The curing of UF resins studied by low‐resolution 1H‐NMR

A series of UF resins and one MUF resin were studied by low‐resolution ¹H‐NMR. The mobility of the resin during curing could be followed by measuring the spin‐spin relaxation time (T₂) with curing time. The relative curing behavior was similar to that found by traditional gel time measurements. In addition, extra features in the T₂ plots with curing time showed at what point the bulk of the condensation reactions took place. The speed of cure was also related to the chemical groups in the liquid resin, and it was found that the linear methylol groups were mainly responsible for the curing speed of the resins. By studying the curing with different hardener levels and glue concentrations it was found that a UF resin is more sensitive to the glue mix concentration than an MUF resin. A cured resin was also studied after curing to investigate postcuring effects. Water seemed to play the biggest role in the postcure, with substantial amounts present immediately after cure, which decreased with curing time and aging. For the low mol ratio resins studied here further curing reactions did not seem to play a major role in the post curing phenomenon. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 754–765, 2000     

The study of poly(styrene‐co‐p‐(hexafluoro‐2‐hydroxylisopropyl)‐α‐methylstyrene)/poly(ethylene oxide) blends

Different hydroxyl content poly(styrene‐co‐p‐(hexafluoro‐2‐hydroxylisopropyl)‐α‐methylstyene) [PS(OH)‐X] copolymers were synthesized and blends with 2,2,6,6‐tetramrthyl‐piperdine‐1‐oxyl end spin‐labeled PEO [SLPEO] were prepared. The miscibility behavior of all the blends was predicted by comparing the critical miscible polymer–polymer interaction parameter (χ_crit) with the polymer–polymer interaction parameter (χ). The micro heterogeneity, chain motion, and hydrogen bonding interaction of the blends were investigated by the ESR spin label method. Two spectral components with different rates of motion were observed in the ESR composite spectra of all the blends, indicating the existence of microheterogeneity at the molecular level. According to the variations of ESR spectral parameters T_a, T_d, ΔT, T_50G and τ_c, with the increasing hydroxyl content in blends, it was shown that the extent of miscibility was progressively enhanced due to the controllable hydrogen bonding interaction between the hydroxyl in PS(OH) and the ether oxygen in PEO. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 2312–2317, 2004     

Study of miscibility enhancement in poly(styrene‐co‐4‐vinylphenol)/poly(ethylene oxide) blends by the spin labelling method

The electron spin resonance (ESR) spectra of end‐group spin labelled poly(ethylene oxide) (SLPEO) using 2,2,6,6‐tetramethyl‐piperdine‐1‐oxyl nitroxide and its blends with poly(styrene‐co‐4‐vinylphenol) (STVPhs) of different hydroxyl contents were recorded over a wide temperature range. For a blend of SLPEO and pure polystyrene (PS), the ESR spectrum was composed of a single motion component, indicating that PS was immiscible with PEO. For blends composed of SLPEO and different‐hydroxyl‐content STVPhs, two spectral components with different motion rates were observed over a certain temperature range. The difference between the motion rates should be attributed to micro‐heterogeneity in the blends, with the faster rate corresponding to a nitroxide radical motion trapped in the PEO‐rich domain and the slower rate corresponding to a nitroxide radical motion trapped in the STVPh‐rich domain. Variations in the values of a number of the ESR parameters (T_a, T_d and T_50G) and the apparent activation energy (E_a) with hydroxyl content in the blends indicated that the miscibility of the blends increased with increasing hydrogen‐bonding density due to specific interactions between the hydroxyl groups in STVPh and the ether oxygens in PEO. Copyright © 2004 Society of Chemical Industry     

13C‐NMR study on cure‐accelerated phenol‐formaldehyde resins with carbonates

Both liquid‐ and solid‐state carbon‐13–nuclear magnetic resonance (¹³C‐NMR) spectroscopies were used to investigate the cure acceleration effects of three carbonates (propylene carbonate, sodium carbonate, and potassium carbonate) on liquid and cured phenol‐formaldehyde (PF) resins. The liquid‐phase ¹³C‐NMR spectra showed that the cure acceleration mechanism in the propylene carbonate‐added PF resin seemed to be involved in increasing reactivity of the phenol rings, whereas the addition of both sodium carbonate and potassium carbonate into PF resin apparently resulted in the presence of ortho–ortho methylene linkages. Proton spin‐lattice rotating frame relaxation time (T_1ρH) measured by solid‐state ¹³C cross polarization/magic‐angle spinning NMR spectroscopy was smaller for the cure‐accelerated PF resins than that of the control PF resin. The result indicated that the cure‐accelerated PF resins are less rigid than the control PF resin. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 1284–1293, 2000     

13C‐NMR study on cure‐accelerated phenol–formaldehyde resins with carbonates

Both liquid‐ and solid‐state ¹³C‐NMR spectroscopies were employed to investigate the cure‐acceleration effects of three carbonates [propylene carbonate (PC), sodium carbonate (NC), and potassium carbonate (KC)] on liquid and cured phenol–formaldehyde (PF) resins. The liquid‐phase ¹³C‐NMR spectra showed that the cure‐acceleration mechanism in the PC‐added PF resin seemed to be involved in increasing reactivity of the phenol rings, while the addition of both NC and KC into PF resin apparently resulted in the presence of ortho–ortho methylene linkages. Proton spin‐lattice rotating frame relaxation time (T_1ρH) measured by solid‐state ¹³C‐CP/MAS‐NMR spectroscopy was smaller for the cure‐accelerated PF resins than for that of the control PF resin. The result indicated that cure‐accelerated PF resins are less rigid than the control PF resin. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 841–851, 2000     

Synthesis,thermal properties,and flame retardance of phosphorus‐containing epoxy‐silica hybrid resins

A novel epoxy resin modifier, phosphorus‐containing epoxide siloxane (DPS) with cyclic phosphorus groups in the Si O network, was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) with polyhedral‐oligomeric siloxanes, which was synthesized by the sol–gel reaction of 3‐glycidoxypropyltrimethoxysilane. DPS was confirmed by Fourier transform infrared and ²⁹Si NMR measurement, and then was employed to modify epoxy resin at various ratios, with 4,4‐diaminodiphenyl‐methane as a curing agent. In order to make a comparison, DOPO‐containing epoxy resins were also cured under the same conditions. The resulting organic–inorganic hybrid epoxy resins modified with DPS exhibited a high glass transition temperature (T_g), a good thermal stability, and a high limited oxygen index. In addition, the tensile strength of cured products was also rather desirable. POLYM. COMPOS., 2010. © 2009 Society of Plastics Engineers     

Synthesis,thermal properties,and flame retardance of the epoxy‐silsesquioxane hybrid resins

Epoxy/silsesquioxane‐OH (EP‐SDOH, ED) hybrid resins were prepared from cyclohexyl‐disilanol silsesquioxane (SDOH) and diglycidyl ether of bisphenol A via the reaction between silanol and the oxirane group, with the cobalt naphthanate as a catalyst. It was found that incorporation of SDOH allows the reaction between oxirane ring and Si? OH, and the silsesquioxane cage structure can be the main chain or as the side chain of the hybrid resin. The EP‐SDOH hybrid resins with various SDOH contents were cured by 4,4′‐diaminodiphenylsulphone, and the curing reaction was investigated by differential scanning calorimetry. The curing characteristics of EP‐SDOH hybrids had been observed to be influenced by the content of SDOH in the hybrid. The differential scanning calorimetry thermograms indicated that the EP‐SDOH hybrid exhibited a higher initial temperature, peak temperature, as well as final temperature than those of the pure epoxy resin when cured by the same curing agent 4,4′‐diaminodiphenylsulphone. The curing kinetic parameters were calculated by using the Ozawa method and the results indicated that EP‐SDOH hybrids possess the same curing mechanism as the pure epoxy resin. The properties of the cured EP‐SDOH hybrid resins such as the glass transition temperature (T_g), dynamic mechanical analysis, thermal stability, as well as the flame retardance were also investigated, and the results showed that introducing silsesquioxane‐OH unit into epoxy resin successfully modified the local structure, made the chain stiffness, restrict the chain mobility, and eventually improved thermal stability and flame retardance of epoxy resin. POLYM. ENG. SCI., 47:225–234, 2007. © 2007 Society of Plastics Engineers.     

Synthesis of a novel phosphorus‐containing dicyclopentadiene novolac hardener and its cured epoxy resin with improved thermal stability and flame retardancy

A novel phosphorus‐containing dicyclopentadiene novolac (DCPD‐DOPO) curing agent for epoxy resins, was prepared from 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) and n‐butylated dicyclopentadiene phenolic resin (DCPD‐E). The chemical structure of the obtained DCPD‐DOPO was characterized with FTIR, ¹H NMR and ³¹P NMR, and its molecular weight was determined by gel permeation chromatography. The flame retardancy and thermal properties of diglycidyl ether bisphenol A (DGEBA) epoxy resin cured with DCPD‐DOPO or the mixture of DCPD‐DOPO and bisphenol A‐formaldehyde Novolac resin 720 (NPEH720) were studied by limiting oxygen index (LOI), UL 94 vertical test and cone calorimeter (CCT), and differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. It is found that the DCPD‐DOPO cured epoxy resin possess a LOI value of 31.6% and achieves the UL 94 V‐0 rating, while its glass transition temperature (T_g) is a bit lower (133 °C). The T_g of epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 increases to 137 °C or above, and the UL 94 V‐0 rating can still be maintained although the LOI decreases slightly. The CCT test results demonstrated that the peak heat release rate and total heat release of the epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 decrease significantly compared with the values of the epoxy resin cured by NPEH720. Moreover, the curing reaction kinetics of the epoxy resin cured by DCPD‐DOPO, NPEH720 or their mixture was studied by DSC. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44599.     

Nanocomposites from phenolic resin and various organo‐modified montmorillonites: Preparation and thermal stability

Phenolic resin (PF)/montmorillonite (MMT) nanocomposites have been successfully prepared using intercalative polymerization of resole‐type phenolic resins in montmorillonites modified by octadecylamine (C18), benzyldimethylhexadecylammonium chloride (B2MH), benzyltriethylammonium chloride (B3E), and benzyldimethylphenylammonium chloride (B2MP). X‐ray diffraction measurements and transmission electron microscope observations showed that clay platelets were partially exfoliated or intercalated after complete curing of the phenolic resins. The cured nanocomposites were named as modifier‐MP (MP means montmorillonite‐phenolic resin), for example, B3E‐MP. Thermogravimetric analysis showed that thermal decomposition temperatures (T_ds) of the cured nanocomposites B2MP‐MP (826 K), B3E‐MP (794 K), and B2MH‐MP (783 K) were much higher than those of C18‐MP (768 K) and cured phenolic resin (737 K). Therefore, thermal stability of the nanocomposites depends mainly on the chemical structure of the organic modifiers. B2MP‐MP possesses the highest T_d since B2MP contains both benzyl and phenyl groups, followed with B3E‐MP and B2MH‐MP whose modifiers contain only one benzyl group. This is attributable to favorable interaction between phenolic resin and organic modifiers containing benzene rings. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 5336–5343, 2006     

Time–temperature–transformation cure diagrams of phenol–formaldehyde and lignin–phenol–formaldehyde novolac resins

In this study, the time–temperature– transformation (TTT) cure diagrams of the curing processes of several novolac resins were determined. Each diagram corresponded to a mixture of commercial phenol–formaldehyde novolac, lignin–phenol–formaldehyde novolac, and methylolated lignin–phenol–formaldehyde novolac resins with hexamethylenetetramine as a curing agent. Thermomechanical analysis and differential scanning calorimetry techniques were applied to study the resin gelation and the kinetics of the curing process to obtain the isoconversional curves. The temperature at which the material gelled and vitrified [the glass‐transition temperature at the gel point (_gelT_g)], the glass‐transition temperature of the uncured material (without crosslinking; T_g0), and the glass‐transition temperature with full crosslinking were also obtained. On the basis of the measured of conversion degree at gelation, the approximate glass‐transition temperature/conversion relationship, and the thermokinetic results of the curing process of the resins, TTT cure diagrams of the novolac samples were constructed. The TTT diagrams showed that the lignin–novolac and methylolated lignin–novolac resins presented lower T_g0 and _gelT_g values than the commercial resin. The TTT diagram is a suitable tool for understanding novolac resin behavior during the isothermal curing process. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Effect of SiC whisker on benzoxazine‐epoxy‐phenolic ternary systems: Microwave curing and thermomechanical characteristics

Microwave radiation at 2.45 GHz with variable power input was investigated as a tool to facilitate the curing reaction of benzoxazine‐epoxy‐phenolic molding compound i.e., BEP893. Dielectric filler for microwave coupling was silicon carbide whisker (SiC_w). Factors such as whisker loading and input irradiation power were found to have a profound effect on the microwave heating of the BEP893 particularly on the rate of temperature rise and maximum heating temperature. The SiC_w loading of 10% by weight with the microwave irradiation condition of 300 W for 10 min renders the ultimate curing of the molding compound. Significant reduction in processing time of the microwave cured sample compared with the conventional heat cured sample i.e., 150 min at 200°C using conventional heating is the key benefit of this technique. Mechanical properties of the microwave cured and conventional heat cured samples show similar characteristics with slightly lower T_g in the microwave cured samples. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Bis[4‐(4‐maleimidephen‐oxy)phenyl]propane/N,N‐4,4′‐bismaleimidodiphenylmethyene blend modified with diallyl bisphenol A

In this article, 2,2′‐bis[4‐(4‐maleimidephen‐oxy)phenyl)]propane (BMPP) resin and N,N‐4,4′‐bismaleimidodiphenylmethyene (BDM) resin blends were modified by diallyl bisphenol A (DABPA). The effects of the mole concentration of BMPP on mechanical properties, fracture toughness, and heat resistance of the modified resins were investigated. Scanning electron microscopy was used to study the microstructure of the fractured modified resins. The introduction of BMPP resin improves the fracture toughness and impact strength of the cured resins, whose thermal stabilities are hardly affected. Dynamic mechanical analysis shows that the modified resins can maintain good mechanical properties at 270.0°C, and their glass transition temperatures (T_g) are above 280.0°C. When the mole ratio of BDM : BMPP is 2 : 1(Code 3), the cured resin performs excellent thermal stability and mechanical property. Its T_g is 298°C, and the Charpy impact strength is 20.46 KJ/m². The plane strain critical stress intensity factor (K_IC) is 1.21 MPa·m^0.5 and the plane strain critical strain energy release rate (G_IC) is 295.64 J/m². Compared with that of BDM/DABPA system, the K_IC and G_IC values of Code 3 are improved by 34.07% and 68.10%, respectively, which show that the modified resin presented good fracture toughness. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40395.     

The glass‐forming ability and thermal stability of novolac–phenolic resin

Glass‐forming ability and thermal stability of novolac–phenolic resin with different contents of curing agent hexamethylenetramine (HMTA) are investigated. Melt fragility (M_g) and T_gd (T_gd = T_g/T_d) are proposed to characterize glass‐forming ability and thermal stability of the novolac–phenolic resin, respectively. It is found that M_g has a negative linear relationship with T_gd. The lower M_g represents the better glass‐forming ability of liquid phenolic resin while the higher T_gd represents the better thermal stability of the fully cured phenolic resin. Further more, M_g establishes a kinetic relationship between glass‐forming ability of liquid uncured and thermal stability of fully cured novolac–phenolic resin in terms of comparing with T_gd. POLYM. COMPOS., 2012. © 2011 Society of Plastics Engineers     

Studies on isotactic poly(phenyl glycidyl ether)‐modified epoxy resins. II. Toughening of epoxy resins

A semicrystalline polymer, isotactic poly(phenyl glycidyl ether) (i‐PPGE) was used as a modifier for epoxy resin; 1,8‐Diamino‐p‐methane (MNDA) and 4,4′‐Diamino diphenyl sulfone (DDS) were used as curing agents. In the MNDA‐cured resins, the dispersed phase were spherical particles with diameters in the range of 0.5–1.0 μm when the resin was blended with 5 phr i‐PPGE. In the DDS‐cured resins, the particle size distribution of the dispersed phase was much wider. The difference was traced back to the reactivity of the curing agent and the different regimes used for curing. Through dynamic mechanical analysis, it was found that in the MNDA‐cured systems, i‐PPGE had a lower crystallinity than in the DDS‐cured system. In spite of the remarkable difference in the morphology and microstructure of the modified resins cured with these two curing agents, the toughening effects of i‐PPGE were similar for these resins. The critical stress intensity factor (K_IC) was increased by 54% and 53%, respectively, for the resins cured by DDS and by MNDA, blending with 5 phr of the toughner. i‐PPGE was comparable with the classical toughners carboxyl‐terminated butadiene‐acrylonitrile copolymers in effectiveness of toughening the epoxy resin. An advantage of i‐PPGE was that the modulus and the glass‐transition temperature of the resin were less affected. However, this modifier caused the flexural strength to decrease somewhat. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 1223–1232, 2002; DOI 10.1002/app.10445     

Development of a DOPO‐containing melamine epoxy hardeners and its thermal and flame‐retardant properties of cured products

In this study, a novel Schiff base of melamine used as flame‐retardant curing agent for epoxy resins, was synthesized via condensation reaction of 4‐hydroxybenzaldehyde with melamine, followed by the addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphen‐anthrene 10‐oxide (DOPO) to the resulting imine linkage. The structure of DOPO‐containing melamine Schiff base (P‐MSB) was characterized by Fourier transformed infrared spectroscopy, ¹H‐nuclear magnetic resonance (¹H‐NMR) and ³¹P‐NMR. The compound (P‐MSB) was used as a reactive flame retardant in o‐cresol formaldehyde novolac epoxy resin (CNE) to prepare flame‐retardant epoxy resins for electronic application. The thermal and flame‐retardant properties of the epoxy resins cured by various equivalent ratios phenol formaldehyde novolac (PN) and P‐MSB were investigated by the nonisothermal differential scanning calorimetry, the thermogravimetric analysis, and limiting oxygen index test. The obtained results showed that the cured epoxy resins possessed high T_g (165°C) and good thermal stability (T_5%, 321°C). Moreover, the P‐MSB/CNE systems exhibited higher limiting oxygen index (35) and more char was maintained in P‐MSB/CNE systems than that in PN/CNE system and the effective synergism of phosphorus–nitrogen indicated their excellent flame retardancy. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Study on a parameter to express glass‐forming relationship of phenolic–novolac resin

Chemoviscosity and glass‐forming ability of commercial phenolic–novolac resin are investigated at hexamethylenetramine (HMTA) curing agent content weight from 6 to 9%. We propose a parameter, M_k, which is based on chemoviscosity change rate and T_g0 of uncured liquid resin, to predict glass‐forming ability of the fully cured phenolic–novolac resin. It is found that M_k has a negative linear relationship with T_g∞, and the lower M_k represents the better glass‐forming ability of initial phenolic–novolac uncured liquid resin while the higher T_g∞ represents the better glass‐forming ability of fully cured resin. Further more, M_k establishes a kinetic glass‐forming relationship between liquid uncured and fully cured phenolic–novolac resin in terms of comparing with T_g∞. POLYM. COMPOS., 2012. © 2011 Society of Plastics Engineers     

Curing behavior and thermal property of epoxy resin with boron‐containing phenol‐formaldehyde resin

The curing reaction of bisphenol‐A epoxy resin (BPAER) with boron‐containing phenol–formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER‐BPFR was shown to follow autocatalytic kinetics. The activation energy in the dynamic cure reaction was derived. The influence of the composition of BPAER and BPFR on the reaction was evaluated. In addition, the glass transition temperatures (T_gs) were measured for the BPAER‐BPFR samples cured partially at isothermal temperatures. With the curing conditions varying, different glass transition behaviors were observed. By monitoring the variation in these T_gs, the curing process and the thermal property of BPAER–BPFR are clearly illustrated. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1054–1061, 2000     

Properties of a reactive‐graphitic‐carbon‐nanofibers‐reinforced epoxy

Our previous studies showed that herringbone graphitic GNFs surface‐derivatized with reactive linker molecules bearing pendant primary amino functional groups capable of binding covalently to epoxy resins. Of special importance, herringbone GNFs derivatized with 3,4′‐oxydianiline (GNF‐ODA) were found to react with neat butyl glycidyl ether to form mono‐, di‐, tri‐, and tetra‐glycidyl oligomers covalently coupled to the ODA pendant amino group. The resulting reactive GNF‐ODA (butyl glycidyl)_n nanofibers, r‐GNF‐ODA, are especially well suited for reactive, covalent incorporation into epoxy resins during thermal curing. Based on these studies, nanocomposites reinforced by the r‐GNF‐ODA nanofibers at nanofiber loadings of 0.15–1.3 wt% were prepared. Flexural property of cured r‐GNF‐ODA/epoxy nanocomposites were measured through three‐point‐bending tests. Thermal properties, including glass transition temperature (T_g) and coefficient of thermal expansion (CTE) for the nanocomposites, were investigated using thermal mechanical analysis. The nanocomposites containing 0.3 wt% of the nanofibers gives the highest mechanical properties. At this 0.3‐wt% fiber loading, the flexural strength, modulus and breaking strain of the particular nanocomposite are increased by about 26, 20, and 30%, respectively, compared to that of pure epoxy matrix. Moreover, the T_g value is the highest for this nanocomposite, 14°C higher than that of pure epoxy. The almost constant change in CTEs before and after T_g, and very close to the change of pure epoxy, is in agreement with our previous study results on a chemical bond existing between the r‐GNF‐ODA nanofibers and epoxy resin in the resulting nanocomposites. POLYM. COMPOS., 28:605–611, 2007. © 2007 Society of Plastics Engineers     

Studies on syntheses and properties of episulfide‐type optical resins with high refractive index

A series of novel high refractive index episulfide‐type optical resins were prepared by ring‐opening copolymerization of bis(β‐epithiopropylthioethyl) sulfide (BEPTES) with episulfide derivative of diglydicyl ether of bisphenol A (ESDGEBA) and 2,4‐tolylene diisocyanate (TDI), respectively, in the presence of triethylamine as a curing catalyst. The episulfide monomers, BEPTES and ESDGEBA, were synthesized from their corresponding epoxy compounds, respectively. The cured transparent resins exhibit high refractive index (n_d > 1.63) and relatively low dispersion. The refractive index (n_d) and Abbe's number (ν_d) of the BEPTES/ESDGEBA curing system increased linearly with the weight content of BEPTES monomer in the range from 1.633 and 34.0 for the copolymer with 10 wt % of BEPTES to 1.697 and 38.1 for the homopolymer of pure BEPTES. For the BEPTES/TDI curing system, the refractive index and Abbe's number varied linearly with the molar ratio of BEPTES to TDI from 1.652 and 28.7 to 1.669 and 34.6. High glass‐transition temperatures (T_g > 130°C) of the cured BEPTES/TDI resins were observed, which indicate that the cured BEPTES/TDI resins possess a good heat resistance. The optical, physical, and thermal properties of the episulfide‐type cured optical resins were also discussed in this study. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 2426–2430, 2003     

Syntheses of epoxy‐bridged polyorganosiloxanes and the effects of terminated alkoxysilanes on cured thermal properties

A series of epoxy‐bridged polyorganosiloxanes have been synthesized by reacting multifunctional aminoalkoxysilanes with diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The reactions of trifunctional 3‐aminopropyltriethoxysilane (APTES), difunctional 3‐aminopropylmethyldiethoxysilane (APMDS), and monofunctional 3‐aminopropyldimethylethoxysilane (APDES) with DGEBA epoxy have been monitored and characterized by FTIR, ¹H NMR, and ²⁹Si NMR spectra in this study. The synthesized epoxy‐bridged polyorganosiloxanes precursors, with different terminated alkoxysilane groups, are thermally cured with or without the addition of curing catalysts. Organometallic dibutyltindilaurate, and alkaline tetrabutylammonium hydroxide have been used as curing catalysts to investigate the thermal curing behaviors and cured properties of epoxy‐bridged polyorganosiloxanes precursors. The maximum exothermal curing temperatures of epoxy‐bridged polyorganosiloxanes precursors are found to appear around the same region of 120°C in DSC analysis. The addition of catalysts to the epoxy/APTES precursor shows significant influence on the cured structure; however, the catalysts exhibit less influence on the cured structure of epoxy‐APMDS precursor and epoxy/APDES precursor. Curing catalysts also show significant enhancement in increasing the thermal decomposition temperature (T_d50s) of cured network of trifunctional epoxy‐bridged polyorganosiloxane (epoxy/APTES). High T_d50s of 518.8 and 613.6 in the cured hybrids of epoxy/APTES and epoxy/APMDS precursors are also observed, respectively. When trialkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes precursor are cured, with or without the addition of catalyst, no obvious T_g transition can be found in the TMA analysis of cured network. The cured network of trialkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes also exhibits the lowest coefficient of thermal expansion (CTE) among the three kinds of alkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes investigated. The organic–inorganic hybrid, from epoxy‐bridged polyorganosiloxanes after the thermal curing process, shows better thermal stability than the cured resin network of pure epoxy‐diaminopropane. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3491–3499, 2006