴起合资LCM的经营策略,原因来自于中国彩电品牌厂商希望藉由进入上游产业链,降低生产制造成本,探询合作的面板厂商,     

基于FPGA的高清LCM在线检测仪设计

针对LCM的生产测试要求,设计了一种基于FPGA的高清LCM在线检测仪,该仪器具有体积小、 成本低、 操作简单、 兼容性和可扩展性强等优点.该系统分为软件和硬件两大部分:上位机软件负责在线配置硬件,硬件部分以FPGA为控制核心,负责产生相应LCM所需要的驱动信号,最终显示LCM特定的测试图片.经实验调试分析发现,本LCM在线检测仪可以实现脱机下的LCM驱动显示,支持RGB、LVDS、MIPI等主流的显示接口,并可驱动分辨率在2560×1600以内的高清LCM的显示测试.     

载带焊接混合集成电路引线成型及外引线焊接图形的设计

引言最近,载带自动焊接(TAB)工艺的进展,使得混合集成电路的组装自动化有了可能。由于混合集成电路的产量一般说来都比较低,至少与单片电路相比是低的,这样,在自动化方面就会碰到一些基本的问题。因为 TAB 组装设备的成本高、各种不同尺寸芯片的品种多,所以必须进行一定程度的标准化,以使 TAB 工艺经济上行之有效,它在成本方面的最大的潜在优点是芯片在组装前可以进行预测,这一点是 TAB 工艺设备昂贵所抵销不了的。     

钉头金凸点芯片用于TAB技术的研究

本文介绍使用超声金丝球焊接机形成的钉头金凸点焊接载带内引线的工艺过程,通过环境应力试验证明该技术可以满足TAB技术中芯片凸点的制作。     

互连技术

半导体封装技术中的电气互连技术，有引线接合法、TAB（带载自动安装）、FC技术等。这个技术的主体为PKG，从模块封装的现状分析，TAB、FC封装需要与采用形成精细图形的技术相配合。     

发展TAB的新途径

<正> 最近,加利福尼亚北部的三家公司Ele-ctronics、Indy Electronics和Olin Mesa,宣布组成联合体。目的是加速电子工业TAB(载带自动焊)的推广应用。联合体集每家公司TAB技术专长于一体,形成TAB技术承包组装服务整体。他们     

TAB/COF带载体和表面处理技术

概述了电子元件搭载用TAB/COF带载体的制造方法和构造,以及最新带载体的表面处理开发例。     

Characteristic study of anisotropic-conductive film for chip-on-film packaging

Chip-on-film (COF) is a new technology after tape-automated bonding (TAB) and chip-on-glass (COG) in the interconnection of liquid crystal module (LCM). The thickness of the film, which is more flexible than TAB, can be as thin as 44 μm. It has pre-test capability, while COG does not have. It possesses great potential in many product fabrication applications.In this study, we used anisotropic-conductive film (ACF) as the adhesive to bind the desired IC chip and polyimide (PI) film. The electric path was formed by connecting the bump on the IC and the electrode on the PI film via the conductive particles in the ACF. In the COF bonding process experimental-design method was applied based on the parameters, such as bonding temperature, bonding pressure and bonding time. After reliability tests of (1) 60 °C/95%RH/500 h and (2) −20 to 70 °C/500 cycles, contact resistance was measured and used as the quality inspection parameter. Correlation between the contact resistance and the three parameters was established and optimal processing condition was obtained. The COF samples analyzed were fabricated accordingly. The contact resistance of the COF samples was measured at varying temperature using the four points test method. The result helped us to realize the relationship between the contact resistance and the operation temperature of the COF technology. This yielded important information for circuit design.     

双工位FOG邦定机的设计

随着全球的LCM制造业的迅速发展,LCM专用设备已日益受到制造商的高度重视.介绍了双工位FOG邦定机的主要特点和技术指标,分析了设备的机械结构以及控制系统的硬件和软件的设计.     

Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability

Tape automated bonding (TAB) is a widely used interconnection technology for high-pincount and fine-pitch IC packaging. In this study, a three-dimensional computational model was developed for analyzing TAB inner lead bonding (ILB) process. This experimental study on the thermomechanical properties of copper leads was achieved using high precision micro-force tensile tests. A stress–stain relation between the copper lead and different temperature ranges was successfully implemented into the finite element model to study large plastic deformation in ILB formation. The resulting ILB lead profile and bump sinking values obtained from the simulations agreed well with the experimental observations from actual manufacturing data with the same bonding parameters. The tool position and lead length effects are analyzed to study the residual stress distribution after ILB. A 10-lead model was developed to study how the tool tip profile and planarity ‘angle affect the co-planarity between the bonding tool and the stage. The numerical results show that the permissible tool profile variance should not exceed 1.25 μm and the acceptable planarity angle is 0.005° to achieve the minimum bump deformation requirement.     

Ligand Shell Engineering to Achieve Optimal Photoalignment of Semiconductor Quantum Rods for Liquid Crystal Displays

The photoalignment process to align semiconductor quantum rods (QRs) in the liquid crystal monomer (LCM) matrix is a flexible technology; however, the optical quality of the resulting enhancement films drops at high concentrations of the QRs. The compatibility between the ligand shell on the QRs and the LCM plays an important role in avoiding this issue. Herein, several kinds of ligand shells on the rod‐in‐rod CdSe/CdS QRs are designed, without affecting the optical properties of QRs, and their compatibility with LCM molecules is studied. Promesogenic dendritic ligands in combination with relatively short alkylphosphonic acids are found to provide the highest optical quality, without QR aggregation, and so the high brightness of the resulting enhancement films, even at higher concentrations of QRs in LCM, which is perfectly suitable for the application in liquid crystal displays.     

激光捕获显微切割分离脑微血管及其蛋白质组学体系的建立

目的：探讨应用激光捕获显微切割（laser capture microdissection,LCM）技术分离脑微血管及双向凝胶电泳（two-dimensional gel electrophoresis,2-DE）研究微血管蛋白质的方法及可行性。方法：将新鲜大鼠脑皮质常规制备冰冻切片,采用快速免疫组织化学染色,应用LC...     

Ultra CSPTM-a wafer level package

There has been a significant amount of work over the past five years on chip scale packaging. The majority of this work has been an extension of conventional integrated circuit (IC) packaging technology utilizing either wire bonders or tape automated bonding (TAB)-type packaging technology. Handling discrete devices during the IC packaging for these type of chip scale packages (CSPs) has resulted in a relatively high cost for these packages. This paper reports a true wafer level packaging (WLP) technology called the Ultra CSP^TM. One advantage of this WLP concept is that it uses standard IC processing technology for the majority of the package manufacturing. This makes the Ultra CSP ideal for both insertion at the end of the wafer fab as well as the facilitation of wafer level test and burn-in options. This is especially true for dynamic random access memory (DRAM) wafers. Wafer level burn-in and wafer level processing can be used for DRAM and other devices as a way to both reduce cost and improve cycle time. Thermal cycling results for Ultra CSPs with a variety of package sizes and input/output (I/O) counts are presented. These test vehicles, assembled to FR-4 boards without underfill, cover a range of footprints typical of flash memory, DRAM and other devices. The electrical and thermal performance characteristics of the Ultra CSP package technology are discussed     

Applications of magnetic levitation-based micro-automation insemiconductor manufacturing

It is pointed out that the demands for precision and speed in manufacturing processes in the semiconductor industry are not well suited to traditional, large-scale approaches to automation. Consideration of several microautomation approaches has led to the development of a magnetic levitation-based system capable of three-dimensional motions. Such systems are able to move quickly and precisely, and can deliver prescribed forces and moments. Several significant applications of magnetic levitation-based microautomation in semiconductor manufacturing have been identified. These include positioning operations at various scales, such as mask alignment, hybrid circuit assembly, and transport between process stations. Other applications are analytical probing, nondestructive tape automated bonding (TAB) bond testing, and optical system alignment. A prototype system capable of high-speed four-degree-of-freedom motions with 0.5-μm accuracy over small workspaces has been demonstrated     

早期流产组织冰冻切片中胚胎成分的分离检验

目的：建立激光捕获显微切割技术与低体积扩增技术联用,进行冰冻切片上胚胎与母体成分DNA的分离检验技术。方法：制备早期流产组织冰冻切片,通过激光捕获显微切割胚胎绒毛细胞,设置10,20,30个细胞数目梯度,比较各组胚胎成分DNA的STR分型的检出率、等位基因丢失率和非特异性扩增情况。最后进行实际样本应用。结果：捕获10个胚胎绒毛细胞即可获得Identifier试剂完整的STR分型。冰冻切片捕获30个细胞数目组的检出率较高,等位基因丢失率和非特异性扩增率较低。结论：激光捕获显微切割技术联用低体积扩增技术可应用于胚胎与母体成分DNA的精确分离和检验。