Microstructure and properties of W-15Cu alloys prepared by mechanical alloying and spark plasma sintering process

W-15Cu composite powders prepared by mechanical alloying （MA） of raw powders were consolidated by spark plasma sintering （SPS） process at temperature ranged 1 230-1 300 ℃ for 10 min and under a pressure of 30 MPa. By using high energy milling, particles containing very fine tungsten grains embedded in copper, called composite particles, could be produced. The W grains were homogeneously dispersed in copper phase, which was very important to obtain W-Cu alloy with high mechanical properties, fine and homogeneous microstructure. The microstructure and properties of W-15Cu alloys prepared by SPS processes at different temperature were researched. The results show that W-15Cu alloys consolidated by SPS can reach 99.6 % relative density, and transverse rupture strength （TRS） is 1 400.9 MPa, Rockwell C hardness （HRC） is 45.2, the thermal conductivity is 196 W/m-K at room temperature, the average grain size is less than 2 μm, and W-15Cu alloy with excellent properties, homogeneous and fine microstructure is obtained.     

机械合金化时间对FeSiAlCr合金微粉电磁特性的影响

以分析纯Fe、Si、Al、Cr粉为原料,采用机械合金化法制备FeSiAlCr合金微粉.利用X射线衍射仪、扫描电镜和微波矢量网络分析仪分别研究了球磨后微粉的形貌、相结构及电磁参数,计算了微粉的微波反射率.结果表明:采用机械合金化方法,球磨时间为80 h时制备得到的FeSiAlCr合金微粉呈细片状,颗粒尺寸约为3umn左右...     

Preparation and properties of 4.25Cu-0.75Ni/NiFe_2O_4 cermet

1INTRODUCTION NiFe2O4cermets,whichareexpectedtobe usedastheinertanodesforaluminumelectrolysis, havelowcorrosionandoxidation,goodelectricalconductivityandhighthermalshockresistance[15]. Nickelferritespinelformsacorrosion resistant networkthatcontainstheelectricallyconductivecopper basedmetallicphase.Especially,Gregget al[6]foundacermetofNiFe2O4 18%NiO 17%Cu (massfraction),whichshowedfavorablecorrosion andconductivitypropertiesasinertanodesinsmalllaboratorycells.However,itwasalsoshowedth…     

过共品铸造Al-Si—Cu—Mg—Fe合金组织性能研究

通过正交试验和单因素试验,考察了Cu、Mg、Zn、Ni和Fe对Al—18Si过共晶铝硅合金室温及高温（350℃）力学性能的影响规律,利用光学金相显微镜（OM）、扫描电镜（SEM）、能谱分析仪（EDX）对合金中富Cu相、富Fe相的组织组成进行了分析．结果表明：Cu、Mg是提高AI-18Si过共晶铝硅舍金室温及高温强度的主要因素;Zn含量增加明显降低合金350℃时的高温强度,改善合金的室温和高温延伸率;Fe降低合金的室温强度,显著提高合金的高温强度;当Cr：Fe=0．35：1,Mn：Cr=2：1,含铁0．8％～1．2％时,Al-18Si-4．0Cu-0．7Mg-0．2Zn-1.0Ni-（0．8～1．2）Fe合金力学性能σb（25℃））310MPa,延伸率受（25℃）≥0．75%,σb（350℃）〉130MPa,延伸率δs（35℃）〉1．5％;合金中富铜相主要以块状Al。Cu相和白灰色花卉状A15Si。cu2Mg8相存在,富铁相主要以三叶草状、树枝状和棒状Al5Si（Cr,Mn,Fe）相存在．     

Evolution of surface microstructure of Cu-50Cr alloy treated by high current pulsed electron beam

A Cu-50Cr alloy was treated by the high current pulsed electron beam(HCPEB)at 20 and 30 ke V with pulse numbers ranging from 1 to 100.Surface morphologies and microstructures of specimens before and after the treatments were investigated by employing scanning electron microscopy and X-ray diffraction.Results show that the HCPEB technique is able to induce remarkable surface modifications for the Cu-50Cr alloy.Cracks in Cr phases appear even after one-pulse treatment and their density always increases with the pulse number.Formation reason for these cracks is attributed to quasi-static thermal stresses accumulated along the specimen surface.Craters with typical morphologies are formed due to the dynamic thermal field induced by the HCPEB and they are found to prefer the sites near cracks or boundaries between neighboring Cr phases.Another microstructural characteristic produced by the HCPEB is the fine Cr spheroids,which are determined to be due to occurrence of liquid phase separation in the Cu-50Cr alloy.Finally,a general microstructural evolution profile that incorporates various HCPEB-induced surface features is tentatively outlined.     

Microstructure and mechanical propertiesof spray-deposited Al-Si-Fe-Cu-Mg alloy containing Mn

Al-20Si-5Fe-3Cu-1Mg alloy was synthesized by the spray atomization and deposition technique. The microstructure and mechanical properties of the spray deposited hypereutectic Al-Si alloy were studied using optical microscopy, scanning electron microscopy, X-ray diffraction, TEM (Transmission Electron Microscope) and HREM (High-resolution Electron Microscope), DSC (Differential Scanning Calorimetry), microhardness measurement, and tensile tests. The effects of Mn on the microstructural evolution of the high-silicon aluminum alloy after extrusion and heat treatment have been examined. The results show that two kinds of phases, i. e. S (Al2CuMg) and σ(Al5Cu6,Mg2), precipitated from matrix and improved the tensile strength of the alloy efficiently at both the ambient and elevated temperatures (300℃). The tensile test results indicate that the spray-deposited Al-20Si-5Fe-3Cu-1Mg alloy has better strength than the powder metallurgy processed Al-20Si-3Cu-1Mg alloy at elevated temperature.     

Microstructural Characteristics of CuCr50 Alloy by Laser Refining

An investigation conceming the thecrostructural characterization of CuCr50 alloy layer by laser surface refining on the powder metallurgy substrate was carried out Significant refined procutectic chromium crystals distributed in an Cr-rich eutectic and high mutual solubility of Cu and Cr elements in the CuCr50 alloy were exam ined by Backscattered Eectron Imaging (BEI) and Energy Dispersive X-ray Spectrum (EDS) techniques. The results show that surface refining and alloying by high-power laser have a great potential to develop new and high performance alloys in the immiscible and limited solubility systems like Cu-Cr and other similar alloy systems.     

Interfacial microstructure of Cu Cr/1Cr18Ni9Ti bi-metal materials and its effect on bonding strength

The Cu Cr/1Cr18Ni9 Ti bi-metal materials were prepared by the solid-liquid bonding method. The microstructures, mechanical properties and formation mechanism of the bonding interface were studied. The results show that there exists a serrated transition layer with a certain width at the interface of Cu Cr/1Cr18Ni9 Ti bi-metal materials, and the transition layer consists of Fe-based and Cu-based solid solutions. The elastic modulus and hardness reach the maximum values at the interface closing to the 1Cr18Ni9 Ti zone. The bonding temperature has a significant effect on the width and morphology of the transition layer. The interfacial bonding strength is at least 30% higher than that of the Cu Cr alloy, and the tensile fracture occurs at the side of the Cu Cr alloy rather than at the bonding interface.     

Preparation and properties of 4.25Cu-0.75Ni／NiFe2O4 cermet

4.25Cu-0.75Ni/NiFe₂O₄ cermets were prepared by doping NiFe₂O₄ ceramic matrix with the mixed powders of Cu and Ni or Cu-Ni alloy powder as the electrical conducting metallic elements. The effects of technological parameters, such as the adding modes of metallic elements, the ball milling time, the sintering time and the sintering temperature, on the relative density and resistivity of the cermets were studied. The results show that the resistivity of 4.25Cu-0.75Ni/NiFe₂O₄ cermets decreases with increasing temperature, and has a turning point at 590 °C, which is similar to that of NiFe₂O₄ ceramic. The sintering temperature and adding modes of metallic elements have a great influence on the properties of 4.25Cu-0.75Ni/NiFe₂O₄ cermets. When the sintering temperature increases from 1200 °C to 1300 °C, the relative density increases from 89.86% to 95.33%, and the resistivity at 960 °C decreases from 0.11 Ω · cm to 0.03 Ω · cm, respectively. When the metallic elements are added with the mixed powders of Cu and Ni, the cermets of finely and uniformly dispersed metallic phase, high density and electric conductivity are obtained. The relative density and resistivity at 960 °C are 90.23% and 0.04 Ω · cm respectively for the cermet samples sintered at 1200 °C for 2 h, which are both better than those of the cermets prepared under the same technique conditions but with the metallic elements added as 85Cu-15Ni alloy powders. Foundation item: Project (G1999064903) supported by the National Key Fundamental Research and Development Program of China; project(2001AA335013) supported by the National High Technology Research and Development Program of China; project (50204014) supported by the National Natural Science Foundation of China     

Synthesis of nanocrystalline NiCrC alloy feedstock powders for thermal spraying by cryogenic ball milling

Nanocrystalline NiCrC alloy powders with a qualified particle size distribution for thermal spraying were synthesized us-ing the cryogenic ball milling (cryomilling) method.The morphology,microstructure,size distribution,and phase transformation of the powders were characterized by scanning electron microscopy (SEM),laser scattering for particle size analysis,X-ray diffraction (XRD),and transmission electron microscopy (TEM).After cryomilling for 20 h,the average grain size of the as-milled powders ap-proached a constant value of 30 nm by XRD measurement.The average particle size slightly increased from 17.5 to 20.3 μm during the 20-h milling.About 90vo1% of the powders satisfied the requirement for thermal spraying with the particle dimension of 10-50 grn,and most of the powders exhibited spherical morphology,which were expected to have good fluidity during thermal spraying.The Cr2O3 phase formed during the cryomilling process as revealed in the XRD spectra,which was expected to enhance the thermal stability of the as-milled powders during the followed thermal spraying or other heat treatment.     

纳米氧化铝颗粒增强铜-碳基复合材料的磨损性能

用MA技术制备了C体积分数为10%的Cu-C固溶体粉体,用溶胶-凝胶(sol-gel)烧结技术制备了平均尺寸为12 nm的γ-Al2O3颗粒和用SPS方法制备了纳米Al2O3颗粒增强Cu-C固溶体基复合材料。采用X射线衍射仪对MA粉体、干凝胶和煅烧粉体进行了物相分析;通过JSM-5500LV型扫描电镜对磨损表面形貌进行观察分析并分析其磨损机制;使用MG-2000型高温摩擦磨损试验机对制备的复合材料进行了干摩擦实验并测定其磨损量。结果表明:纳米氧化铝颗粒体积分数及磨损载荷对复合材料摩擦磨损特性有显著影响,纳米氧化铝的体积分数从0%增加到2%,Cu基复合材料的磨损量从6.2 mg降到2.1 mg。     

Cu-Zr合金定向凝固组织的研究

采用定向凝固方法制备了Cu 12 .2 5Zr自生复合材料,并通过扫描电镜(SEM)、透射电镜(TEM)和X射线衍射等方法对定向凝固组织进行了研究.结果表明,在温度梯度一定的前提下,生长速度对定向凝固组织的形貌有着重要的影响,随着生长速度的增加,凝固组织由层片状依次转化为棒状、树枝状和集群状组织;在所制备的Cu 12 .2 5Zr自生复合材料中,第2相主要是Cu5Zr,并且Cu5Zr与基体α(Cu)之间存在着一定的取向关系,另外还有少量的Cu8Zr3 相和Cu10 Zr7相;在Cu 12 .2 5Zr合金枝晶端部存在明显的Zr元素富集.     

喷射沉积含Sc超高强铝合金固溶处理组织与性能分析

采用金相、扫描电镜、X射线衍射分析方法,研究了不同工艺条件下喷射沉积Al-12Zn-2.4Mg-1.1Cu-0.20Zr-0.30Sc-0.30Ni合金的微观组织与力学性能.结果表明,过喷粉颗粒的大小为3~15μm,是沉积坯等轴晶平均直径的1/6~3/4;挤压坯经460℃/0.5 h+480℃/2 h二级固溶处理后Zn,Mg,Cu等溶质元素回溶到Al基体中,固溶后未见形成W(ScCu6.6~4Al5.4~8)相,合金抗拉强度由挤压态的410 MPa增加到固溶态的750 MPa,增幅为82.9%;再经T6时效后合金的抗拉强度可达855 MPa.凝固过程形成的粗大难溶DO23结构Al3(Sc,Zr)粒子是影响合金抗拉强度的重要原因.     

一种高硬度铸造镁合金

设计了一种成分（质量分数/%）为Mg-8Zn-6Al-3Cu-3Ca-1.5Mn-1Si的合金,利用金相显微镜、扫描电镜、X射线衍射和维氏硬度计研究了自然冷却、快速冷却及时效处理对合金显微组织和硬度的影响.Mg-8Zn-6Al-3Cu-3Ca-1.5Mn-1Si合金慢冷组织主要由α-Mg、Mg2Cu6Al5、CaMgSi、Mg2Zn3等相构成,没有出现Mg17Al12相.合金经快冷后,抑制了第二相从基体中的析出;时效10 h后,CaMgSi相以细小的块状相均匀析出.合金具有较高的硬度值,在时效时间10 h时最大HV值达到111.     

Effect of electric field on the activity and quenching structure of liquid Cu-Al alloys

The activity coefficient of A1 in molten Cu decreases with the increasing of electric current applied to the liquid alloy of Cu-0.2wt%Al. To investigate the mechanism, the quenching experimental results of the liquid A1-Cu alloy show that there is a remarkable change in structure, in which the solute congregates along the current direction especially for DC current. The mechanism of the activity coefficient change of A1 in molten Cu-0.2wt%Al alloy treated by electrical field was discussed. Further, the results also provide an evidence for the short-range-ordered liquid metal.     

机械合金化制备Mg-Cu非晶合金粉末的机理研究

采用XRD和TEM研究了MgCu2和Mg58Cu42混合粉末在机械合金化过程中的结构变化。结果表明:Mg、Cu粉末在机械合金化过程中是互溶的,机械合金化可以大大提高它们之间的固溶度;球磨过程中,Mg原子逐步溶入Cu基体中,形成Mg在Cu中的过饱和固溶体;固溶体的变形能量积聚到很大时,发生固溶体晶体结构的失稳,最后形成非晶态合金。在相同的球料比的条件下,提高球磨转速,可以大大促进非晶化的形成过程,缩短非晶形成的时间。     

Cu—Sn合金共还原法制备及电化学性能研究

采用共还原沉淀法制得Cu-Sn合金负极材料Cu6Sn5和Cu6Sn4,并分别进行不同时间的时效处理,对所得样品进行XRD分析、场发射SEM图像观察和恒流充放电性能测试。结果表明,随着时效时间的延长,样品相组成的均质性和电化学活性都得到了提高,300min时效处理的Cu6Sn5和Cu6Sn4试样的第一周比容量分别为267．5mA·h／g和342．0mA·h／g,比20min时效处理试样相应值分别增加了12．7％和17．4％。另外,增加惰性元素Cu的含量,也会改善舍金的电化学性能,增加其循环稳定性。     

High temperature scaling of Ni-15Cu-5Al alloy in 1 × 105 Pa pure oxygen

The oxidation of the ternary alloy Ni-15Cu-5Al in 1 × 105 Pa pure oxygen at 700 ℃ and 800 ℃ was studied. The results show that the behavior of the Ni-rich alloy is similar to that of the binary Ni-Al alloy with the same Al content in the form of an external NiO layer coupled to the internal oxidation of aluminium. The presence of 15%(mole fraction) Cu cannot modify substantially the values of relevant parameters affecting the transition from the internal to the external oxidation of aluminium. The presence of 5 % Al reduces the oxidation rate of the corresponding Ni-Cu alloy during the whole oxidation stages, though 5 % Al is still insufficient to form protective external alumina scales.     

Existing form and action mechanism of minor scandium and zirconium in Al-Cu-Mg alloy

In order to investigate the existing form and action mechanism of minor scandium (Sc) and zirconium (Zr) in Al-Cu-Mg alloy, microstructures of Al-4Cu-1Mg-Sc-Zr alloy under different conditions, including states of as-cast, homogenized, hot-rolled, as-solution and natural aged, were observed by scanning electron microscopy (SEM), X-ray diffractometry (XRD) and transmission electron microscopy (TEM). It is revealed that Sc and Zr are completely dissolved into the supersaturated solid solution in as-cast ingot...     

Sol－Gel法制备YBa_2Cu_3O_（7－x）超细粉末研究

用柠檬酸盐作螯合剂，用氨水调节溶液的酸度，通过Ｓｏｌ－Ｇｅｌ转变制得了粒径为１００ｎｍ大小的ＹＢａ２Ｃｕ３Ｏ（７－ｘ）超细粉末，对ＹＢａ２Ｃｕ３Ｏ（７－ｘ）在合成反应中溶胶的形成和凝胶聚合过程进行了研究和探讨。Ｓｏｌ－Ｇｅｌ法制得的ＹＢａ２Ｃｕ３Ｏ（７－ｘ）超细粉末在粒度、纯度、烧结特性和超导性能上，均优于固态反应合成方法。