二维应力对PbTiO3多晶薄膜相变的影响

用热力唯象理论研究了二维应力对ＰｂＴｉＯ３多晶铁电薄膜相转变的影响，理论分析表明，在二维应力的作用下，薄膜的相转变温度Ｔｃ将发生移动，该移动量ΔＴ的大小和正负不仅与应力的性质有关，而且与晶粒的取向有关。经推导给ΔＴ与晶粒取向之间的关系式。对晶粒呈随机取向的多晶薄膜，在二维张应力的作用下，平均Ｔｃ将向高温移动，并且相转变温区将展宽。     

自支撑硼掺杂金刚石膜残余应力和微观应力的XRD分析

利用XRD(包括sin2ψ法)研究了电子辅助热灯丝化学气相沉积法(EA-HFCVD)生长的自支撑硼掺杂多晶金刚石薄膜的残余应力和微观应力.结果表明,薄膜的残余应力为压应力,随着薄膜制备过程中硼流量的增加,应力值有减小的趋势.薄膜的微观应力随着硼流量的增加,由拉应力转变为压应力然后又转变为拉应力.残余应力和微观应力的变化归因于一定量的硼掺杂导致的多晶膜中晶粒尺寸、晶面取向及孪晶变化的共同作用.     

离子注入条件下单晶银薄膜形成的理论探讨

在室温环境下，用不同的注入剂量将２４ｋｅＶ的Ｎ＋离子和３５０ｋｅＶ的Ｘｅ＋离子注入进多晶银薄膜中。对实验结果进行分析后发现，经离子注入后在银薄膜中出现了再结晶和晶粒长大现象。当注入的离子达到一定剂量时，多晶银薄膜转变成单晶银薄膜．本文对单晶银薄膜的形成机理作了探讨，认为与晶粒生长有关的主要因素是：（１）离子注入．过程中在薄膜内部产生的高密度的缺陷和位错促进了晶粒再结晶和晶粒生长。（２）由于晶格畸变而产生的界面张力为在晶粒初始再结晶以后的进一步长大提供了驱动力。（３）晶粒之间的取向差有助于晶粒的生长。（４）离子注入过程中产生的晶格弛豫效应促使薄膜中的应变能不断恢复和产生，使晶粒持续不断地再结晶而逐渐长大。（５）薄膜的基底对单晶薄膜的形成有一定影响。     

基片温度对射频磁控溅射碲化铋薄膜微结构和表面形貌的影响

碲化铋材料是目前已知的室温下性能优异的热电材料之一。本文利用射频磁控溅射在不同基片温度下制备了碲化铋薄膜。研究发现,基片温度对薄膜的微结构和表面形貌影响显著。随着温度的提高,薄膜内晶粒尺寸都不同程度地增加。基片温度100℃以上碲化铋薄膜为Bi2Te3相为主的多晶结构,并具有良好的c轴择优取向,形成了六角层状结构。基片温度250℃时薄膜转变为BiTe相,并在表面生成Te长条状颗粒。应力分析表明碲化铋薄膜与Si(100)基片之间的残余应力受温度影响明显。     

沉积温度对Gd掺杂CeO2电解质薄膜生长及电学特性的影响

采用反应射频磁控溅射技术,在非晶石英衬底上不同温度下制备了纳米多晶Gd掺杂CeO2(简称GDC)氧离子导体电解质薄膜,采用X射线衍射仪、原子力显微镜对薄膜物相、晶粒大小、生长形貌进行了表征,利用交流阻抗谱仪测试了GDC薄膜的电学性能.结果表明,GDC薄膜生长取向随沉积温度而变化:300-400℃时为强(111)织构生长,而500-600℃时薄膜趋于无规则生长;随着沉积温度的升高,薄膜的牛长形貌由同一取向的大棱形生长岛转变为密集球形小生长岛;GDC多晶薄膜的电导活化能约为1.3eV,接近于晶界电导活化能值,说明GDC交流阻抗主要源于晶界的贡献;晶界空间电荷效应导致GDC薄膜电导率随晶粒尺寸而变化,晶粒尺寸越小,电导率越大.     

K403镍基合金Al-Cr涂层组织转变及取向与应力的影响

用物理冶金常用的分析手段对不同取向的K403单晶和多晶材料渗态和高温长时热暴露条件下Al-Cr涂层的组织转变进行分析,研究应力对涂层组织的影响。结果表明,在900℃下,Al-Cr涂层组织稳定性极佳,可经受5000h热暴露。晶体取向对涂层的形成与转变无明显影响,但对σ相的排列与取向有明显作用。此外,应力加速了涂层的增厚和析出相的沉淀与粗化。在1050℃以上,涂层的β→γ转变在1000h内可完成,包括,σM6C相在内的析出相明显粗化,造成涂层组织严重损伤。     

离子束增强沉积VO2多晶薄膜的相变模拟

用多晶薄膜晶粒—晶界两相结构模型,考虑晶格畸变和载流子对晶界势垒区的隧穿机制,在10～100℃范围内,模拟了离子束增强沉积(IBED)VO2多晶薄膜的相变。模拟结果显示,由于晶粒中间隙位置氩的存在,使VO2晶格畸变,导致了薄膜中部分晶粒的相交温度降低,使IBED VO2薄膜在48℃开始由半导体相向金属相转变。     

退火温度对Si基Bi4Ti3O12铁电薄膜微观结构影响研究

采用Sol-Gel工艺制备了Si基Bi4Ti3O12铁电薄膜。研究了退火温度对Si基Bi4Ti3O12薄膜晶相结构、晶粒尺寸及薄膜表面形貌的影响。研究表明，退火温度低于450℃时Bi4Ti3O12薄膜为非晶状态，退火温度在550-850℃范围内均为多晶薄膜，而且随退火温度升高，Bi4Ti3O12薄膜更趋向于沿c轴取向的生长；而晶粒尺寸及薄膜粗糙度随退火温度升高而增大，但在较高温度下增长速度趋缓。     

冷轧多晶铜与多晶铝形变显微组织演变的研究

采用ＴＥＭ对冷轧多晶铜与多晶铝的形变显微组织演谱进行了对比研究,多晶铜及多晶铝形变显微组织中均含有三类典型的位错结构类型,其中的两种结构特征在两种材料中是相似的,这两种类型结构存在于非立方取向晶粒,可通过晶粒中位错边界的晶体学取向加以区别,另一类型结构存在于立方取向晶粒;晶粒的晶体学取向决定了其形变显微组织类型,但其它冶金学因素对显微组织也有影响。     

纳米晶粒受控生长抑制PZNT铁电薄膜中异相形成

在LaAlO3（001）、MgO（001）、SrTiO3（001）衬底以及SrTiO3（001）／PZT（001）种膜上用液相外延方法生长了PZNT薄膜。生长结果表明：在LaAlO3（001）基片PZNT晶粒以三维岛状自发生长。薄膜中有大量的焦绿石异相；在MgO（001）和SrlriO3（001）衬底上，为三维岛状异质外延生长。薄膜中焦绿石异相几乎消失；引入[001]取向的PZT种膜后，岛状三维生长变为二维生长，显著改善了外延膜的质量，获得了完整的PZNT膜。分析了衬底取向对紧邻层纳米尺寸范围的晶粒形成、薄膜晶粒的发育、克服薄膜中异相形成等的影响，总结了获得完整PZNT薄膜的生长条件。     

Barium titanate thin films deposited by electrophoresis on p-Doped Si (001) substrates

Barium titanate (BaTiO3) thin films have been prepared by electrophoretic deposition on p-doped and platinum covered silicon (Si) substrates. Their structure, nanostructure and dielectric properties were characterized. The as-deposited films were polycrystalline and composed by barium titanate nanograins with an average grain size approximately 9 nm. Annealing at high temperatures promoted grain growth, so that the samples annealed at 600 degrees C presented average grain sizes approximately 24 nm. From Raman spectroscopy measurements it was found that the tetragonal (ferroelectric) BaTiO3 phase was stabilized on the films. Also, at higher annealing temperatures, cation disorder was reduced on the films. From measurements of the temperature dependence of the dielectric permittivity the corresponding paraelectric-ferroelectric phase transition was determined. The observed transition temperature (approximately 100 degrees C) was found to be below the BaTiO3 bulk or thick film values, due to the small nanosized grains composing the films.     

Heteroepitaxial growth of tungsten oxide films on sapphire for chemical gas sensors

The performance of chemiresistive gas sensors made from semiconducting metal oxide films is influenced by film stoichiometry, crystallographic structure, surface morphology and defect structure. To obtain well-defined microstructures, heteroepitaxial WO₃ films were grown on r-cut and c-cut single crystal sapphire substrates using rf magnetron Ar/O₂ reactive sputtering of a W target. On r-cut sapphire, an epitaxial tetragonal WO₃ phase is produced at a 450°C deposition temperature whereas 650°C growth stabilizes an epitaxial monoclinic WO₃ phase. On c-cut sapphire, a metastable hexagonal WO₃ phase is formed. RHEED and X-ray diffraction indicate that the films have a ‘polycrystalline epitaxial structure’ in which several grains are present, each having the same crystallographic orientation. STM analysis of the film surfaces reveals morphological features that appear to be derived from the substrate symmetries. The monoclinic phase has a step/terrace growth structure, has the smallest mosaic spread in XRD rocking curves and exhibits the highest degree of reproducibility suggesting that it is the best suited for sensor applications. Measurements of film conductivity versus temperature indicate that the charge transport mechanisms are also dependent on the crystallographic phase and microstructure of the WO₃ films.     

不同厚度的La2/3Sr1/3MnO3多晶薄膜输运性质研究

运用磁控溅射的方法,在表面氧化的Si(100)基片上制备了一系列不同厚度的La2/3Sri/3MnO3多晶薄膜.根据对输运的研究,发现存在一个厚度73nm,当t＞73nm的时候,薄膜呈现出与块材类似的输运特点,而当t＜73nm的时候,薄膜的电阻太大以至于薄膜的金属-绝缘体转变温度(Tp)变得不可测量.X射线衍射(XRD)结果显示:在t=73nm附近存在一个结构的转变.这表明La2/3Sr1/3MnO3不同厚度多晶薄膜的输运性质的不同或许来自结构的转变.     

Tungsten chemical vapor deposition using tungsten hexacarbonyl: microstructure of as-deposited and annealed films

Tungsten (W) films were deposited on Si(100) from tungsten hexacarbonyl, [W(CO)₆], by low-pressure chemical vapor deposition (CVD) in an ultra-high vacuum (UHV)-compatible reactor. The chemical purity, resistivity, crystallographic phase, and morphology of the deposited films depend markedly on the substrate temperature. Films deposited at 375°C contain approximately 80 at.% tungsten, 15 at.% carbon and 5 at.% oxygen. These films are polycrystalline β-W with a strong (211) orientation and resistivities of >1000 μΩ cm. Vacuum annealing at 900°C converts the metastable β-W to polycrystalline -W, with a resistivity of approximately 19 μΩ cm. The resultant -W films are porous, with small randomly oriented grains and nanoscale (<100 nm) voids. Films deposited at 540°C are high-purity (>95 at.%) polycrystalline -W, with low resistivities (18–23 μΩ cm) and a tendency towards a (100) orientation. Vacuum annealing at 900°C reduces the resistivity to approximately 10 μΩ cm, and results in a columnar morphology with a very strong (100) orientation.     

Crystallization behavior and domain structure in textured Pb(Zr0.52Ti0.48)O3 thin films by different annealing processes

Amorphous Pb(Zr_0.52Ti_0.48)O₃ (PZT) thin films were prepared on the Pt/Ti/SiO₂/Si substrates by radio-frequency magnetron sputtering at room temperature. After rapid thermal annealing (RTA) and conventional furnace annealing (CFA) at different temperatures, the films were transformed into polycrystalline PZT thin films with (111) and (100) orientation, respectively. The phase formation and ferroelectric domains correlated with different orientation were systematically investigated by X-ray diffraction and piezoresponse force microscopy. The results showed that the perovskite PZT crystal with [111] orientation hetero-nucleated preferentially on top of the PtPb intermetallic phase at the PZT/Pt interface during RTA process. It is of interest to find that the domain self-organized into a structure with rounded shape at the early stage of crystallization. While the nucleation of the films treated by CFA dominantly homo-nucleated, thus the (100) orientation grains with minimum surface energy were easy to grow. The texture effects on ferroelectric properties of PZT films were also discussed in relation to the domain structure.     

Electrical and Magnetic Properties of Ultrathin Polycrystalline Fe Films Grown on SiO<Subscript>2</Subscript>/Si(001)

Ultrathin polycrystalline Fe films have been grown on the oxidized surface of a Si(001) substrate. The resistivity and magnetic hysteresis of Fe films have been measured in the range of thickness from 2.5 to 10 nm. Based on the analysis of the data obtained, it is suggested that there is a transition to the structurally continuous film at a thickness of ~6 nm. It is found that Fe grains in this film acquire the preferred (111) orientation during this transition.     

Transition from a disordered to a crystalline state in II–VI and III–V films

The initial stages of HgCdTe growth on Al₂O₃, GaAs, CdTe, and KCl substrates have been studied by electron diffraction. HgCdTe films were produced by pulsed laser deposition and isothermal vapor phase epitaxy. InGaAs films were grown by isothermal chloride epitaxy on GaAs substrates. In the initial stages of the growth process, we observed a transition from an amorphous to a textured polycrystalline phase and then to a mosaic single-crystal structure. We have calculated the critical size of crystalline grains below which amorphization occurs in II-VI and III-V compounds. The critical grain size agrees with the grain size of the disordered (amorphous) phase that forms in the initial stage of epitaxy. We have determined some characteristics of the heterostructures: critical film thickness below which pseudomorphic growth is possible without misfit dislocation generation, elastic stress in the epitaxial system, surface density of dangling bonds at dislocations, and the critical island radius above which no interfacial misfit dislocations are generated.     

Optimal growth windows of multiferroic BiFeO3 films and characteristics of ferroelectric domain structures

Multiferroic BiFeO₃ films of smooth surface and fully-saturated ferroelectric hysteresis loops have been grown by RF magnetron sputtering. The (001)-oriented epitaxial films showed a large remanent polarisation of 61 µC/cm². A strategy to grow BiFeO₃ films of good ferroelectric property was demonstrated, that was using fast growth rate to achieve accurate stoichiometry for the BiFeO₃ phase and at the same time to avoid the formation of impurity phases associated with the fast growth by accurate control of thermodynamic parameters such as oxygen partial pressure and temperature, as well as proper selection of substrates. Piezoresponse force microscopy revealed fine spontaneous domains for highly resistive epitaxial films, which were switchable under DC biases. For the polycrystalline films of increased density of free carriers, single-domain grains of about 200 nm in diameter were observed due to effective compensation of depolarisation field by free carriers and therefore allowing larger domains.     

采用金属镓层氮化技术在石英衬底上生长多晶GaN

随着多晶GaN材料发光研究的不断深入 ,大面积、价格低廉的多晶GaN基光电器件的研制已成为工业生产中一个重要的研究领域。石英玻璃以其自身特有的优势 ,成为生长多晶GaN材料的较为理想的衬底。本文采用一种新的金属镓层氮化技术 ,使用无定形石英作衬底 ,在常压下制备出多晶GaN。经分析测试表明 ,生长出的多晶GaN为六方结构且质量较好 ,并观察到针状的表面结构