聚合物/SiO2混合波导2×2热光开关的制备与测试

利用聚合物材料SU-8作为芯层、聚合物材料PMMA作为上包层、无机材料SiO2作为下包层,设计并制备了一种有机/无机混合波导2×2定向耦合-马赫曾德尔(DC-MZI)热光开关。为了保证波导中的单模传输、减小模式辐射和衬底泄露损耗、缩短响应时间并降低器件功耗,对其结构参数做了优化。利用涂膜、湿法刻蚀等工艺制备了器件样品。在1 550nm波长下,器件的交叉态和直通态的驱动功率分别为0和7.8mW(开关功率为7.8mW),交叉态和直通态的两端口串扰分别为-9dB和-12.8dB。在方波驱动电压信号作用下,测得器件交叉端口的上升时间和下降时间分别为138μs和136μs,直通端口的上升时间和下降时间分别为63μs和140μs。制备的混合结构器件综合利用了芯层聚合物材料热光系数大、上/下缓冲层厚度均较小以及Si/SiO2导热系数大的优点,因此同时具备了较低的功耗和较快的响应时间,在低功耗、快速光通信系统中具有较好的应用前景。     

基于Polymer/SiO_2的快速低功耗可变光衰减器的研制

为了有效改善基于无机材料的可变光衰减器(VOA)功耗大以及全聚合物VOA响应速度慢的问题,设计并研制了一种基于有机聚合物/无机SiO2材料的马赫曾德尔干涉仪(MZI)型VOA器件。根据脊型波导结构的单模传输条件,设计并优化了单模波导的截面尺寸,同时对器件结构进行了模拟,采用光刻和显影等工艺制备出功耗较低、响应速度快的VOA器件。在1550nm通信波长下,器件的衰减范围为23dB,最大功耗仅为14mW,器件的上升时间为252μs,下降时间为384μs。实验结果表明,采用有机/无机混合波导结构,并通过对器件结构参数的优化,可以实现功耗低且响应快速的VOA器件。     

低功耗聚合物MZI结构热光开关研究

设计并制作了一种基于马赫-曾德尔干涉仪(MZI)结构的低功耗聚合物热光开关。聚合物材料具有低热导率和高热光系数的优点,可以有效降低热光器件的功耗。在Si O2衬底上,采用热光系数较大的Norland紫外固化胶(NOA73)作为波导芯层,聚甲基丙烯酸甲酯和甲基丙烯酸环氧丙酯的共聚物[P(MMA-GMA)]作为波导的上包层,设计了热光开关器件,并对光场和热场进行了模拟,采用传统的半导体工艺完成了热光开关器件的制备。器件的测试结果表明,在1550 nm工作波长下,热光开关器件的消光比为20.2 d B,驱动功率仅为9.14 m W,开关的上升时间为174μs,下降时间为292μs。     

2×2有机聚合物的全内反射型热光光开关

利用有机聚合物材料的负性热光效应 ,设计并研制成功了 2× 2全内反射型光开关。所研制的无阻塞 2× 2光开关 ,具有 >2 7dB的消光比 ,全内反射状态下 ,器件驱动功率约为 132mW (驱动电压约 3V×驱动电流约 4 4mA) ,这一驱动功率值可以降至 5 0～ 6 0mW ,同时给出器件插入损耗的测试结果。     

650nm波长低功耗聚合物可变光衰减器的研制

为了有效改善基于无机材料的可变光衰减器(VO A)功耗大以及成本高的问题,设计并研制了一种基于有 机聚合物材料的低功耗马赫-曾德尔干涉仪(MZI)型VOA器件。为保证器件的单模传输,优 化了波导的结构和横截面 尺寸,同时对加热电极的热场分布进行了模拟分析。最后,采用紫外光刻和湿法刻蚀等半导 体工艺,制备出功耗较低、响应速 度较快的VOA器件。在650nm工作波长下,测得器件的衰减为14.6dB,驱动功率仅为12.3mW,器件的上升时间为 240μs, 下降时间为200μs。实验结果表明,采用聚合物材料,并通过对器 件的结构参数进行优化,可研制出工作在可见光波段的低功耗VOA器件。     

宽光谱聚合物热光开关的制备及容噪特性研究

利用聚合物/SiO₂混合材料脊形波 导结构以及化学气相沉积(CVD)、涂膜和湿法刻蚀等 工艺,设计并制备了一种低功耗 马赫-曾德尔干涉(MZI)热光开关。测试了波导芯层和包覆层材料的色散特性,模拟分析了 器件的输出功率和光谱性能。以可调 谐激光器作为光源,实验测试了所制备器件的开关、响应和光谱特性。在1〖KG －1/ 6〗550nm中心波长下,器件的开关功耗约为7.8mW, ON与OFF状态间的消光比达32.6dB。在纯净方波驱动电压信号(峰峰 值为3V_pp)作用下,测得器件的上升和下降时间分别 为107μs。保持器件在1550nm波长下的驱动功率不变,测得器 件的输出光谱约为50nm(1520～1570nm),且在此范 围内,器件的消光比大于18dB。利用NE555等 集成电路自主制作了一种噪声幅度可调的含噪信号驱动源,借此研究了器件 的容噪特性。结果显示,当要求器件的消光比大于10dB时,可允许的最大噪声幅度为1.1V_pp。     

支撑光网络发展的Si基光子集成器件的研究进展

本文报道了可用于光网络系统终端OADM和OXC的Si基长波长量子阱窄带响应光电接收器、MOEMS和F-P TO宽频域光学滤波器、M-Z型 TO光开关和MMI多路分束器以及可变光强衰减器.用应变层SiGe/Si MQW研制的RCE光电接收器响应谱半宽FWHM<6nm,外量子效率η>4.2%;采用表面微机械加工的桥式光学滤波器,当外加电压0→50V,连续可调谐范围达90nm;彩全平面工艺研制的F-P腔TO滤波器,当外加电流0→57mA时,连续可调谐范围达23nm,FWHM<0.5nm.在SOI Si基片上研制的M-Z TO波导光开关,开关时间<30μs,功耗～100mW.开关消光比为-13dB和-10dB,1×4MMI多路分束器输出光声的不均衡性<0.36dB,总插入损耗为6.9dB.用背向对接的MMI构成的M-Z干涉仪实现了光强的可变调最大衰减量26dB,响应时间为100μs,插入损耗为4.8～7dB.     

支撑光网络发展的Si基光子集成器件的研究进展

本文报道了可用于光网络系统终端OADM和OXC的Si基长波长量子阱窄带响应光电接收器、MOEMS和F-P TO宽频域光学滤波器、M-Z型 TO光开关和MMI多路分束器以及可变光强衰减器.用应变层SiGe/Si MQW研制的RCE光电接收器响应谱半宽FWHM<6nm,外量子效率η>4.2%;采用表面微机械加工的桥式光学滤波器,当外加电压0→50V,连续可调谐范围达90nm;彩全平面工艺研制的F-P腔TO滤波器,当外加电流0→57mA时,连续可调谐范围达23nm,FWHM<0.5nm.在SOI Si基片上研制的M-Z TO波导光开关,开关时间<30μs,功耗～100mW.开关消光比为-13dB和-10dB,1×4MMI多路分束器输出光声的不均衡性<0.36dB,总插入损耗为6.9dB.用背向对接的MMI构成的M-Z干涉仪实现了光强的可变调最大衰减量26dB,响应时间为100μs,插入损耗为4.8～7dB.     

8×8重排无阻塞型SOI热光波导开关阵列

设计并制作了一种重排无阻塞型的8×8 SOI热光波导开关阵列。开关单元采用了MMI-MZI结构的2×2光开关。整个器件的开关时间约为2μs。器件中开关单元功耗小于240mW。消光比在17~22dB范围内变化。功耗和开关速度都明显优于SiO2基和聚合物基的开关阵列。     

基于氮氧化硅与聚合物混合集成低功耗全内反射热光开关

利用具有相反热光特性的氮氧化硅(SiON)与聚合物材料,采用混合集成技术设计了一种低功耗全内反射(TIR)热光波导开关。该光开关通过在两交叉的氮氧化硅波导芯的X结中心部分制作一个深度等于波导芯厚度的狭缝,并在其中填充与波导包层相同的聚合物材料,同时在狭缝聚合物上方制作加热电极来实现开关功能。理论分析表明,通过选择与氮氧化硅折射率相匹配的聚合物材料,并优化设计单模光波导尺寸,两交叉波导间的夹角、所开狭缝的宽度以及相应的加热电极结构,对于1550nm的工作波长,开关的驱动功率在低至2.3mW时仍可实现消光比均大于36dB,串扰均小于-36dB的TE与TM模式。     

基于PVK/PbS纳米晶有机无机复合薄膜电双稳器件性能研究

通过简单旋涂方法,制备了一种基于硫化铅（PbS）纳米晶与聚乙烯基咔唑（PVK）的有机/无机复合薄膜电双稳器件,并对所制备的器件进行性能测试及其电荷传输机制研究。首先采用热注入的方法制备了尺寸均一的立方形PbS纳米晶,然后将PbS纳米晶与PVK聚合物混合作为活性层材料,制备了有机/无机复合薄膜电双稳器件。该器件展示了良好的电双稳特性并且可以实现稳定的“读-写-读-擦”操作。器件的最大电流开关比能够达到10⁴。并进一步对器件在正向电压下的I-V曲线进行了理论拟合,发现在不同电流传导状态下,器件符合不同的电传导模型。进而分析了该电双稳器件中的电荷传输机制,认为在电场的作用下,发生在纳米晶与聚合物之间的电场诱导电荷转移是产生电双稳特性的主要原因。     

Chemical linkage functions of poly(ether imide)s on the resistive switching memory effects

A series of aromatic poly(ether imide)s, AZTA-PEIs containing triphenylamine and 1,2,4-triazole moieties are prepared and characterized. All the polymers with inherent viscosity from 0.58 to 1.1 dL/g show glass transition temperatures in the range of 250–278 °C. Resistive switching memory devices are constructed based on the processable poly(ether imide) (AZTA-PEIa). The device can be switched from the initial OFF state to the ON state under either positive or negative electrical sweep at about ±3.2 V. The ON state is nonvolatile and can maintain the high conducting state even turning off the electrical power and applying a reverse bias. The device fulfills the requirements of a write-once read-many times memory (WORM) with a high ON/OFF current ratio up to 10⁵ and a long retention time in both ON and OFF states. The bistable switching effects of the polymer result from the conformation-coupled charge transfer from electron donors (triazole-substituted triphenylamine moieties) to electron acceptors (phthalimide moieties). By comparing with the memory behaviors of analogue polymers, the functions of ether and imide in the chemical polymer structure on the memory behaviors are discussed.     

Novel Digital Nonvolatile Memory Devices Based on Semiconducting Polymer Thin Films

Recent increases in the demand for mobile devices have stimulated the development of nonvolatile memory devices with high performance. In this Communication, we describe the fabrication of low‐cost, high‐performance, digital nonvolatile memory devices based on semiconducting polymers, poly(o‐anthranilic acid) and poly(o‐anthranilic acid‐co‐aniline). These memory devices have ground‐breaking and novel current–voltage switching characteristics. The devices are switchable in a very low voltage range (which is much less than those of all other devices reported so far) with a very high ON/OFF current ratio (which is on the order of 10⁵). The low critical voltages have the advantage for nonvolatile memory device applications of low operation voltages and hence low power consumption. With this very low power consumption, the devices demonstrate in air ambient to have very stable ON‐ and OFF‐states without any degradation for a very long time (which has been confirmed up to one year so far) and to be repeatedly written, read and erased. Our study proposes that the ON/OFF switching of the devices is mainly governed by a filament mechanism. The high ON/OFF switching ratio and stability of these devices, as well as their repeatable writing, reading and erasing capability with low power consumption, opens up the possibility of the mass production of high performance digital nonvolatile polymer memory devices with low cost. Further, these devices promise to revolutionize microelectronics by providing extremely inexpensive, lightweight, and versatile components that can be printed onto plastics, glasses or metal foils.     

Non-blocking four-port optical router based on thermo- optic silicon microrings

By using silicon-on-insulator(SOI) platform, 12 channel waveguides, and four parallel-coupling one-microring resonator routing elements, a non-blocking four-port optical router is proposed. Structure design and optimization are performed on the routing elements at 1 550 nm. At drop state with a power consumption of 0 m W, the insertion loss of the drop port is less than 1.12 d B, and the crosstalk between the two output ports is less than-28 d B; at through state with a power consumption of 22 m W, the insertion loss of the through port is less than 0.45 d B, and the crosstalk between the two output ports is below-21 d B. Routing topology and function are demonstrated for the four-port optical router. The router can work at nine non-blocking routing states using the thermo-optic(TO) effect of silicon for tuning the resonance of each switching element. Detailed characterizations are presented, including output spectrum, insertion loss, and crosstalk. According to the analysis on all the data links of the router, the insertion loss is within the range of 0.13—3.36 d B, and the crosstalk is less than-19.46 d B. The router can meet the need of large-scale optical network-on-chip(ONo C).     

Design and performance of a polymer Mach-Zehnder interferometer electro-optic modulator at 1.55 μm

Based on poled guest-host electro-optic (EO) polymer DR1/SU-8, a Mach-Zehnder interferometer (MZI) EO modulator operated at 1.55 μm is proposed. For achieving high response speed and high EO modulation efficiency, both waveguide structure and electrode structure are especially optimized. The impedance match and less index mismatch are achieved. The final characteristic impedance of electrode is about 49.4 Ω, and the microwave index and the light-wave index are 1.5616 and 1.6006, respectively. The device is fabricated using wet-etching technique and inductively coupled plasma (ICP) etching technique, and its performance is measured at 1.55 μm. Experimental results show that when the applied voltage is tuned, the modulator can be changed from ON state to OFF state. The insertion loss at ON state is 12 dB and the extinction ratio between ON and OFF states is about 10 dB. The high response speed is in nano-second level for a square-wave signal. Therefore, the modulator possesses potential applications in high-speed optical networks on chip.     

Asymmetric X-junction thermooptic switches based on fluorinatedpolymer waveguides

Thermooptic 2×2 switches based on low-loss fluorinated polymer waveguides have been demonstrated. For the waveguide possessing a low-loss around the 1.55-μm wavelength, crosslinkable fluorinated poly(arylene ethers) (FPAE) is developed as a core material and perfluorocyclobutane (PFCB) is used as a cladding material. To enhance the fabrication tolerance and to achieve a low switching power, asymmetric X-junctions with a Mach-Zehnder interferometer are exploited for the polymeric waveguide switches. An inverted rib waveguide structure is fabricated by filling up the etched groove on a lower cladding with the core polymer. The switch exhibits a crosstalk of less than -20 dB, a switching power of 10 mW, and an insertion loss of 4.5 dB     

Polymer Optical Waveguide Switch Using Thermo-Optic Total-Internal-Reflection and Strain-Effect

A new optical waveguide switch using thermo-optic total-internal-reflection and strain-induced effects in polymer materials has been experimentally demonstrated. The switch consists of three-layered slab waveguides and two metal strip lines that are located close to one another on top of the upper cladding. The deposition of metal strips introduces strain in the underlying polymer materials, creating two strain-induced optical waveguides for the cross state. Current applied along these metal strips results in a thermo-optic based total-internal-reflection waveguide between the two metal strips for the bar state. The fabrication and the device characteristics of the new optical switch are reported.      

SOI热光4×4光开关阵列的研制

设计和制作了由5个2×2多模干涉马赫-曾德开关元组成的重排无阻塞型SOI 4×4热光开关阵列.阵列的最小和最大附加损耗分别为6.6和10.4dB,阵列的串扰为-12 ～-19.8dB,光开关阵列的开关速度小于30μs,单个开关元的功耗大约为330mW.     

基于石英衬底的16通道二氧化硅可调复用器/解复用器的单片集成

本文是关于可调复用器/解复用器的单片集成,它由一个16通道200 GHZ的二氧化硅阵列波导光栅和一组马赫增德尔干涉型热光可调光衰减器阵列构成。该集成器件是基于石英衬底的,与基于硅衬底的器件相比,省去了沉积下包层的工艺步骤,并且降低了器件功耗。该集成器件的插入损耗是-5 dB,串扰小于-22 dB。在衰减为20 dB的时候每个通道的功耗只有110 mW。     

4×4 polymer thermo-optic directional coupler switch at 1.55μm

An integrated 4×4 polymer thermo-optic switch at 1.55 μm is demonstrated for the first time. A fibre to fibre insertion loss of 10 dB, and extinction ratios of 17.5-19.5 dB were measured. The polarisation sensitivity was typically less then 0.5 dB and the response time was less then 1 ms. The electrical power consumption was found to be 70 mW per single switch